PCB Packaging - Highleap Electronic

I-BGA vs. QFN: Umehluko Oyinhloko Ekukhethweni Kwephakheji ye-IC

Umfanekiso 1. I-BGA vs. QFNIsingeniso: Kungani i-BGA vs. QFN Ibalulekile Ekwakhiweni kwe-elekthronikhi yesimanje, ukukhethwa kwephakheji ye-IC kuthinta ngqo ukukhiqizwa kwe-PCB, ukusebenza kukagesi, kanye nezindleko zomkhiqizo jikelele. Phakathi kobuchwepheshe bokufaka phezulu, i-BGA (i-Ball Grid Array) kanye ne-QFN (i-Quad...

Iphakheji ye-Flip-Chip: Izinto Okucatshangwa Ngazo Ngesakhiwo, Inqubo, kanye Nobunjiniyela

Isithombe 1. Iphakheji ye-Flip-Chip PCB1. Iyini Iphakheji ye-Flip-Chip? Iphakheji ye-flip-chip ubuchwepheshe bokuxhumana obusezingeni lokudayela lapho i-semiconductor die ifakwe khona ibheke phansi, ubuso bayo obusebenzayo bubheke phansi. Ngokungafani nokubopha ucingo, okuqondisa...

I-WLCSP: Ubuchwepheshe Bokupakisha Isilinganiso Se-Chip Esisezingeni Le-Wafer Buchaziwe

Umfanekiso 1. I-WLCSPIsingeniso ku-WLCSP Njengoba amadivayisi kagesi eqhubeka nokuncipha ngenkathi efuna ukusebenza okuphezulu, ubuchwepheshe bokupakisha be-IC bube yisisusa esibalulekile sokusungula izinto ezintsha. I-WLCSP (i-Wafer-Level Chip-Scale Packaging) imele intuthuko enkulu ku...

Iphakheji ye-LGA: Isakhiwo, Izinzuzo, kanye Nomhlahlandlela Wokuklama we-PCB

Umfanekiso 1. Iphakheji ye-LGA1. Isingeniso: Kungani Iphakheji ye-LGA Ibalulekile Kuma-elekthronikhi Esimanje Isidingo sokubalwa kwe-I/O okuphezulu, isivinini sesignali esisheshayo, kanye nokuphathwa kokushisa okuthuthukisiwe kuyaqhubeka nokukhuthaza ukusungulwa kokupakisha kwe-semiconductor. Amaphakheji endabuko afana ne-QFP abhekene...

Iphakheji ye-CSP: Umhlahlandlela Wobuchwepheshe Wokupakisha I-Chip Scale

Umfanekiso 1. Iphakheji Yesikali Se-Chip1. Isingeniso: Kungani I-CSP Ibalulekile Kuma-elekthronikhi Esimanje Ama-elekthronikhi abathengi, izinto ezigqokwayo, namadivayisi eselula ayaqhubeka nokuncipha ngenkathi efuna ukusebenza okwengeziwe. Lo mkhuba uqhubekisela phambili ukupakishwa kwe-IC ekujuleni kwe-I/O ngaphakathi...

I-BGA vs. i-LGA: Umehluko Obalulekile Kubuchwepheshe Bephakheji Yokuhlanganiswa Kwe-PCB

Isithombe 1. I-BGA vs. i-LGA1. Isingeniso: Kungani Uqhathanisa Amaphakheji e-BGA kanye ne-LGA I-BGA kanye ne-LGA zimelela amafomethi amabili okupakisha aphambili aphambili kuma-elekthronikhi anabantu abaningi. Zombili zisusa ama-lead avele obala, zivumela iphimbo elincane kanye nokwanda kobuningi be-I/O okubalulekile kumaseva,...

Iphakheji ye-BGA: Umhlahlandlela Wesakhiwo, Izinhlobo, Umklamo Nokuhlanganiswa

Umfanekiso 1. Amaphakheji e-BGA1. Isingeniso: Iyini Iphakheji ye-BGA nokuthi Kungani Kubalulekile Iphakheji ye-BGA (i-Ball Grid Array) ifomethi yokupakisha ye-IC esebenzisa uhlu lwamabhola e-solder ngaphansi kwengxenye yokuxhuma kagesi kanye neyomshini kwi-PCB. Ngokungafani...

Iphakheji ye-SOP: Isakhiwo, Izinhlobo, kanye Nokucatshangelwa Komklamo we-PCB

Umfanekiso 1. Iphakheji ye-SOP1. Isingeniso: Iyini Iphakheji ye-SOP? Iphakheji ye-SOP (Iphakheji Encane Yohlaka) iyiphakheji ye-IC yokufaka ebusweni eyenzelwe ukuhlanganiswa kwe-PCB okuzenzakalelayo. Yakhiwe ngesikhathi sokuguquka kusuka kubuchwepheshe obungena emgodini kuya kubuchwepheshe be-SMT, inomugqa oyisicaba...

Iyini iPhakheji ye-QFN? Umhlahlandlela Ophelele Wokupakisha i-IC ye-Quad Flat No-Lead

Umfanekiso 1. Iphakheji ye-QFN1. Isingeniso kubuchwepheshe bephakheji ye-QFN Ukupakishwa kwesekethe ehlanganisiwe (i-IC) kusebenza njengesixhumi esibalulekile phakathi kwama-semiconductor dies namabhodi wesekethe aphrintiwe. Ukupakishwa okusebenzayo kuqinisekisa ukuxhumana kukagesi okuthembekile, ukushisa okusebenzayo...

Amaphakheji e-QFN vs. QFP: Ukuqhathanisa Okuphelele Komklamo we-PCB

Umfanekiso 1. Amaphakheji e-QFN vs. QFP1. Isingeniso Ukupakishwa kwe-IC kusebenza njengesixhumi esibalulekile phakathi kwama-semiconductor dies namabhodi wesekethe aphrintiwe, okuthinta ngqo ukusebenza kukagesi, ukuphathwa kokushisa, kanye nokusebenza kahle kokukhiqiza. Phakathi kokufakwa kwendawo...