I-WLCSP: Ubuchwepheshe Bokupakisha Isilinganiso Se-Chip Esisezingeni Le-Wafer Buchaziwe

Isingeniso ku-WLCSP

Njengoba amadivayisi kagesi eqhubeka nokuncipha ngenkathi efuna ukusebenza okuphezulu, ubuchwepheshe bokupakisha be-IC bube yisisusa esibalulekile sokusungula izinto ezintsha. I-WLCSP (i-Wafer-Level Chip-Scale Packaging) imele intuthuko enkulu ekupakisheni kwe-semiconductor, inikeza ikhambi elincane elihlangabezana nezidingo eziqinile ze-elekthronikhi zesimanje.

Le ndlela yokufaka isusa ama-substrate endabuko kanye namafreyimu e-lead, okwenza kube nokuxhumana okuqondile kwe-chip-to-PCB. Ezigabeni ezilandelayo, sihlola incazelo, isakhiwo, inqubo yokukhiqiza, kanye nokusetshenziswa okusebenzayo kobuchwepheshe be-WLCSP.

Incazelo ye-WLCSP

Kuyini i-WLCSP?

I-WLCSP imele i-Wafer-Level Chip-Scale Packaging. Ngokungafani nezindlela zokupakisha ezivamile lapho ama-chip eqala ngokuhlanganiswa bese epakishwa ngamanye, i-WLCSP iqeda zonke izinyathelo zokupakisha ngenkathi idayisi lihlala ku-wafer. Usayizi wokugcina wephakheji ulingana nedayi ye-silicon uqobo, uhlangabezana nenqubo yephakheji yesilinganiso se-chip yokungabi nkulu kunezikhathi eziyi-1.2 zobukhulu bediyisi.

I-WLCSP vs Ukupakishwa Kwendabuko

Amafomethi okupakisha endabuko njenge- BGA ne -QFN adinga i-substrate ephakathi noma uhlaka lomthofu phakathi kwe-chip ne-PCB. I-WLCSP isusa ngokuphelele lezi zingqimba. Umphumela uba yisisombululo sangempela se-chip-scale lapho amabhola e-solder akhiwa khona ngqo ebusweni be-wafer, futhi ukuhlukaniswa kwenzeka njengesinyathelo sokugcina. Le ndlela ishintsha ngokuyisisekelo indlela yokupakisha kusuka ku-chip-then-package kuya ku-package-then-daice.

Isakhiwo kanye nezici ze-WLCSP

Isakhiwo Esijwayelekile se-WLCSP

I-WLCSP ejwayelekile iqukethe i-silicon die enesendlalelo sokusabalalisa kabusha (i-RDL) esihambisa ukuxhumana kwe-bond pad ku-uniform ball grid array. Ama-solder bumps afakwa ngqo ku-RDL, enikeza isikhombimsebenzisi sikagesi nesomshini ku-PCB. Isendlalelo sokudlulisa noma sokuvikela simboza isekethe esebenzayo. Azikho izibopho zentambo, ozimele be-lead, noma izinhlaka zokupakisha ezikhona kulo mklamo omncane.

Izici Eziyinhloko Zesakhiwo

Ifomethi ye-WLCSP ifinyelela ukwenziwa okuncane kakhulu kanye nobuningi obukhulu bokuxhumana. Ubukhulu bephakheji bunqunywa ngokuyinhloko ubukhulu be-wafer kanye nokuphakama kwebhola le-solder, okuvame ukuholela kumaphrofayili angaphansi kuka-0.5mm. Ukuxhumeka okuqondile kwe-die-to-board kudala indlela kagesi emfushane kakhulu, okuzuzisa kakhulu izinhlelo zokusebenza zemvamisa ephezulu ezidinga i-inductance encane ye-parasitic kanye ne-capacitance.

Inqubo Yokukhiqiza ye-WLCSP

Ukulungiswa kwe-Wafer kanye nokwakheka kwe-RDL

Ukwenziwa kwe-WLCSP kuqala ngama-wafer aqediwe avela enkambisweni engaphambili. Isendlalelo se-dielectric siyabekwa, kulandelwe ukwakheka kwesendlalelo sokusabalalisa kabusha kwensimbi okuvunguza izindawo zokuqala ze-bond pad kuya endaweni yegridi yebhola ejwayelekile. Lesi sinyathelo se-RDL sibalulekile ekuhlanganiseni imiklamo ehlukahlukene ye-die ibe yindawo efanayo yephakheji efanele ukuhlanganiswa kwe-SMT.

Ukwakheka Kwe-Solder Bump

I-Under-bump metallization (UBM) isetshenziswa ukulungiselela izindawo zokunamathisela i-solder. Amabhola e-solder abe esebekwa noma i-solder paste ibekwa endaweni ngayinye yokuxhuma, kulandelwe ukugeleza kabusha ukuze kwakheke amaqhubu alinganayo ayindilinga. I-ball pitch ivame ukusuka ku-0.3mm kuya ku-0.5mm kuye ngokuthi inani le-I/O kanye nezidingo zohlelo lokusebenza lingakanani. Ukuhlolwa kwekhwalithi kuqinisekisa ukuhambisana kwamaqhubu kanye nokuvumelana kobukhulu.

Ukuhlola kanye nokulinganisa

Ukuhlolwa kwezinga le-wafer kwenziwa ukuze kutholakale ukuthi i-wafer ilungile ngaphambi kokufakwa kwe-singling. I-wafer ibe isinqunywa ibe amayunithi e-WLCSP ngamanye kusetshenziswa i-blade noma i-laser cutting. Idivayisi ngayinye efakwe i-singling iyiphakheji ephelele elungele ukuhlanganiswa kwezinga lebhodi. Le ndlela yokucubungula i-batch ezingeni le-wafer inikeza izinzuzo ezinkulu zokusebenzisa ngaphezu kwezindlela zokupakisha zendabuko ze-single-chip.

Izinzuzo ze-WLCSP

Usayizi kanye nokusebenza kukagesi

I-WLCSP inikeza indawo encane kakhulu yephakheji, okuvumela ukuminyana kwezingxenye eziphezulu kumiklamo ye-PCB . Ukususwa kwezintambo zebhondi kanye nezendlalelo ze-substrate kunciphisa kakhulu ukumelana nezinambuzane, i-inductance, kanye ne-capacitance. Lezi zici zikagesi zenza i-WLCSP ifanelekele i-RF, ukuphathwa kwamandla, kanye nezinhlelo zokusebenza zedijithali ezisheshayo lapho ubuqotho besiginali bubaluleke kakhulu.

Ukusebenza Kokushisa Nokuhlanganiswa

Ukunamathiselwa kwe-die ngqo kwi-PCB kunikeza indlela ephumelelayo yokushisa yokushabalalisa ukushisa. I-silicon die iqhuba ukushisa ngamabhola e-solder ngqo ezicini zokuphathwa kokushisa ezingeni lebhodi. I-WLCSP ihambisana ngokugcwele nezinqubo ezijwayelekile ze-SMT reflow, ayidingi imishini ekhethekile yokuhlanganisa. Lokhu kuhambisana kwenza kube lula ukuhlanganiswa emigqeni yokukhiqiza ekhona.

Imikhawulo kanye nezinselele ze-WLCSP

PCB Design Izidingo

Ukuqaliswa kwe-WLCSP okuphumelelayo kudinga ukwakheka kanye nokwakhiwa kwe-PCB okunembile. Ama-array ebhola le-solder acwebezelayo adinga ukubekezelela ukubhaliswa kwephedi eqinile kanye nokufakwa kwe-solder okulawulweyo. Umzila wokulandelela we-PCB ngaphansi kwezinyathelo ze-WLCSP kumele uvumelane nemikhawulo yokubekwa. Amaqembu okuklama kumele acabangele lezi zici ngesikhathi sokubamba okuhleliwe kanye nezigaba zokuhlelwa.

Izinto Ezicatshangelwayo Zokusebenza Ngobuchwepheshe Nokuthembeka

Ngaphandle kwe-encapsulant noma i-substrate evikelayo, amaphakheji e-WLCSP abonisa ukuqina okulinganiselwe kwemishini uma kuqhathaniswa nezinye izindlela ezibunjiwe. Ukungafani kwe-CTE phakathi kwe-silicon kanye ne-FR-4 substrates kudala ukucindezeleka emajoyintini e-solder ngesikhathi sokujikeleza kokushisa. Ukuhlolwa kokuthembeka kwezinga lebhodi kubalulekile, ikakhulukazi kuzinhlelo zokusebenza ezibhekene nokushaqeka kwemishini noma ukuvakasha kokushisa okubanzi. Ukusetshenziswa kokugcwalisa okungaphelele kungadingeka ukuze kuthuthukiswe ukuthembeka.

Izinselele Zokuhlola Nokuvuselela

Ukuhlolwa kwamalunga e-WLCSP ngemva kokuhlanganiswa kudinga ukuthwetshulwa kwe-X-ray ngenxa yokuxhumeka kwe-solder okufihliwe ngaphansi kwedayi. Ukulungiswa kabusha kwezingxenye ze-WLCSP ezihlulekile kuyinselele ngokobuchwepheshe futhi kuyingozi ekulimaleni kwezingxenye eziseduze ezihlanganisweni ezixineneyo. Lezi zici zigcizelela ukubaluleka kokulawulwa kwenqubo okuqinile kulo lonke ukuhlanganiswa kwe-SMT ukuze kufezwe isivuno esiphezulu sokudlula kokuqala.

Izinhlelo zokusebenza ze-WLCSP

Ama-elekthronikhi Eselula Nabathengi

I-WLCSP isibe yiphakheji ekhethwayo yama-smartphone namathebulethi lapho izindlu zebhodi zisezingeni eliphezulu. Ama-IC okuphatha amandla, ama-codec omsindo, izinzwa, namamojula okuxhumana avame ukusebenzisa le fomethi. Iphrofayili encane isekela ukwakheka kwamadivayisi amancane ngenkathi igcina ukusebenza kahle kukagesi kwe-RF kanye nemisebenzi yesignali exubile.

Okugqokwayo kanye namadivayisi e-IoT

Ubuchwepheshe obugqokwayo kanye nezinhlelo zokusebenza ze-IoT zisebenzisa i-WLCSP ukuze kutholakale izidingo ezincane kakhulu. Ama-tracker okuqina komzimba, ama-smartwatches, nama-node ezinzwa ezingenantambo azuza ku-compact form factor. Ama-microcontroller anamandla aphansi, ama-sensor e-MEMS, kanye nama-transceiver angenantambo ku-WLCSP avumela ukwakheka kwemikhiqizo okwakungenakwenzeka ngaphambili ngezixazululo zokupakisha ezivamile.

Isiphetho

I-WLCSP imelela ubuchwepheshe bokupakisha obuvuthiwe nobubalulekile bemiklamo ye-elekthronikhi encishisiwe, esebenza kahle kakhulu. Indlela yayo yokucubungula ezingeni le-wafer inikeza ubukhulu be-chip-scale yangempela ngezici zikagesi eziphakeme. Ngenkathi ukunemba komklamo we-PCB nokuphathwa kokuthembeka kudinga ukunakwa ngokucophelela, izinzuzo ze-WLCSP—unyawo oluncane, ubuqotho besignali obuhle kakhulu, kanye nokusebenza kahle kokushisa—kwenza kube yinto ebalulekile kuma-elekthronikhi aphathekayo esimanje. Njengoba ukwenziwa kwedivayisi kube kuncane, i-WLCSP izohlala iwubuchwepheshe obuyisisekelo ekuhlanganisweni kwe-PCB okuthuthukisiwe kanye nokukhiqizwa kwe-elekthronikhi.