Kugadzira PCB yeRO3003G2 ye77 ne79 GHz

Kugadzira PCB dzeRogers RO3003G2 muChina dzeMabhodhi eRadar e77-79 GHz

Kutarisa kwe77/79 GHz kunoita kuti kudzokorora kwehukuru hwechinhu kuve kwakakosha kupfuura tsananguro yezvinhu zvakajairika. Peji rino rinotarisa pane zvakapedzwa, RF geometry yakanaka, bhodhi, kunyoreswa, mamiriro epamusoro uye kuongororwa kunodiwa kuti udzokorore dhizaini yeradar yakaburitswa.

Mufananidzo 1. Kugadzirwa kweRogers RO3003G2 PCB muChina ye77-79 GHz Radar Boards

Kugadzirwa kwePCB yeRO3003G2 yemabhodhi eradar e77 ne79 GHz hakurevi mukana wekufungidzira kwekugadzirwa kwakajairika. Kureba kwekudya, ukobvu hwe dielectric, tsananguro yemupendero wemhangura uye kuburikidza nejometri zvese zvinogona kukanganisa maitiro ekupedzisira eRF panguva ino. Kureba kwezvinhu: Highleap Electronics ndiyo mugadziri wePCB uye muunganidzi wekuvaka kwakatsanangurwa pano. Rogers nemazita egiredhi anotsanangurwa anoratidza zvinhu zvakatsanangurwa uye haasi tsananguro yekugadzira zvinhu zveHighleap. Kufungidzira kwekurasikirwa neconductor kunofanirwa kuenderana nesarudzo yemhangura isina kunyatsojeka yemabhodhi eRF , kusanganisira kuvaka kwefoil chaiyo kwakarairwa kuvaka.

Highleap Electronics inopa Rogers RO3003G2 PCB kugadzira uye PCB assembly yemabhodhi eradar ane frequency yakakwira, maRF front-end modules, ma antenna circuits uye ma Rogers hybrid stackups.

Tumira Gerber yako, ODB++, stackup, Rogers material callout, zvinodiwa zve impedance uye huwandu hwaunoda. Highleap Electronics ichaongorora kuwanikwa kwezvinhu, kugona kugadzira, RF-critical dimensions, PCBA scope uye sarudzo dzenguva yekutora zvinhu usati watenga.

Kugona Kugadzira PCB yeRO3003G2

Mapurojekiti eRogers RO3003G2 PCB anoda zvinopfuura kugadziriswa kwebhodhi repamusoro-soro. Chivako chinofanira kuchengetedza RF geometry, kuenderana kwezvinhu, copper profile, mhando yekuboorera, kupedzisa kwepamusoro uye kudzora mativi kubva kumasampuru einjiniya kuburikidza nekugadzirwa kwakadzokororwa. Saka ongororo yeHighleap's DFM inotarisa pakuvakwa kweRF layer uye kushivirira mativi kunogona kuchengetwa mukugadzirwa. CAM nehurongwa hwekuongorora zvinofanirwa kuratidza magumo akafanana akapedzwa anoshandiswa nechikwata chekugadzira. Hunhu chaihwo hwezvinhu hunofanirwa kuongororwa zvichienderana nemagwaro emutengesi aripo egiredhi rakatarwa uye kuvaka.

Highleap Electronics inotsigira kugadzirwa kweRogers RO3003G2 PCB ye:

  • Mabhodhi eantenna eradar e77 GHz ne79 GHz
  • ADAS radar modules uye RF front-end circuits
  • Kaneti yekubatanidza, network yekudya uye MIMO antenna PCBs
  • RO3003G2 Rogers dzakagadzirwa nezvinhu chimwe chete kana kuti dzakasanganiswa
  • Zvigadzirwa zvemuenzaniso, zvigadzirwa zvidiki, zvekutanga uye zvakarongwa
  • Kuungana kwePCB kwemamodule eRF anoda SMT, kuongororwa, kuwanikwa uye kugadzirira bvunzo

Highleap inogona kungoongorora kugadzirwa kwePCB isina chinhu chete kana chirongwa chakazara chePCBA chinosanganisira kuwanikwa kwezvikamu, kuunganidzwa kweSMT, kuongororwa uye kugadzirira bvunzo dzinoshanda. Mapeji ekushandisa ane chekuita nekushandiswa anosanganisira kugadzirwa kwePCB yeradar yemotokari uye kugadzirwa kwePCB yeradar ye millimeter-wave.

Ongororo yeZvinhu, Stackup uye RF Layer

Kudanwa kwezvinhu zveRO3003G2, stackup uye RF layer position zvinofanirwa kusimbiswa mutengo usati wapera uye nguva yekutungamirira. Ongororo iyi inoongorora kana RO3003G2 ichidikanwa pabhodhi rese, antenna layer chete, kana chikamu chekuvakwa kwehybrid nechimwe chinhu cheRogers kana chikamu chedigital-control.

Zvinhu zvakakosha zve stackup zvinosanganisira ukobvu hweRogers laminate, huremu hwemhangura, ukobvu hwebhodhi rakapedzwa, reference ground, solder mask rule, surface finish, controlled impedance uye RF-critical mechanical tolerances.

Chinhu chakaunganidzwa Ongororo yekutarisa Manufacturing impact
Kutsvaga zvinhu Zita chairo rezvinhu zveRogers, ukobvu hwe laminate, rudzi rwemhangura uye mitemo inotenderwa yekutsiva. Inodzivisa kushandisa RO3003, RO4350B kana chimwe chinhu kana dhizaini yacho ichida RO3003G2.
Nzvimbo yeRF layer Chigadziko cheAntena, chigadziko chenetwork yekudyisa, nzvimbo yekureferensira uye chero zvikamu zvedhijitari/zvekutonga. Inodzora maitiro eRF, grounding uye hybrid stackup facility.
Mhangura uye kupedzisa Huremu hwemhangura, chimiro chemhangura, kupedzisa kwekupedzisira uye zvinodiwa pamusoro peantenna. Inokanganisa kurasikirwa kweRF, kugona kusungirirwa uye kuenderana kwechimiro cheantenna.
Vaka zvinyorwa Kubvumidzwa kwestackup, zvinodiwa zvechitupa chezvinhu, mushumo weimpedance uye zvinyorwa zvekuongorora. Inotsigira kukodzera, kudzokorora kuvaka uye kutamisa vatengesi.

Zvimwe zvinongedzo: Rogers RO3003 PCB zvinhu, high-frequency PCB zvinhu uye copper foil uye surface finish yeRF PCBs.

Muenzaniso, Chikamu Chidiki uye Rutsigiro rweKugadzira

Mapurojekiti eradar eRO3003G2 neRF anowanzo shanduka kubva kumasampuru einjiniya kuenda kukuvaka kwekuyedza uye ozoenda kukugadzirwa kwakarongwa. Highleap Electronics inoongorora data padanho rega rega kuitira kuti kutenga zvinhu, dhizaini yemapaneru, zvinodiwa pakuongorora uye kugadzirira kwePCBA zvirambe zvakaenzana.

  • Zvivakwa zvemuenzaniso: Tarisa pakusimbisa zvinhu, kugona kugadzira zvinhu, saizi yemagadzirirwo eRF uye kugona kugadzira zvinhu.
  • Zvivakwa zvidiki: tarisa pakudzokororwa, zvinyorwa zvekuongorora, hurongwa hwemakuponi, maitiro ekugadzira uye kugadzirira bvunzo.
  • Zvivakwa zvekugadzira: tarisa pakuronga zvinhu, kuwanda kwezvishandiso, magwaro emhando yepamusoro, kurongedza uye purogiramu yekuburitsa zvinhu.
  • Kugadzirwa kwekutamisa kwevatengesi: enzanisa zvakaunganidzwa kare, zvinyorwa zvekuongorora uye zvinyorwa zvekugadzira nenzira itsva yekugadzira.

Kune vanogadzira zvinhu zvinoenderana nenguva, RFQ package yakakwana ndiyo nzira inokurumidza yekusimbisa mutengo nehurongwa. Kushaikwa kwezvinhu, ruzivo rwekuunganidzwa, RF tolerances kana mafaira ePCBA zvinogona kunonotsa ongororo.

Kudzora Kugadzirwa kweAntena yeRadar ye77/79 GHz

RO3003G2 inowanzo shandiswa muma 77/79 GHz radar antenna circuits apo marongerwo ePCB ari chikamu cheRF performance path. Trace geometry, patch antenna dimensions, feed network structure, edge profile uye ground reference zvinofanirwa kudzorwa panguva yekugadzira.

Highleap Electronics inoongorora zvinhu zvakakosha zveRF isati yagadzirwa:

  • Zviyero zvechigamba cheantena: kushivirira kuchekwa kwesimbi uye muripo wemhangura zvinofanirwa kuenderana neRF drawing yakatenderwa.
  • Maitiro e network yekudya: upamhi hwetrace, nzvimbo, makotama uye kushanduka zvinofanirwa kutevedzera dhizaini yakaburitswa.
  • Nzvimbo yekutarisa: Kuenderera mberi kwepasi, kuburikidza nefenzi uye maburi endege kunofanirwa kuongororwa kutenderedza nharaunda yeantenna.
  • Purofayi yemupendero: mipendero yakarongwa, nzvimbo dzinoiswa tambo, mipendero yakaiswa jira kana nzvimbo dzinoiswa tambo dzinobatanidza tambo dzingada kudzorwa kwakasimba kwemuchina.
  • Maburi emasiki eSolder: Nzvimbo dzeRF dzingada mitemo chaiyo yekuvhura masiki, kuvhura kana kuchengetedza masiki.

Kuti uwane misoro yeRF iri pedyo, ona kugadzirwa kwePCB ine frequency yakakwira uye kufungwa nezvekugadzira PCB ine frequency yakakwira.

Rogers RO3003G2 PCB

Mufananidzo 2. Rogers RO3003G2 PCB

Sarudzo dzeHybrid Rogers Stackup

Mazhinji ma module eradar neRF haadi RO3003G2 pane imwe neimwe layer. RO3003G2 inogona kushandiswa kune antenna kana RF layer nepo imwe Rogers material kana digital-control section ichishandiswa kune mamwe layer. Chinangwa ndechekuchengetedza mashandiro eRF akagadzikana uku uchidzora mutengo, ukobvu, maitiro ekugadzira uye nguva yekutungamirwa kwezvinhu.

Ma "hybrid stackups" anofanirwa kuongororwa kuti aone kana lamination inoenderana, maitiro eCTE, zvinhu zvinobatanidza, nzvimbo dzekutarisa, njodzi yekudonha kwepage uye shanduko yeRF-to-digital.

Rudzi rwekuunganidzwa Chaizvoizvo kushandiswa Ongororo yekugadzira
Laminate yeRF imwe chete Bhodhi reAntena kana bhodhi reRF repamberi uchishandisa RO3003G2 senzvimbo huru yekushandisa. RF geometry, mhando yemupendero, kupedzisa uye kutonga kwemativi.
RO3003G2 + RO4350B Radar module ine RF antenna layer uye digital/control section muPCB imwe chete. Lamination, bonding layer, warpage uye RF-to-digital transition.
Chikamu cheRO3003G2 + FR-4 Mamodule anodzorwa nemutengo ane RF yakaparadzaniswa uye nzvimbo dzekudzora dzinomhanya zvishoma. Kuenderana kwezvinhu, kuenzana kwemakanika uye mamiriro emusangano.
Zvimwe zvikamu zveRogers Magadzirirwo anobvumira Rogers kushandisa imwe nzira kana kuti chirongwa chekugadzira zvinhu zviviri. Kutenderwa kwevatengi kunodiwa usati wachinja fungidziro dzeRF.

Kuti uwane zvimwe zvinhu zvine chekuita nazvo, ongorora kugadzirwa kweRogers RO4350B PCB, zvinhu zveRogers PCB uye zvinhu zveFR-4 neRogers hybrid PCB.

Impedance, Edge Profile uye RF Details

Mabhodhi eradar eRO3003G2 anogona kusanganisira zvinhu apo kusiyana kudiki kwekugadzirwa kunokanganisa maitiro eRF. Ongororo yekugadzira inofanirwa kufukidza kudzorwa kweimpedance, chimiro chemhangura, mhando yemupendero wenzira, geometry yekuburitsa, kuburikidza nefenzi uye sarudzo yekupedzisa.

  • Kudzorwa impedance: kukosha kwakatarwa kunofanirwa kuenzaniswa nechikamu chekupedzisira chemuunganidzwa, ukobvu hwemhangura uye chirongwa checoupon.
  • Maumbirwo ekuburitswa kweRF: Kuburitswa kweconnector, nzvimbo dzekupa simba kana shanduko dzewaveguide zvinogona kuda kudzora nzira yekufambisa zvinhu (routing) uye kudzora ma plating.
  • Rondedzero yebhodhi: mipendero yeantenna, nzvimbo dzinochengeterwa antenna nenzvimbo dzinochengeterwa antenna dzinofanira kutevedzera zvinodiwa nevatengi pakushivirira michina.
  • Kuburikidza nefenzi nepasi: RF ground via patterns inofanira kuongororwa kuti inokwanisa here kuboorwa uye kuti yakanyoreswa here.
  • Surface kupera: Kusarudzwa kwekupedzisa kunofanirwa kufunga nezvekugona kusundirwa, kuchengetwa, kuunganidzwa uye zvinodiwa neRF region.

Zvinobatsira zvinosanganisira kugadzirwa kwePCB inodzorwa , kuputira madziro ePCB uye ENEPIG vs ENIG surface finish.

PCBA, Kuongorora uye Rutsigiro rweKuyedza

Highleap Electronics inotsigira kugadzirwa kwePCB isina chinhu yeRO3003G2 uye maRF PCBA akabatanidzwa. Kana zvichidikanwa, PCB stackup, surface finish, solder mask, connector placement uye nzira yekuongorora zvinofanirwa kuongororwa pamwe chete neBOM ne test plan.

Rutsigiro rwegungano

  • Musangano weSMT weRF front-end ICs, MCUs, zvishandiso zvemagetsi, zvinobatanidza uye network dzisingashande
  • Kuungana kwekubatanidza kwekubatanidza bhodhi-ku-bhodhi, RF, mupendero, mota kana tsika
  • Ongororo yestencil ne solder paste yezvikamu zve fine-pitch uye thermal-pad
  • Kuongorora kweAOI, X-ray kana nyaya yekutanga zvichibva parudzi rwepakeji uye zvinodiwa nevatengi

Kutsvaga rubatsiro uye kuyedza

  • Ongororo yeBOM yenhamba dzezvikamu zvemugadziri, zvimwe zvinotenderwa uye zvimwe zvisingatsiviwe
  • Mhando dzezvikamu zvine chikamu che "partial-turnkey", "full-turnkey" kana "consigned component models"
  • Rutsigiro rwepurogiramu kana mafaira efirmware uye maitiro apihwa
  • Kugadzirira bvunzo dzinoshanda zvinoenderana nemaitiro emutengi, zvinodiwa nevatengi, uye zvinodiwa zvekupasa/kukundikana

Kuti uwane mapeji ane chekuita nePCBA, ona turnkey PCB assembly , electronic component sourcing uye functional testing yePCB assemblys.

RO3003G2 PCB RFQ Package

Pakeji yakazara yeRFQ inobatsira Highleap Electronics kusimbisa nzira yezvinhu, maitiro ekugadzira, chiyero chePCBA, mutengo uye nguva yekutungamira nekupfupisa kujekesa.

  • Mafaira ekugadzira eGerber X2, ODB++ kana IPC-2581
  • Faira rekuboorera reNC rine saizi dzemaburi, maburi akaiswa mapuranga, maburi asina mapuranga uye matenderi
  • Dhirowa rakarongwa rine Rogers RO3003G2 callout yezvinhu uye chero callout yezvinhu zvakasanganiswa
  • Kurema kwemhangura, ukobvu hwebhodhi rakapedzwa uye zvinodiwa pakupedzisa pamusoro
  • Tafura ye impedance inodzorwa uye manotsi eRF-critical dimension
  • Antena yekubatanidza, RF feed, edge profile, slot kana plated-edge zvinodiwa kana zvichibvira
  • Mitemo yemasiki eSolder yenzvimbo dzeRF nenzvimbo dzekuungana
  • BOM, CPL uye dhizaini yemusangano kana PCBA ichidikanwa
  • Kuongorora, bvunzo, magwaro, kurongedza kana zvinodiwa zvemhando yepamusoro
  • Huwandu hwemuenzaniso, nguva yakatarwa uye huwandu hwekugadzirwa hunotarisirwa

Highleap Electronics inogona kuongorora mapurojekiti eRogers RO3003G2 PCB ekugadzira mapurojekiti emhando yepamusoro, diki, kuchinjisa kugadzirwa kana turnkey PCBA.

Tumira Mutengo weRogers RO3003G2 PCB kana kuti bata Highleap Electronics kuti uwane zvinhu, stackup, RF design, PCBA kana production-transfer review. Kune RFQ, ipa radar band, board thickness, layer stackup, copper, finish, RF acceptance limits uye huwandu. Prototype kana chinhu chekutanga chinogona kurongwa zvichienderana nezvinhu zvinogona kukanganisa mhedzisiro ye77/79 GHz.

get-instant-quote

varumbidzwa Posts

Nzira yekuwana sei quote yePCBs

Ngatiite ongororo yeDFM/DFA kwauri tobva tadzoka kwauri nemushumo. Unogona kurodha mafaira ako zvakachengeteka kuburikidza newebhusaiti yedu. Tinoda ruzivo runotevera kuti tikupe mutengo:

    • Gerber, ODB++, kana .pcb, spec.
    • BOM rondedzero kana iwe uchida kusangana
    • uwandu
    • Kuchinja nguva
Pamusoro pekugadzira PCB, isu tinopa huwandu hwakakwana hwemagetsi masevhisi, anosanganisira PCB dhizaini, PCBA, uye turnkey mhinduro. Kunyangwe iwe uchida rubatsiro neprototyping, dhizaini yekusimbisa, kutsvagisa chikamu, kana kugadzirwa kwakawanda, isu tinopa yekupedzisira-kusvika-kumagumo rutsigiro kuti uve nechokwadi chekubudirira kweprojekiti yako.

Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.






    Quick Note: Chikwata chedu chinokutumira email munguva pfupi mushure mekutumira. Kuti uve nechokwadi chekuti wagamuchira mhinduro yedu, tinokurudzira kutarisa SPAM/JUNK FOLDER yako kana usingaone meseji yedu muinbox yako.