Umklamo we-PCB Stackup Wezingqimba Eziyi-10 We-Impedance Nezindiza

I-stackup enezingqimba eziyishumi iyisakhiwo sikagesi nesokukhiqiza, hhayi uhlu lwezingqimba zethusi ezihlukaniswe ubukhulu obujwayelekile be-prepreg. Inquma ukuthi yiziphi izimpawu ezinezinkomba eziqhubekayo, ukuthi kungakanani umthamo wokuhambisa otholakalayo, lapho kusakazwa khona amandla, ukuthi iyiphi i-geometry yokulandelela ekhiqizwayo nokuthi iphaneli iziphatha kanjani ngesikhathi se-lamination. Ngenxa yokuthi izingqimba zethusi eziyishumi zakha izikhala eziyisishiyagalolunye ze-dielectric, ushintsho olubonakala luncane kugebe elilodwa lungashintsha i-impedance, ukujiya okuphelele kanye nokulingana.

Izibonelo ezingezansi ziyizindawo zokuqala zokuklama kunezitaki zokukhishwa kokukhiqiza. Ukwakhiwa kokugcina okuyinhloko nokwangaphambi kokulungiswa, ubukhulu obucindezelwe, ama-foil ethusi kanye namajiyometri alawulwayo kumele kuqinisekiswe ngumenzi. Sebenzisa leli khasi elinomhlahlandlela wezinto ezibonakalayo kanye nencazelo ye-impedance.

Khetha Ukwakheka Kwesendlalelo Ngaphambi Kokukhetha Ubukhulu Be-Dielectric

Qala ngokuhlela umklamo: inani leziteshi zomzila ezisheshayo, izindiza zamandla ezidingekayo, ubuningi bokuphunyuka kwe-BGA, izingxenye ze-analog noma ze-RF ezibucayi, isakhiwo se-through-via noma i-HDI, ukujiya okuqediwe kanye nemikhawulo yemishini. Umgomo awukona ukwandisa izendlalelo ezibhalwe ukuthi “isignali.” Umgomo ukunikeza umzila ngamunye obalulekile ireferensi esebenzisekayo, ukugcina izindlela zokubuya ziqhubeka nokugcina indawo eyanele yendiza yokusatshalaliswa kwamandla.

Isiqondiso somzila siyisinqumo sesibili. Ukunikeza izendlalelo "ezivundlile" kanye "eziqondile" akulungisi i-stackup enezendlalelo zesignali zesivinini esiphezulu eziseduze futhi akukho plane yokubhekisela. Xazulula isakhiwo sensimu kanye nendlela yokubuyela kuqala, bese unikeza iziqondiso ozikhethile ngokusekelwe ekubekweni nasekuminyaneni.

Izinhlobo Ezintathu Eziwusizo Zokuqoqwa Kwezingqimba Eziyi-10

Isilinganiso sodwa asibonisi ukuthi i-stackup ilungile. Amalungiselelo amabili “esiginali esingu-6/4” angasebenza ngendlela ehluke kakhulu kuye ngokuthi izindiza zibekwe kuphi. Uma umklamo udinga izendlalelo eziyisithupha zesignali, gcina izendlalelo eziseduze nendiza ukuze uthole amanethi abalulekile bese ubeka izimpawu ezihamba kancane, ezimfushane noma eziqondiswe ngendlela eqondile kubhangqa elingafanele.

Isibonelo Sezingqimba Eziyishumi Ezinezikhombo Ezicebile Ngendiza

Ukuhleleka okulandelayo kwezendlalelo kuyindawo yokuqala eqinile yebhodi eliqinile elinezendlalelo ezine zesignali eziyinhloko. Lilingana ngogesi ezindaweni zesignali ezibalulekile futhi lingenziwa lilingane ngomshini ngokulingisa ukwakheka kwe-dielectric nethusi. Alishicileli ubukhulu be-dielectric noma ububanzi be-trace.

Lokhu kulungiselela kunikeza zombili izingqimba zesignali zangaphakathi izinkomba ezimbili zomhlaba futhi kugcina isignali ngayinye yangaphandle eduze komhlaba. Indiza ngayinye yamandla ephakathi inomlingani womhlaba ongaphandle. Isikhala esiphakathi se-L5-L6 singakhethwa ngenxa yobukhulu obuphelele kanye nebhalansi yomshini ngaphandle kokuchazwa kabi njengepheya lokuhlukanisa amandla nomhlaba.

Imiklamo edinga umzila owengeziwe ingaguqula indiza ibe yisignali, kodwa imiphumela kumele icace. Isibonelo, ukuguqula i-L6 ibe yisignali kususa indiza yamandla ebanzi futhi kudala ungqimba lwesignali eduze kwamandla e-L5 kanye nomhlabathi we-L7. Imizila ebalulekile kulolo ngqimba kumele igweme ukuhlukana kwe-L5 noma iklanywe ukuze ibhekisele kakhulu ku-L7.

Ukuvalwa kwe-Press-Out, Copper kanye ne-Impedance

Ubukhulu be-prepreg ngemva kwe-lamination abulingani nenani lekhathalogi yayo engakaphekwa. Ubukhulu obucindezelwe buxhomeke kwisitayela sengilazi, okuqukethwe kwe-resin, ubuningi bethusi, ukwelashwa, umjikelezo wokucindezela kanye nokugeleza kwe-resin yendawo. Umenzi kufanele anikeze ukucindezela okulindelekile kokwakhiwa okuqondile futhi akhombise ukubekezelelana okusetshenziswe kumodeli ye-impedance.

Ithusi langaphandle liyisilinganiso esiqediwe

Izendlalelo zangaphandle ziqala nge-foil eyisisekelo futhi zithola ithusi ngesikhathi sokufakwa kwembobo kanye nephethini. Imodeli ye-controlled-impedance kufanele isebenzise isigaba esiqediwe se-trace cross-section, kufaka phakathi ukuma kwe-trapezoidal etch. Izendlalelo zangaphakathi zivame ukuqoshwa kusuka ku-foil ngaphandle kokukhula okufanayo kwe-pattern-plating, ngakho-ke i-trace yangaphandle neyangaphakathi enegama elifanayo le-ounce ayihlanganyeli ngempela i-geometry efanayo.

Ungadedeli ububanzi bokulandelela ngaphambi kokufakwa kwe-stackup

Umdwebo olungisa ama-50 Ω ngobubanzi obuthile ngenkathi uvumela umhlinzeki ukuthi ashintshe ukwakhiwa kwe-dielectric udala ukuphikisana. Noma ukukhulula i-stackup kanye ne-geometry eqondile, noma ucacise i-impedance target bese ugunyaza umenzi ukuthi alungise ububanzi/isikhala ngaphakathi kwemingcele evunyelwene ngayo. Noma yiluphi ushintsho oluthinta ukucaciswa komzila noma i-pair skew kufanele lubuyele ukuze kuvunyelwe amakhasimende.

Sebenzisa idatha efanele yezinto ezibonakalayo

Isixazululi sensimu kufanele sisebenzise i-Dk eqondene nokwakhiwa noma elinganiswe ngenqubo, hhayi isihloko somndeni esisodwa esikopishwe kusuka eshidini ledatha. Izakhiwo zomphezulu kufanele zifake imaski ye-solder lapho ikhona. Ukuhlaziywa kokulahlekelwa ngesivinini esikhulu kudinga i-Df, ubulukhuni bethusi kanye nokuziphatha okuncike emvamisa; ukubalwa kwe-impedance kukodwa akufanelani nokulahlekelwa yisiteshi.

Ubuqotho Bamandla, Izindlela Zokubuyisa kanye ne-EMI

Isikhala esiseduze sesignali kuya ku-reference sinciphisa i-loop inductance kanye nokusabalala kwensimu, kodwa ukuthuthukiswa okuqondile kuncike ku-geometry; akufanele kukhangiswe njengokunciphisa okuhleliwe kwe-dB. Ama-plane pairs anganikeza i-distributed capacitance, kodwa inani lawo lilandela ubudlelwano be-parallel-plate kanye nendawo yangempela yokugqagqana. I-dielectric encane enamandla-ground ingaba usizo, kodwa ayiqedi i-discrete dracoupling noma i-package inductance.

Gcina izindiza zokubhekisela zesivinini esiphezulu ziqhubeka. Uma indiza yamandla iqukethe iziqhingi eziningi, ungabeki imizila ebalulekile lapho amandla okubuya amakhulu kuzodingeka awele umngcele wesiqhingi. Uma ungqimba lwesignali luphakathi kwamandla nomhlabathi, nquma ukuthi iyiphi indiza okubhekiselwe kuyo futhi uqinisekise ukuthi indlela ehlukile iyalawulwa.

Unqenqema olusebenzisa uthango lungasiza ezinkingeni ze-RF ezikhethiwe noma zamanje, kodwa iphimbo eliqinile elizungezile yonke ibhodi yedijithali alidingeki futhi linganciphisa umzila noma lidale ukubhoboka kwendiza. Iphimbo kanye nokuphela kothango kufanele kulandele imvamisa ephezulu kanye nesu lokuvala elilawulwayo.

Hlela indlela yokubuya kukho konke ukuguqulwa kwesendlalelo

Isignali edlulayo ishintsha insimu ye-electromagnetic kusuka kwesinye isakhiwo somugqa wokudlulisela iye kwesinye. Lapho zombili izingqimba zomzila zibhekisela ezindizeni zomhlaba, izingqimba zomhlaba eziseduze zingaxhuma lezo zindiza futhi zinciphise iluphu yendlela yokubuya, kodwa inombolo yazo kanye nokubekwa kwazo kufanele kulandele i-geometry yokuguquka kunomthetho webanga elijwayelekile. Lapho umzila ushintsha phakathi kwezingqimba ezibhekiselwe ezindizeni ezahlukene, njengomhlaba osengqimbeni eyodwa kanye nendiza yamandla komunye, ugesi wokubuya udinga indlela yokudlulisa ngamabomu. Leyo ndlela ingasebenzisa i-capacitor yokuhlukanisa ebekwe kahle phakathi kwezinginjini zokubhekisela, isabelo sengqimba ehlukile, noma ushintsho oluhlelwe kabusha olugcina zombili izingxenye zibhekiselwe emhlabathini.

Ngakho-ke umdwebo we-stackup kufanele ukhombe ireferensi ehlosiwe yesendlalelo ngasinye esilawulwayo, hhayi nje ukulebula isendlalelo ngokuthi “isignali.” Ngokusebenzisa amasimu, ama-anti-pads kanye nezindawo zokuvula izindiza kumele kubuyekezwe ndawonye ngoba i-oda lesendlalelo esinomsindo kagesi lisengaphazanyiswa ushintsho olususa ithusi eliningi kakhulu eliseduze.

Ukulingana, Ibhalansi Yethusi kanye Nengozi Yomnsalo/Ukujika

Ukulingana kwemishini kusho okungaphezu kokunikeza amagama afanayo e-net emgqeni ophakathi nendawo. Hlanganisa izisindo zethusi zangaphandle, ukwakheka kwe-dielectric kanye nokumbozwa kwethusi okulindelekile. Uhlangothi lwengxenye olunobuningi obukhulu lungaba nethusi eliningi kakhulu kunohlangothi oluphambene noma ngabe izisindo ze-foil ezijwayelekile ziyafana; ukweba kwe-CAM noma ukulinganisa umklamo kungadingeka.

Ukwamukelwa kwe-Bow kanye ne-twist kulawulwa yincazelo yomkhiqizo efanele kanye nesidingo sokuhlanganiswa. Ukuhlanganiswa kwe-BGA okune-fine-pitch kungadinga ukuba bushelelezi kakhulu kunomkhawulo webhodi elingenalutho ojwayelekile. Ngakho-ke, ukubuyekezwa kwe-stackup kufanele kucabangele usayizi wephaneli, uhlaka lwebhodi, ukusatshalaliswa kwethusi, ama-cutout, ingxube yezinto kanye nendlela yokususa ama-panelization, hhayi nje ukulingana kwezingqimba.

Izinto Ezihlanganisiwe, i-HDI kanye Nezinhlobo Eziqinile Eziguquguqukayo

Ukwakhiwa kwe-hybrid okunokulahlekelwa okuphansi

Izinto ezilahlekelwa kancane zingatholakala eduze kwezingqimba zesignali ezikhethiwe, kodwa ukuhlelwa okuqondile kwe-core, prepreg noma bondply kumele kuqinisekiswe. Ungabeki umkhawulo womehluko we-CTE ojwayelekile bese ucabanga ukuthi uhambisana. Buyekeza ukugeleza kwe-resin, ukunamathela, ukwelapha, ukunyakaza kobukhulu, inqubo yokubhoboza/yokucwilisa kanye nokuthembeka kwembobo ehlanganisiwe ukuze uthole umbhangqwana wezinto eziphelele.

Ukwakheka kwe-HDI

Ebhodini elingu-1+8+1, 2+6+2 noma 3+4+3, uphawu lwesendlalelo luchaza ukusatshalaliswa kokwakheka, hhayi indlela ephelele yokukhiqiza ngokwayo. Izinga ngalinye lokwakheka lengeza izithombe, i-lamination, ukubhoboza nge-laser, i-metallization, futhi lapho kudingeka, ukugcwalisa/ukuhlela. I-stackup kumele ikhombe yonke i-microvia span, efihliwe nge-via, nge-via kanye nohlelo lapho izakhiwo zakhiwe khona. Ukubalwa komjikelezo wokucindezela kufanele kufake i-subcomposite ephakathi kanye nokwakheka ngakunye okulandelanayo, kusetshenziswa amagama achazwe ngumhlinzeki.

I-stackup eqinile neguquguqukayo

Ibhodi eliqinile eligobile elinezingqimba eziyishumi alithwali zonke izingqimba eziyishumi endaweni yokugoba. Ngokuvamile izingqimba ezikhethiwe ezigobile kuphela eziqhubekayo kuyilapho ezinye izingqimba zethusi ziphela endaweni eqinile. Umklamo kufanele ubonise inani lezingqimba ezigobile, ukwakhiwa okungenanamathela noma okunamathelayo, isembozo, izinti, uhlobo lwethusi, isiqondiso sokugoba kanye nomsebenzi ongaguquki noma oguquguqukayo. I-IPC-2223 iyindinganiso yomklamo; ukusebenza kwebhodi eliguquguqukayo neliqinile okuqediwe kuqondiswa yi-IPC-6013.

Iphakheji Yokukhishwa Kwe-Stackup kanye neSango le-DFM

Iqoqo lokukhiqiza kufanele lilawulwe ngokubuyekezwa futhi lifake zonke izendlalelo zethusi eziyishumi, zonke izikhala eziyisishiyagalolunye ze-dielectric, ibanga lezinto zokwakha kanye nokwakhiwa, ukuqokwa kwe-core/prepreg, ubukhulu obujwayelekile kanye nokubekezelelana, uhlobo lwethusi kanye nobukhulu, ubukhulu bebhodi eliqediwe, izakhiwo ezilawulwayo, ngokusebenzisa ama-span kanye nanoma yimaphi amanothi e-sequentially-lamination.

Qedela leli sango ngaphambi kokusayina i-routing. Ukuhamba komsebenzi "kokugcina ngemva kokuthunyelwa kwe-Gerber" kuphoqa izinguquko zobuciko ezingagwenywa futhi kungenza isikhathi kanye nokulingisa isiteshi kungasebenzi. Thumela ukwakhiwa ngokubuyekezwa kwe-DFM kanye nethebula lokulawula ukuvinjelwa kanye nokuqagela okubalulekile kwe-routing.

Amaphutha Avamile Okuqoqa Izinto Ezihlanganisiwe Nemiphumela Yawo

Ukubala imisebenzi ngendlela engafanele

Ithebula lesendlalelo elibiza izendlalelo eziyisithupha zesignali kodwa libala izendlalelo ezine zesignali kuphela lichitha yonke inhloso yomklamo. Bala imisebenzi yethusi ngqo bese uqinisekisa indawo yokubhekisela yesignali ngayinye.

Ukushiya izikhala ze-dielectric

Izendlalelo eziyishumi zethusi zidinga ukuhlukaniswa kwe-dielectric eziyisishiyagalolunye. Ithebula elibala izendlalelo ezikhethiwe ze-dielectric kuphela “ezingaphansi” livame ukushiya noma ukubala kabili izikhala futhi alikwazi ukuvumelanisa nobukhulu obuqediwe.

Ukusebenzisa ububanzi bokulandelela obujwayelekile

Ubukhulu obulungisiwe obungu-50 Ω noma obungu-100 Ω obukopishwe komunye ukwakhiwa akufanele buvele njengemithetho yokulungiselela ukwenziwa. Kumelwe kubalwe kabusha ngemodeli yangempela ye-dielectric ecindezelwe, yethusi kanye nezinto.

Ukubiza izindiza ezimbili zamandla ngokuthi i-discoupling pair

I-capacitance yendiza esakazwayo iwusizo phakathi kwabaqhubi abaphethe ishaja ephambene, ngokuvamile amandla kanye nomhlabathi. Izindiza ezimbili zamandla eziseduze ezitimeleni ezahlukene aziyona indawo evamile yebhangqa lamandla-mhlabathi futhi zingase zingenise ukuxhumanisa phakathi kwemizila.

Uma sicabanga ukuthi amalebula kagesi adala ukulingana kwemishini

I-Warpage incike ezintweni ezibonakalayo, ukujiya kanye nokusatshalaliswa kwethusi. Amagama ezingqimba ezibukwayo awanele uma uhlangothi olulodwa lunethusi elijiyile kanti olunye lunendlela encane yokuhamba.

Hlanganisa Ubukhulu Obuqediwe Ngaphambi Kokukhululwa Kwesakhiwo

Ubukhulu bebhodi elijwayelekile buwumphumela wazo zonke izikhala eziyisishiyagalolunye ze-dielectric ezicindezelwe, izendlalelo eziyishumi zethusi, umnikelo we-plating kanye nomthetho wokulinganisa womhlinzeki. Isamba esilula sama-cores ekhathalogi kanye nama-prepregs singaba yiphutha ngoba ithusi lifakwa ku-resin futhi i-plating yangaphandle iyengezwa ngemuva kwe-lamination. I-stackup ekhishwe kufanele ibonise inani eliqediwe lomhlinzeki kanye nokubekezelelana, bese iqinisekisa ukuthi izixhumi, ukulingana kwe-press-fit, i-card-edge kanye nezidingo ze-enclosure zisebenzisa incazelo efanayo.

Ukubekezelela ukujiya nakho kushintsha i-impedance kanye ne-geometry ye-back-drill. Umklamo oseduze nomkhawulo webanga lokuxhumana kwesixhumi noma ifasitela lokubhoboza elilawulwayo lingadinga ukulawulwa kokwakhiwa okuqinile kunebhodi elivamile. Uma kuhlongozwa ukuthi ibhodi elincane lincishiswe ngobude, hlola ukuqina, ukuphathwa kokuhlanganiswa, i-warpage kanye nokuhambisana kwesixhumi kunokuphatha ukujiya njengento eguquguqukayo kagesi kuphela.

Ukulawula ukubuyekezwa kwe-stackup

Nikeza yonke i-stackup evunyiwe ukubuyekezwa bese uxhumanisa umdwebo wokukhiqiza, ithebula le-impedance, imodeli yokulingisa kanye nomthetho wokwakheka okusethwe kulolo kubuyekezwa. Ushintsho oluphakanyisiwe ngumhlinzeki ku-core, prepreg, ithusi noma izinto kufanele lukhiqize i-stackup ebomvu futhi lubone ukuthi yiziphi i-geometri ezilawulwayo ezishintshayo. Lokhu kuvimbela ukushintshwa kokuthenga okubonakala kuncane ekuvimbeleni buthule imikhawulo yomzila.

Imiphumela yezinga lephaneli

Uhlaka olufanayo lwebhodi lungaziphatha ngendlela ehlukile uma luhlelwe kuphaneli yokukhiqiza ehlukile. Ukwebiwa kwethusi, ukwakheka kwesitimela, ukubekwa kwekhuphoni, ukulayisha ngokucindezela kanye nokuhanjiswa kwezici eziqhekekile kungathinta ukufana kobukhulu kanye nokugoba/ukusonta. Faka ukufakwa kwamaphaneli ekubuyekezweni kwesihloko sokuqala lapho ukuthamba, ukujula okulawulwayo noma isampula ye-impedance kubalulekile.

Ukwakhiwa Okukhethekile Kwethusi Elinzima, i-RF kanye Nokushisa

Ithusi elisindayo lishintsha kakhulu kunomthamo wamanje. I-foil ejiyile idinga imvume enkulu yokusika, ithinta umkhondo omncane kanye nesikhala, yandisa isidingo se-resin ngesikhathi sokulamina futhi ingenza ibhalansi yethusi ibe nzima kakhulu. Ibhodi elinezingqimba eziyishumi elinezingqimba zamandla aqinile ezikhethiwe lingadinga ukwakheka kwangaphambilini okugcwele i-resin, ithusi elinezitebhisi noma izakhiwo zebhasi zasendaweni esikhundleni sethusi elisindayo elifanayo kuzo zonke izingqimba. Umhlinzeki kufanele ahlinzeke nge-geometry efinyelelekayo yobukhulu bethusi obuqondile kanye nosayizi wephaneli.

Izendlalelo ze-RF zingabekwa ngaphandle noma ngaphakathi kwe-hybrid stackup kuye ngokufinyelela kokuqalisa, ukuvikela kanye nokucutshungulwa kwezinto. Izakhiwo ze-RF ezilawulwayo zingadinga umhlabathi we-coplanar, ngokusebenzisa uthango, i-cavity noma i-edge plating kanye nokuqedwa okungena-nickel ezinhlelweni ezikhethiwe. Lezi zici kufanele ziphathwe njengomklamo othile wesifunda esatshalaliswayo; i-IPC-2228 kanye nesiqondiso senqubo yomhlinzeki wezinto ezikhethiwe zingase zifaneleke. Akufanele zincishiswe zibe "ukusebenzisa i-laminate ekhethekile ephansi yokulahlekelwa ku-L1."

Izinhlamvu zemali zethusi ezifakiwe, ama-inlays okushisa kanye nama-heat spreader ensimbi adala ukujiya kwendawo, imingcele ye-plating kanye ne-lamination. Izixhumi zazo, ukuhlukaniswa, i-planarity kanye nendlela yokushisa kumele zichazwe ngaphambi kokuba kukhishwe i-stackup. Isici sokushisa singaphazamisa i-impedance eseduze noma i-warpage uma ingezwa ngemva kokusebenzisa i-routing. Hlanganisa imodeli yokushisa, umdwebo womshini kanye ne-elekthronikhi njengomklamo owodwa.

Kunoma yikuphi ukwakhiwa okukhethekile, cela umdwebo wesigaba esiphambene kanye nempendulo ye-DFM eqondene nenqubo ethile. Ithebula lamandla elijwayelekile elinezingqimba eziyishumi akufanele lisho ukuthi yonke inketho yethusi elisindayo, i-RF, i-flex kanye ne-embedded-thermal ingahlanganiswa ngaphandle kwesiqinisekiso sephrojekthi.

Ukulawula Ukushintsha I-Stackup Ngemva Kokuqala Kwesakhiwo

Uma imithetho yokuqondisa, ama-targets okulibaziseka kanye namamodeli esiteshi esexhunywe ku-stackup evunyelwe, ushintsho lwezinto noma lokwakha luwushintsho lobunjiniyela kunokuba kube ukushintshaniswa kokuthenga. Izinguquko ekwakhiweni kwe-core noma prepreg, okuqukethwe kwe-resin, i-copper foil, i-finished copper, i-solder mask, nge-span noma i-lamination sequence zingathinta imikhawulo yokuklama engaphezu kweyodwa ngesikhathi esisodwa.

Uma ukuthenga kudinga ukujiya okuhlukile kwe-dielectric, phinda uhlole kokubili ugesi kanye nowomshini. Ukushintsha i-prepreg eyodwa kungashintsha ububanzi bokulandelela, isikhala esiphindwe kabili, ukubambezeleka kokusabalala, ukujiya okuphelele kanye nebhalansi ye-resin. Umdwebo obuyekeziwe kufanele ukhombe ukwakhiwa okusha kunokugcina inombolo yokubuyekezwa endala. Lo mkhakha ubaluleke kakhulu lapho i-stackup isetshenziswa kabusha emikhiqizweni eminingana noma ezindaweni zokukhiqiza.

Uhlu Lokuhlola Lokusayina Nge-Stackup

I-stackup ilungele ukukhishwa kwesakhiwo lapho ukwakheka kukagesi kanye nokwakhiwa kwezinto ezikhiqizwayo sekulungisiwe. Iphakheji yokusayina kufanele ibonise zonke izendlalelo zethusi eziyishumi kanye nazo zonke izikhala ze-dielectric eziyisishiyagalolunye, ihlonze indiza yokubhekisela kuyo yonke isendlalelo sesignali esilawulwayo, bese ivala ukubalwa kobukhulu obuqediwe kusetshenziswa amanani acindezelwe hhayi ekhathalogi-dielectric.

• Qinisekisa imisebenzi yesendlalelo, ukuqhubeka kwereferensi kanye nokuhlukaniswa kwendiza yamandla.
• Linganisa ukwakhiwa kwe-dielectric, ukusatshalaliswa kwethusi kanye nezinto ezikhethekile mayelana nesikhungo semishini lapho kusebenza khona.
• Thola izinketho eziqondile ze-core, prepreg, resin-content kanye ne-copper-foil ezisetshenziswa kumamodeli we-impedance kanye nokulahlekelwa.
• Xazulula ama-sublaminations e-HDI, ama-via angcwatshwe, izinguquko eziguquguqukayo kanye nezibopho zezinto ezihlanganisiwe ngaphambi kokufaka izinombolo zokugcina.
• Ububanzi bokukhiqiza obubuyisiwe, izikhala ezimbili kanye nobukhulu obuqediwe ukuze kuvunywe.
• Khiya ukubuyekezwa kwe-stackup ngaphambi kokuba kuqedwe imikhawulo yokuhambisa kanye nemithetho yokufanisa ukubambezeleka.

Umdwebo owusizo we-stackup uyindlela yomngcele wemodeli kagesi kanye nomyalelo wokukhiqiza. Uma ungakwazi ukuchaza indlela yokubuya, ukujiya okuphelele, ukwakhiwa kwethusi kanye nokulandelana kwe-lamination, awukakulungeli ukukhululwa.