Umkhiqizi we-Al2O3 Ceramic PCB we-Precision Ceramic Circuits

Umkhiqizi we-Al2O3 Ceramic PCB we-Custom Electronics

I-Highleap ikhiqiza izifunda ze-ceramic ze-aluminium oxide ezichazwe ngamakhasimende, kunokuphatha wonke amabhodi e-ceramic njengento engenalutho ehleliwe eshalofini. I-oda lingamboza izifunda ze-ceramic ezinephethini zezinsimbi, izinzwa, izifunda zokushisa okuphezulu, amamojula e-LED kanye namaphakheji e-RF/elekthronikhi aqinile. Izinketho zokukhiqiza izifunda ze-ceramic ze-Highleap zifaka phakathi amamaki e-alumina asetshenziswa njengendawo yokuqala yale miklamo.

I-oda lokuthenga lokukhiqiza kufanele libonise ukwakheka kwe-ceramic, ubukhulu obushisiwe noma obuqediwe, ubulukhuni bomphezulu lapho kufanele khona, uhlelo lwensimbi yomqhubi kanye nendlela yokuhlola kagesi. Isicelo "se-PCB ye-ceramic ene-ENIG" asanele lapho umklamo owodwa udinga abaqhubi be-Ag/Pd abashisiwe kanti omunye udinga ithusi lefilimu elicolekile elinokuphela kwegolide okunamathelayo.

Ingabe i-Al2O3 Ceramic PCB ihlukile kwi-alumina PCB?

Cha. Zombili zibhekisela ku-substrate ye-ceramic ye-aluminium-oxide. Ibanga, ukubhoboka, ukulungiswa kwendawo, inqubo yefilimu kanye ne-geometry yesekethe yokugcina kusamele kuchazwe. Igama lezentengiselwano lodwa alisunguli impahla kagesi noma yokushisa yebhodi eliqediwe.

Amabhodi Esekethe E-Ceramic E-Alumina Angama-96%

I-Highleap ingabuyekeza amaphrojekthi e-PCB e-ceramic e-Al2O3 thick-film angu-96% wezinsimbi, amasekethe ahlanganisiwe, izinto zokuzwa kanye nezithwali zesekethe ezizinzile. Ukukhiqizwa kwesekethe ye-thick-film kuvame ukubeka ama-conductor, resistor noma ama-dielectric paste ku-ceramic bese kuwashisa ngaphansi kwephrofayili encike ezintweni ezibonakalayo. Ulwazi lwethu lokwenziwa kwesekethe ye-ceramic e-thick-film luhlanganisa lo mndeni wenqubo.

Isekethe ehlanganisiwe ingahlanganisa ama-trace omqhubi ovuthayo, izinto eziphrintiwe eziphikisayo, i-overglaze evikelayo kanye namadivayisi e-semiconductor angenalutho noma angenalutho. Umdwebo udinga amanani okumelana nokubekezelelana uma kucelwa ama-resistors aphrintiwe, isakhiwo se-crossover uma sisetshenziswa, i-pad metallurgy kanye nesimo sokugcina sobuso. Isekethe yesiliva/ye-palladium ephrintiwe esikrinini ayinakushintshaniswa nesekethe ye-DPC yethusi ngoba nje umsebenzi wobuciko ubukeka ufana.

Ingabe i-alumina engu-96% inenani eliqinile lokuqhuba ukushisa?

Cha. Isibonelo, umndeni owodwa oshicilelwe we-technical-ceramic ubika cishe ama-W/m·K angu-24.7 ngebanga lawo elingu-96% kanye nama-W/m·K angu-30 ngebanga elingu-99.5% ku-20°C. Lezi yizibonelo zabahlinzeki , hhayi iziqinisekiso zenqubo ye-Highleap; umthengisi we-ceramic, izinga lokushisa lokulinganisa kanye nebanga langempela. Umdwebo obalulekile ekushiseni kufanele ucacise ishidi ledatha lezinto ezamukelekayo noma impahla edingekayo kanye nendlela yokuhlola.

Ingabe i-96% Al2O3 ceramic PCB ingafaka ama-resistor aphrintiwe?

Indlela yefilimu ejiyile ehambisanayo ingafaka izici ze-resistor eziphrintiwe uma umklamo uzidinga. Sho inani eliqondiwe, ukubekezelelana, i-coefficient yokushisa, imvume yokusika kanye nendlela yokuqinisekisa. Ungacabangi ukuthi i-resistor trimming, test noma overglaze ifakiwe ngaphandle kokuthi kuchazwe ku-quotation.

I-99.6% Alumina Ifilimu Encane kanye Nezingxenyana Ezinhle

Ama-substrate e-ceramic e-Al2O3 ahlanzekile kakhulu angama-99.6% angachazwa ukuze kusetshenziswe i-metallization enephethini elihle, amasekethe e-RF akhethiwe kanye nezithwali ze-microelectronic ezinembile. Ubumsulwa be-substrate bubodwa abunqumi i-pitch yomqhubi engasetshenziswa: ukuqeda kobuso, i-stack yensimbi efakiwe, i-lithography, i-etching, i-adhesion kanye nokuqeda kokuvikela kokugcina konke kubalulekile. Insizakalo ye-PCB ye-ceramic ye-Highleap enembile kakhulu iyindlela ehlobene nalezi zakhiwo.

Ukuze uthole isekethe ye-alumina enefilimu encane, thumela umugqa/isikhala osifunayo, ubukhulu bomqhubi, ngokwelashwa uma kukhona, ukuqeda ukugoqa noma ukubopha kanye nezindinganiso zokugcina zokuthamba/zomphezulu. Ama-substrate okupakisha angadinga futhi imikhawulo yokuqhekeka komphetho we-substrate, ama-fiducial, ukuhlolwa kokunamathela kwensimbi, kanye nombiko ohlukile wobukhulu. Lezi zidingo kufanele zilungiswe ngaphambi kokukhishwa kwamathuluzi okuqala noma i-photomask.

Ingabe i-99.6% Al2O3 isekela ngokuzenzakalelayo iminonjana yethusi ecolekileyo?

Cha. I-ceramic ehlanzekile kakhulu inganikeza indawo efaneleka kangcono kumzila wefilimu encane ekhethiwe, kodwa umugqa/isikhala esincane siphinde sivinjelwe yi-conductor stack, i-lithography, indlela ye-plating/etch, ukunamathela kanye nokuqeda kokugcina. Caphuna ububanzi bokulandelela, isikhala kanye nobukhulu bensimbi obuqediwe ndawonye; ukusebenzisa iphesenti lobumsulwa njenge-proxy yokunemba kokwenziwa akwanele.

Ingabe i-alumina engu-99.6% ihlala inikeza ukusebenza okungcono kwe-RF noma ukushisa?

Hhayi ngokuzenzakalelayo. Ibanga le-ceramic lithinta izakhiwo zezinto ezibonakalayo, kodwa ukuziphatha kwesignali nakho kuncike ekuvameni, ubulukhuni bomqhubi kanye nokwakheka, kuyilapho ukumelana nokushisa kuncike ekujiyeni, izinsimbi kanye nezixhumi zokushisa. Cela ishidi ledatha likagesi nelokushisa eliqondene nebanga elithile esikhundleni sokuqhathanisa izinombolo zobumsulwa njengezinga lokusebenza elijwayelekile.

I-Al2O3 DPC, i-DBC kanye ne-Metallized Ceramic Circuits

Amabhodi e-ceramic e-Al2O3 angaklanywa ngezinhlelo ezahlukene ze-conductor metallization, futhi i-geometry yesekethe edingekayo inquma ukuthi iyiphi indlela esebenzayo. Insizakalo yokukhiqiza i-PCB ye-ceramic eyenziwe ngokwezifiso ye-Highleap ihlanganisa izinketho eziningi zokukhiqiza; ikhotheshini kumele ikhombe inqubo eceliwe kunokuthi kuthathwe ukuthi i-thick-film, i-thin-film, i-DPC kanye ne-DBC ziyashintshana.

Ukuze uthole izakhiwo eziboshwe ngethusi ezigxile emandleni, buyekeza izinsiza zokukhiqiza ibhodi le-ceramic le-DBC le-Highleap . Ukwakheka kwe-DBC kungadinga izimbobo ezinkulu noma ama-conductor ayinkimbinkimbi kakhulu kunokwakheka kwe-DPC okunesici esihle. Indlela yokunamathisela ehlosiwe—i-solder, i-brazing, i-wire bonding noma enye indlela ekhethekile—nayo ithonya ukuqeda kwensimbi.

Ingabe isekethe ye-ceramic ingahlanganisa ama-resistor aphrintiwe kanye nethusi elinamandla aphezulu?

Umkhiqizo ohlanganisa imisebenzi ungadinga ama-subassemblies ahlukene e-ceramic noma ukwakhiwa kwe-hybrid metal/resistor okufanelekile ngokukhethekile. Akuphephile ukubiza inhlanganisela ngokuthi akunakwenzeka emhlabeni wonke—noma itholakala njalo. Nikeza inhloso yesekethe, ukusebenza kwe-resistor, ukuhlukaniswa kanye nezidingo zamanje ukuze umzila wokukhiqiza uhlolwe ngaphambi kokuba kwenziwe isilinganiso.

Ingabe i-Al2O3 PCB kufanele isebenzise i-DBC copper noma i-DPC metallization?

Khetha kusuka kumandla avunyiwe, ubukhulu bethusi, usayizi wesici, ukunamathela kanye nezidingo zokuthembeka. I-DBC ifanelana nezisekelo eziningi zamandla zethusi ezijiyile; i-DPC ingasekela izidingo zesici ezihlukene ezinamaphethini. Akukho okunye okungena esikhundleni esifanele ngaphandle kokuqinisekisa imikhawulo yangempela yomklamo kanye nenqubo.

Ama-PCB e-Ceramic e-Al2O3 e-Sensors, RF kanye ne-Instrumentation

I-Highleap ingacaphuna amabhodi wesekethe se-ceramic e-Al2O3 ukuze ikwazi ukuzwa, ukuxhumana, amamojula e-LED kanye nezinsimbi ezikhethekile. Izibonelo zifaka phakathi abathwali bezinzwa ze-ceramic, ama-substrates enethiwekhi ye-RF angasebenzi, amasekethe esenzwa yokucindezela noma yokushisa, ama-subsemblies ezinsimbi zezokwelapha kanye namaphakheji e-laser/optical detector. Isicelo ngasinye kufanele sikhishwe kanye nezidingo zaso zomqhubi kanye nokungcola, hhayi inothi elijwayelekile elithi "ceramic PCB".

Ezinhlelweni zezokwelapha, izinhlelo zokusebenza zebhodi le-ceramic zezinsimbi zezokwelapha ze-Highleap ziyireferensi efanele yokukhiqiza. Ukuvunyelwa kwedivayisi yezokwelapha akukwazi ukucatshangelwa ngokusetshenziswa kwe-substrate ye-alumina noma ezimangalweni zesistimu yekhwalithi yomhlinzeki webhodi elingenalutho. Amakhasimende kanye nezindawo zokukhiqiza ezifanelekayo kumele bavumelane nokulethwa kokuthobela imithetho.

Ingabe izifunda ze-alumina ceramic zingasetshenziswa kuma-electronics asebenzisa imvamisa ephezulu?

Yebo, ezindleleni ezifanele zokuvama, ukulahleka kanye nokusetshenziswa kwensimbi. Umthengi we-RF kufanele acele idatha yangempela ye-dielectric ku-frequency efanele, kanye nokuphela kobuso, ukujiya komqhubi kanye nohlelo lokuhlola oluhlanganisiwe. I-substrate ebizwa ngokuthi i-99.6% alumina ayiqinisekisi ukulahleka kokufakwa kwe-RF okuqediwe.

Ama-PCB e-Alumina Ceramic aqoshwe nge-laser ane-Vias yensimbi

Ukukhiqizwa kwe-PCB ye-ceramic ye-Al2O3 ngokwezifiso kungabandakanya izimbobo ezinembile, ama-vias ensimbi, izikhala, ukubhala kanye nezinhlaka ezingezona unxande. Umshini wokugaya i-ceramic uhlukile ekubholeni okuvamile kwe-FR-4: ukucubungula kungaletha ama-edge chips, ama-microcracks, umonakalo wobuso noma ukushintshashintsha kobukhulu okuthinta ukuhlanganiswa kamuva. I-Highleap ingabuyekeza iphrofayili kanye nezidingo ngendlela yomhlinzeki we-ceramic okhethiwe kanye nereferensi yokucubungula i-PCB ye-ceramic.

Iphakheji ye-CAD kufanele ifake ungqimba oluyimishini oluhlukanisa imigodi yensimbi nengafakwanga ipulasitiki, ububanzi bemigodi kanye nokubekezelelana kwendawo, i-geometry yemigodi eqediwe, ububanzi bewebhu obuncane, ukuqhekeka komphetho okuvumelekile kanye nanoma yisiphi isici esidinga i-laser ethile noma indlela yokuhudula. Uma ibhodi le-ceramic kumele livumelane ne-heat spreader noma iphakheji ye-optical, maka ama-datum abalulekile kulowo mhlangano.

Ingabe ukusika nokubhala nge-laser ye-ceramic kuqedwa njalo ngaphambi kokwenziwa kwensimbi?

Cha. Imizila yenqubo ye-ceramic iyahlukahluka: imigodi noma izici zohlaka zingase zakhiwe ngaphambi kokwenziwa kwensimbi, kuyilapho ukubhala nge-laser ngemuva kokwenziwa kwensimbi kanye nokusikwa kwayo kusetshenziswa nesikhala esifanele sensimbi ukuze ibhalwe. Umdwebo kufanele uhlukanise ubukhulu bokugcina bezingcezu ngazinye nezici zephaneli futhi ukhombe izindawo zokugcina insimbi eduze kwezindlela ezisikiwe noma zokubhala. I-oda lokucubungula livunyelwe i-substrate ekhethiwe kanye nohlelo lwensimbi.

Ingabe ama-PCB e-ceramic e-Al2O3 angambozwa ngemigodi?

Izinhlelo ze-ceramic metallization ezikhethiwe zisekela imigodi yensimbi, kodwa ukwakheka kwemigodi okufinyelelekayo kanye nokuxhumeka kukagesi kuncike ekujiyeni kwe-substrate, usayizi wemigodi kanye nokucutshungulwa kwensimbi. Thumela imephu yesigaba esiphambeneyo kanye ne-drill. Ungacabangi ukuthi incazelo ejwayelekile ye-FR-4 PTH isebenza ngqo.

Ukuhlolwa kwe-PCB ye-Ceramic, Ubukhulu kanye nokuhlolwa kukagesi

Uhlelo lokuhlola i-Al2O3 ceramic PCB kufanele lulandele umdwebo we-substrate oqediwe kanye nowe-conductor. Ubufakazi obujwayelekile obuhleliwe buhlanganisa ukuhlonza i-substrate, ukuhlolwa kobukhulu kanye nokuthamba, ukuhlolwa okubonakalayo kwama-chips noma imifantu, ukulinganisa umkhondo we-conductor kanye nokuqeda, ukuhlolwa kokuqhubeka/ukuhlukaniswa kanye nokuhlolwa kokunamathela noma ukuthembeka kwesicelo esithile. Izinsiza zokuhlola zobukhulu kanye nogesi ze-PCB ze-Highleap zichaza umehluko omkhulu phakathi kokuhlolwa kwekhwalithi ebonakalayo nekagesi.

Kumthwali wezinzwa, ukuvezwa kwamakhemikhali kagesi kanye nokuhlanzeka kobuso kungabalulekile ngaphezu kobukhulu bethusi. Kwi-substrate encane ye-RF, i-geometry yomugqa kanye nokunamathela kwensimbi kungalawula umphumela. Kwi-ceramic enamandla eboshiwe-ethusi, ubuqotho be-interface, ukuhlukaniswa kanye nokujikeleza kokushisa kungaba yinto ephakathi. Ilebula elilodwa "elihlolwe ngo-100% we-ceramic" alilona uhlelo oluphelele lwekhwalithi.

Ingabe umhlinzeki angaqinisekisa ukuthi i-PCB yobumba ngeke iqhekeke lapho isetshenziswa?

Cha. Ukucindezeleka kwesevisi kuncike ekufakeni, ukungalingani kokushisa, ukuhlanganiswa kwe-solder, ukubopha kanye nendawo yokushaqeka. Chaza isimo somphetho ovumelekile, ukwakheka kwe-fixture kanye nokuhlolwa kokuthembeka okusebenzayo kunokufuna isitatimende esingenamibandela mayelana nokusebenza okungenamaphutha.

Izingcaphuno ze-PCB ze-Ceramic ze-Al2O3 ezenziwe ngokwezifiso kanye nezincazelo ze-Substrate

Cela ikhotheshini ye-PCB ye-Al2O3 eyenziwe ngokwezifiso enomdwebo wokwenziwa kanye nohlelo lwensimbi olucacile. I-Highleap ingabuka izinto ze-alumina, ukwenziwa komqhubi, imigodi/iphrofayili, ukuqeda ubuso, ukuhlolwa kanye nokulethwa kokuhlanganiswa okukhethwayo. Intengo incike ebangeni lezinto, ukusetshenziswa kwe-substrate, isivuno sesici esihle, umzila wenqubo, ubuningi besampula kanye nomsebenzi wokuhlola; akukho zindleko ezijwayelekile ngesentimitha lesikwele ngasinye ezimele zonke lezi zakhiwo.

• Isendlalelo: 96% noma 99.6% Al2O3, ukujiya, umthombo webanga, ukuqeda kanye nokuba yisicaba.
• Umjikelezo: Idatha ye-Gerber/DXF noma yemaski, inqubo yomqhubi/ubukhulu bensimbi, izici ze-resistor noma ze-dielectric uma zikhona.
• Imishini: iphrofayili, izimbobo/ama-via, uhlelo lwedatha, imikhawulo yomphetho/ye-chip kanye nokubekezelelana kobukhulu.
• Ukwamukela: izidingo zokushisa nokugcina izinto ziqinile, ukunamathela, ukuqeda, ukuhlanzeka kanye nokuthatha amasampula.
• Umhlangano: i-module ye-ceramic engenalutho noma egcwele abantu, i-BOM, ama-solder/bond pads, i-test fixture kanye nobuningi obulindelekile.

Ukuze uthole ukuqhathanisa okubanzi kwensizakalo, i-Highleap inikeza ukwesekwa kokwenziwa nokucubungula ibhodi le-ceramic ; izinga eliqondile le-alumina kanye nendlela kufanele kusalungiswa ku-RFQ yakho.

Yimaphi amadokhumenti enza ukuthi isilinganiso se-Al2O3 ceramic PCB sisebenze?

Nikeza umthengisi/izinga le-substrate noma ezinye izindlela ezamukelekayo, ubukhulu obujwayelekile, ubuciko/izendlalelo zensimbi, uhlaka olucishiwe noma oluqediwe kanye nezikhala, uhlelo lwensimbi kanye nokuqeda kwesigaba ngasinye sephedi, ubuningi, kanye nokuhlolwa okuqondene nohlelo lokusebenza. Uma izingxenye zizofakwa, engeza umdwebo wokuhlanganisa, i-BOM, inqubo yokunamathisela kanye nemikhawulo yokwamukela; amanani okuhlanganisa kuphela kanye namanani okuhlanganisa aqediwe kufanele ahlukaniswe.

Yiluphi ulwazi olubangela ukubambezeleka kwesilinganiso se-PCB se-Al2O3 ceramic?

Ukungahlanzeki okungekho, inqubo yensimbi engacacisiwe, umdwebo ongabonakali ubukhulu bokusha uma kuqhathaniswa nokuqeda, akukho ukubekezelelana kwe-via/edge, kanye nobubanzi bokuhlanganisa/bokwamukela obungacacile. Ukuhlinzeka ngalokhu ekuphenyweni kokuqala kwenza kube nokwenzeka ukubuyekeza ukukhiqizwa nokucaphuna inqubo efanele.