Umhlahlandlela kanye Nokusetshenziswa Kwe-Substrate Yethusi Ehlanganisiwe Ngokuqondile

I-substrate yethusi eboshiwe ngqo iyisithwali sesekethe se-ceramic esakhiwe ngokubopha ithusi ngqo esisekelweni se-ceramic ekushiseni okuphezulu. Isetshenziswa kabanzi kumamojula wamandla nakwezinye imiklamo ye-elekthronikhi eshisa kakhulu edinga ukudluliselwa kokushisa okusebenzayo kanye nokufakwa kogesi. Leli khasi lichaza amagama, ubudlelwano nobuchwepheshe be-DBC, kanye nezici ezibalulekile eziphathelene nokukhiqizwa kwe-PCB ye-ceramic kanye ne-PCB.

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Ama-substrate ethusi aboshwe ngqo avame ukusetshenziswa kuma-elekthronikhi anamandla kanye neminye imiklamo yamandla aphezulu lapho ukuphathwa kokushisa kanye nokuhlukaniswa kukagesi kubalulekile khona. Kwa-Highleap Electronics, singumkhiqizi we-PCB ohlinzeka ngezinsizakalo ezigcwele ohlinzeka ngama-PCB e-ceramic, ama-substrate e-DBC, amabhodi ensimbi ayinhloko, ama-PCB anezingqimba eziningi, kanye nezinsizakalo eziphelele zokuhlanganisa ama-PCB. Lo mhlahlandlela usiza onjiniyela namaqembu okuthola ulwazi ukuqonda ukuthi ama-substrate ethusi aboshwe ngqo asebenza kanjani nokuthi angena kanjani ngaphakathi kwezinketho zokukhiqiza ze-PCB ezibanzi kanye ne-PCB ye-ceramic.

Cela Isilinganiso Sephrojekthi Yakho Ye-PCB noma Ye-Ceramic PCB

Funda kabanzi ngamakhono ethu okukhiqiza i-PCB ngobumba noma uhlole izinsizakalo zethu eziphelele zokukhiqiza nokuhlanganisa i-PCB.

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1) Incazelo ye-Substrate yethusi ehlanganisiwe ngqo

I-substrate yethusi eboshiwe ngqo iyi-substrate ekhethekile ye-elekthronikhi equkethe ungqimba lokuvikela i-ceramic olune-foil yethusi eboshiwe ngensimbi endaweni eyodwa noma zombili. Igama elithi "i-direct bond" ligcizelela ukuthi ithusi linamathela ngqo kwi-ceramic ngaphandle kwezingqimba zokunamathela eziphakathi, ama-epoxies, noma ukubopha ngomshini.

Ukubopha kwenzeka emazingeni okushisa aphezulu (ngokuvamile angu-1065-1085°C) emoyeni olawulwayo, lapho i-copper oxide esixhumini ivumela ukusabela kwamakhemikhali ebusweni be-ceramic. Lokhu kudala ungqimba lwe-intermetallic compound oluhlanganisa unomphela ithusi nezinto zobumba ezifana ne-alumina (Al₂O₃), i-aluminium nitride (AlN), noma i-silicon nitride (Si₃N₄).

Isakhiwo esiphumelayo sihlanganisa ukuqhutshwa kukagesi kwethusi kanye nokuqhutshwa kokushisa kanye nezakhiwo ze-dielectric ze-ceramic. Ngokungafani namabhodi wesekethe e-organic, ama-substrate ethusi aboshwe ngqo agcina ukuqina emazingeni okushisa angaphezu kuka-300°C futhi angamelana nezinkulungwane zemijikelezo yokushisa ngaphandle kokuhlukanisa.

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2) Ubudlelwano Phakathi Kwethusi Elihlanganisiwe Ngokuqondile kanye ne-DBC

“I-substrate yethusi eboshiwe ngqo” kanye ne-“ DBC substrate ” kubhekisela kubuchwepheshe obufanayo. I-DBC imane nje iyisifinyezo esijwayelekile embonini esithathwe ku-Direct Bonded Copper. Womabili la magama avela ngokushintshana ezincwadini zobuchwepheshe, ezinhlotsheni zokuthengwa, kanye nasemibhalweni yokukhiqiza.

Imibhalo yobunjiniyela ingasebenzisa noma yiliphi igama kuye ngomongo kanye nemigomo yesifunda. Onjiniyela baseNyakatho Melika naseYurophu bavame ukusebenzisa igama elithi “DBC” ekuxhumaneni okungahleliwe ngenkathi bechaza “ithusi elihlanganisiwe ngqo” kumadokhumenti asemthethweni. Abakhiqizi base-Asia bavame ukusebenzisa igama elithi “DBC” cishe kuphela. Ochwepheshe bokuthenga kufanele baqaphele womabili la magama lapho bethola lawa ma-substrate.

Amanye amagama ahlobene kodwa ahlukile ngezinye izikhathi abangela ukudideka:

• I-DCB (Ukubopha Okuqondile Kwethusi): Isifinyezo esihlukile ngezinye izikhathi esisetshenziswa ezincwadini zobuchwepheshe zolimi lwesiJalimane, esibhekisela kubuchwepheshe obufanayo.
• I-DPC (Ithusi Eliqoshwe Ngokuqondile): Ubuchwepheshe obuhlukile obuhilela ukufakwa kwethusi elithambile kune-bulk copper bonding.
• I-AMB (I-Active Metal Brazing): Ubuchwepheshe obuhlobene bokwenza insimbi ye-ceramic obusebenzisa ama-braze alloys esikhundleni sokubopha okuqondile kwe-oxidation.

3) Izici Eziyinhloko Nezinzuzo

Ama-substrate ethusi ahlanganiswe ngqo abonisa izici eziningana zokusebenza eziwahlukanisa nezinto ezivamile zebhodi lesifunda:

3.1 Ukusebenza Okushisayo

Isibopho esiqondile siqeda ukumelana kwesikhombisi sokushisa phakathi kwethusi ne-ceramic. Uma sihlanganiswe nokushisa kwe-ceramic okusuka ku-24 W/m·K (alumina) kuya ku-230 W/m·K (high-purity AlN), izisekelo zethusi eziboshiwe ngqo zidlulisa ukushisa kahle kusuka kumadivayisi kagesi ziye ezinhlelweni zokupholisa. Amanani okumelana nokushisa aphansi njengo-0.1°C/W ngesentimitha lesikwele angatholakala ngezisekelo ze-aluminium nitride.

3.2 Izakhiwo zikagesi

Izinto zobumba zinikeza ukwahlukaniswa kukagesi okumangalisayo, kanti amandla e-dielectric ngokuvamile adlula i-15 kV/mm. Lokhu kwenza ama-substrate ethusi ahlanganiswe ngqo akwazi ukuhlukanisa ngokuphephile amasekethe kagesi ane-voltage ephezulu kuma-heatsink asekelwe phansi. Ukuhlanganiswa kwethusi elijiyile (0.127-0.635mm) kanye namandla aphezulu e-dielectric kwenza la ma-substrate afanelekele amamojula kagesi asebenza ku-1200V, 1700V, noma ngaphezulu.

3.3 Ukuthembeka Kwemishini

Isibopho sensimbi phakathi kwethusi ne-ceramic simelana nokuqhekeka ngaphansi kokucindezeleka kokushisa. Izisekelo zethusi eziboshwe ngqo ezenziwe kahle zisinda imijikelezo yokushisa engaphezu kuka-3,000+ phakathi kuka--40°C no-+125°C ngaphandle kokuwohloka kwesibopho. Lokhu kuthembeka kubalulekile ezisetshenziswayo zezimoto, zezimboni, kanye nezindiza ezinezidingo eziqinile zokuphila konke.

3.4 Amandla Okuphatha Amanje

Ubukhulu bethusi obungu-0.3mm nangaphezulu buvumela ama-substrate ethusi aboshwe ngqo ukuthi athwale imisinga eqhubekayo engaphezu kuka-50A ngomkhondo wesekethe ngamunye. Kuhlanganiswe nokushabalalisa ukushisa okuhle kakhulu, lokhu kuvumela ukwakheka kwemodyuli yamandla amancane okungenakwenzeka ngamabhodi wesekethe e-organic.

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4) Izicelo Ezijwayelekile Zezimboni

Ama-substrate ethusi ahlanganiswe ngqo asebenza ngezinhlelo zokusebenza ezidingayo emikhakheni eminingi lapho ukuphathwa kokushisa, ukuthembeka, kanye nokusebenza kukagesi kubalulekile khona. Funda kabanzi mayelana nezinketho ezithile zezinto ze-ceramic kumhlahlandlela wethu we-substrate ye-ceramic ye-DBC.

4.1 Ugesi Wamandla

• Amamojula e-IGBT okushayela izimoto zezimboni kanye nezinhlelo zokudonsa
• Ukupakishwa kwamadivayisi kagesi e-SiC ne-GaN
• Ama-inverter e-EV kanye namashaja angaphakathi
• Ama-inverter elanga kanye nama-converter e-wind turbine
• Imishini yokushisela yezimboni kanye neyokushisa yokungenisa

4.2 RF kanye ne-Microwave

• Ama-amplifier e-RF anamandla aphezulu
• Amamojula okudlulisa i-radar
• Izikhulisamandla zesiteshi se-5G

4.3 Ukukhanyisa Okuqinile

• Amaphakheji e-LED akhanya kakhulu
• Amamojula e-LED e-COB (i-Chip-on-Board)
• Izibani zemoto kanye nezinhlelo zokubonisa

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5) Indlela Lobu Buchhubhu Obuhambisana Ngayo Nokukhiqiza Ama-PCB

Ukukhiqizwa kwe-substrate yethusi eboshiwe ngqo kudinga amakhono akhethekile ahlukile ekwenziweni kwe-PCB okuvamile . Ngenkathi ama-PCB endabuko esebenzisa i-lamination, ukubhoboza, kanye nokufaka izinto eziphilayo, ama-substrate ethusi aboshiwe ngqo adinga:

• Izithando zokubopha ezinokushisa okuphezulu: Iyakwazi ukulawula izinga lokushisa elinembile ku-1065-1085°C ngomkhathi olawulwayo.
• Ubuchwepheshe bokuphatha i-ceramic: Izisekelo ze-ceramic ezithambile zidinga ukulungiswa okukhethekile kanye nokuphathwa ngesikhathi sokucubungula.
• I-chemistry ekhethekile yokuqopha: Izendlalelo zethusi ezijiyile zidinga izikhathi ezinde zokusika kanye nokwenza ngcono inqubo ukuze kuchazwe umugqa ngendlela efanayo.
• Amandla okucubungula nge-laser: Imiklamo eminingi idinga ukuskenwa noma ukusika nge-laser ukuze kuhlanganiswe i-ceramic.

Ukusebenza nomkhiqizi we-DBC substrate onolwazi kuqinisekisa ukufinyelela kulawa makhono akhethekile kanye nolwazi lwenqubo olubalulekile ukuze kube nekhwalithi ehambisanayo.

Ukuze uthole ukuqonda okujulile ngezindlela zokubopha kanye nemingcele yenqubo, bheka umhlahlandlela wethu wezobuchwepheshe mayelana nenqubo ye-DBC.

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6) Funda Okwengeziwe Nge-DBC Substrates

I-Highleap Electronics inikeza izinsiza eziphelele zonjiniyela kanye nochwepheshe bokuthenga abasebenza ngobuchwepheshe bethusi obuhlanganisiwe ngqo. Hlola amakhasi ethu ahlobene ukuze uthole ulwazi olujulile lobuchwepheshe:

• Ukubuka konke kwe-DBC Substrate - Isikhungo Esiphakathi esimboza zonke izici zobuchwepheshe be-DBC
• Umhlahlandlela we-DBC Ceramic Substrate - Ukuqhathaniswa okuningiliziwe kwezinketho zezinto zobumba
• Umhlahlandlela Wobuchwepheshe Benqubo Ye-DBC - Izimiso zokukhiqiza kanye nezici zekhwalithi
• Ceramic PCB Solutions - Ukubuka kabanzi ubuchwepheshe bebhodi lesifunda le-ceramic

6.1 Cela Usekelo Lobuchwepheshe

Ithimba lethu lobunjiniyela bezinhlelo zokusebenza lisiza ngokukhetha izinto zokwakha, ukwenza ngcono umklamo, kanye nokuthuthukiswa kwemininingwane yamaphrojekthi e-substrate yethusi ahlanganiswe ngqo. Kungakhathaliseki ukuthi udinga isiqondiso ngokukhetha izinto ze-ceramic noma usizo lokwenza ngcono umklamo wakho ukuze ukwazi ukukhiqizwa, sikulungele ukusekela iphrojekthi yakho.

Xhumana Nosekelo Lobunjiniyela