Ama-DBC Substrates ama-PCB e-Ceramic nama-Power Module

Izisekelo ze-DBC (Direct Bonded Copper) zisetshenziswa kabanzi kumamojula kagesi kanye nemiklamo kagesi eshisa kakhulu lapho ukudluliselwa kokushisa okuphumelelayo kanye nokuhlukaniswa kukagesi kubalulekile khona. Leli khasi linikeza umbono osebenzayo wezakhiwo ze-DBC, izinto zokwakha, izinto zokukhiqiza, nokuthi ziqhathaniswa kanjani nezinye ubuchwepheshe be-PCB be-ceramic.

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Kwa-Highleap Electronics, singumkhiqizi we-PCB ohlinzeka ngezinsizakalo ezigcwele ohlinzeka ngama-PCB e-ceramic, ama-DBC substrates, amabhodi ensimbi ayinhloko, ama-PCB anezingqimba eziningi, kanye nezinsizakalo eziphelele zokuhlanganisa ama-PCB.

Ama-substrate e-DBC angenye yezixazululo zokuphathwa kokushisa esizisekelayo zezinhlelo zokusebenza ezinamandla aphezulu kanye nokuthembeka okuphezulu njenge-elekthronikhi yamandla, amamojula ezimoto, kanye nemishini yezimboni. Lo mhlahlandlela uchaza ukuthi ubuchwepheshe be-DBC busebenza kanjani, ukuthi kufanele busetshenziswe nini, nokuthi bufanelana kanjani nezinketho ezibanzi zokwenziwa kwe-PCB kanye ne-ceramic PCB.

Thola I-Quote Esheshayo Manje

Ukulungele ukuhlola amakhono ethu akhethekile? Vakashela ikhasi lethu elizinikele lokukhiqiza i-PCB ngobumba noma ufunde ngezinsizakalo zethu ezigcwele zokukhiqiza i-PCB.

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1) Iyini i-DBC Substrate?

I-substrate ye-DBC, eyaziwa nangokuthi i -substrate yethusi eboshiwe ngqo , uhlobo lwebhodi lesekethe le-ceramic lapho i-foil yethusi iboshelwa khona ngqo kolunye noma zombili izinhlangothi zezinto eziyisisekelo se-ceramic ngenqubo yokuxiliswa kokushisa okuphezulu. Ngokungafani nezindlela zokwenziwa ze-PCB zendabuko ezithembele ezingqimbeni zokunamathela, ubuchwepheshe be-DBC budala isibopho se-metallurgical phakathi kwethusi ne-ceramic, okuholela ekuqhutshweni kokushisa okumangalisayo kanye nokuthembeka kwemishini.

Indlela yokubopha ihilela ukufudumeza ithusi kanye ne-ceramic emazingeni okushisa aseduze nendawo ye-copper-oxygen eutectic (cishe i-1065°C). Kuleli zinga lokushisa, kwakheka ungqimba oluncane lwe-copper oxide endaweni ehlanganayo, olube seluphendulana nomphezulu we-ceramic ukuze kudalwe isibopho esihlala njalo, esinamandla aphezulu. Le nqubo iqeda isidingo sama-intermediate bonding agents futhi iqinisekisa ukumelana okuncane kokushisa phakathi kwesendlalelo sesekethe yethusi kanye ne-ceramic substrate.

Ama-substrate e-DBC ngokuvamile anobukhulu bethusi obusukela ku-0.127mm kuya ku-0.635mm (5 mil kuya ku-25 mil), kanye nobukhulu be-ceramic obusukela ku-0.25mm kuya ku-1.0mm. Le nhlanganisela inikeza kokubili ukuhanjiswa kukagesi okuhle kakhulu kwezicelo zamandla aphezulu kanye nokushabalaliswa kokushisa okuphezulu kwamadivayisi e-semiconductor yamandla.

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2) Indlela Ama-DBC Substrates Angena Ngayo Ekwenziweni Kwe-PCB

Nakuba ama-substrate e-DBC abelana ngokufana okusebenzayo namabhodi wesekethe aphrintiwe avamile, inqubo yawo yokukhiqiza ihluke kakhulu emisebenzini ejwayelekile yokwenziwa kwe-PCB . Ama-PCB endabuko asebenzisa ama-laminate e-organic (njenge-FR-4) anethusi elifakwe ngogesi noma elifakwe i-laminate, kanti ama-substrate e-DBC adinga imishini ekhethekile yokubopha eshisa kakhulu kanye nezitofu zomoya ezilawulwayo.

Ukuhlanganiswa kwe-DBC substrates ekuhlanganisweni kwe-elekthronikhi kuvame ukulandela lolu chungechunge: ukulungiswa kwe-ceramic substrate, ukubopha ngethusi, ukufota ngesekethe nge-photolithography kanye nokuqopha, ukuqeda ubuso, kanye nokufakwa kwezingxenye ekugcineni. Abakhiqizi abaningi bamandla module bathola i-DBC substrates enamaphethini evela kubaphakeli abakhethekile njenge-Highleap Electronics, bese benza i-die attach, i-wire bonding, kanye ne-encapsulation ezindaweni zabo.

Ukuqonda inqubo yokukhiqiza ye-DBC kubalulekile konjiniyela abacacisa lezi zingxenye, njengoba imingcele yenqubo ithinta ngqo ukuthembeka kokujikeleza kokushisa, amandla ebhondi, kanye nokusebenza kwesikhathi eside ezindaweni ezidinga kakhulu.

3) Ukusetshenziswa Okuvamile Kwezingxenye Ze-DBC

Ama-substrate e-DBC asebenza njengomgogodla we-elekthronikhi yamandla kuzo zonke izimboni eziningi. Inhlanganisela yawo eyingqayizivele yokuqhuba ukushisa okuphezulu, ukuhlukaniswa kukagesi okuhle kakhulu, kanye nokuzinza komshini kuwenza abe yinto ebalulekile ekusetshenzisweni lapho ukuphathwa kokushisa kubaluleke kakhulu.

• Amamojula we-IGBT kanye naMandla: Amamojula e-Insulated Gate Bipolar Transistor ama-drive ezimoto zezimboni, ama-traction inverters, kanye nezinhlelo zamandla avuselelekayo athembele kakhulu kuma-substrate e-DBC. I-substrate inikeza kokubili ukuhlukaniswa kukagesi kanye nokudluliselwa kokushisa okuphumelelayo kusuka ku-die ye-semiconductor kuya ohlelweni lokupholisa.
• Izimoto Zikagesi Amandla E-elekthronikhi: Ama-inverter e-EV, amashaja angaphakathi, kanye nabaguquli be-DC-DC bafuna ama-substrate akwazi ukusingatha ubuningi bamandla aphezulu ngenkathi egcina ukuthembeka ngaphezu kwezigidi zemijikelezo yokushisa.
• Ukukhanya kwe-LED Okunamandla Aphezulu: Amaphakheji e-LED akhanya kakhulu kanye nemiklamo ye-COB (Chip-on-Board) asebenzisa ama-substrate e-DBC ukuphatha ukushisa okukhulu okukhiqizwa ama-LED agcwele kakhulu.
• I-Aerospace nokuvikela: Izinhlelo ze-radar, ama-power amplifiers, kanye nama-avionics zidinga ama-substrates agcina ukusebenza kahle kuzo zonke izigaba zokushisa eziphakeme kanye nezimo zokusebenza ezinzima.
• I-Industrial Automation: Ama-servo drive, imishini yokushisela, kanye nezinsiza zikagesi kuzuza ekhonweni le-DBC substrates lokusingatha imisinga ephezulu ngenkathi kugcinwa ukuzinza kokushisa.
• Amasistimu Amandla Avuselelekayo: Ama-solar inverters kanye nama-wind turbine converters asebenzisa ubuchwepheshe be-DBC ukuze athembeke isikhathi eside ekufakweni kwangaphandle.

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4) Izinzuzo Eziyinhloko Zokusebenza

Ama-substrate e-DBC anikeza izinzuzo eziningana ezibalulekile ezichaza ukubusa kwawo ezinhlelweni zikagesi zamandla:

• I-Superior Thermal Conductivity: Isibopho esiqondile sethusi-ceramic sinciphisa ukumelana kwe-interface yokushisa. Izisekelo ze-aluminium nitride (AlN) DBC zingafinyelela ukuhanjiswa kokushisa okungaphezu kuka-170 W/m·K, okusebenza kangcono kakhulu kunezinto ze-PCB eziphilayo.
• Ikhono Lokuthwala Eliphezulu Lamanje: Izendlalelo zethusi ezijiyile (kufika ku-0.635mm) zivumela ama-substrate e-DBC ukuthi athwale amaza angaphezu kuka-100A, okwenza afaneleke ukusetshenziswa kwamandla aphezulu lapho ama-PCB ajwayelekile engahluleka khona.
• Ukuhlukaniswa Kagesi Okuhle Kakhulu: Izinto zobumba zinikeza amandla e-dielectric angokwemvelo, ngamanani ajwayelekile angu-15-20 kV/mm e-alumina nangaphezulu kwe-aluminium nitride, okuqinisekisa ukuhlukaniswa okuphephile ezisetshenzisweni ze-high voltage.
• Ukwanda Kokushisa Okufanayo: Ama-substrate e-ceramic ane-coefficients of thermal expansion (CTE) eduze kwe-silicon kune-organic laminates, okunciphisa ukucindezeleka kuma-die attach joints ngesikhathi sokujikeleza kokushisa.
• Ukuthembeka Kwesikhathi Eside: Isibopho sensimbi phakathi kwethusi ne-ceramic sigcina ubuqotho phakathi kwezinkulungwane zemijikelezo yokushisa, sidlula kakhulu isikhathi sokuphila sezinye izindlela ezisekelwe ku-glue.

5) Izinto Zobumba Ezisetshenziswa Ezingxenyeni Ze-DBC

Ukukhethwa kwezinto eziyisisekelo ze-ceramic kuthinta kakhulu ukusebenza kwe-DBC substrate. Izitsha ezintathu eziyinhloko ze-ceramic zibusa emakethe, ngayinye inezici ezihlukile ezifanele ukusetshenziswa okuhlukile. Ukuze uthole ukuqhathanisa okuningiliziwe kwalezi zinto, bheka umhlahlandlela wethu ozinikele we- DBC ceramic substrates.

5.1 I-Alumina (Al₂O₃)

I-Alumina iyi-ceramic esetshenziswa kakhulu kuma-substrate e-DBC ngenxa yebhalansi yayo enhle kakhulu yokusebenza kwezindleko. Njengoba i-thermal conductivity ingu-24-28 W/m·K ngama-grade angu-96% okumsulwa, i-alumina ifanela izinhlelo zokusebenza lapho ukusebenza kwayo okukhulu kokushisa kungadingeki khona. Ukutholakala kwayo kabanzi, ubuchwepheshe bokucubungula obuvuthiwe, kanye namanani okuncintisana kwenza kube ukukhetha okuzenzakalelayo kwemiklamo eminingi yamamojula wamandla.

5.2 I-Aluminium Nitride (AlN)

I-aluminium nitride inikeza ukuhanjiswa kokushisa okungu-170-230 W/m·K, cishe izikhathi ezingu-7-10 eziphakeme kune-alumina. Lokhu kwenza ama-substrate e-AlN DBC abaluleke kakhulu ekusetshenzisweni kwamandla aphezulu lapho ukushabalaliswa kokushisa kuyisici esinqunyelwe khona. Izindleko zezinto eziphezulu ziyafaneleka ezinhlelweni zokusebenza ezifana nama-inverters e-EV traction, ama-amplifiers e-RF avame kakhulu, kanye nezinhlelo zamandla ezindiza.

5.3 I-Silicon Nitride (Si₃N₄)

I-silicon nitride ihlanganisa ukuhanjiswa kokushisa okumaphakathi (70-90 W/m·K) ngamandla akhethekile omshini kanye nokuqina kokuphuka. Ama-substrate e-Si₃N₄ DBC ahamba phambili ezinhlelweni ezidinga ukumelana nokushaqeka kokushisa kanye nokucindezeleka komshini, njengezinhlelo zokudonsa ezingaphansi kokudlidliza kanye nokujikeleza kokushisa okuphindaphindiwe. Nakuba kubiza kakhulu kune-alumina, ukuthembeka okuphezulu kwe-silicon nitride ezindaweni ezidinga kakhulu kuyenza ithandwe kakhulu ezisetshenzisweni zezimoto nezesitimela.

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6) I-DBC vs Ezinye I-Ceramic PCB Technologies

Imakethe ye -ceramic PCB ihlanganisa ubuchwepheshe obuningana ngale kwe-DBC. Ukuqonda lezi zindlela kusiza onjiniyela ukuthi bakhethe ikhambi elifanele izidingo zabo ezithile.

6.1 DBC vs AMB (I-Active Metal Brazing)

I-Active Metal Brazing isebenzisa insimbi yokugcwalisa equkethe i-titanium ukuhlanganisa ithusi ne-ceramic emazingeni okushisa azungeze u-850°C. I-AMB inikeza amandla okubopha aqinile kune-DBC futhi ivumela izendlalelo zethusi ezijiyile (kufika ku-0.8mm noma ngaphezulu). Kodwa-ke, ama-substrate e-AMB ngokuvamile abiza ngaphezu kwe-DBC equivalents futhi adinga imishini ekhethekile. I-AMB ikhethwa kakhulu ekusetshenzisweni kokuthembeka okuphezulu kakhulu nalapho kudingeka ubukhulu bethusi obukhulu.

6.2 DBC vs DPC (Ithusi Eliqoshwe Ngokuqondile)

Ubuchwepheshe be-Direct Plated Copper buhilela ukufaka ungqimba lwembewu ku-ceramic, kulandelwe yi-electroplating ukuze kwakhiwe ugqinsi lwethusi. I-DPC inikeza ukulungiswa komugqa okucolekile kune-DBC kodwa ikhawulelwe ezingqimbeni zethusi ezincane (ngokuvamile ngaphansi kuka-0.1mm). I-DPC ifanela izinhlelo zokusebenza ezidinga amaphethini wesekethe aqondile kanye nokuphathwa kwamandla kagesi aphansi, njengamaphakheji e-LED kanye nezisekethe ezincane zesignali.

6.3 DBC vs LTCC/HTCC

I-Ceramic Esebenzisa Ukushisa Okuphansi (LTCC) kanye ne-High-Temperature Co-fired Ceramic (HTCC) zivumela amasekethe e-ceramic anezingqimba eziningi ezinama-passive afakiwe. Nakuba lobu buchwepheshe bunikeza ukuguquguquka komklamo, abukwazi ukuhambisana nokusebenza kokushisa kwe-DBC noma ikhono lokuphatha lamanje. Ama-ceramic asebenzisa Ukushisa Okuphansi ngokuvamile akhethwa kuzinhlelo zokusebenza ze-RF/microwave kanye nemiklamo eyinkimbinkimbi yezingqimba eziningi kune-electronics enamandla.

7) Ukukhetha Isixazululo Esifanele Se-DBC Substrate

Ukukhetha i-substrate ye-DBC efanele kudinga ukulinganisela izici eziningi okuhlanganisa izidingo zokushisa, imininingwane kagesi, imikhawulo yemishini, kanye nesabelomali. Ukusebenza nomkhiqizi we-substrate we-DBC onolwazi kwenza le nqubo yokukhetha ibe lula.

7.1 Imibandela Yokukhetha Ebalulekile

• Izidingo Zokushabalalisa Amandla: Bala ukushisa okukhiqizwa amadivayisi kagesi bese uqinisekisa ukuthi i-substrate ingadlulisela lokhu kushisa ohlelweni lokupholisa ngaphandle kokwenyuka okukhulu kwezinga lokushisa.
• I-Voltage yokusebenza: Qinisekisa ukuthi ukujiya kwe-ceramic kanye nezinto ezisetshenziswayo kunikeza i-voltage eyanele yokumelana ne-dielectric enemingcele efanele yokuphepha.
• Ukuphatha Kwamanje: Cacisa ukujiya kwethusi ngokusekelwe ezidingweni zamandla aqhubekayo aphezulu kanye nokuphakama kwawo, okubangela ukuqhekeka kokushisa.
• Iphrofayili Yokujikeleza Ngebhayisikile Eshisayo: Cabanga ngokushintshashintsha kwezinga lokushisa okulindelekile kanye nenani lemijikelezo esikhathini sokuphila komkhiqizo lapho ukhetha izinto zobumba.
• Imikhawulo yosayizi: Izingxenye ze-ceramic zinemikhawulo yobukhulu bokukhiqiza engathinta ukwakheka kwemodyuli.
• Izindleko Ezihlosiwe: Linganisa ukukhethwa kwezinto ezibonakalayo nomthamo wokukhiqiza kanye nezindleko zamayunithi ezamukelekayo.

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8) Izinyathelo Ezilandelayo: Ukukhiqiza, Ukubhala Amaphrothokholi kanye ne-RFQ

Kungakhathaliseki ukuthi uthuthukisa umqondo omusha wemojuli yamandla noma ukhulisa umklamo okhona wokukhiqiza ivolumu, i-Highleap Electronics inikeza izixazululo eziphelele ze-DBC substrate ezenzelwe isigaba sakho sephrojekthi.

Ukuze kuthuthukiswe isigaba sokuqala kanye nokuqinisekiswa komklamo, insizakalo yethu yokwenza iphrothokholi ye-DBC substrate inikeza inani elincane ngokushintsha okusheshayo, okuvumela ukuhlolwa okuphindaphindiwe ngaphandle kwezibopho zesikali sokukhiqiza.

Ukuze uhlole amakhono ethu okukhiqiza abanzi ama-PCB e-ceramic namabhodi wesekethe yendabuko, vakashela umbono wethu wokukhiqiza ama-PCB e-ceramic aseShayina.

8.1 Okufanele Ukufaka Ku-RFQ Yakho

• Amafayela okuklama: Amafayela e-Gerber, uhlaka lwe-DXF, noma imidwebo yemishini
• Izimfuneko zezinto: Uhlobo lwe-Ceramic, ubukhulu, ubukhulu bethusi
• Ekupheleni kwendawo: Izidingo zokufaka iplati yokubopha i-die kanye ne-wire bonding
• Ubuningi: Inani lokuqala kanye nomthamo wonyaka olindelwe
• Izidingo zekhwalithi: Noma yiziphi izidingo zokuhlolwa okukhethekile noma zokuhlolwa
• Umugqa wesikhathi oqondiwe: Izinsuku ezibalulekile zokulethwa noma izigaba zokuthuthukiswa

Thola Isilinganiso Sakho Se-DBC Substrate