Isevisi Yomkhiqizi Nokukhiqiza Ama-PCB E-Ceramic Angokwezifiso

Ama-PCB e-Ceramic asebenzisa ama-substrate e-ceramic angaphili — i-alumina, i-aluminium nitride, i-silicon nitride — esikhundleni se-fiberglass-epoxy ephilayo etholakala kumabhodi ajwayelekile e-FR4. I-substrate ye-ceramic ibopha ngqo kwisekethe yethusi ngaphandle kwesendlalelo sokufakelwa kwe-dielectric esihlukile, okudala indlela yokushisa kusuka ku-component kuya kusinki yokushisa esebenza kahle ngama-50–500× kune-FR4. Leyo nzuzo yesakhiwo yingakho ama-PCB e-ceramic echazwe kumamojula wamandla, ama-LED akhanya kakhulu, ama-front-ends e-RF, ama-sub-mount e-laser diode, nanoma yikuphi ukusetshenziswa lapho ukushisa kushintshashintsha, izinga lokushisa lokusebenza, noma impilo yokujikeleza kokushisa idlula lokho okungasinda ama-laminate e-organic.

I-Highleap Electronics ikhiqiza ama-PCB e-ceramic kuma-substrate e-alumina (Al₂O₃), i-aluminium nitride (AlN), kanye ne-silicon nitride (Si₃N₄) isebenzisa izinqubo ze-DBC, DPC, thick-film, thin-film, LTCC, kanye ne-HTCC . Siphinde sihlanganise izingxenye kuma-substrate e-ceramic — SMT, wire bonding, die attach, kanye nokuhlolwa kukagesi — ngaphansi kophahla olulodwa.

Thola Isilinganiso se-PCB se-Ceramic →

Izinto Ezine Ze-Ceramic Substrate Nalapho Ngayinye Ifanelana Khona

I-PCB ngayinye ye-ceramic iqala nge-substrate. Izinto ezikhethiwe zinquma ukuhanjiswa kokushisa, amandla omshini, ukufana kwe-CTE ne-semiconductor die, kanye nezindleko zebhodi eliqediwe. Igcina futhi icubungule zonke izi-substrate ezine ze-ceramic zezinga lokukhiqiza.

I-Alumina — ihhashi elisebenzayo lokukhiqiza

Ama-PCB e-Alumina ceramic akhiqiza iningi lemikhiqizo ye-PCB ye-ceramic emhlabeni jikelele. Atholakala ngamazinga okuhlanzeka angama-96% kanye nama-99.6%, i-alumina inikeza ukuhanjiswa kokushisa okusebenzayo (okungcono ngo-50–100× kune-FR4), ukufudumala kukagesi okuhle kakhulu, kanye nezinga lezindleko elenza kube lula ukusebenza ekukhiqizeni okunomthamo omaphakathi. Sisebenzisa i-alumina engama-96% ezinhlelweni eziningi ze-LED, inzwa, kanye ne-elekthronikhi yamandla, kanye ne-alumina engama-99.6% lapho kudingeka ubulukhuni bendawo obuqinile noma ukubekezelelana kwe-dielectric - ngokuvamile kumasekethe e-RF e-thin-film.

I-aluminium nitride — umholi wokusebenza kokushisa

I-AlN inikeza ukuqhutshwa kokushisa okungu-7 × kanye nokufana kwe-CTE okuseduze kakhulu ne-silicon phakathi kwezingxenye ze-ceramic (4.5 vs. 3.0 ppm/°C). Lokho kufaniswa kwe-CTE yingakho i-AlN ichazwa noma yikuphi lapho i-semiconductor die ixhunywe khona ngqo kwi-substrate - amamojula wamandla, amaphakheji e-laser diode, kanye namamojula we-5G RF. Ukushintshaniswa yizindleko nezidingo ze-metallization ezidinga kakhulu. Ukusekelwa kwethu kobunjiniyela bokuphathwa kokushisa kusiza ukunquma ukuthi umklamo wakho udinga ngempela i-AlN noma ukuthi i-alumina enomklamo ongcono we-interface yokushisa ingafinyelela yini inhloso efanayo yokushisa kwe-junction ngezindleko eziphansi.

I-silicon nitride — i-ceramic enzima kakhulu yokujikeleza ngokweqile

I-Si₃N₄ inikeza ukuqina kokuqhekeka kwe-alumina noma i-AlN okungu-2–3×, okwenza ikwazi ukusinda ezimisweni zokujikeleza kokushisa (–55 kuya ku-+250 °C, imijikelezo engu-30,000+) ephula ezinye izisekelo ze-ceramic. Sekuyi-substrate ekhethwayo yamamojula kagesi kagesi esizukulwane esilandelayo se-SiC kanye ne-GaN kuma-inverters e-EV traction kanye nama-drive ezimoto zezimboni. I-Si₃N₄ icutshungulwa cishe kuphela nge-AMB (active metal brazing) metallization.

I-Beryllium oxide — ukusebenza okuphezulu kwefa, ukusetshenziswa okulinganiselwe

I-BeO inikeza ukuhanjiswa kokushisa okuphezulu kakhulu kunanoma iyiphi into ye-PCB yobumba, kodwa ubuthi bayo bezinto ezingavuthiwe (uthuli lwe-beryllium luyingozi enkulu yokuphefumula) luyikhawulela ekusetshenzisweni lapho kungekho okunye esikhundleni salokho — ikakhulukazi izinhlelo zezindiza nezokulwa ezindala ezinezinqubo zokuphatha ezisunguliwe. Imiklamo emisha icacisa kakhulu i-AlN noma i-Si₃N₄ esikhundleni salokho.

Izinqubo Eziyisikhombisa Zokukhiqiza: Indlela Ithusi Elifika Ngayo Ku-Ceramic

Izinto ezisetshenziswa ngaphansi komhlaba zichaza izakhiwo zokushisa ze-PCB ye-ceramic. Inqubo yokwenza insimbi ichaza ikhono likagesi — isixazululo sokulandelela, ukujiya kwethusi, inani lezingqimba, kanye namandla esibopho sethusi ne-ceramic. I-Highleap isekela zonke izinqubo eziyisikhombisa zokwenza insimbi zibe yizinga lokukhiqiza.

I-DBC — Ithusi Elihlanganisiwe Ngokuqondile

I-DBC ibopha i-foil yethusi elijiyile (0.15–0.6 mm) ku-ceramic ngokusebenzisa ukusabela kwe-oxidation okulawulwayo cishe ku-1,065 °C. I-interface yethusi-ceramic ephumelayo inokumelana okuphansi kakhulu kokushisa futhi isekela imigoqo yebhasi yamandla aphezulu yamamojula wamandla we-IGBT ne-MOSFET. I-DBC iyindinganiso emisiwe yezingxenye ze-ceramic ze-module yamandla kokubili ku-alumina kanye ne-AlN. Umkhawulo: ububanzi obuncane bokulandelela ngokuvamile bungu-0.3–0.5 mm ngenxa yethusi elijiyile, futhi incazelo yomphetho iqinile kune-DPC.

I-DPC — Ithusi Eliqoshwe Ngokuqondile

I-DPC ifaka ungqimba lwembewu ye-titanium/yethusi oluncane phezu kobumba ngaphansi kwe-vacuum, bese ifaka ithusi kuze kube ugqinsi oluqondiwe (ngokuvamile 5–140 µm) isebenzisa i-photolithography ejwayelekile kanye ne-electroplating. Le nqubo ifinyelela ukuxazululwa komugqa omuhle (ukulandelela/isikhala kuze kufike ku-50/50 µm) futhi isekela izimbobo ezimboziwe kanye nama-via - okwenza kube yi-metalization eguquguqukayo kakhulu yemiklamo yesekethe eyinkimbinkimbi. I-DPC inqubo ejwayelekile yamaphakheji e-LED aqinile, amasekethe e-RF ku-alumina, nanoma yimuphi umklamo we-PCB we-ceramic odinga ama-trace alawulwa yi-impedance.

I-AMB — I-Active Metal Brazing

I-AMB ihlanganisa ithusi ne-ceramic isebenzisa i-active braze alloy (ngokuvamile i-Ag-Cu-Ti) ku-800–900 °C ngaphansi kwe-vacuum. I-active titanium element imanzisa ubuso be-ceramic, idale isibopho se-metallurgical esinamandla kune-DBC — okubaluleke kakhulu kuma-substrate e-Si₃N₄ lapho inqubo ejwayelekile ye-oxidation ye-DBC ingakhi isibopho esithembekile. I-AMB isekela ubukhulu bethusi obufika ku-800 µm futhi ubuchwepheshe obuphambili bamamojula we-SiC/GaN wesizukulwane esilandelayo.

Ifilimu ewugqinsi

Ama-PCB e-ceramic anombala ojiyile asebenzisa ama-pastes aqhutshwayo aphrintiwe esikrinini (isiliva, igolide, isiliva-palladium) ashisiwe ku-850–900 °C. Le nqubo ivumela ama-resistors aphrintiwe kanye nama-capacitor ngqo ku-substrate - asusa ama-passive ahlukene kuma-circuits e-hybrid. Ifilimu ejiyile iyinqubo ye-PCB ye-ceramic engabizi kakhulu yezinhlelo zokusebenza zamanje ezimaphakathi ezinobukhulu obukhulu bezici (ubuncane bomugqa ngokuvamile buyi-100–150 µm). Izinga elijwayelekile lezinzwa zezimoto, izilawuli zezimboni, kanye nama-microelectronics e-hybrid.

Ifilimu elincanyana

Ama-PCB e-ceramic acwebezelayo afaka insimbi ngokuyikhipha noma ngokuyikhipha, bese kuba iphethini nge-photolithography — efinyelela isinqumo esihle kakhulu kunoma iyiphi inqubo ye-PCB ye-ceramic (umugqa/isikhala sifinyelela ku-10/10 µm). Ifilimu encane ichazwe ngezihlungi ze-RF ezinembile, amasekethe e-microwave, kanye nezinhlelo zokusebenza zemvamisa ephezulu lapho i-trace geometry ilawula ngqo i-impedance kanye nokulahlekelwa kokufakwa. Ubukhulu bethusi bunqunyelwe (ngokuvamile ngaphansi kwama-5 µm); imiklamo edinga ugesi ophezulu ihlanganisa ukufometha kwe-thin-film kanye nokuphotha okulandelayo (indlela ye-DPC).

I-LTCC — I-Ceramic Ehlanganisiwe Enokushisa Okuphansi

I-LTCC ishisa izendlalelo zetheyiphu ye-ceramic ngama-conductor esiliva noma egolide ahlanganisiwe ku-850–900 °C, ikhiqiza ama-PCB e-ceramic anezendlalelo eziningi (izendlalelo eziyi-10+) anezi-vias ezihlanganisiwe, imigodi, kanye nezingxenye ezihlanganisiwe ze-passive. I-LTCC iyindinganiso yamamojula e-RF ahlanganisiwe, ama-front-ends e-mmWave (i-radar yezimoto, ama-antenna e-5G), kanye nanoma yimuphi umklamo odinga ubuningi bokuxhumana obunezinhlangothi ezintathu kuphakheji ye-ceramic e-hermetic. Amakhono ethu e-LTCC kanye ne-HTCC amboza kokubili ama-prototype kanye nomthamo wokukhiqiza.

I-HTCC — I-Ceramic Enokushisa Okuphezulu Esebenzisa Ukushisa Okuphezulu

I-HTCC ivutha ku-1,500–1,800 °C isebenzisa ama-tungsten noma ama-molybdenum conductors (igolide nesiliva azikwazi ukusinda kulezi zindawo zokushisa). I-HTCC ikhiqiza ama-substrate anamandla aphezulu kakhulu esakhiwo kanye nokumelana namakhemikhali - achazwe kumaphakheji e-hermetic, izinsimbi ezingaphansi komhlaba, kanye nama-electronics asendaweni eyingozi. Ukushintshana yi-conductivity ephansi yama-conductor (i-W ne-Mo zine-resistivity ephezulu engu-3–5× kune-Cu noma i-Ag) kanye namathuluzi abiza kakhulu.

Ukukhetha i-PCB ye-Ceramic Efanele Yesicelo Sakho

Amaphrojekthi amaningi awela kwenye yezinhlanganisela ezinhlanu zezinto ezibonakalayo. Ukukhetha kuqhutshwa yimingcele yokubopha ekwakhiweni — ugesi, ukujikeleza kokushisa, isixazululo sokulandelela, imvamisa, noma izindleko.

Ithebula Lokukwazi Ukukhiqiza le-Highleap

Indlela Yokucacisa Noku-oda Ama-PCB E-Ceramic

Izincazelo ezingaphelele ziyimbangela eyinhloko yokulibaziseka kokucaphuna kanye nokumangala kwesihloko sokuqala kumaphrojekthi e-PCB e-ceramic. Ngokungafani nama-oda e-FR4 lapho okuzenzakalelayo kuhlanganisa khona amacala amaningi, ama-PCB e-ceramic adinga ukucaciswa okucacile kuwo wonke amapharamitha ngoba azikho izinguqulo ezijwayelekile zemboni ezikhona.

Iphakheji yakho yokucaphuna ye-PCB ye-ceramic kufanele ifake:

Uma ungaqiniseki ngezinto noma ngokukhetha inqubo, thumela lokho onakho. Ithimba lethu lobunjiniyela linikeza izincomo zokubuyekezwa kwe-DFM kanye nezinto ezisuselwe ezidingweni zakho zokushisa, zikagesi, nezomshini — ngaphambi kokuba uzibophezele ekwakheni okuthile.

imibuzo ejwayelekile ukubuzwa

Yiziphi izinto ezisetshenziswa ngaphansi komhlaba ezitholakalayo kuma-PCB e-ceramic?

Izingxenye ezine ze-PCB ze-ceramic zezinga lokukhiqiza yi-alumina (Al₂O₃) enokushisa okuhambayo okungu-24–28 W/m·K, i-aluminium nitride (AlN) ku-170–200 W/m·K, i-silicon nitride (Si₃N₄) ku-80–90 W/m·K enokuqina okuphezulu kokuqhekeka, kanye ne-beryllium oxide (BeO) ku-250–300 W/m·K yezinhlelo zokusebenza zamandla aphezulu ezindala. I-Alumina isingatha izinhlelo zokusebenza eziningi ngezindleko eziphansi kakhulu; I-AlN ikhonza amamojula wamandla aphezulu lapho ukushisa okuhambayo kuyisithiyo sokubopha; I-Si₃N₄ ichazwa lapho ukukhuthazela kokujikeleza kokushisa kanye nokuqina komshini kubaluleke kakhulu — ama-inverter e-SiC/GaN EV, isibonelo.

Uyini umehluko phakathi kwama-PCB e-ceramic e-DBC, DPC, kanye ne-AMB?

I-DBC ibopha ithusi elijiyile (0.15–0.6 mm) ku-ceramic cishe ku-1,065 °C ngenqubo yokulawula i-oxidation — engcono kakhulu kumamojula wamandla aphezulu ku-alumina kanye ne-AlN. I-DPC ibeka ungqimba lwembewu yethusi oluncane ngokufaka amapuleti ukuze afinyelele ubukhulu obuqondiwe — okungcono kakhulu kumasekethe aqondile, ama-LED, kanye nemiklamo ye-RF. I-AMB ifaka ithusi ku-800–900 °C isebenzisa i-active metal filler — engcono kakhulu kuma-substrate e-Si₃N₄ nanoma yisiphi isicelo esidinga isibopho esiqine kakhulu sethusi-ceramic kanye nokukhuthazela okukhulu kokujikeleza kokushisa. Bheka imininingwane yethu yenqubo ye-DBC ukuze uthole ukuqhathanisa okujulile kobuchwepheshe.

Zibiza malini ama-PCB e-ceramic uma kuqhathaniswa ne-FR4?

Ama-PCB e-Ceramic ngokuvamile asebenzisa izindleko ezilingana nama-5-50× zamabhodi e-FR4 kuye ngokuthi i-substrate material, inqubo yokwenza insimbi, usayizi webhodi, kanye nobuningi be-oda. I-Alumina thick-film iyindlela engabizi kakhulu ye-ceramic. I-AlN ne-Si₃N₄ AMB zinekhwalithi ephezulu kakhulu. Intengo eqondile incike ngokuphelele kumklamo wakho othize — i-aluminium DPC LED sub-mount engu-10 mm × 10 mm ibiza ngendlela ehluke kakhulu kune-substrate ye-AlN DBC power module engu-50 mm × 80 mm. Thumela amafayela akho e-Gerber ukuze uthole isilinganiso esinembile esisekelwe kumklamo wakho wangempela. Ukuze uthole imininingwane eyengeziwe ngalokho okuqhuba intengo ye-PCB ye-ceramic, bheka ukuhlaziywa kwezindleko ze-PCB ye-ceramic.

Ingabe ama-PCB e-ceramic angaba nezingqimba eziningi?

Yebo. Izinqubo zokudubulana ze-LTCC kanye ne-HTCC zisekela izendlalelo ezingaphezu kweziyi-10 ezinama-resistors afakiwe, ama-capacitor, ama-inductor, kanye nama-vertical interconnect. Ama-substrate e-DBC kanye ne-AMB ngokuvamile ayizendlalelo ezi-conductive ezingu-1-2. I-DPC isekela izendlalelo ezingu-2-4 ezinezimbobo ezifakwe i-through-holes kuma-substrate e-alumina noma e-AlN. Ukuze uthole imiklamo eyinkimbinkimbi yezendlalelo eziningi, bheka amakhono ethu e-PCB e-ceramic yezendlalelo eziningi.

Yimaphi amafayela engiwadingayo ukuze ngithole isilinganiso se-PCB se-ceramic?

Amafayela e-Gerber aphelele azo zonke izendlalelo, umdwebo wokwenziwa ochaza izinto ze-ceramic kanye nezinga lobumsulwa, ukujiya kwe-substrate kanye nokubekezelelana, indlela yokwenza insimbi, ukujiya kwethusi, ukuqeda kobuso, ukubekezelelana okulinganayo, izindlela zokuhlola zikagesi, ubuningi, kanye nosuku lokulethwa okuqondiwe. Ukuze uthole ukuhlanganiswa kwe-turnkey, engeza amafayela e-BOM kanye nokukhetha nokubeka. Ngaleyo phakheji, sikhipha ikhotheshini enokwehlukaniswa kwezindleko zezinto zomugqa - intengo incike kumklamo wakho wangempela, futhi ngeke siqagele inombolo yesethi ye-Gerber esingakayibukezi.