Ukwakhiwa Kwe-DBC Substrate Prototype kanye Nokusekelwa Kokuhlanganiswa Kwe-PCB

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I-prototype ye-substrate ye-DBC ivame ukusetshenziswa lapho umklamo udinga ukuqinisekiswa okusheshayo ngaphambi kokuzibophezela ekukhiqizeni amathuluzi kanye nokunikezwa kwesikhathi eside. Kuma-inverters okudonsa e-EV kanye ne-HEV, ama-converter e-OBC kanye ne-DC DC, amashaja asheshayo, ama-drive ezimoto zezimboni, isitoreji samandla, kanye nokuguqulwa kwamandla avuselelekayo, ukwakheka kwe-prototype kwenza kube wusizo ukuqinisekisa ukuziphatha kokushisa, ama-insulation margins, ama-mechanical interfaces, kanye nokuhambisana kwe-assembly ngenkathi izinguquko zomklamo zisalula ukuzisebenzisa.

I-Highleap Electronics iyifektri yokukhiqiza i-PCB kanye ne-PCB assembly. Asibekwanga njengomkhiqizi we-DBC substrate oqondile. Inani lethu ukusiza amaqembu ukuthi asuke ekuqinisekisweni kwe-prototype aye ekulethweni kokukhiqiza ngokuhlanganisa ukubuyekezwa kwe-DFM, izinsizakalo zokukhiqiza i-PCB , kanye nokuhlanganiswa kwe-turnkey, ngenkathi ehlanganisa ukutholakala kwe-DBC substrate lapho kudingeka umhlinzeki ofanelekayo wemininingwane yakho. Izinhlelo ezifaka izidingo zesekethe ye-ceramic zivame ukuhlanganisa i-DBC nezinye izinhlobo zokwakha, futhi amaqembu avame ukuhlola izinketho zokukhiqiza i-PCB ye-ceramic kanye nohlelo lwawo lwe-substrate.

Thola I-Quote Esheshayo Manje

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1. Ukubuka konke kwe-prototype ye-DBC substrate

I-prototype ye-substrate ye-DBC iyinani elincane lokwakhiwa kwe -substrate ze-DBC ezenzelwe ukuqinisekiswa komklamo, ukuhlolwa kokusebenza, kanye nokuhlolwa kokuthembeka kwasekuqaleni. Ngokungafani nokusebenza kwevolumu okwenziwe ngcono ngezindleko, i-prototyping ibeka phambili isivinini kanye nokuguquguquka ukuze ukwazi ukuphindaphinda ngaphandle kokulinda ama-MOQ aphezulu kanye namafasitela okukhiqiza amade. Amaqembu avame ukwenza i-prototype ukuze aphendule imibuzo embalwa eyisisekelo kusenesikhathi.

• Ukuqinisekisa okushisayo kuqinisekisa ukuthi ukusabalala kokushisa kanye nokuhlangana kokuziphatha kwecala kuyafana nokulinganisa kanye nokuqagela kokupholisa
• Ukuqina kukagesi ihlola ukusebenza kokuhlukaniswa kanye nemingcele yokuhlanza ngaphansi kokucindezeleka kwe-voltage yangempela
• Ukulungela ukuhlangana kuqinisekisa ukuthi ukukhetha kokuqeda ubuso kanye nokwenza insimbi kufana nenqubo yokunamathisela ehlosiwe kanye nokuxhumanisa
• Ukulingana kwemishini iqinisekisa ukuxhumana kwezindawo zokuhlala, ama-heat sink, kanye nezakhiwo zokubopha ngenkathi ukubekezelelana kusalungiseka

Ukuhlela iphrothokholi kulula uma ababambiqhaza bevumelana ngendlela yokubopha kanye nemikhawulo yenqubo kusenesikhathi, yingakho amaqembu amaningi ehlanganisa ukukhetha kwawo kokuklama nenqubo ye-DBC eyisisekelo ngaphambi kokukhipha isakhiwo sendatshana yokuqala.

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2. Imininingwane yesibonelo se-DBC substrate

Imininingwane ecacile inciphisa imijikelezo yokuphindaphinda futhi ivikele ishejuli. Imininingwane yephrothokholi ye-DBC substrate esebenzayo kufanele ihlanganise ukukhethwa kwezinto, incazelo yethusi, injongo yokuqeda ubuso, kanye nemikhawulo yemishini ethinta ukuphathwa nokuhlanganiswa. Umgomo awukona ukucacisa yonke imininingwane ngokweqile kodwa ukukhiya izinto ezimbalwa ezinquma ukuthi iphrothokholi ingahlanganiswa futhi ihlolwe ngaphandle kokumangala.

2.1 Ukukhetha izinto zobumba

Ukukhetha i-ceramic kusetha isisekelo sokuqhutshwa kokushisa, ukuqina kwemishini, kanye nezindleko. Amaqembu amaningi aqala nge-alumina ukuze afunde imijikelezo yokuqala, bese ethuthela ku-ceramics esebenza kahle kakhulu lapho ubuningi bamandla kanye nezinhloso zokuthembeka ziqina.

• I-Alumina Al2O3 itholakala kabanzi futhi ingabizi kakhulu kumadizayini amaningi ezimboni kanye nezakhiwo zokuhlola zakuqala
• I-Aluminium nitride AlN isekela ukuhanjiswa kokushisa okuphezulu lapho ukufudumala kokushisa kuyisici esikhawulelayo
• I-Silicon nitride i-Si3N4 inikeza amandla aphezulu okusebenza ngomshini futhi ivame ukubhekwa njengendawo yokugibela ibhayisikili enamandla

Izinqumo zezinto ezibonakalayo zilula uma ithimba livumelana ngomthwalo olindelekile wokushisa kanye nephrofayili yokujikeleza, futhi amaphrojekthi amaningi athatha lezo zibikezelo kanye nencazelo yesisekelo.

2.2 Ubukhulu bethusi kanye nenhloso yokwakheka kwethusi

Ubukhulu bethusi kanye ne-geometry yamaphethini kuthinta ukuphathwa kwamanje, ukusabalala kokushisa, kanye nokuhlushwa kokucindezeleka komshini. Ukulinganisa kuyisigaba lapho amaqembu eqinisekisa khona ukuthi ukukhetha kwethusi kusekela kokubili ukusebenza kukagesi kanye nokukwazi ukukhiqizwa.

• Izinketho ezivamile zobukhulu bethusi zifaka phakathi u-0.127mm 5 mil, 0.254mm 10 mil, 0.3mm, 0.508mm 20 mil, kanye no-0.635mm 25 mil.
• Ukubopha kwethusi okunezinhlangothi ezimbili noma ezihlangothini olulodwa kukhethwa ngokusekelwe kumklamo wokushisa kanye nesu lokugeleza kokushisa
• Imininingwane yephethini kufanele igweme ukukhuphuka kokucindezeleka okubukhali kanye nezici zethusi ezinde ezincane ezingasekelwa lapho ukujikeleza kokushisa kubalulekile

2.3 Ukuphela kwendawo kuhlanganiswe nokunamathiselwa kanye nokuxhumeka

Ukuqeda umphezulu kungenye yezimbangela ezivame kakhulu zokulungiswa kabusha kweprototype ngoba kuthinta ngqo ukushintshwa kwe-soldering, ukuziphatha kokumanzisa, kanye nokuqina kwe-bonding. Ukuchaza injongo yokuqeda ngaphambili kuvimbela ukungalingani phakathi kwe-substrate kanye nenqubo yokuhlanganisa.

• I-ENIG ivame ukukhethwa ukuze ikwazi ukushintshwa kalula kanye nokumelana nokugqwala ngesikhathi sokuphathwa kweprototype
• Izinhlobo zegolide le-nickel zivame ukusetshenziswa lapho ukubopha ngentambo kuyingxenye yohlelo lokuxhumanisa
• Ukufakwa kwesiliva kuvame ukucaciswa lapho i-sintered silver die attach iyingxenye yenqubo.

2.4 Ubukhulu bokuthi isicaba kanye nekhwalithi yomphetho

Imikhawulo yemishini inquma ukuthi i-substrate iziphatha kanjani ngesikhathi sokuphrinta, ukubeka, ukubopha, kanye nokubopha. Ngisho noma umklamo kagesi ulungile, ukuthamba kanye nekhwalithi yomphetho kungadala umonakalo wokuhlanganiswa kanye nokuphathwa. Ukucaciswa okuhle kweprototype kuchaza imikhawulo edingekayo ukuze ukwakhiwa kuhambe ngokuthembekile ezisekelweni.

• Usayizi weyunithi kanye nefomethi yephaneli kufanele kuhambisane nemibono ye-fixture kanye nokuhamba kokuhlanganiswa
• Ama-flatness target kufanele avumelane nekhono lokuphrinta kanye nokubeka
• Izidingo zekhwalithi yomphetho zisiza ukuvimbela ukuqhekeka ngesikhathi sokuthunyelwa nokuphathwa

3.Ukusebenza komsebenzi we-prototype we-substrate ye-DBC

Umjikelezo we-prototype osheshayo uncike kokufakwayo okuhlanzekile kanye nempendulo esheshayo yobunjiniyela. Amaphrojekthi amaningi adlula ezinyathelweni ezintathu ezisebenzayo ezinciphisa isikhathi sokuphindaphinda ngenkathi kugcinwa ukwakhiwa kuhambisana nezidingo zokukhulisa.

3.1 Iphakheji yefayela kanye nenhloso yokwakha

• Amafayela e-Gerber, uhlaka lwe-DXF, kanye nemidwebo yemishini yencazelo yeyunithi
• Izinto zokwakha kanye nokukhethwa kokuqeda ngokusekelwe endleleni yokuhlanganisa ehlosiwe
• Ubuningi besibonelo kanye nefasitela lomkhumbi eliqondiwe
• Umongo omfushane wokusetshenziswa ochaza i-voltage, umthwalo wokushisa, kanye nohlelo lokuhlanganisa

3.2 Ukubuyekezwa kwe-DFM kanye nokunciphisa ubungozi

Impendulo ye-DFM igxila kulokho okuzovimbela i-prototype ukuthi ihlangane kahle. Ngokuvamile ihlanganisa imikhawulo emincane yezici, i-geometry yethusi engagxilisa ukucindezeleka, ukuhambisana kokuqeda nokunamathiselwa, kanye nezinto zomshini ezingangqubuzana nezinto ezifakiwe noma eziboshiwe.

3.3 Yakha iluphu yokulethwa nokufunda

Ngemva kokulethwa, amaqembu avame ukwenza izivivinyo zokuhlanganisa kanye nezivivinyo eziqondiwe, bese efaka imiphumela ekubuyekezweni okulandelayo. Ukulingisa kusebenza kahle kakhulu uma ukuphindaphinda ngakunye kuphendula umbuzo ocacile ukuze umklamo uhlangane ngokushesha.

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4. Ukwenziwa kwe-PCB kanye nokuhlanganiswa kwe-PCB kwezinhlelo ezisekelwe ku-DBC

Ama-substrate e-DBC awavamile ukuthunyelwa njengezingxenye ezizimele. Imikhiqizo eminingi ye-elekthronikhi yamandla ifaka amabhodi okulawula, amabhodi okushayela, amasekethe okuzwa, kanye nezixhumi zokuxhumana okumele zenziwe futhi zihlanganiswe ngekhwalithi ezinzile. I-Highleap Electronics isekela lezi zidingo ngokwenziwa kwe-PCB okukhuliswayo kanye ne-turnkey PCBA ukuze umsebenzi we-substrate uxhumeke ohlelweni oluphelele olukhiqizwayo.

• Ukwakhiwa kwe-PCB isekela ama-PCB aqinile, i-HDI, ithusi elisindayo, kanye nezinye izinto ezisetshenziswa kuma-electronics anamandla kanye nezifunda zokulawula
• Umhlangano we-PCB isekela i-SMT futhi ngezinqubo zemigodi, ukwakhiwa kobuchwepheshe obuxubile, kanye nemisebenzi yokukhiqiza ekhula kusukela ezinhlotsheni zeprototype kuya kumthamo
• Ukuvumelana kwesistimu kuyathuthuka lapho ukwakhiwa kwe-PCB, ukuhlela ukuhlanganiswa, kanye nezindlela zokuhlola kuhambisana kusenesikhathi ngesikhathi sokubuyekezwa kwe-DFM

Izinhlelo ezidinga izinketho zesekethe ye-ceramic ngale kwe-DBC zivame ukucabangela i-AMB ne-DPC njengengxenye yesinqumo sobuchwepheshe. I-Highleap Electronics isekela lezi zidingo njengomlingani wokukhiqiza i-PCB ye-ceramic eseShayina, futhi amakhono ethu okukhiqiza i-PCB ye-ceramic yaseShayina asiza amaqembu ukuqhathanisa imizila yenqubo futhi asuke ekwakhiweni kokuhlola aye ekukhiqizeni okuzinzile.

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5. Ukukhiqizwa kwevolumu kanye nokuhlanganiswa kwevolumu

Uma i-prototype ye-DBC substrate isiqinisekisiwe, okubalulekile kuyashintsha kusukela ekufundeni okusheshayo kuya ekulethweni okuzinzile. Ukulungela ivolumu kuvela ekukhiyeni imininingwane yokhiye, ukuqinisekisa imiphumela yokuhlanganiswa ephindaphindwayo, kanye nokwakha uhlelo lokunikezela olusekela amashejuli okukhiqiza. I-Highleap isekela lolu shintsho ngokwenziwa kwe-PCB yevolumu kanye ne-PCBA yevolumu, futhi sisekela nokukhiqizwa ngobuningi kwezinye izinhlobo ze-PCB ezisetshenziswa kuzo zonke izimboni kanye ne-electronics zabathengi.

• Ukwakhiwa kwezindiza qinisekisa ukuqina kwenqubo kanye nokuvuna kwangaphambi kwesikhathi ngaphambi kokukhishwa kwesikali esigcwele
• Ukwenziwa kwe-PCB yevolumu ihlinzeka ngokukhiqiza okuqhubekayo kwemiklamo eqinile, eguquguqukayo, eqinile, i-HDI, kanye neyethusi elisindayo
• Umhlangano we-PCB wevolumu isekela i-SMT ephindaphindwayo kanye nezinqubo zemigodi ngokuhlolwa nokuhlolwa okuhambisana nezindlela zakho zokwamukela
• Ukulula kokunikeza kunciphisa ubungozi besikhathi lapho ukwenziwa nokuhlanganiswa kwe-PCB kuhlanganiswa ngaphansi komsebenzi owodwa wefektri

Amaqembu aqhathanisa abahlinzeki be-substrate avame ukugcina imigomo yokukhetha ibhaliwe, futhi isihloko sivumelana ngokwemvelo nendlela umenzi we-substrate we-DBC ofanelekayo ahlolwa ngayo ukuze aqiniseke ukuthi uhambisana futhi uthembekile.

Thumela i-DBC Prototype RFQ

6. Uhlu lokuhlola lwe-RFQ lwe-prototype ye-DBC substrate

Iphakheji ephelele ye-RFQ iyasiza ekunciphiseni ukubuyela emuva naphambili futhi ivikela isikhathi sokuhola. Uma ukwakhiwa kwakho kufaka phakathi ukwenziwa nokuhlanganiswa kwe-PCB, ukuthumela konke ndawonye kuvame ukufinyeza ishejuli iyonke ngoba impendulo ye-DFM ingabhekana nohlelo oluphelele esikhundleni sengxenye eyodwa ngesikhathi.

• Amafayela okuklama Imidwebo ye-Gerber, i-DXF, kanye ne-PDF
• Incazelo ye-DBC uhlobo lwe-ceramic, ubukhulu, ubukhulu bethusi, ukuqeda ubuso
• Ubuningi inani le-prototype kanye nomthamo wokukhiqiza okulindelekile
• esibekelwe usuku lomkhumbi oluqondiwe kanye nezidingo ezibalulekile
• Inhloso yokuhlanganisa ukunamathisela nge-solder, ukufaka i-die, ukubopha ucingo, imikhawulo yokuphatha
• Izidingo zokuhlola ukuqhubeka, ukuvikela ukushisa, kanye nokuhlolwa kokusebenza uma kudingeka

Amaqembu amaningi agcina amagama e-DBC kanye nomongo wezinto ezibonakalayo kumadokhumenti awo angaphakathi, futhi okuqukethwe okufanayo kuvame ukusekelwa ukubuka konke okusebenzayo kwezincazelo ze -substrate zethusi ezihlanganisiwe ngqo kanye nobubanzi be -substrate ye-DBC esetshenziswa ngesikhathi sokuhlela iphrojekthi kwasekuqaleni.