Mugadziri weTaconic RF-35 High-Frequency PCB
Highleap Electronics inogadzira maTaconic RF-35 high-frequency PCBs emafirita, macouplers, ma amplifiers, ma antennas, ma communication modules uye ma microwave control assemblies. Rutsigiro rwekugadzira runosanganisira controlled transmission-line geometry, low-profile copper review, PTH processing, precision mechanical features, RF connector assembling uye RF kana functional testing inotsanangurwa nevatengi.
Highleap inoshandura dhizaini yemagetsi inoburitswa kuita hurongwa hwekugadzira hunodzorwa hunosanganisira frequency range, stackup, Drk model, finished dielectric thickness, copper profile, critical line and gap dimensions, surface finish, connector launch uye acceptance method. Izvi zvinobatanidza zvinodiwa zveRF performance kune zvinoyerwa manufacturing controls pachinzvimbo chekuvimba nezita re laminate chete.
Hunhu hweRF-35 hweMagetsi neKugadzira
RF-35 ndeyekirasi yezvinhu zvePTFE RF zvinorasikirwa zvishoma. Pakugadzira, kukosha kwayo hakubatwi nenhamba imwe chete yeDk: mhinduro yese yedunhu inoenderanawo nehukobvu hwe dielectric, copper profile, etch shape, plated copper, solder mask, finish uye launch construction.
| mamirire | Kukosha kwekugadzirwa kweRF | Mhinduro yekugadzira |
|---|---|---|
| Low dielectric kurasikirwa | Inotsigira mafirita, network dzekudya, ma amplifiers uye nzira dze microwave uko kurasikirwa kwe conductor ne dielectric zvinodzorwa pamwe chete. | Ongorora chimiro chemhangura, kupedzisa kwenzvimbo, kureba kwenzira uye nzira yekuyera. |
| Maitiro e dielectric akagadzikana | Inotsigira kudzorwa kweimpedance uye kuenderana kwechikamu kana dhizaini yakakodzera uye ukobvu hwayo zvikashandiswa. | Bvisai zvinhu zvakakosha zvevatengi musati mabhadhara CAM. |
| Kugadziriswa kwePTFE kwakabatana | Zvinoda kubatwa kwakakodzera, kuboorwa, kugadzirira maburi uye kudzora mapuratifomu. | Bvisa vafambi vemaitiro akasiyana-siyana uye zvinodiwa zvechikamu chidiki chemukati. |
| Chinzvimbo chezvinhu zvenhaka | Kuenderera mberi kwemagetsi kunogona kutsamira pakuburitsazve chivakwa chakakodzera chiripo. | Tarisa kwakabva, nzvimbo, ukobvu, mhangura uye mvumo yekutsiva usati wagadzira. |
Highleap inobatanidza ma controls aya nemaitiro ayo ekugadzira PCB ane frequency yakakwira uye haipe miganho yekugamuchirwa kubva kudata rewebhu rakajairika.
Kugona Kugadzira PCB yeTaconic RF-35 Yakanyanya Kuwanda
RF-35 ichiri kutaurwa zvakanyanya mumadhizaini ekare ema microwave uye muraibhurari yeAGC technical-article, asi haina kunyorwa segiredhi repamusoro-soro razvino mutafura yechigadzirwa cheAGC RF/microwave. Saka Highleap inosimbisa kwainobva zvinhu zvinodzorwa uye gwaro rezvinyorwa zvisati zvaburitswa.
Kudzora Kugadzira Kunowanikwa kuRF-35 Circuits
| Nzvimbo yeprojekiti | Rutsigiro rwepurojekiti yeHighleap |
|---|---|
| Maitiro ekuongorora akakosha | Upamhi hwemutsetse hwakadzorwa, nzvimbo, mipata yakabatana, saizi ye resonator uye maficha ekuvhura |
| Impedance uye chikamu | Makuponi anoenderana nepurojekiti, zvinodiwa paTDR/kuyerwa uye kutonga kwekugadzirwa kwehurefu hwakafanana |
| Mhangura uye kupedzisa | Foil uye pamusoro pechinhu zvakatsanangurwa nemutengi zvakaongororwa kuti zvionekwe kuti kondakita yarasikirwa here, kuti inogona kusunganidzwa here uye kuti inobatanidza sei. |
| PTH uye kugadzika pasi | MaRF ground vias, mafenzi akakora, nzvimbo dzekubatanidza uye kuongororwa kwechikamu chidiki chemagetsi |
| Kubatanidzwa kwemuchina | Nzvimbo dzakasimba dzekubatanidza, marongero akarongwa, maburi, ma countersink kana maficha e hardware kana zvatsanangurwa |
| Kuungana/bvunzo | MMICs, QFN, RF passives, connectors, nhoo, X-ray uye RF kana bvunzo inoshanda inotsanangurwa nemutengi |
Highleap Rigid RF PCB Kugadzira Kugona
Miganhu yeHighleap yakaburitswa-rigid-PCB inopa chigadziko chekugadzira RF-35. Kune ma microwave circuits, upamhi hwemutsara wakakosha, gap rakabatana, ukobvu hwe dielectric, copper profile uye connector geometry zvinoburitswa kuburikidza neprojekiti-specific DFM pane kufungidzirwa kubva kumiganhu yepamusoro yefekitori. Ona tafura yakazara yeHighleap rigid PCB yekugona kuti uwane tsanangudzo yefekitori yakaburitswa.
| Chinhu chekugadzira | Kugona kwakabudiswa kweHighleap | Mamiriro epurojekiti yeRF/PTFE |
|---|---|---|
| Maximum layer count | Kusvikira ku60 layer | Kuwanda kwezvikamu zveRF/PTFE kana hybrid stackup kunosimbiswa mushure mekuiswa kwelamination, kunyoreswa, kuburikidza nekuongorora zvinhu. |
| Nzvimbo/nzvimbo shoma yemukati mechikamu | 2/2 mirimita (0.05/0.05 mm) | Maitiro eRF akaburitswa anoenderanawo nekukora kwemhangura, rudzi rwefoil, muripo we etch uye kushivirira kwehukuru hwakakosha. |
| Nzvimbo/nzvimbo shoma yekunze | 2/2 mirimita (0.05/0.05 mm) | Maburi madiki eRF uye maumbirwo akabatana zvinoda kuti purojekiti ishande uye kuti zviongororwe zvinoenderana nezvinodiwa. |
| Board ukobvu siyana | 0.2-8.0 mm | Ukobvu huripo hwekuvaka Taconic/AGC hunoenderana negeji ye laminate, nzira yekubatanidza uye stackup inotenderwa. |
| Kushivirira ukobvu hwebhodhi | ± 0.1 mm pasi pe 1.0 mm; ± 10% pa 1.0 mm zvichikwira | Kuburitswa kweRF connector uye enclosure interfaces zvinofanira kutaura chero chinhu chakaoma chinodiwa padanho rechigadzirwa. |
| Saizi shoma yebhodhi rapera | 10 × 10 mm | Maseketi madiki anogona kuda kutumirwa mupaneru yekugadzira kana array kuti igadziriswe uye iunganidzwe. |
| Saizi yepamusoro yebhodhi yakapedzwa | 22.5 × 47.5 mu (571.5 × 1206.5 mm) | Mabhodhi ePTFE ane mafomu makuru anoda kuongororwa kwakasiyana kwehukuru hwepepa rezvinhu, kunyoreswa, kuti rakatsetseka sei, kuti zvinhu zvinofambiswa sei uye kuti zvinotumirwa sei. |
| Mhete shoma yemuchina yekuboorera / mhete yeannular | 0.15 mamirimita / 0.127 mm | Dhizaini yekupedzisira inoenderana nekukora kwebhodhi, chiyero cheaspect, zvinodiwa pakuputira uye maitiro ekuboorera anoenderana nezvinhu. |
| Mhete shoma yelaser / annular ring | 0.075 mamirimita / 0.075 mm | Ma microvia eLaser anogona kuenzaniswa nehukobvu hwe dielectric, dhizaini ye capture-pad, kuvakwa kwemhangura uye ongororo ye sequentially-lamination. |
| Chiyero cheMechanical-drill | Kusvikira ku 20: 1 | Chiyero chinogoneka chekuvaka RF/PTFE chinofanira kusimbiswa nehukuru hwegomba hwakapedzwa, ukobvu hwebhodhi uye zvinodiwa zveplating. |
| Chiyero cheLaser-drill | 1:1 | Microvia geometry inoburitswa chete mushure mekuongororwa kwe stackup uye kuvimbika. |
| Mhangura yepamusoro yemukati/yekunze | Kusvikira 10 oz | Mhangura yepamusoro haigone kusanganiswa otomatiki nenzvimbo/nzvimbo yakanakisisa kana PTFE yega yega yakagadzirwa. |
| Kushivirira kwePTH / NPTH | PTH ±0.075 mm; NPTH ±0.05 mm | Maburi ekubatanidza neRF grounding anofanira kuratidza dhayamita rakapedzwa uye chero chinhu chipi zvacho chinodiwa kuti chikwane. |
| Kushivirira kwenzvimbo dzakaita sedenderedzwa | ± 0.1 mm | Maburi emumucheto, maburi, nzvimbo dzinopinzwa uye nzvimbo dzinobatanidza zvinogona kuda hurongwa hwakatsaurirwa hwekudzora mativi. |
| Kushivirira kweimpedance inodzorwa | Imwe chete uye musiyano: ±5 Ω pa ≤50 Ω; ±7% pamusoro pe50 Ω | Kushivirira kwakataurwa kunoshanda kune stackup yakatenderwa, nzira yekukuponi uye nzira yekuyera. |
| Kupera kwepamusoro kunowanikwa | ENIG, ENEPIG, OSP, HASL, sirivha yekunyudza, gaba rekunyudza, goridhe rakapenya, minwe yegoridhe rakaoma negoridhe | Kusarudzwa kwekupedzisira kunoongororwa kuti uone kurasikirwa kweRF, kusungirirwa, kubatana kwewaya, kubatana kweconnector uye zvinodiwa zvakatipoteredza. |
Ziviso yekugona-kusanganisa: kukosha kuri patafura imiganhu yekugona kwemufekitori wega wega. Kuwanda kwezvikamu, 2/2 mil geometry, 10 oz copper, saizi yepamusoro yepaneru, 20:1 aspect ratio uye kuvakwa kwebhodhi rakatetepa hazvifungidzirwe kuti zvinogoneka panguva imwe chete. Highleap inosimbisa musanganiswa unoshandiswa mushure mekuongorora chaiwo material, stackup, copper, drill, RF tolerance, surface finish uye assembly package.
Highleap inogadzira maRF-35 high-frequency PCBs e antennas, filters, couplers, splitters, combiners, power-amplifier circuits, RF front ends, test fixtures uye mixed RF/control modules. Zvivakwa zvinogona kusanganisira microstrip, stripline mu hybrid constructions, grounded coplanar waveguide, coupled lines, via fences, plated edges, cavities, connector launches uye controlled mechanical reference features, zvichienderana nekubvumidzwa kweDFM.
Chirongwa ichi chinoongororwa kuburikidza neHighleap's high-frequency PCB controls. Mainjiniya eCAM anoona ma transmission-line layers, critical line/gap dimensions, phase-matched features, RF grounds, launch transitions, isolation structures uye chero miganhu inofanira kuyerwa zvakasiyana neyakajairika PCB tolerances.
| Chinhu chedunhu | Kutarisisa kugadzirwa kwezvinhu | Humbowo hunogona kutsanangurwa |
|---|---|---|
| Microstrip kana CPWG | Ukobvu hwe dielectric, upamhi hwemutsetse, gap repasi, profile yemhangura, mamiriro emasiki | Maumbirwo eCoupon kana echapupu, kuyerwa kwemutsetse/mukaha, mushumo weimpedance. |
| Chimiro chefirita chakabatana | Kufanana kwemukana, kusarura kwemavara, kunyoresa, geometry yekona | Mushumo wechikamu chakakosha uye kuongororwa kwechinyorwa chekutanga. |
| RF kuburikidza nefenzi | Nzvimbo yegomba, dhayamita rakapedzwa, mhangura, nzvimbo uye kuenderera mberi kwevhu | Kuedzwa kwemagetsi, kupatsanurwa kwechikamu chidiki uye kutorwa kwemasampuli emhando dzakasiyana. |
| Kutanga kwekubatanidza | Geometry yepad, nzvimbo yemucheto, ukobvu hwebhodhi, plating uye kushivirira kwemuchina | Kukwana kwechinongedzo chekutanga uye mushumo wekuona/wezvikamu. |
| Hybrid RF/digital stackup | Kubatana, kuyerera kwe resin, ukobvu hwese, shanduko yeRF uye nzira yekudzoka | Ruzivo rwakatenderwa rwekuunganidzwa, kupatsanurwa kwezvikamu zvishoma uye kuvharwa kweimpedance. |
Kucheka, Mbiri yeMhangura, uye Kuenderana Kwehurefu hwePase
Pa microwave frequency, bhodhi rinogona kupasa bvunzo yekuenderera mberi asi richikundikana kuisa-kurasikirwa, chikamu kana zvinodiwa zvekufananidza. Saka Highleap inobata mafambiro emuchina wekufambisa uye pamusoro pemhangura sezvinhu zvinoshanduka pakugadzirwa, kwete zvinhu zvekushongedza.
- Mari yeunyanzvi inosarudzwa zvichienderana nehuremu hwemhangura, plating, circuit density uye zvakataurwa Kushivirira kweRF PCB.
- Mhangura isina kunyatsogadzirwa zvakanaka, yakagadziriswa shure kana yakamonerwa inoongororwa kana kurasikirwa neconductor kwakakosha; shandisa iyo gwara repamusoro-soro remhangura foil nezvemamiriro ekugadzira.
- Makomba akabatana akakosha uye saizi ye resonator zvinogona kuiswa pachirongwa chekuyera chekutanga pane kungovimba nekuongororwa kwepaneru chete.
- Ukobvu hwemhangura hwakapedzwa hunobatanidzwa mumuenzaniso we impedance nehupamhi hwemutsara nekuti plating inoshandura chikamu chemuchina.
- Mask inosungirirwa pamusoro pemitsetse yemagetsi inodzorwa zvichienderana nemuenzaniso wekugadzira; haiwedzerwi kana kubviswa pasina mvumo.
- Kurongeka kwepaneru nenzvimbo yekuponi zvinorongwa uko kuenderana kwechikamu kana mativi epaneru yekugadzira kwakakosha.
Highleap inoongororawo hukama huripo pakati pemhando yekugadzira uye kukosha kwekugadzirwa kwakatsanangurwa mu dielectric constant uye loss tangent . Kukosha kweDk yekare hakuna kukwana kuburitsa circuit yakakosha; nzira yekuverenga inotenderwa nevatengi uye kuvaka zvinodzora geometry.
Kusapindirana, Kurasikirwa Nekuisa, uye Zvinodiwa zvePIM Yakaderera
Kudzora kusingadzorwi kunotsanangurwa nechimiro chemutsetse wekutumira, chinangwa, kushivirira, frequency yekuyedza uye hukama hwemakuponi. Highleap's RF impedance-control process inoongorora ukobvu hwe dielectric, mhangura, upamhi hwemutsetse, nzvimbo yevhu, plating uye mamiriro emasiki data risati raburitswa.
Kurasikirwa kwekuisa, kurasikirwa kwekudzoka, chikamu uye PIM hazvibatanidzwi otomatiki mukotesheni isina bhodhi. Kana zvichidikanwa, RFQ inofanira kutsanangura nzira yekuyedza, bhendi rema frequency, dhizaini kana chinobatanidza, nzvimbo yekuenzanisa, huwandu hwesampuro uye muganho wekugamuchira. Highleap inogona kuronga bvunzo dzeRF dzakatsanangurwa nevatengi kana kuendesa mabhodhi akagadzirirwa gadziriro yebvunzo inokodzera yemutengi.
| kudiwa | Ruzivo runodiwa paRFQ | Mhinduro yekugadzira |
|---|---|---|
| Kudzora impedance | Kuunganidza zvinhu, chimiro, chinangwa, kushivirira uye nzira yekuyera | Geometry yekugadzira, coupon, chiyero cheTDR/VNA uye mushumo. |
| Insertion kurasikirwa | Kuwanda kwemutsara, kureba kwemutsetse, kutanga/kugadzira, kugadzirisa uye muganho | Nzira yekuedza mota kana kuti nzira yekupedza bhodhi yakabvumiranwa musati mashandisa maturusi. |
| Kufananidza zvikamu | Mambure akaenzana, mafrequency, delta inobvumirwa uye geometry yekutarisa | Chirongwa chehukuru hwakakosha uye kuenderana kwezvikamu. |
| Kupindirana kwekuchinja kusingashande | Mafambiro ekutakura, simba, kurongeka, muganho, chinongedzo uye chiyero chekuchena | Zvinhu, mhangura, kupedzisa, kuungana uye kudzora bvunzo zvakabatana nenzira yakatarwa. |
| Kuzviparadzanisa/kutaura nevanhu | Maumbirwo emurwisi/munhu akabatwa uye nzira yekuyedza | Ongororo yeMarongerwo/DFM pamwe nehurongwa hwekushivirira kugadzirwa. |
Kune zvigadzirwa zveantenna zvinonzwa PIM, Highleap inoshandisa dhizaini uye kudzora zvinhu zvinotsanangurwa mukugadzirwa kwePCB yePIM yakaderera uye kusarudzwa kwezvinhu zvePIM yakaderera.
Kudzora Kwemakanika uye Kwakaputirwa-Kuburikidza-Maburi kwePTFE Boards
RF-35 inobatanidzwa nekugadzirwa kwePTFE-based high-frequency. Kugadzirira maburi, kuaita kuti activate, kunamira maplate, rutsigiro rwenzira uye kubata zvinhu zvinoda nzira yakaenzana nelaminate chaiyo. Highleap inosimbisa zvinhu zvakapihwa uye gwara rekugadzirisa usati watanga maitiro ePTH.
Kuramba Kuchinjwa Kwemagetsi Pasina Kutenderwa
Kana masheya ekare eRF-35 akashomeka, Highleap inoparadzanisa dambudziko rekugovera kubva kusarudzo yemagetsi. Imwe nzira inokurudzirwa haiburitswe kusvika mutengi aongorora modhi yeDk, kurasikirwa, ukobvu, mhangura, mhinduro yechikamu, maitiro ePTH, kutevedzera mitemo uye chero shanduko yehunyanzvi kana yekugadzirisa.
- Zviyero zvekuboorera uye miganhu yekuchinja maturusi zvinosarudzwa pahukuru hwe laminate, mhangura negomba;
- Kugadzirira maburi pamadziro kunoenderana nezvinhu zvakaongororwa pane kukopwa kubva kuFR-4;
- mhangura isina magiya uye mhangura yemagetsi inodzorwa zvichienderana nezvinodiwa zvemaburi nemhangura yakapedzwa;
- zvikamu zvidiki zvinomiririra zvinotsanangurwa zvezvivakwa zvine njodzi huru kana zvirongwa zvemhando yepamusoro yechibvumirano;
- routing uye depanelization inotsigira macircuit eRF akatetepa kana anonzwa nemakanika;
- Zvinobatanidza mativi emucheto, macastellations, mipendero yakaiswa jira, mipata uye mabhodhi anogadziriswa zvinoongororwa kuti zvionekwe kuti zvinogoneka kugadzirwa sei uye kuti zviyero zvekupedzisira zvinoonekwa sei.
Kuburikidza nekuisa kunogonawo kukanganisa RF return current uye resonance. RF PCB kuburikidza nedhizaini inopa mamiriro edhizaini, ukuwo ongororo yekugadzirwa kweHighleap ichisimbisa zvinogona kubatwa uye kuyerwa pa stackup chaiyo.
Kuunganidzwa kweRF Devices, Connectors, uye Shields
Highleap inounganidza mabhodhi eRF-35 ane ma "fine-pitch passives", maQFN/LGA packages, maRF transistors, ma mixers, ma filters, ma "oscillators", ma "shielding frames", ma "coaxial connectors" uye michina. Nzira yekubatanidza inosarudzwa kubva kuBOM, dhizaini yekupisa, magumo emapakeji uye zvinodiwa zveRF grounding.
| Njodzi yekuunganidza | Kudzora kweHighleap |
|---|---|
| Mapedhi makuru akavhurika | Dhizaini yekuvhura stencil, kudzora kuumbwa kwehuwandu hwemapepa, kuburikidza nekurapa, kuyerera kwemvura uye kugamuchira X-ray. |
| RF connectors pamucheto webhodhi | Rutsigiro rwezvigadziko, kudzora ukobvu hwebhodhi, kurongeka kwekuburitswa kwechinhu, solder fillet uye kuongorora kwemuchina. |
| Zvishandiso zvinoparadzira kupisa | Kutsetseka, zvinhu zvekushandisa, kutevedzana kwe torque uye kudzora kusvibiswa. |
| Ma "RF passiv" akanaka | Kurongeka kwenzvimbo, kurongeka kwezvikamu, kutonga kwekunama uye zvinodiwa neAOI/nemaoko. |
| Nhoo uye machira | Kubatana, nzira yekusonesa, mukana wekugadzirisa patsva uye kukodzera kwekupedzisira. |
| RF bvunzo interface | Edza mamiriro ekubatanidza, ratidziro yekuenzanisa uye mhedzisiro yakatevedzana kana yatsanangurwa. |
Kuongorora kunogona kusanganisira SPI, AOI, zvinoonekwa uye kuongororwa kweX-ray kwemapedhi akavigwa pasi. Maitiro ese anoenderana nebasa reHighleap reSMT PCB assembly uye RF test specification yemutengi.
Ongororo yeUinjiniya, Kuendesa, uye Mutengo weRF-35
Highleap inopa hurongwa hwakazvipira mushure mekusimbisa zvinhu, data reinjiniya, nzira yekugadzira, BOM yekuunganidza uye chiyero chekuyedza. Sarudzo dzekukurumidzira dzinoongororwa kuburikidza nekugadzirwa kwePCB nekukurumidza uye dzinogona kusanganisira kugadzirwa kwekutanga, kutumirwa kwezvinhu zvekutanga kana matanho akasiyana ebhodhi risina chinhu uye PCBA.
Kuti uwane nzira yakakwana yePCB nePCBA, Highleap inogona kusanganisa ongororo yeRF laminate neRF PCB assembly engineering uye mutengo wekugadzirwa kwepamutemo.
Nguva yekutenga inotanga neruzivo rwakakwana rweRF. Highleap inosimbisa kugadzirira kwezvinhu uye maitiro isati yapa kugadzirwa kwakajairika kana kwekukurumidzira kuburikidza nenzira yayo inokurumidza yekugadzira PCB.
Tumira Gerber/ODB++, dhizaini yekugadzira, controlled stackup, RF geometry kana impedance table, copper, finish, drill/route files, material documentation, manufacture, target date, BOM, centroid, assembly draws uye RF test method kuburikidza neHighleap Electronics . Kuti uwane rumwe ruzivo nezvemutengo wekutengesa, ona RF-35 PCB price uye lead time ; kuti uwane scope yakakwana yekugadzira, ona RF-35 PCB yekugadzira uye assembly.
Highleap inogona kugadzira macircuit eRF-35 anoenderana nechikamu here?
Ehe, mushure mekunge zvivakwa zvaenderana, modhi yekugadzira, kushivirira kugadzirwa, nzira yekuyera uye miganhu yekugamuchira zvinotsanangurwa.
Kuedza kweHighleap kunodzosa kurasikirwa here kana kuti kunodzosa kurasikirwa?
Kuongororwa kweRF kwakatsanangurwa nemutengi kunogona kuongororwa. Kuwanda, chigadzirwa, chiyero chekuenzanisa, huwandu hwemuenzaniso uye miganhu zvinofanirwa kubvumwa usati wataura mutengo.
Ko RF-35 inogona kusanganiswa neFR-4 layers here?
Kugadzirwa kwehybrid kunogona kuitika, asi zvinhu zvinobatanidza, kuyerera kwepress, kuwedzera kwekupisa, ukobvu hwese uye RF transition zvinofanirwa kugadzirwa uye kubvumidzwa.
Chii chinoitika kana zvinhu zveRF-35 zvisipo?
Highleap inoshuma mamiriro ezvinhu uye inogona kupa imwe nzira yakanyorwa yekutenderwa kwevatengi. Hapana chinotsiva chinoshandiswa pasina mvumo yakanyorwa.
Ndeapi data reRF rinofanira kuiswa mumafaira ePCB?
Zvinosanganisira huwandu hwema frequency, stackup, miganhu inodzorwa, zvinangwa zve impedance, zvinodiwa zve phase kana insertion-loss, copper uye finish, connector launch, zvinodiwa zve coupon uye nzira yekuyedza kana muganho wekugamuchira.
Ko Highleap inopa RF-35 PCB assembly uye connector here?
Ehe. Highleap inogona kutaura nezveSMT/THT assembly, RF connector uye shield installation, kuongorora, kuchenesa, kuronga mapurogiramu uye functional defined customer kana RF testing seimwe yeproduction package.
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Ngatiite ongororo yeDFM/DFA kwauri tobva tadzoka kwauri nemushumo. Unogona kurodha mafaira ako zvakachengeteka kuburikidza newebhusaiti yedu. Tinoda ruzivo runotevera kuti tikupe mutengo:
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- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.
