Chimurenga cheAI Server PCB che2026

Kushanduka kwePCB yeAl Server

NVIDIA Blackwell GB300 inoda maPCB layers 28-34 ane M7-grade ultra-low-loss dielectrics. Vera Rubin (H2 2026) ichawedzera ma layers neM10 zvinhu zvinodarika 40 - kuyedzwa kwakasimbiswa musi wa13 Kurume, 2026. Tsiva nemifananidzo yako yefekitori kana yechigadzirwa.

Musika wePCB wepasi rose 2026
$ 100.64B
Mordor Intelligence Ndira 2026
AI Server PCB CAGR
> 25%
vs 4.83% musika wese
NVIDIA Racks 2026
60,000 +
2x 2025 — Morgan Stanley
8 CSP CapEx 2026
> $60B
+40% YoY — TrendForce
Kudiwa Kwevanhu Vane Makore 18+ Pakuwanda
+ 18.5%
Gore regore Q1 2025 — Prismark

Musika wepasi rose wePCB wakapfuura mabhiriyoni emadhora zana nemakumi matanhatu nemana muna 2026 - chiitiko chakakosha zvikuru chinotungamirirwa neAI server uye zvivakwa zvemakomputa zvinoshanda zvakanyanya. Vashandi veHyperscale vakaisa maseva angangoita mamiriyoni zana nemazana maviri eAI-optimized muna 2025 chete, imwe neimwe ichibatanidza 8 kusvika gumi nematanhatu GPU accelerators inodarika 1.0 kW pa socket. Avhareji yeAI server PCB layer count yakakwira kubva pagumi nemasere muna 2023 kusvika pamakumi matatu nemaviri muna 2025 - kuwedzera kwe78% mumakore maviri chete.

Musi wa13 Kurume 2026, nyanzvi yezvekutengeswa kwezvinhu Guo Mingqi akasimbisa kuti NVIDIA neWus Printed Circuit vakatanga kuyedza zvinhu zveM10 CCL zvechizvarwa chinotevera vachitarisa chinhu chinoparadza chiri pasi pe0.002 — pasi pehafu yezvinhu zveM7 zviripo iye zvino. Izvi zvinoratidza kutanga kwedanho rekuvandudza iro richatsanangura zvinodiwa zveAI server PCB kusvika muna 2027 zvichienda mberi.

CHATI 1 — MUSIKANO WEPASI ROSE WEPCB
Saizi yeMusika wePCB wepasi rose 2021-2026 (USD Bhiriyoni)
Manyuko: Mordor Intelligence (kuvandudzwa kwaNdira 2026); Prismark; kubvumirana kweindasitiri
2021
$ 76.7B

2022
$ 81.5B

2023
$ 78.2B

2024
$ 87.6B

2025
$ 95.8B

2026
$ 100.64B
Gore rekutanga remadhora zana emadhora

$0
$ 50B
$ 100.64B

"Paunenge uchivandudza kubva pa400G kuenda ku800G kana 1.6T, mutengo wemaPCB hauwedzere ne20-30%. Unopetwa kaviri."

— Huadian Technology / 36Kr ongororo, Ndira 2026

Manera eTekinoroji: Maitiro Ekuti Chizvarwa Chete Chepuratifomu Chinopeta Kaviri Mutengo wePCB

Kugadzirwa kwepuratifomu yega yega yeNVIDIA kunoda maPCB akasiyana zvachose. Kufambira mberi hakusi kuwedzera - ibasa rinoda zvinhu zvitsva, maitiro matsva, uye mitengo yakakwira zvakanyanya. Pa224 Gbps (Blackwell), M7 ultra-low-loss CCL inosungirwa pa6-9x mutengo westandard FR4. Pa448 Gbps+ (Vera Rubin), zvinhu zveM9/M10 zvinodhura 15-20x FR4. Kuwedzera kwese kwesignali kunopa mutengo wakapetwa kaviri.

CHATI 2 — KUSANDUKA KWEPUROgiramu
AI Server PCB: Kuwanda kweLayer uye Kuwanda kweMitengo nePlatform
Manyuko: 36Kr; UGPCB; EIPC Ndira 2026; ongororo yaGuo Mingqi Kurume 13, 2026

H100 / H200 (Hopper) · Vhoriyamu: 2022-2024
18-24 Matanho
112 Gbps
Giredhi reCCL: M6
Bhawa rekuverenga ma layer (18-24L avhareji 21 ​​= 52.5% ye40L yepamusoro)
18-24 layita
Mutengo uchienzaniswa neH100 yekutanga
1x yekutanga

GB200 / GB300 (Blackwell) · Vhoriyamu: 2025-2026
28-34 Matanho
224 Gbps
Giredhi reCCL: M7
Bhawa rekuverenga ma layer (28-34L avhareji 31 ​​= 77.5% ye40L yepamusoro)
28-34 layita
Mutengo uchienzaniswa neH100 yekutanga
~2x — mutengo wakapetwa kaviri
M7 Ultra Low Loss CCL = 6-9x FR4 mutengo. Mwero wechiratidzo unopetwa kaviri kubva paH100.

VR200 / VR300 (Vera Rubin) · H2 2026 ramp
32-40+ Matanho + HDI
448 Gbps+
KUYEDZA M9/M10
Bhawa rekuverenga ma layer (32-40+ L = 100% yescale)
32-40+ layers + chero layers HDIMAX
Mutengo uchienzaniswa neH100 yekutanga
~ 3-4x - mutengo wakapetwa katatu / quadruples
M9/M10 CCL = 15-20x FR4 mutengo | M10 KUYEDZA KWAKASIMBISWA Kurume 13, 2026 (Guo Mingqi)

Zvinyorwa zveM10: Zvinoreva Kurume 13 Chaizvo

Kusimbiswa kweongororo yakaitwa nemuongorori Guo Mingqi musi wa13 Kurume 2026 yekuti NVIDIA neWus Printed Circuit vari kuyedza zvinhu zveM10 CCL ndiyo chiratidzo chekutanga chedanho rinotevera rekuvandudza. M10 inotarisa Df pasi pe0.002 - ichigonesa mwero we448 Gbps+ wekutumira masaini unodiwa neVera Rubin architecture yakarongerwa kugadzirwa kwevhoriyamu yeH2 2026.

Kugadziriswa kwezvinhu kuri kuramba kuchienderera mberi: izvo zvakambotora mwedzi 18-24 zvava kumanikidzwa kusvika kumwedzi gumi nemiviri nekuda kwekumanikidzwa kwemakwikwi. Vatengesi veCCL vasati vagadzira zvinhu zveM10-grade vari panjodzi yekusabatanidzwa muchirongwa chinotevera cheAI server board qualification.

CSP CapEx: Chiratidzo cheKudiwa kweMagadzirirwo

TrendForce yakagadzirisa kukura kwayo kweCSP CapEx muna 2025 kubva pa +61% kusvika pa +65% mugore rose. Muna 2026, huwandu hweCSP CapEx hunofungidzirwa kuti huchapfuura mabhiriyoni makumi matanhatu emadhora - kuwedzera kwe40% gore negore. IDC inofungidzira kuti musika wepasi rose weAI server uchakura kubva pamadhora makumi matatu nemanomwe emadhora muna 2023 kusvika pamadhora makumi mapfumbamwe emadhora muna 2028 pa24% CAGR.

Dhora rega rega remari inowanikwa neAI server rinodarika ka3-4 kukosha kwePCB kwesevhisi yecompute yakajairwa. Uku hakusi kutenderera kwemari - asi kuchinja kwechimiro chekugadzira zvigadzirwa zvemagetsi pasi rose.

CHATI 3 — CCL COST MADZIRERO
Kuwanda Kwemutengo weCCL Material vs Standard FR4 (2026)
Upamhi hwebha = mutengo uchienzaniswa neFR4 (chiyero: 1x kusvika 20x). Manyuko: UGPCB; PCBOnline; EIPC Ndira 2026; Guo Mingqi survey Kurume 13, 2026

Giredhi / Df / Chiyero Chepamusoro Chechiratidzo
Mutengo uchienzaniswa neFR4

FR4 (Yakajairika)
Df 0.020-0.025 | <10 Gbps

1x

M4 (Kurasikirwa Kwakaderera)
Df 0.010-0.013 | 56 Gbps

2-3x

M6 (Kurasikirwa Kwakaderera Kwazvo)
Df 0.005-0.008 | 112 Gbps

4-6x

M7 (Kurasikirwa Kwakaderera Kwakanyanya)
Current
Df 0.003-0.005 | 224 Gbps

6-9x

M9
KUKWIRA KWEMAHARA 2026
Df <0.003 | 448 Gbps

10-15x

M10
KUYEDZA Kurume 13, 2026
Df <0.002 chinangwa | 448+ Gbps | NVIDIA + Wus Printed Circuit yasimbiswa

15-20x

Mutengo wepamusoro-soro - zvinhu zvechizvarwa chinotevera

1x (FR4 yekutanga)
10x
20x (M10 yakakwira)

ZVIZIVISO ZVEKUBVA MUCHIKAMU CHIKURU CHA2026
RMB 20B
Tekinoroji yeShenghong
HDI + kugona kwepamusoro-soro, China
RMB 4.3B
Foxconn FIT Thailand
Nzvimbo yepamusoro yeHDI, Southeast Asia
EUR 1.2B
AT&S Malaysia (Zvita 2025)
IC substrate, mota + machipisi eAI
KRW 31T
SK Hynix Yongin (Kurume 1, 2026)
HBM / AI ndangariro yakanaka kusvika 2030
+ 10.6%
Boka reSCHMID (Kurume 11, 2026)
Kukwira kwemasheya pazuva rekuraira kwemidziyo yeHDI

Musika Une Mapoka Maviri: Vakundi vs Vapukunyuki muna 2026

Vagadziri Vanoratidzwa NeAI — Kubudirira
+Mutengo wemari yeVictory Giant HDI board ~ 39% muQ1 2025
+Mitengo yepamusoro yePCB yakakwira 37.8% Gore ra2025
+Vagadziri gumi vepamusoro vanobata 52% mugove wemusika (+3pp muna 2025)
+Kuonekwa kweAI kunounza +2-3pp kuvandudzwa kwemari yakawanda gore negore
Zvigadzirwa Zvakajairika — Zviri Mudzvinyiriro
-Zvinhu zvisina kugadzirwa ~60% yeBOM pasina simba remitengo rekugadzirisa
-Nguva yekutora chikwereti inobva pamavhiki mana kusvika matanhatu kusvika pakupera kwevhiki 12-16 mavhiki
-Mari yekushandisa michina inosvika >$12B; nguva yekutumira michina kwemwedzi 15-18
-Makambani madiki nemadiki ari kubuda mumusika wepakati; kubatana kuri kukurumidza

Nezve Highleap Electronics: Highleap Electronics inogadzira maPCB ane layer yakawanda uye inopa masevhisi akazara ePCBA ekubatanidza maAI server, maindasitiri, uye maapplication ekutaurirana. Isu tinotsigira magadzirirwo eHDI ane layer yakawanda uye hunyanzvi hwepamusoro hunosanganisira M6 neM7 grade laminates. Kumbira mutengo wePCB une layer yakawanda.

Manyuko: Mordor Intelligence PCB Market Report (data update yaNdira 2026); EIPC SpeedNews Chinyorwa 1, Ndira 2026 (Chiu Shih-fang / TPCA interview); Guo Mingqi supply chain survey Kurume 13, 2026 (via Futunn News); 36Kr “2026: AI Servers Ichadhura Zvikuru”; TrendForce CSP CapEx analysis 2026; Prismark Q1 2025 market data; Morgan Stanley AI server rack demand forecast; IDC AI server market report; PCBOnline “PCBs: Powering AI Servers”; SCHMID Group press release Kurume 11, 2026; AT&S Malaysia completion Dec 2025; TTM Technologies Mbudzi 2025; SK Hynix Yongin investment advertisement Kurume 1, 2026.

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