Umkhiqizi we-AlN Ceramic PCB we-High-Thermal-Performance Electronics

Umkhiqizi we-PCB we-AlN Ceramic ngokwezifiso

I-Highleap ikhiqiza futhi ithole amabhodi wesekethe se-aluminium nitride ceramic njengomndeni we-substrate ohlukile ngaphakathi kokunikezwa kwayo kwe-PCB ye-ceramic. Iphrojekthi iqala ngebanga le-substrate elifanelekile kanye nephethini yokwenza insimbi, hhayi i-FR-4 stack-up. Iphothifoliyo yokwenziwa kwebhodi yesekethe se-ceramic ye-Highleap ichaza izinketho ze-AlN, i-alumina kanye ne-silicon-nitride kanye nokwenza insimbi kanye nokuhlanganiswa okulandelayo.

I-AlN ikhethwa lapho umklamo udinga ukufakelwa kukagesi okunokushisa okuphezulu kakhulu kunokushisa okujwayelekile kwe-alumina. Umndeni we-substrate we-Kyocera AlN, isibonelo, ucacisa ukufudumala okungu-150 W/(m·K) noma ngaphezulu; amanani angempela ancike ebangeni, indlela yokuhlola kanye nokushisa okusebenzayo. Ukushisa kwe-substrate kungokufaka okukodwa kuphela ekushiseni kwe-junction-to-case: i-die attach, ukumbozwa kwethusi, ukujiya kwe-ceramic, ama-solder voids kanye nokuxhumana kwe-heatsink kungabusa imodyuli eqediwe.

I-OEM kufanele ikhethe nini i-AlN esikhundleni se-alumina ceramic?

Uma ukumelana nokushisa okulinganisiwe noma okumodeliwe nge-substrate kuyingxenye ekhawulelayo yendlela yoku-die-to-heatsink, hhayi ngoba nje ishidi ledatha le-AlN libika inombolo enkulu yokuqhuba. Amamaki e-AlN omhlinzeki angashicilela amanani azungeze i-150–240 W/m·K, kuyilapho amamaki athile e-alumina evame ukuba seduze ne-20–30 W/m·K ekushiseni kwegumbi. Lezi yizibonelo zezinga lezinto ezibonakalayo, hhayi isilinganiso sokusebenza kwebhodi eliqediwe esithembisiwe . I-die attach, insimbi enephethini, ukujiya kanye ne-interface ye-heatsink kumele kuhlolwe futhi.

Ingabe i-AlN iyinto ye-PCB noma i-substrate yamandla e-ceramic?

Womabili la magama avela kumadokhumenti okuthenga. Empeleni, imininingwane kumele isho ukuthi umkhiqizo uyibhodi le-ceramic elinephethini, i-DBC/AMB power substrate, isekethe yefilimu encane noma imodyuli ehlanganisiwe. Ubukhulu bayo bethusi, osayizi bezici kanye nezinqubo zokuhlanganisa azikwazi ukushintshaniswa.

Ama-substrate e-AlN Ceramic ama-Laser Diode nama-LED anamandla aphezulu

Amabhodi e-LED e-ceramic e-AlN kanye nama-substrate e-laser-diode asebenzisa umzimba we-ceramic njengengxenye yendlela yokushisa ngenkathi egcina ukuhlukaniswa kukagesi. Imikhiqizo evamile yokuthenga ukuze uphrinte ifaka ama-substrate e-LED anamandla aphezulu, abathwali be-UV ne-IR emitter, ama-submount e-laser-diode, amaphakheji enzwa ye-optical kanye namamojula okukhanyisa acwebezelayo. I-Highleap ingahlola la maphrojekthi ngokusebenzisa izinsiza zayo zokukhiqiza i-substrate ye-ceramic eyenziwe ngokwezifiso ngobukhulu kanye nezidingo zokunamathisela ezichazwe yi-OEM.

Ukuze uthole indawo engaphansi kwe-laser-diode, umdwebo kufanele ukhombe indawo yedayi, unamathisele i-metallization, ukujiya kwensimbi, ukuba yisicaba, indawo yokubeka umswakama ekushiseni kanye nanoma yimaphi ama-wire-bond pads. Ukuze uthole i-LED array, faka izinombolo zezingxenye zomkhiqizi we-LED, ukuma kwephakheji, isakhiwo se-thermal pad, ukuqeda okusongelwayo, iphethini yokufaka kanye nesithwali noma i-heatsink ehlosiwe. Uma ikhasimende lidinga ukumelana nokushisa noma ukuhlolwa kokukhanya, imingcele efanele ye-fixture kanye nokuhlolwa kumele kuvunyelwane ngayo ngokwehlukana.

Ingabe ibhodi lesifunda le-aluminium nitride LED lingayithatha indawo ye-PCB ene-aluminium-core?

Akuyona into yokufaka esikhundleni. Amabhodi e-aluminium-core aqukethe i-dielectric ehlukile evikela ugesi phakathi kwesekethe yabo yethusi kanye ne-metal core. I-AlN ceramic ngokwayo iyavikela ugesi, ene-CTE ehlukile, ukuziphatha kokuqhekeka, uhlelo lokunamathisela insimbi kanye nomklamo wokubopha. I-OEM kumele iqinisekise imiphumela yokushisa, kagesi kanye neyemishini. I-Highleap iphinde inikeze ezinye izindlela ze-PCB ze-LED ze-metal-core uma lezo zifanelana kangcono nomklamo.

Ama-substrate e-AlN DBC kanye ne-AMB wama-SiC/GaN Power Modules

Ama-substrate e-AlN DBC kanye ne-AlN AMB abhekana namamojula kagesi adinga ama-conductor ethusi ahlanganiswe ne-ceramic evikela ngogesi. Lawa ubuchwepheshe obuhlukile be-copper-to-ceramic. I-Highleap ishicilela ukukhiqizwa kwe-substrate yethusi eboshwe ngqo kanye nezinketho ze-substrate ze-ceramic eziboshwe ngensimbi esebenzayo njengemigqa yomkhiqizo efanele; umzila okhethiwe kumele uhambisane nebanga eliqondile le-AlN kanye nencazelo yemishini/yokuthembeka.

I-substrate ye-AlN eboshwe ngethusi enezinhlayiya ezinkulu ayilingani ngokuzenzakalelayo nesekethe ye-AlN microelectronic enesici esihle. I-AMB ingase ikhethwe kwezinye izakhiwo zamandla ezinokwethenjelwa okuphezulu; i-DBC ingaba yindlela ehlukile esebenzayo kuye ngomklamo kanye neziqu zenqubo. I-Highleap kufanele icaphune inqubo evunyiwe kanye namarekhodi okuhlolwa kwebhondi adingekayo esikhundleni sokumelela zonke izinhlelo ze-ceramic metallization njengezilinganayo.

Ingabe i-AMB ithembeke kakhulu ngokuzenzakalelayo kune-DBC kuyo yonke imodyuli yamandla?

Cha. Umklamo wemodyuli ofanelekayo—kufaka phakathi ukujiya kwe-ceramic, ukuma kwephethini yethusi, izinto ze-substrate, ungqimba lokunamathisela, iphrofayili yokujikeleza kanye nokuhlolwa kokwamukelwa—usetha umphumela. Ukukhetha i-AMB ngegama akunakuqinisekisa impilo yomjikelezo wokushisa. Thumela ububanzi bokushisa, iphrofayili yomjikelezo kanye nokucaciswa kwesixhumi semodyuli nge-RFQ.

Ingabe i-AlN DBC iyaqinisekisa impilo yokujikeleza kokushisa kwemodyuli ye-SiC?

Cha. Ukwakheka kwe-ceramic, iphethini yethusi, i-geometry yekona, izixhumanisi ezihlanganisiwe noma ezihlanganisiwe, izibopho zentambo, indlu kanye nephrofayili yangempela yomsebenzi konke kuthinta ukuthembeka. Cela izimo zomjikelezo, usayizi wesampula, izindlela zokwamukelwa kanye nomnikazi wokuhlolwa kunenombolo ejwayelekile yesikhathi sokuphila.

Ukukhiqizwa kwe-AlN DPC kanye ne-Thin-Film Ceramic PCB

I-AlN DPC kanye nezifunda ze-ceramic ze-thin-film zikhonza ama-conductor acwebezelayo noma ama-pad amancane kuneziningi zamandla ethusi elisindayo. Ukunikezwa kwe-PCB ye-ceramic ye-thin-film metallized ye-Highleap kubalulekile lapho ama-photonics, ama-RF noma ama-microelectronic assemblies edinga i-geometry encane noma izakhiwo zobuso ezihambisana nebhondi. Buza ukuthi yikuphi ukubhoboza, ukubeka, ukuthwebula, ukupenda kanye nomzila wokugcina otholakalayo ngempela webanga le-AlN eliceliwe.

Iphrojekthi ye-AlN DPC ingadinga i-plated ngesakhiwo, izendlalelo ze-conductor ezinephethini kanye nokuqedwa kwendawo echaziwe. Isekethe yefilimu encane ingase ikhethwe esikhundleni salokho ngobubanzi bemigqa emincane noma izitaki zensimbi ezinembile. Amalebula amabili awachazi ubukhulu obufanayo noma amafasitela enqubo. Ukwamukelwa kokukhiqiza kufanele kusebenzise imephu yemaski/yomugqa echaziwe, ubukhulu be-conductor, ngokuphela, ukuhlolwa kokuhlukaniswa kanye nendlela yokunamathela kwephedi.

Ingabe i-PCB ye-AlN ceramic eyenziwe ngokwezifiso ingaba nezendlalelo eziningi noma ama-via ensimbi?

Ukwenziwa kwensimbi okunezinhlangothi ezimbili kanye nokukhethwa ngezindlela kuhlukile kwiphakheji ye-ceramic yangempela enezingqimba eziningi. Ukwakhiwa kwe-AlN enezingqimba eziningi ezihlanganisiwe kukhona ekupakishweni kwe-ceramic okukhethekile, kodwa akufakiwe ngokuzenzakalelayo ku-oda le-AlN DBC/DPC, futhi izinqubo ze-LTCC ezivamile akufanele zichazwe njengokuthuthukiswa kwe-AlN okuvamile. Thola inani lezendlalelo zomqhubi ezizimele, ngokusebenzisa umsebenzi, ubukhulu obukhishiwe noma obuqediwe kanye nendlela yenqubo ekhethekile yokubuyekezwa kokusebenziseka okuhlukile.

Ingabe i-AlN ceramic PCB ingaba nama-vias ensimbi noma amasekethe anezinhlangothi ezimbili?

Eminye imizila yokwenza insimbi ye-ceramic ingasekela ama-via kanye nezinhlangothi ezingaphezu kweyodwa ezinamaphethini, kodwa isilinganiso se-aspect ratio esitholakalayo, ukuqeda imbobo kanye nokulandelana kwenqubo akufani nokwenziwa kwe-PCB efakwe imbobo embobo e-FR-4. Nikeza isigaba esiphambene bese ucela isibuyekezo somzila esiqondene nephrojekthi.

Amabhodi e-AlN Ceramic ama-RF Power Amplifiers kanye namadivayisi e-Microwave

Ama-PCB e-AlN ceramic ayasiza lapho ubuningi bokushisa, ukufakelwa kwe-insulation kanye nokupakishwa kwesekethe kufanele kusebenze ndawonye. I-Highleap ingahlola ama-substrate e-AlN ezigaba ze-RF amplifier, amadivayisi kagesi e-GaN, amamojula okushintsha i-SiC, izigaba zamandla ze-DC/DC ezihlanganisiwe kanye namaphakheji okushisa anembile. Ngayinye iyincazelo ehlukile yomhlangano: i-RF amplifier ibeka phambili i-geometry ye-RF elawulwayo kanye nokuqhubeka komhlaba, kuyilapho imojula yamandla okushintsha ingase ibeke phambili ithusi elijiyile, ukuhlukaniswa kwe-dielectric kanye nokuziphatha komjikelezo wokushisa.

Lapho umkhiqizo uhlanganisa isilawuli esijwayelekile esihlukile esinezingqimba eziningi, i-Highleap ingaxhumanisa i-substrate yamandla e-ceramic nephakheji yokukhiqiza ye-PCB yesilawuli esivamile. Kubalulekile ukungahlanganisi i-ceramic substrate qualification ne-system-level EMC, i-RF characterization, isitifiketi sokuphepha okusebenzayo noma ukuhlolwa kwe-inverter. Insizakalo yokukhiqiza i-PCB yamandla kagesi inikeza izinketho eziseduze zengxenye yebhodi lokulawula.

Izidingo ze-AlN PCB kufanele zihluke kanjani ku-RF kanye namandla aphezulu kagesi?

Abathengi be-RF kufanele babeke phambili i-metallization efanele, i-conductor geometry, uxhumano lomhlabathi, amaza kanye nokusebenza kwedivayisi ehlanganisiwe. Abathengi be-Power-module kufanele bacacise ukujiya kwethusi, ukuhlukaniswa, izinga lokushisa lokusebenza, iphrofayili yomjikelezo wokushisa kanye nezixhumi zokunamathisela/zokufaka. Bobabili basadinga ibanga le-AlN elivunyiwe kanye nomdwebo womshini.

I-Aluminium Nitride Ceramic PCB Assembly kanye ne-Die Attach

I-Highleap ingaxhumanisa ukuhlanganiswa kwezifunda ze-ceramic ze-AlN ezihambisanayo ngaphezu kokwenziwa kwe-ceramic engenalutho. Imisebenzi engaba khona echazwe yiphrojekthi ifaka phakathi ukubekwa kwengxenye ye-SMT, ukuhlanganisa i-die, ukubopha ucingo, ukunamathisela nge-soldering noma ukunamathisela okusikiwe, ukuhlolwa kanye nokuhlolwa kwezinga le-module. Ubuchwepheshe bangempela bokuhlanganisa kanye nendawo yokukhiqiza ekhethekile kufanele kuqinisekiswe ngenqubo yekhasimende kanye nezidingo zokupakisha, hhayi ngokusekelwe emandleni e-SMT avamile.

Ngokungafani nebhodi elivamile le-FR-4, i-substrate ye-AlN ingaba mncane, iqine futhi izwele ekuthwaleni amaphuzu. I-fixture, i-vacuum pick-up, i-clamping kanye nephrofayili ye-oven kudingeka kufane ne-ceramic geometry. Ama-bond pad ensimbi, ama-flux residues kanye nemikhawulo yokuhlanza kumele ivumelane nedivayisi ekhethiwe kanye nokuphela kwendawo. Ukuhlanganiswa kwamandla okunama-MOSFET afakwe kungadinga imingcele ye-void ngaphansi kwe-die; i-laser module ingadinga ukulungiswa kwendawo kanye nobufakazi bamandla e-bond.

Ingabe i-Highleap inganikeza imojuli yamandla ye-AlN ephelele enamathiselwe ngokudaya?

I-Highleap ingacaphuna ukwenziwa kwe-ceramic substrate futhi ixoxe ngephakheji yokuhlanganisa ehlanganisiwe. Ukunamathiselwa kwe-die, i-sintered interfaces, i-wire bonding, i-encapsulation kanye ne-completed-module equipped electrical noma thermal qualification kuyimisebenzi ekhethekile; kumele ibhalwe ngazinye nenqubo enesibopho kanye namarekhodi okwamukelwa, kunokuba kuthathwe kusukela ku-standard SMT assembly.

Izinsizakalo zokuhlanganisa i-PCB ze-Highleap kanye nokuhlanganiswa kwezingxenye zingacatshangelwa kuma-elekthronikhi azungezile, ngencazelo ehlukile yenqubo yanoma yimiphi imisebenzi yezinga le-chip. Lapho kuchazwe khona ukubopha kwe-microelectronic, bhala indlela yokubopha kanye nobunikazi be-fixture ku-scope yokuhlanganisa.

Ingabe imodyuli ye-AlN ceramic ephelele ifakiwe nekhotheshini ye-PCB engenalutho?

Cha. I-substrate engenalutho eyenziwe ngensimbi kanye ne-ceramic assembly egcwele abantu inezinhlobo ezahlukene ze-BOM, amathuluzi, ukuphathwa, ukuhlolwa kanye nezikweletu. Cela okuhlukile okulethwayo kokwenziwa kwe-ceramic, izingxenye, imisebenzi yokunamathisela, ukuhlolwa kwemodyuli kanye nanoma yikuphi ukuqinisekiswa kwedivayisi eqediwe.

Ukuhlolwa kwe-AlN Ceramic Substrate kanye nemininingwane ye-Thermal

Uhlelo lokwamukela ukukhiqizwa kwe-AlN ceramic PCB kumele luqinisekise umdwebo ochaziwe, ukufakwa kogesi kanye nekhwalithi yokwenza insimbi. I-Highleap ingaxoxa ngokuhlonza i-substrate engenayo, ukuhlolwa kobukhulu/ukuthamba, ukuhlolwa kwephethini yomqhubi, ukuqhubeka nokuhlukaniswa, ukujiya kokuqeda kanye namarekhodi esibopho noma ukuthembeka kwephrojekthi ethile. Indlela yokuhlola eqondile kanye nemibhalo yokulethwa kufanele kuvunyelwane ngayo nendlela yokukhiqiza i-ceramic ekhethiwe.

Ulwazi lwekhwalithi kanye nokuhlolwa kwe-PCB ye-Highleap lusiza ukuchaza umehluko phakathi kokuhlolwa kokwenziwa kanye nokuhlolwa komkhiqizo ohlanganisiwe. Ukuhlolwa okufunwayo okungu-100% kudinga ububanzi bawo obuqondile: iyiphi ipharamitha, ngayiphi indlela kanye nomkhawulo wokwamukelwa. Amakhuphoni okuhlola noma inani lesampula kumele lihlonzwe ukuze kutholakale ukunamathela okubhubhisayo noma ukufaneleka komjikelezo wokushisa.

Ingabe umhlinzeki angaqinisekisa ukuhanjiswa kokushisa kwe-AlN PCB ngayinye eqediwe?

Ukuqhuba ukushisa ngokuvamile kuyimpahla yezinga le-substrate enendlela yokuhlola izinto kanye nesitifiketi somhlinzeki. Ukugeleza kokushisa kwebhodi eliqediwe kuncike ensimbini enephethini, izendlalelo ezinamathiselwe kanye nezixhumi. Uma kudingeka ukulinganisa ukushisa kokukhiqiza, chaza ukuhlanganiswa kwangempela kanye ne-fixture yokuhlola kunokuba ucabange ukuthi kufakiwe ekuhlolweni kwe-substrate ejwayelekile.

Izilinganiso ze-AlN Ceramic PCB kanye Nezidingo Zokwenziwa Ngokwezifiso

I-Highleap icaphuna amabhodi e-ceramic e-aluminium nitride ngokwezifiso kusukela ku-substrate ekhishwe kanye nencazelo ye-metallization. Isikhathi sokukhokha kanye nentengo kuncike ebangeni le-AlN, usayizi wengxenye, ukujiya, incazelo yephethini, umzila we-DBC/DPC/thin-film, ukusetshenziswa kwe-substrate, izidingo zembobo/i-cavity, ukuqeda, izinga lokuhlola kanye nobuningi. Imojula yamandla kanye ne-submount ye-laser-diode enobukhulu obufanayo ingaba nezindleko zokucubungula ezihluke ngokuphelele.

• Izinto zokwakha kanye nobuchwepheshe: Ibanga le-AlN, ukunqunyelwa komkhiqizi uma kukhona, ukujiya okujwayelekile, uhlaka, ukubekezelelana, isimo somphezulu kanye nokuba yisicaba.
• Incazelo yomqhubi: I-Gerber/DXF, inqubo yokwenza insimbi, ukujiya, ukuqeda, uhlangothi lwesekethe, izindawo zamaphedi, ama-via kanye nezikhala zokuhlukanisa.
• Ububanzi bomhlangano: i-substrate engenalutho noma iyunithi egcwele abantu; i-die/LED BOM, uhlelo lwe-bond pad, i-attach kanye nemiyalelo ye-thermal-interface.
• Ukwamukela: ukuhlolwa, ukuhlolwa kwe-dielectric, izidingo zebhondi/i-void, amasampula okuthembeka, ukupakisha kanye nokulandelela.
• Ububanzi bezentengiselwano: inani le-prototype, isibikezelo sonyaka, ishejuli yokukhishwa kanye nendawo okuya kuyo.

Ukuze uthole imikhawulo eningiliziwe yenqubo yobumba, ulwazi lwensizakalo yokwenziwa kwebhodi lobumba lwe-Highleap luyinsiza ehlobene. Thumela iphakheji ephelele yokukhiqiza ukuze ikhotheshini ibone umsebenzi ngamunye wobumba kanye nowokuhlanganisa futhi ikhiphe umsebenzi weziqu ongacelwanga.

Yini ebangela intengo ye-AlN ceramic PCB?

Izindleko zezinto ezisetshenziswa ngaphansi komhlaba ziyisici esisodwa kuphela. Isivuno, ukunemba kwephethini yethusi, ukuqedwa okukhethekile, ukunamathela kweplati/insimbi, ukuphathwa kwe-thin-ceramic, ukuhlolwa okubhubhisayo, amathuluzi okunamathisela ngodayi kanye nokusetha okuphansi konke kungathinta ikhotheshini. Ubuningi obuceliwe kanye nedatha yokudweba eqondile kuyadingeka ngentengo evikelekile.