Ukukhiqizwa kwe-TMM3 PCB kwamaModule e-RF

Ukukhiqizwa kwe-TMM3 PCB kuwusizo kakhulu lapho imodyuli ye-RF inezithiyo zomshini noma zomshini. Kulezi zakhiwo, isikhombimsebenzisi esizinzile somshini singabaluleka njengokusebenza okuphezulu kwe-dielectric. I-TMM3 ikhethwa lapho isekethe ye-RF kufanele isebenze njengengxenye yemodyuli yomshini. Ibhodi lingafaka imigodi efakwe ngomshini, imigodi yokufaka, imiphetho efakwe ngomshini, ama-wire-bond pads, ama-clamp noma indlu yensimbi. Kuleyo ndawo, ukulahlekelwa okuphansi kuyimfuneko eyodwa kuphela; ukuqina, ukunemba kobukhulu, ukuthembeka kwemigodi efakwe ngomshini kanye nesimo sobuso kubaluleke ngokulinganayo.

I-Highleap Electronics isekela ukwenziwa kwe-TMM3 PCB kwamamojula e-microwave, okuhlanganisa ukuqondisa ngokunemba, imigodi efakwe amapulangwe, izici zomgodi, ukuqeda okukhethiwe kanye nokuhlanganiswa kwe-wire-bond noma izingxenye ongazikhethela. Uhlelo lokukhiqiza lwakhiwe ngokuzungeza ukwakheka kwemojula kunokuhlola uhlu olujwayelekile lwe-laminate.

I-TMM3 ixazululwa ngamamojula e-RF ahlanganiswe ngomshini. Ama-cavity, imiphetho yokuxhuma, imigodi efakwe amapulangwe, izinkomba zokufaka kanye ne-RF traces zidinga i-datum efanayo futhi kufanele zihlolwe ndawonye lapho ibhodi lihlangana ngqo ne-enclosure yomshini.

Kungani i-TMM3 Ifanelana Nemiklamo ye-Mechanical RF Module PCB

I-TMM3 ine-dielectric constant ephansi kakhulu emndenini we-TMM, esekela imigqa yokudlulisa ebanzi kanye nezikhala ezinkulu zokuxhuma. I-geometry ebanzi ingathuthukisa ukubekezelelana kwe-etch kanye nokuziphatha kwe-broadband lapho imodyuli inendawo eyanele. Isakhiwo esigcwele i-thermoset ceramic simelana nokugeleza okubandayo okuhlotshaniswa nama-laminate e-PTFE athambile, okwenza ifaneleke kuma-assembly asebenzisa izikulufo, ama-clamp noma ama-wire bonds.

Uma ukuzinza komshini kubaluleke kakhulu kunokunciphisa kakhulu

I-TMM3 ayikhangi kangako uma umkhiqizo udinga ukwenziwa kube kuncane kakhulu. Kuleso simo, i-TMM4, i-TMM6 noma i-substrate ene-Dk ephezulu inganciphisa indawo yesekethe, kodwa isabelomali se-geometry kanye nokubekezelelana kumele sibuyekezwe.

Ububanzi bezinto ezibonakalayo: I-Highleap Electronics ingumkhiqizi we-PCB kanye nomhlanganisi wesakhiwo esichazwe lapha. URogers kanye namagama ebanga elibhekiselwe kuwo akhomba izinto ezicacisiwe futhi akuyona incazelo yokukhiqiza izinto ze-Highleap.

Umshini, Izimbobo kanye Nezimbobo Ezihlanganisiwe ku-TMM3

Amamojula e-RF omshini kufanele akhishwe ohlelweni olujwayelekile lwe-datum. I-cavity, ama-RF traces, imigodi efakwe amapulangwe, umphetho wokuxhuma kanye nezici zendlu kumele zivumelane ngemva kokuhambisa nokuqeda. I-Highleap ibuyekeza amathuluzi okuhambisa, indlela yokusekela, ukubekezelelana komphetho kanye nokulandelana kwe-plating ngaphambi kokwenziwa. Izici ezincane zomshini akufanele zichazwe kuphela kusukela kuhlaka lwe-CAD olujwayelekile; ubukhulu obuqediwe kanye namaphuzu okuhlola kudingeka kutholakale. I-Highleap ibuyekeza imigodi, izindawo ezifakwe umshini, imigodi efakwe amapulangwe, izici zokufaka kanye nezendlalelo ze-RF ndawonye. Umdwebo wokukhiqiza kufanele ukhombe ubukhulu obulawula kokubili ukulingana komshini kanye ne-geometry kagesi ukuze kuhlolwe ngaphansi kokubuyekezwa okukodwa. Amanani empahla eqondile kufanele ahlolwe ngokumelene nemibhalo yamanje yomhlinzeki webanga elicacisiwe kanye nokwakhiwa. Uma umklamo uthuthela kwelinye izinga, izidingo zokukhiqiza isihlungi se-TMM4 kufanele zibuyekezwe ngobukhulu obusha bukagesi kunokuba zikopishwe kumsebenzi wobuciko we-TMM3.

Izimbobo ezifakwe amapulangwe kanye nokuqedwa kwe-wire-bond

Ama-hole adlulayo anganikeza isisekelo, ukunamathiswa kwesixhumi noma ukugcinwa kwemishini. Ukuthembeka kwawo kuncike ekulungisweni kwemigodi, ukujiya kweplati kanye nokucindezeleka okusetshenziswa ngesikhathi sokuhlanganiswa. Ama-wire-bond pad engeza olunye ungqimba lokulawula: ukuqeda okukhethiwe kumele kuhambisane nentambo kanye nenqubo yokubopha, futhi ukungcola noma ukushintshashintsha kokuqeda ngokweqile kunganciphisa isivuno se-bond.

Isiqondiso se -PCB wire bonding sikaHighleap sichaza ukuthi kungani i-pad metallurgy, ukuhlanzeka kanye nokusekelwa kwe-substrate kumele kucatshangelwe ngomklamo webhodi elingenalutho.

Ukuhlanganiswa Kwemodyuli ye-TMM3 kanye Nokuqinisekiswa Kokushisa

Ibhodi le-RF alisebenzi lodwa. Isivalo sensimbi, udonga olungaphakathi, i-heat spreader, i-fastener noma i-glue ingalayisha insimu futhi ishintshe impendulo. Izinga lokushisa liphinde lishintshe kokubili i-substrate kanye nesakhiwo esizungezile. Ngakho-ke ukuqinisekiswa kweprototype kufanele kusebenzise indlu ehlosiwe noma i-fixture emele kunokuhlola ibhodi evulekile kuphela.

Amacala okusetshenziswa okuvamile kokukhiqiza

I-TMM3 iyisinqumo esisebenzayo samamojula we-amplifier, ama-couplers e-broadband, ama-antenna-feed assemblies, i-hardware yokuhlola i-microwave kanye nama-RF circuits agcinwe ngomshini. Ingasetshenziswa futhi lapho kudingeka khona enye indlela ye-PTFE kodwa imojula idinga ukumelana okungcono nokuqhekeka noma imishini ebikezelwayo. Kwimojula ye-RF equkethe i-radiator ephrintiwe, ukukhiqizwa kwebhodi le-antenna le-TMM kunezela i-geometry ye-antenna kanye nezidingo zenethiwekhi yokuphakelayo ekubuyekezweni kwebhodi.

Ngemikhiqizo ehlanganisa ibhodi le-RF nesakhiwo sensimbi, i-Highleap ingabuyekeza umklamo kanye nezidingo zokwenziwa kwe-PCB ezivame kakhulu kanye nokuhlanganiswa. Ukubuyekezwa kufanele kufake i-torque yokufaka, isikhombimsebenzisi sokushisa, ukulingana kwesixhumi kanye nanoma yikuphi ukufinyelela kokulungiswa ngemva kokuhlanganiswa.

Ukufaneleka kwe-TMM3 Prototype yokukhiqiza okuphindayo

Iphakheji yokufaneleka kufanele ifane nengozi yangempela yomkhiqizo. Imojula enezibopho zentambo ingadinga isitifiketi sokuqeda, idatha yokudonsa izibopho noma ukuhlolwa komhlangano okuchazwe amakhasimende. Isihlungi se-cavity singadinga ukubika kobukhulu obubalulekile kanye nokuxhumana kwe-S-parameter. Ibhodi eliboshwe ngomshini lingadinga ukuba yisicaba, indawo yembobo kanye nokuqinisekiswa kwe-torque.

I-Highleap ingahlinzeka ngama-prototypes ebhodi elingenalutho, ukukhiqizwa okuphansi kanye nokuhlanganiswa okukhethwa kukho. Imigomo yokukhokha, indlela yokuthumela kanye nesheduli yokulethwa kuqinisekiswa ngesilinganiso ngemuva kokutholakala kwezinto kanye nobunzima bokusebenza. Ama-oda aphindaphindwayo angasebenzisa ukwakhiwa okuvunyiwe kanye nedatha yesihloko sokuqala egciniwe ukunciphisa izinguquko ezingagwenywa.

Imibuzo yemodyuli ye-TMM3

Ingabe i-TMM3 icutshungulwa njenge-FR-4? Cha. Iyinto eqinile ye-thermoset microwave, kodwa imishini, ukubhoboza kanye nokuqeda kusadinga izilawuli ezithile zezinto. Ukuze uthole ikhotheshini, faka umdwebo womshini, i-stackup, izidingo zomshini, ithusi, imigodi, ukuqeda kanye nobuningi. Lokhu kuvumela umenzi ukuthi abeke intengo yokusebenza kwemishini kanye ne-PCB njengokwakhiwa okukodwa.

Ingabe i-TMM3 ingakwazi ukusekela ukubopha kwentambo? Yebo, uma kuchazwa ukuqeda, i-geometry yamaphedi, ukuhlanzeka kanye nenqubo yokuhlanganisa.