Chii chinonzi Substrate-Senge PCB (SLP)? Tsanangudzo, Tekinoroji, uye Zvishandiso

Kunzwisisa Substrate-Kufanana nePCB Technology

PCB yakaita seSubstrate (SLP) inomiririra shanduko yakakosha mukugadzirwa kwemabhodhi ecircuit akadhindwa, ichivhara musiyano uripo pakati pemabhodhi echinyakare eHigh-Density Interconnect nesubstrate dzecircuit dzakasanganiswa . Sezvo zvishandiso zvemagetsi zvichida zvinhu zviri kuwedzera kusimba uye huwandu hwakawanda hweinterconnect, tekinoroji yeSLP inoita kuti pave nekushanda kwesubstrate uku ichichengetedza hupfumi hwekugadzira maPCB.

Iyi tekinoroji inogonesa kuteedzera hupamhi uye nzvimbo kusvika 30/30 µm mazinga, ichitsigira iyo miniaturization maitiro akakosha kune smartphones, zvinopfekeka, uye yepamusoro komputa modules. Kune vagadziri vanoongorora kushandiswa kweSLP, kunzwisisa maitiro ekuita uye kukumbira mavhidhiyo ekugadzira fekitori padivi pemishumo yekugona inovimbisa kukodzera kwemupi.

Tsanangudzo yehunyanzvi uye Kumisikidzwa kweSubstrate-Senge PCB

PCB yakaita seSubstrate inotora nzvimbo yehunyanzvi pakati pemabhodhi eHDI epamusoro uye masubstrate echokwadi eIC. Kunyange hazvo HDI yakajairwa ichiwanzoshanda nehupamhi hwemutsara uye nzvimbo ye50/50 µm kana yakafara, SLP inosundira miganhu iyi kusvika ku30/30 µm zvichidzika, nekushandiswa kwepamusoro kunosvika 25/25 µm kana geometries dzakapfava.

Iyo tekinoroji inoshandisa zvakanyanya denser microvia arrays, dzakatetepa dielectric layer (40-60 µm zvichienzaniswa neHDI's 75-100 µm), uye kunyatso kunyoresa kushivirira. Kugadzirwa kwechinyakare kwePCB kunoshandisa nzira dzekubvisa dzinonetseka neakanaka maficha, nepo Substrate-Senge PCB inonyanya kushandisa yakagadziridzwa semi-yekuwedzera maitiro ayo anogonesa yepamusoro yekuteedzera tsananguro uye inobvumira chikamu chechikamu pazasi 0.4 mm.

Core Manufacturing Technologies ye Substrate-Senge PCB

Modified Semi-Additive process (mSAP)

Iyo mSAP nzira inoumba hwaro hweakawanda Substrate-Senge PCB kugadzira. Iyi nzira inotanga nembeu yakatetepa yemhangura (0.5-2 µm), inoteverwa nekusarudza electroplating kuvaka inodiwa conductor pateni, uye inopedzisa neflash etching kubvisa mhodzi. Kutevedzana uku kunogadzira maronda ane padhuze-akatwasuka padivi uye kushoma undercutting, yakakosha pakuchengetedza chiratidzo chekutendeseka mune yekupedzisira-yakanaka pitch routing inosiyanisa SLP kubva kune yakajairwa nzira dzekugadzira.

Yepamberi Microvia Magadzirirwo uye Stacking

Tekinoroji yekuboora neLaser inogonesa ma microvias asingaonekwe akafanana nezvikamu zvePCB zvakaita seSubstrate. Ma CO₂ kana ma UV lasers anobhururuka nepakati pezvikamu zvitete zve dielectric kuti agadzire maburi madiki se50 µm ayo anozozoiswa simbi kuburikidza ne electrolyte uye electrolytic copper deposition. Zvimiro zve HDI chero-layer zvinopa routing flexibility inodiwa kune madhizaini akaomarara eSLP, nepo ma stacked uye staggered microvia configurations pamwe chete ne via-in-pad implementations zvinowedzera routing density uye kuderedza hurefu hwenzira yesignal.

Kudzora Hunhu uye Kuvimbika Kufunga

Kugadzira Substrate-SePCB inoda kuomarara maitiro ekudzora kune akawanda akakosha paramita:

• Upamhi hwemutsara uye kuenderana kwepakati -Kushivirira kunofanirwa kuramba kuri mukati me ± 10% kuve nechokwadi chekuita kwemagetsi kwakavimbika uye chiratidzo chekuvimbika pane zvese zvinoteedzera.
• Microvia copper plating -Kuzadza kwakazara kana kudzorwa kuvharika kunodzivirira kutadza kuvimbika uye inova nechokwadi chekubatanidza magetsi ekubatanidza kuburikidza ne layer shanduko.
• Surface roughness control -Kunangisa Rz <3 µm panzvimbo yemhangura inokonzeresa kurasikirwa kwekuisa pane yakakwirira frequency uye inovandudza impedance kuenderana.
• Lamination quality -Void-yemahara layer bonding isina yakawandisa resin kuyerera inochengetedza microvia kutendeseka uye inodzivirira delamination kutadza.

Kusarudzwa kwezvinhu uye Stack-Up Architecture ye Substrate-Senge PCB

Dielectric uye Copper Material Systems

Substrate-Senge PCB zvinhu masisitimu anosiyana zvakanyanya kubva kune yakajairwa FR-4 zvivakwa. Yakaderera-kurasikirwa dielectric zvinhu zvine dissipation zvinhu pazasi 0.005 uye dielectric constants pakati pe 3.0-3.5 inopa kushanda kwemagetsi kunodiwa kune yakakwirira-kumhanya yedhijitari uye RF application. Sarudzo yemhangura foil inowanzofarira reverse-yakarapwa kana yakanyanya-yakaderera-mbiri sarudzo ine yakaderedzwa pamusoro roughness kuti ideredze kurasikirwa kweganda pamulti-gigahertz frequencies, ichikanganisa zvakananga kugona kweSubstrate-Senge PCB mukuda maapplication.

Stack-Up Design Principles

Stack-up madhizaini eSubstrate-SePCB anowanzo shandisa asymmetric zvimiro zvine matete dielectrics munzvimbo dzepamusoro-density routing matunhu uye akakora macores ekugadzikana kwemichina. Yakajairwa 6-layer SLP inogona kushandisa 50 µm dielectric layers pakati pemukati routing peya ine 0.5 oz huremu hwemhangura uku ichichengetedza 200 µm musimboti wekutendeseka kwechimiro. Solder mask zvinhu zvinofanirwa kutsigira kuvhurwa kwakanaka-kuna (150 µm kana diki) nekunyoreswa chaiko, nepo kufunga kwekutonga kwemafuta kunowanzo fambisa kubatanidzwa kwemari yemhangura yakamisikidzwa kana zvinhu zvinowedzerwa nemoto.

Zvikumbiro Kutyaira Substrate-Senge PCB Adoption

1. Smartphone mainboards -Shandisa seyakakura-vhoriyamu application yeSubstrate-Senge PCB tekinoroji. Yakanyanya kuganhurirwa nzvimbo uye kupindirana kwakaomarara pakati pema processor, ndangariro, PMICs, uye RF transceivers inoda density yenzira kupfuura kugona kwechinyakare HDI mabhodhi.
2. Kamera module mabhodhi -Gonesa compact kubatanidzwa kwemifananidzo sensors, lens actuators, uye mufananidzo chiratidzo processors. SLP inobvumira chaiyo impedance kudzora uye compact kuburikidza nezvimiro zvinoderedza kurasikirwa kwechiratidzo uye kunatsiridza mufananidzo-kugadzirisa kumhanya.
3. Zvemagetsi zvinopfekeka -Push miniaturization zvakatowedzera nehuremu hwebhodhi pazasi 0.4 mm uchichengetedza 6-8 routing layer. SLP tekinoroji inovimbisa kuvimbika kwemuchina kunyangwe yakadzokororwa kukotama uye compact mudziyo wakavharirwa.
4. Yepamberi isina waya uye 5G modules - Batanidza RF yekumberi-yekupedzisira zvikamu mukati meimwe compact chimiro. Iyo yakaderera-kurasikirwa zvinhu uye yakanaka-mutsara nzira muSLP inoburitsa isingachinjiki impedance uye chiratidzo chekuvimbika pamamirimita-wave frequency.

Muchidimbu, kutorwa kweiyo Substrate-Kufanana nePCB tekinoroji inofambiswa nezvikumbiro zvinoda Ultra-yakakwirira wiring density, hukuru hwemagetsi kuita, uye yakanyanyisa miniaturization. Sezvo aya mafambiro achienderera mberi, SLP inoshanda sekiyi inogonesa kuvhara mukaha pakati peHDI PCB neIC substrate kugadzira.

Dhizaini Mazano e Substrate-Senge PCB

Microvia uye Trace Dhizaini Mitemo

Mainjiniya anogadzirira Substrate-Senge PCB yekugadzira inofanirwa kugadzirisa maitiro avo kuti aenderane nehunyanzvi hwetekinoroji uye zvimhingamipinyi. Madhayamita eMicrovia anofanirwa kuchengetedza chiyero che1:1 pakati pekupedzwa kwedhayamita nekukora kwedielectric, nemasaizi ematedhi ekubata anokwana 50 µm akakura kupfuura dhayamita kuti ive nechokwadi chekubvumirwa kunyoreswa kwakakwana.

Trace spacing inofanirwa kuchengetedza 30 µm shoma yekugadzira madhizaini ane 40-50 µm inosarudzwa pakugadzirisa goho, ukuwo impedance control inoda yakadzama stack-up kurongeka kuti uwane zvinokanganiswa zve50Ω imwe-yakapera kana 90-100Ω musiyano.

Signal Kutendeseka uye Thermal Management

Kumashure-kuchera kuburikidza ne-gomba vias inofamba-yepamusoro-inomhanya masiginecha kunobatsira kudzikisa stub resonances iyo inosvibisa kutendeseka kwechiratidzo pamusoro akati wandei gigahertz, nepo vagadziri vachifanirwa kumisikidza annular mhete zvinodiwa vachiziva kuti Substrate-Senge PCB magadzirirwo anowanzo tsigira mashoma madiki (25-30 µm) pane akajairwa maitiro.

Thermal pad dhizaini yeQFN neBGA mapakeji anofanirwa kuenzanisa solder paste vhoriyamu zvinodiwa pakatarisana nekuiswa kwekudziya kwemukati kune ndege dzemukati, kudzivirira chikamu chekupisa uku uchichengetedza compact fomu zvinhu zvinotyaira kutorwa kwehunyanzvi hweSLP.

Kugadzira Kugona Kuongorora uye Kutenga

Yakakosha Kugona Metrics

Kukodzera iyo Substrate-Senge PCB mugadziri inoda kuongororwa kwakaringana kwemaitiro ekugona kupfuura akajairwa masheji:

• Upamhi hwemutsara unokwanisa kuita zvishoma uye nzvimbo -Kugona kugadzira kwechokwadi negoho rinogamuchirwa, kazhinji 30/30 µm kusvika 40/40 µm yekugadzira vhoriyamu.
• Diki yakavimbika microvia dhayamita -Kugadzirwa-kuratidzwa zviyero zvine hunoenderana plating mhando, kazhinji 50-75 µm yapera dhayamita.
• Maximum layer count ine chero-layer microvia zvimiro -Kukura kwemaitiro ezvakaomesesa stack-ups kupfuura ekutanga anoteedzana ekuvaka-up nzira.
• Ukobvu kudzora kushivirira -Kururamisa manejimendi emabhodhi ekupedzisira matete apo uchichengetedza kugadzikana kwemichina uye flatness zvinodiwa.

Quality Verification uye Mutengo Kufunga

Sample board qualification inofanirwa kusanganisira yakazara-muchinjika-sectional ongororo yekuona mhando yemhangura yeplating, dielectric ukobvu kufanana, uye kurongeka kwekunyoresa, ukuwo X-ray imaging inoratidza yemukati kuburikidza nemhando uye inogona kuvharika. Yemagetsi bvunzo yedhata inoratidza impedance kutonga kwechokwadi uye inopisa bhasikoro bvunzo data (kazhinji -40 ° C kusvika +125 ° C ye500-1000 macycles) inosimbisa kusimba kwemechani yeSubstrate-Senge PCB zvivakwa.

Kufunga kwemitengo yeSLP kunowanzo kuisimisa 40-80% pamusoro peyakaenzana dhizaini HDI mabhodhi nekuda kwehunyanzvi maitiro uye zvigadzirwa, ine nguva dzekutungamira dzinowedzera mavhiki maviri-4 kupfuura yakajairwa HDI, kunyangwe vhoriyamu kugadzirwa kunofambisa kuderedzwa kwemutengo sezvo goho rinowedzera.

mhedziso

Substrate-Senge PCB (SLP) tekinoroji inovhara mukaha uripo pakati peHDI neIC substrate mhinduro, ichigonesa Ultra-yakanaka nzira, compact marongero, uye yakavimbika yekubatanidza kune inotevera-chizvarwa zvigadzirwa zvemagetsi. Kusanganiswa kwayo kwemSAP kugadzirisa, tekinoroji yemicrovia, uye zvigadzirwa zvepamberi zvinopa kuwanda uye kuita madhizaini emazuva ano anodiwa pamafoni ese, zvinopfeka, uye akakwira-kumhanya komputa module.

Highleap Electronics inonyanya kugadzira nekugadzira maPCB , ichipa mhinduro dzakakwana kubva pakugadzira maPCB kusvika pakugadzira kwakazara:

• Yakakwana SLP kugadzira -Kutsigira kwakazara kune yakanaka-mutsara (≤30 µm) uye microvia (≤75 µm) zvimiro.
• Maitiro akajeka -Mafekitari ekugadzira mavhidhiyo uye yakadzama yekugona mishumo yekusimbisa engineering.
• DFM uye rutsigiro rwehunyanzvi -Nyanzvi dhizaini mhinduro kukwidziridza kuvimbika, goho, uye mutengo wakanaka.

Uri kuda kuongorora kana kugadzira maPCB akafanana neSubstrate here? Bata Highleap Electronics kuti uwane mhinduro dzedu dzekugadzira dzeSLP kubva pakutanga kusvika pakupedzisira uye uve nechokwadi chekuti magadzirirwo ako emhando yepamusoro anoita zvese zviri zviviri kushanda uye kugona kugadzirwa.

Mibvunzo Inonyanya Kubvunzwa

1. Inogona Substrate-SePCB zvachose kutsiva IC substrates?
Nepo SLP ichiswedera kuita substrate-level kuita muzvinhu zvakawanda, echokwadi IC substrates ichiri kuchengetedza mabhenefiti muhukuru hwekupedzisira saizi (pazasi pe20 µm L/S), mapakeji-chaiwo mhango maumbirwo, uye yakanyanyisa yakakwirira layer inodarika gumi nemaviri akaturikidzana. SLP inoshandisa zvikumbiro uko substrate performance inodiwa asi yakazara substrate mutengo uye nguva yekutungamira haina kurongeka.

2. Ndeapi akajairwa mashoma mutsara upamhi uye spacing kugona kune Substrate-SePCB?
Kugadzira SLP kugona kunowanzo kubva pa30/30 µm kusvika 40/40 µm yehupamhi hwemutsara uye kupatsanurana, nemaitiro epamberi ekuwana 25/25 µm. Kugona kwacho kunosiyana nemugadziri uye kunofanirwa kusimbiswa panguva yekukodzera kwemupi, sezvishoma zvakashambadzwa zvinogona kuratidza kugona murabhoritari kwete goho rekugadzira.

3. Ko Substrate-Kufanana nePCB mutengo unoenzaniswa sei neHDI neIC substrates?
SLP inowanzoita 40-80% kupfuura inofananidzwa HDI mabhodhi nekuda kwemSAP maitiro uye zvigadzirwa zvehunyanzvi, ichisara 50-70% isingadhuri pane yechokwadi IC substrates. Kugadzirwa kwevhoriyamu uye dhizaini dhizaini inogona kukanganisa zvakanyanya mutengo wekupedzisira, zvichiita kuti kutanga kwevatengesi kuve kwakakosha kune zvirongwa zvinodhura.