Inqubo ye-DBC Yokukhiqiza I-Ceramic Substrate

Inqubo ye-DBC (Direct Bonded Copper) idala isibopho esihlala njalo sensimbi phakathi kwethusi ne-ceramic ngokusebenzisa i-oxidation elawulwayo yokushisa okuphezulu. Ukuqonda le nqubo yokukhiqiza kwenza onjiniyela bakwazi ukucacisa ama-substrate ahlangabezana nezidingo zokuthembeka futhi kusiza amaqembu okuthenga ukuthi ahlole amakhono abaphakeli.

Kwa-Highleap Electronics, silandela izinqubo zokukhiqiza ze-DBC ezilawulwayo kanye nezindinganiso zekhwalithi ezihambisanayo ukuqinisekisa ukusebenza okuzinzile kwe-substrate kwezicelo ze-elekthronikhi zamandla. Lo mhlahlandlela uchaza izimiso eziyisisekelo zokucubungula i-DBC futhi uhloselwe ukusiza onjiniyela ukuqonda kangcono izidingo zenqubo, ukuchaza imininingwane efanele, nokuhlola abaphakeli ngokuzethemba okukhulu.

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1) Ukubuka konke kwenqubo ye-DBC

Inqubo ye-DBC imelela inqubo ekhethekile yokukhiqiza yokwakha ama-substrate e-DBC — amabhodi wesekethe e-ceramic anama-conductor ethusi aboshwe ngqo ebusweni be-ceramic ngaphandle kwezinamathiselo eziphakathi. Yasungulwa ngawo-1970, le nqubo isibe yindlela ejwayelekile yokukhiqiza ama-substrate asebenza kahle kakhulu kagesi kagesi.

Ngokungafani nokwakhiwa kwe-PCB okuvamile okuncike ekubopheni okwenziwe ngomshini noma okunamathelayo, inqubo ye-DBC idala isibopho samakhemikhali esixhumi se-copper-ceramic. Lesi sibopho sakha ngokusabela okulawulwa ngokucophelela okubandakanya i-copper oxide njengesigaba esiphakathi, okuholela emandleni esibopho angavamile kanye nokuqhuba kokushisa.

Le nqubo idinga imishini ekhethekile ehlanganisa izitofu zokushisa okuphezulu ezikwazi ukulawula umoya ngendlela enembile, izindawo zamakamelo ezihlanzekile ukuze kuthathwe izinyathelo ezibucayi ekungcoleni, kanye nezinhlelo zokuhlola ukuqinisekisa ikhwalithi yebhondi. Lezi zidingo zihlukanisa ukukhiqizwa kwe-DBC ekukhiqizweni kwe-elekthronikhi okujwayelekile.

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2) Isimiso Sokubopha Okuqondile Kwethusi Ne-Ceramic

Isimiso esiyisisekelo esisekelwe kubuchwepheshe be-DBC sihilela ukwakha ungqimba lwe-copper oxide esixhumi se-copper-ceramic esiphendulana nezinto zombili ukuze sakhe isibopho esihlala njalo. Lokhu kwenzeka emazingeni okushisa aseduze nephuzu le-copper-oxygen eutectic (1065°C).

2.1 Indlela Yokubopha

Uma i-copper foil ithinta i-ceramic emazingeni okushisa aphezulu emoyeni olawulwayo we-oxygen, okulandelayo kwenzeka:

• Ukushiswa komhlaba: Ithusi endaweni ehlanganisiwe liyancibilika ukuze lakhe i-Cu₂O (i-cuprous oxide)
• Ukwakheka kwe-Eutectic: Cishe ku-1065°C, ithusi kanye ne-cuprous oxide kwakha uketshezi lwe-eutectic endaweni ehlanganayo.
• Ukumanzisa nge-ceramic: Isigaba soketshezi siyamanzisa futhi singene ebusweni be-ceramic
• Ukuqinisa: Lapho ipholile, isikhombikubona siyaqina, sidale isibopho esiqinile sensimbi

Kuma-ceramic e-alumina (Al₂O₃), isibopho sakha ngokuhlanganiswa kokuxhumana komshini kanye nokusabela kwamakhemikhali phakathi kwe-copper oxide kanye nobuso be-ceramic. Nge-aluminium nitride (AlN), ukulungiswa okwengeziwe kwendawo kungadingeka ngoba ungqimba lwe-oxide lwendabuko lwe-AlN lungaphazamisa ukubopha.

2.2 Amapharamitha Enqubo Ebucayi

• Ukushisa: Kumelwe kulawulwe ngokunembile ngaphakathi kuka-±2°C ukuqinisekisa ukwakheka okufanele kwe-eutectic ngaphandle kokuncibilika kakhulu kwethusi
• Umfutho we-oxygen ongaphelele: Ilawula ukujiya kwengqimba ye-oxide; okuncane kakhulu kuvimbela ukuhlangana, okuningi kakhulu kubangela ukujiya ngokweqile
• Isikhathi ekushiseni: Kwanele ukumanzisa ngokuphelele kodwa hhayi isikhathi eside kangangokuthi kungabangela ukukhula kwezinhlamvu zethusi
• Izinga lokupholisa: Kuthinta ukucindezeleka okusele kanye namathuba okuqhekeka kwe-ceramic

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3) Izigaba Ezibalulekile Zokukhiqiza

Ukukhiqizwa kwe-DBC substrate kulandela ukulandelana okuchaziwe kwezinyathelo zokucubungula, ngasinye sibalulekile ekhwalithini yokugcina yomkhiqizo. Ukuqonda lezi zigaba kusiza onjiniyela nabathengi ukuhlola amakhono abaphakeli.

3.1 Ukulungiselela Okubalulekile

• Ukuhlolwa kwe-Ceramic: Izisekelo ze-ceramic ezingenayo ziyahlolwa ukuze kutholakale amaphutha ebusweni, ukuthamba, kanye nokungcola
• Ukulungiswa kwethusi: I-foil yethusi engenawo umoya-mpilo iyahlolwa futhi ihlanzwe ukuze kususwe amafutha kanye nama-oxide angaphezulu
• ukwelashwa surface: Ezinye izinto zobumba, ikakhulukazi i-AlN, zidinga ukushiswa komhlaba noma ezinye izindlela zokwelapha ngaphambi kokubopha

3.2 Ukubopha

• Ukuhlanganiswa kwe-stack: I-foil yethusi ibekwe ohlangothini olulodwa noma zombili ze-substrate ye-ceramic
• Ukulayisha isithando somlilo: Ama-Assemblies afakwa ezithandweni zokushisa okuphezulu ezinekhono lokulawula umoya
• Ukusebenza kwephrofayili yokushisa: Ama-ramp okushisa anembile, ama-hold, kanye namaphrofayili okupholisa asetshenziswa ngokohlobo lwe-ceramic
• Ukuhlolwa kwe-bond ngemuva kokukhokha: Ukuhlolwa okubonakalayo kanye ne-ultrasound kuqinisekisa ubuqotho besibopho

3.3 Ukuhlela Amaphethini Esekethe

• Uhlelo lokusebenza lwe-Photoresist: Ukumelana nokuzwela ukukhanya kufakwe noma kufakwe phezu kobuso bethusi
• Ukuchayeka kanye nentuthuko: Amaphethini wesekethe adluliselwa kusetshenziswa i-photolithography
• Ukufakwa kwe-Copper: Ithusi elingafuneki lisuswa kusetshenziswa i-ferric chloride noma i-cupric chloride etchants
• Melana nokukhumula: I-photoresist esele iyasuswa, kushiye iphethini yesekethe yethusi

3.4 Ukuqedwa kwendawo

• Ukufakwa kwe-nickel: Inikeza ukuvikelwa kwe-oxidation kanye nendawo ethengiswayo
• Ukufakwa kwegolide: Kusetshenziswa ezindaweni ezibophayo ngentambo noma ukumelana nokugqwala okuthuthukisiwe
• Ukufakwa kwesiliva: Isetshenziselwa izinhlelo zokusebenza zokunamathisela idayi yesiliva e-sintered

3.5 Ukulinganisa kanye Nokucubungula Kokugcina

• Ukubhala nge-laser: I-Ceramic ifakwa amaphuzu ukudala imigqa yokuqhekeka kwezingxenye ezihlukene
• Ukuphula noma ukusika: Izingxenye ezingaphansi ngazinye zihlukaniswa ngemigqa yokubhala
• Ukuhlola kokugcina: Ukuqinisekiswa kobukhulu, ukuhlolwa okubonakalayo, kanye nokuhlolwa kukagesi
• Okufakiwe: Ama-substrate apakishwa ezitsheni eziphephile ze-ESD ezivikelwe umswakama

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4) Izinselele Zenqubo Namaphuzu Okulawula

Ukukhiqizwa kwe-DBC kuletha izinselele ezihlukile ezidinga ukulawulwa kwenqubo ngokucophelela. Ukuqonda lezi zinselele kusiza ekucaciseni izidingo zekhwalithi ezifanele.

4.1 Ukwakheka Kwebhondi Engenalutho

Ama-voids esixhumini esibonakalayo se-copper-ceramic anciphisa ukuhanjiswa kokushisa futhi angabangela izindawo ezishisayo ezisendaweni ngaphansi kwamadivayisi kagesi. Izimbangela zifaka phakathi ukungcola, ukulawulwa okwanele komoya, kanye namaphrofayili okushisa angafanele. Abakhiqizi bekhwalithi basebenzisa i-scanning acoustic microscopy (SAM) ukuthola nokulinganisa ama-bond voids, ngokuvamile ecacisa iphesenti eliphezulu le-void (isb., <2% indawo iyonke).

4.2 Ukuqhekeka Kwe-Ceramic

Ukungafani kwe-CTE phakathi kwethusi ne-ceramic kudala ukucindezeleka kokushisa ngesikhathi sokupholisa. Uma ukupholisa kushesha kakhulu noma kungalingani, i-ceramic ingase iqhekeke. Ukulungiswa kwenqubo kulinganisela izinga lokupholisa ukuze kuncishiswe ukucindezeleka ngenkathi kugcinwa umkhiqizo. Ubukhulu be-ceramic kanye nesilinganiso sobukhulu be-copper nakho kuthinta ukuthambekela kokuqhekeka.

4.3 Ikhwalithi Yokuqeda Okungaphezulu

Ukuhlanganiswa kwedivayisi yamandla kudinga imininingwane eqondile yokuqeda ubuso ukuze kuhlanganiswe i-die attach kanye ne-wire bonding ethembekile. Ubukhulu be-plating, ukufana, kanye nokulawula ukungcola kuthinta ngqo isivuno se-plating esezansi. Imingcele ebalulekile ifaka phakathi ukubekezelelana kobukhulu be-plating, ubulukhuni bendawo, kanye nokuhlanzeka.

4.4 Ukulawula Okulinganayo

Ukucubungula izinga lokushisa eliphezulu kungabangela ukugoba kanye nokushintsha kobukhulu. Imininingwane yokuba yisicaba (ngokuvamile <0.1mm ngo-25mm), ukubekezelelana kobukhulu, kanye nokubhaliswa phakathi kwamaphethini ethusi nezici ze-ceramic kudinga ukulawulwa kwenqubo ngokucophelela kulo lonke ukukhiqiza.

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5) Ukuthembeka kanye nokusebenza kwe-Thermal Cycling

Ukuthembeka kwe-DBC substrate ngaphansi kokujikeleza kokushisa kubalulekile ekusetshenzisweni kwamandla kagesi. Amapharamitha enqubo yokubopha athinta ngqo ukusebenza kokuthembeka kwesikhathi eside.

5.1 Izindlela Zokujikeleza Ngokushisa

Ngesikhathi sokujikeleza kokushisa, umehluko we-CTE phakathi kwethusi ne-ceramic udala ukucindezeleka okujikelezayo endaweni ehlanganayo. Emijikelezweni eminingi, lokhu kucindezeleka kungabangela ukuqhekeka kokukhathala kuqale emngceleni wethusi ne-ceramic, ekugcineni kusakazeke ngesibopho. Izindlela zokwehluleka zifaka phakathi ukuhlukanisa, ukuqhekeka kwethusi, kanye nokuqhekeka kwe-ceramic.

5.2 Izici Ezithinta Impilo Yokujikeleza Kwe-Thermal

• Ubukhulu bethusi: Ithusi elijiyile landisa ukucindezeleka; ukujiya okuhle kulinganisela ukuphathwa kwamandla kagesi ngokumelene nokuthembeka
• Ukushintshashintsha kwezinga lokushisa: I-ΔT enkulu isheshisa ukukhathala; -40°C kuya ku-+150°C inzima kakhulu kune-0°C kuya ku-+100°C
• Izinto zobumba: I-Si₃N₄ inikeza ukusebenza okuhle kakhulu kokujikeleza kokushisa ngenxa yokuqina okuphezulu kokuqhekeka
• Ikhwalithi yebhondi: Ama-voids kanye nezibopho ezibuthakathaka kusheshisa ukwehluleka
• I-geometry yesekethe: Amakhona abukhali kanye nezikhala ezincane ezigxilile

5.3 Amazinga Okuhlola

Ukuthembeka kokujikeleza kokushisa kuvame ukuqinisekiswa ngokwezindinganiso zomkhakha ezifana ne-AQG 324 (iziqu zezimoto) noma izinqubo zokuhlola eziqondene namakhasimende. Izimo zokuhlola ezivamile zifaka phakathi ukushintshashintsha kwezinga lokushisa kusuka ku--40°C kuya ku-+125°C noma -55°C kuya ku-+150°C, ngokubalwa kwemijikelezo kusuka ku-1,000 kuya ku-5,000+ kuye ngezidingo zesicelo.

Ubunjiniyela Bezinqubo Zokuxhumana

6) Indlela Inqubo ye-DBC Ethinta Ngayo Ikhwalithi Yokugcina Ye-Substrate

Isinyathelo ngasinye enkambisweni yokukhiqiza ye-DBC sithonya ikhwalithi kanye nokusebenza kwe-substrate eqediwe. Uma uhlola abahlinzeki noma ucacisa i-substrate, cabanga ukuthi amakhono enqubo athinta kanjani:

• Ukusebenza kokushisa: Okuqukethwe kwe-bond void kuthinta ngqo ukumelana nokushisa; chaza iphesenti eliphezulu le-void
• Ukuthembeka kukagesi: Ikhwalithi ye-ceramic kanye nokucubungula kuthinta ukusebenza kokukhishwa kwengxenye kuma-voltage aphezulu
• Inzuzo yokuhlanganisa: Ikhwalithi yokuqeda okuphezulu ithinta amazinga empumelelo okubopha intambo kanye ne-die attach
• Ukwethembeka kwesikhathi eside: Amapharamitha enqubo yokubopha anquma isikhathi sokuphila kokujikeleza kokushisa

I-Highleap Electronics igcina izilawuli zenqubo eziqinile kuyo yonke imboni ye-DBC. Izikhungo zethu zifaka imishini yokuhlola ethuthukisiwe yokuthola i-bond void, ukuqinisekiswa kobukhulu, kanye nokuhlaziywa kwekhwalithi yomphezulu. Ukuze uthole ulwazi oluningiliziwe mayelana namakhono ethu e-ceramic PCB , noma ukuxoxa ngezidingo zakho ezithile, ithimba lethu lobunjiniyela likulungele ukusiza.

Funda kabanzi mayelana nokukhetha izinto ezifanele ze-ceramic kumhlahlandlela wethu we-DBC ceramic substrate , noma hlola izinketho ze-prototyping ekhasini lethu lesevisi ye-DBC substrate prototype .

Ukuze uthole umbono ophelele wobuchwepheshe be-DBC kanye nezinhlelo zokusebenza, vakashela ikhasi lethu le-DBC substrate hub, noma ufunde kabanzi mayelana namagama ekhasini lethu lencazelo ye-stratebrate yethusi eboshiwe ngqo.