Yako PCB Manufacturing Nyanzvi - Highleap Electronic
Tafura yezviri mukati Ruzivo Rwakazara rweZvinhu Zviri Mukati mePCB Copper Foil: Iyo 42% Inotungamira Zvimwe Zvese Masisitimu eResin: Epoxy, PPE/PPO, BT, PTFE Girazi Fiber Machira: E-Girazi, NE-Girazi, T-Girazi, Q-Girazi Kupedzisa Pamusoro: Goridhe, Sirivha, Palladium, Tin, OSP Tungsten Carbide...
Tafura yezviri mukati Mabottlenecks matanhatu, Nguva Nhanhatu Dzakasiyana Dzekudzoreredza PPE/PPO Resin: Imwe Nzvimbo pa70% yeGlobal Supply T-Glass neQ-Glass: Nittobo's 90% Position HVLP Copper Foil: Mitsui pa90%+ Premium Share Tungsten Carbide yeDrill Bits Electronic-Grade Chemistry:...
Tafura yezviri mukati Nhamba yeMusoro: $35,100 → $116,700 paRack Nei Rubin VR200 NVL72 Inodhura $7.8 Million kubva kuODM Manera eCCL Grade: M6 → M7 → M8 → M9 Q-Glass → M10 Kuwanda kweMateru Kukwira Kwemitengo: Kubva pa22 kusvika 26 kusvika 44 kusvika 78 Materu Midplane PCB neConnectX...
Tafura yezviri mukati Nei 80% yemutengo wePCB yakavharirwa paDesign Stage Lever 1: Kukura Kwezvinhu Zvakakodzera (Rega Kutsanangura M7 Kana M6 Yakwana) Lever 2: Kuunganidzwa kweHybrid — Premium CCL Chete Pazvinokosha Lever 3: Kuverengerwa kweLayer Discipline uye 20-30% Per-Layer Rule Lever 4: DFM...
Mufananidzo 1. PCB ine nhanho gumi inomhanya yeDDR5 nePCIe routing. Tafura yeZviri Mukati Tanga neChannel, Kwete Protocol Label Zvinoitwa neData Rate - uye Hazvikuudze - Kuvaka Insertion - Loss and Discontinuity Budget Sarudza Zvinhu, Copper uye Geometry Pamwe Chete ...
Mufananidzo 1. Kuponi yekudzora impedance yePCB ine layer gumi uye kusimbiswa kweTDR. Tafura yeZviri Mukati Impedance Inodzorwa Ipfungwa Yekuunganidzwa uye Tsananguro Yemaitiro Zvinodiwa Zvinodiwa Pamberi Pekuti Trace Geometry Igone Kuburitswa Microstrip Yekupindirana Kwemagetsi Imwe Chete, Yemhando Yekusarongeka uye Yekusiyana,...
Mufananidzo 1. Kuunganidzwa kwePCB yezvikamu gumi (10 layer) ye impedance uye kuronga plane. Zviri Mukati Sarudza Architecture yezvikamu Usati Wasarudza Ukobvu hweDielectric Three Inobatsira 10 Layer Stackup Archetypes Muenzaniso weReference-Plane-Rich 10 Layer Press-Out, Copper and Impedance Closure...
Mufananidzo 1. Mitemo gumi yePCB routing yeDDR5 PCIe uye crosstalk. Tafura yeZviri Mukati Freeze the Electrical Rules Before Routing Begins Layer Assignment and Return-Path Continuity Differential Pairs: Geometry, Skew and Transitions DDR5 and Other Parallel Memory...
Mufananidzo 1. Kugona kugadzira PCB ine zvidimbu gumi. Zviri Mukati 10 Mugadziri wePCB ine zvidimbu gumi weMabhodhi Akaomesesa, Akapfava uye Akaomesa Mabhodhi Maitiro Ekusarudza Mugadziri wePCB ane zvidimbu gumi 10 PCB DFM, Kusarudzwa Kwezvinhu uye Rutsigiro Rwedhizaini Usati Wagadzirwa 10 Layer...
Mufananidzo 1. PCB yeAI server ine layer gumi ye accelerator hardware. Tafura yezviri mukati Apo PCB ine layer gumi inokodzera muAI Infrastructure Ronga Bhodhi Usati Wasarudza Stackup Accelerator Packaging, HBM uye PCB Boundary PCIe, CXL uye Ethernet Channel Engineering...