Ukukhiqizwa kwe-PCB Yesihlungi se-TMM4

Ukukhiqizwa kwe-PCB yesihlungi se-TMM4 kulawulwa yi-geometry esetha impendulo yesihlungi. Ngakho-ke ama-resonator, imigqa ehlanganisiwe, imigodi kanye noshintsho oluhlanganisiwe kufanele kukhishwe ngosayizi ocacile kanye nokubekezelelana. I-TMM4 iwusizo kakhulu lapho isekethe ye-microwave kumele ibe ncane ngaphandle kokuthuthela ngokushesha kwi-substrate ephezulu kakhulu ye-Dk. Lokho kwenza kube yinto ewusizo yezihlungi ezihlangene, ama-resonator, ama-couplers, amanethiwekhi afanayo kanye namamojula e-RF agcinwe lapho imvamisa yesikhungo kanye nokuxhumanisa kuncike kubukhulu obuqediwe. Uma kudingeka i-dielectric constant ehlukile, ukwakhiwa kwesihlungi se-TMM6 njengenketho ehlukile kudinga imodeli ye-RF ebuyekeziwe esikhundleni sokushintshana kwezinto kuphela.

I-Highleap Electronics ikhiqiza ama-PCB e-TMM4 kusukela kuma-prototypes alungisiwe ukuze kuphindwe ukukhiqizwa. Umsebenzi ugxile ebukhulu obusetha impendulo ye-RF, ukwenziwa kwemishini kanye nokuqeda okudingekayo yi-module, kanye nobufakazi obudingekayo ngaphambi kokukhishwa kwevolumu.

Ikhasi le-TMM4 liphethe ukukhiqizwa kwesihlungi se-microwave esincanyana. Ubukhulu be-resonator, izakhiwo zokuxhumanisa, ukuguqulwa okunama-plated kanye nokulinganiswa kwe-RF yesihloko sokuqala kuphathwa njengezilawuli zokukhiqiza eziyinhloko kunokuphinda ulwazi olujwayelekile lwezinto ze-TMM.

Kungani i-TMM4 Isetshenziselwa i-Compact Microwave Filter PCB

I-TMM4 ithatha indawo ephakathi nendawo: ifinyeza izakhiwo ezisatshalaliswe uma kuqhathaniswa ne-TMM3 ngenkathi ivame ukulondoloza imigqa nezikhala eziningi ezikhiqizwayo kunezinto eziphezulu kakhulu ze-Dk. Iphrojekthi kufanele ichaze ukuthi kudingeka ukunciphisa usayizi ongakanani, ngoba ukunciphisa ngakunye kwandisa umthelela wephesenti lokushintshashintsha kwe-etch, ukujiya kanye nezindlu.

Izihlungi nama-couplers kulawulwa yi-geometry eqediwe

Inothi elijwayelekile le-impedance alanele kwisihlungi se-narrowband. Ubude be-resonator, igebe lokuxhuma, indawo evulekile, ngokusebenzisa udonga kanye nesikhala sendlu kungalawula ngqo imvamisa yesikhungo, i-bandwidth kanye nokwenqatshwa. Umdwebo kufanele ukhombe lezi zilinganiso futhi usho ukuthi i-plating yokugcina kanye nokuqeda kufakiwe yini.

Ububanzi bezinto ezibonakalayo: Leli khasi liphathelene nokwakhiwa kwe-PCB kusetshenziswa izinto ezishiwo yiRogers. I-Highleap Electronics ikhiqiza ibhodi eliqediwe kanye ne-PCBA; ukukhiqizwa kwe-laminate kanye nokuthengiswa kwezinto ezibonakalayo kungaphandle kobubanzi besevisi yethu.

Kusukela Ekulingiseni kuya Kumodeli Ye-TMM4 Elungisiwe

Iphrothokholi yokuqala kufanele yakhelwe njengokwakhiwa kokufunda, hhayi nje i-oda lokuphasa/lokwehluleka. I-Highleap ingalinganisa ubukhulu obubalulekile obuvunyelweneyo futhi inikeze amarekhodi okukhiqiza ukuze ikhasimende likwazi ukuwaqhathanisa nempendulo ye-RF elingisiwe nelinganisiwe. Lapho kufakwa khona amathebhu okulungisa noma izici zokusika, indlela yokulungisa kumele iphindwe ngokwanele ukuze kukhiqizwe.

Umshini, imigodi kanye nezimbobo ezifakwe amapulangwe

Amamojula e-TMM4 avame ukusebenzisa imigodi eqondiwe, izici zokufaka, imigodi ehlanganisiwe noma isisekelo sensimbi. Izici zemishini kufanele zibhekisele ohlelweni olufanayo lwedatha njengomsebenzi wobuciko wokuhlunga. Ukufakwa kwemigodi kanye nekhwalithi yomphetho kubaluleke kakhulu lapho ama-vias akha udonga oluvikelayo noma ukuqaliswa kwesixhumi kuseduze nohlaka oluqondiwe.

Ukubopha ucingo kanye nokuqedwa okukhethiwe

Izindawo eziboshiwe ngentambo noma ezinamathiselwe nge-die akufanele zithole ukuqeda okungacacisiwe. I-pad metallurgy, ukujiya, ukususwa kwemaski kanye nokuhlanzeka kudingeka kuhambisane nenqubo yokuhlanganisa. I-Highleap ingaxhumanisa ukuqeda kwebhodi elingenalutho nezidingo zokuhlanganisa i-PCB ye-wire-bond uma imojuli inikezwa njenge-PCBA ephelele.

Ukukhiqizwa Kwemodyuli Enezindlu Nezisekelwe Ngensimbi ye-TMM4

Isisekelo sensimbi noma indlu eyenziwe ngomshini ingahlinzeka ngokusabalalisa ukushisa, ukuqina kanye nokuvikela i-RF, kodwa futhi kushintsha indawo ye-electromagnetic. Ubukhulu obunamathelayo, isikhundla sesikulufu, ukujula kwesikhala kanye nesikhala sesivalo kufanele kufakwe ekuqinisekisweni. Ibhodi elidlula endaweni ekhululekile lingase lishintshe lapho lihlanganiswe endaweni yokugcina.

Ukuze uthole ukwakheka okubanzi kanye nomongo wokwenziwa, bheka amasu amancane okwenziwa kwe-RF PCB.

Ukuhambisa Isihlungi se-TMM4 Ukusuka Kumodeli Kuya Kuvolumu

Ukulungela ivolumu kuboniswa lapho impendulo ye-RF eyamukelekayo ingaxhunyaniswa neziguquguquko zokukhiqiza ezilinganiswayo. I-Highleap ingagcina i-stackup evunyiwe, ukwakhiwa kwezinto, amanothi amathuluzi, umbiko wobukhulu obubalulekile kanye nezidingo zokuhlola zama-oda aphindaphindwayo. Uma kuphakanyiswa ushintsho lwezinto, ithusi noma ukuqeda, kufanele lubuyekezwe ngaphambi kokwenziwa ngoba impendulo ingase ihambe.

Ubufakazi bokukhiqiza

Uhlelo lokukhiqiza lungafaka ukuqinisekiswa kwezinto ezingenayo, isinxephezelo se-etch esilawulwayo, ukuhlolwa kwe-optical, i-microsection, ukuhlolwa kukagesi kanye nokuhlolwa kwe-RF okuchazwe ngamakhasimende. Ama-oda e-prototype kanye ne-volume ephansi angalandelwa ukutholakala kwezingxenye kanye nokuhlanganiswa kwemodyuli lapho i-BOM, indawo kanye nemikhawulo yokusebenza itholakala khona. I-Highleap ibuyekeza isakhiwo sesihlungi, imishini, izimbobo ezifakwe amapulangwe kanye nobudlelwano be-reference-plane ngaphambi kwendatshana yokuqala. Lapho kulindeleke khona ukulungiswa, uhlelo lwe-prototype kufanele lusho ukuthi yiziphi izilinganiso ezingalungiswa nokuthi yiziphi ezinqunyelwe umdwebo wokukhiqiza. Amanani empahla eqondile kufanele ahlolwe ngokumelene nemibhalo yamanje yomhlinzeki webanga elicacisiwe kanye nokwakhiwa. Ngomzila wokuklama we-Dk ephansi, ukwakhiwa kwe-TMM3 RF-module kunikeza ukuhweba okuhlukile kwe-geometry okufanele kuhlolwe ngaphambi kokuba i-stackup iqandiswe.

Imibuzo yesihlungi se-TMM4

Ingabe i-TMM4 ingcono njalo kune-TMM3? Cha. I-TMM4 inikeza i-miniaturization eyengeziwe, kuyilapho i-TMM3 inganikeza i-geometry ebanzi kanye ne-broadband margin eyengeziwe.

Ingabe isihlungi kufanele samukelwe ngekhuphoni ye-impedance? Ngokuvamile hhayi ngekhuphoni kuphela. Impendulo yesihlungi kanye nobukhulu obubalulekile kungaba yinto efanele kakhulu. Ukuze uthole isilinganiso sesihlungi se-TMM4, nikeza ukwakheka kwesihlungi, ibhendi yemvamisa, i-stackup, ubukhulu obubalulekile, ukuqeda kanye nobuningi. Faka indlela yokulinganisa ye-RF edingekayo lapho isihlungi samukelwa ngempendulo elinganisiwe.