Ama-PCB eCeramic Ogesi Wamandla | Izixazululo Ezisebenza Kakhulu

Isingeniso

Kuma-elekthronikhi anamandla kanye nezinhlelo ze-LED ezikhanya kakhulu, ukuphathwa kokushisa okuphumelelayo kubalulekile ekusebenzeni nasekuthembekeni. Ama-PCB e-Ceramic ama- elekthronikhi anamandla anikeza ukuhanjiswa kokushisa okuphezulu kanye nokushisa uma kuqhathaniswa nama-PCB endabuko e-FR4 noma asekelwe ensimbi, okwenza kube kuhle kakhulu ezindaweni ezidinga amandla njengamamojula e-IGBT, ama-power converter, kanye nezinhlelo zokukhanyisa ze-LED.

Njengoba ukuminyana kwamandla kuqhubeka ukwanda emishinini yesimanje kagesi, ukulinganiselwa kwama-substrates avamile kuya ngokuya kucaca. Ama-substrates e-Ceramic abhekana nalezi zinselele ngokuhlanganisa izakhiwo ezinhle kakhulu zokushisa nokufakwa kukagesi okuqinile nokuzinza kwemishini, okwenza onjiniyela bakwazi ukusunduza imingcele yokusebenza kuyilapho begcina ukwethembeka kwesikhathi eside.

Kungani Ukuphathwa Kwe-Thermal Kubalulekile Ku-Power Electronics

Amadivayisi we-semiconductor yamandla afana nama-MOSFET, ama-IGBT, nama-LED anamandla amakhulu aguqula ingxenye ebalulekile yamandla kagesi abe ukushisa ngesikhathi sokusebenza. Kumamojula e-IGBT, ukushintsha ukulahlekelwa nokulahlekelwa kwe- conduction kungadala ukuminyana kokushisa okudlula u-100 W/cm², kuyilapho ama-LED chips aguqula ngaphezu kuka-50% wamandla awo okufaka abe amandla ashisayo kunokukhanya okubonakalayo.

Ngaphandle kokuphathwa kokushisa okwanele, amazinga okushisa okuhlangana angeqa imikhawulo yokusebenza ephephile, okuholela ekukhukhuleni kwepharamitha, ukunciphisa isivinini sokushintsha, futhi ekugcineni kube nokwehluleka okuyinhlekelele. Ama-Ceramic PCBs wamandla kagesi ahlinzeka ngendlela eshisayo ebalulekile yokuqeda lokhu kushisa kahle, ukugcinwa kwamazinga okushisa okuhlangana ngaphakathi kwebanga elamukelekayo nokuqinisekisa ukusebenza okungaguquguquki kukho konke ukuphila komkhiqizo.

Izakhiwo Eziyinhloko zama-PCB oCeramic we-Power Electronics kanye nezicelo ze-LED

Ukusebenza okuphezulu kwama-PCB e-ceramic wamandla kagesi kuvela ezintweni ezimbalwa ezibalulekile ezibhekana ngqo nezinselelo ezishisayo nezikagesi ezinhlelweni zamandla aphezulu:

Izinzuzo Zokusebenza Ezishisayo

Ama-substrates e-Aluminium nitride (AlN) aletha ukuguquguquka okushisayo okukhethekile okusondela ku-170 W/m·K, okuwenza abe yinketho ekhethwayo yamamojula anamandla aphezulu lapho ukusabalalisa ukushisa okukhulu kubalulekile. I-Silicon nitride (Si₃N₄) ihlanganisa ukusebenza okuhle kokushisayo namandla avelele emishini kanye nokuqina kokuphuka, okubaluleke kakhulu kuzinhlelo zokusebenza zezimoto nezimboni ezingaphansi kokuhamba ngebhayisikili okushisayo nokushaqeka komshini.

Ukufaniswa kwe-CTE kanye Nokufakwa Kagesi

I-coefficient ephansi yokwanda okushisayo ezintweni zobumba ifana eduze nama-silicon semiconductor chips, ukunciphisa ingcindezi ye-thermomechanical phakathi nohambo lwezinga lokushisa. Lokhu kuhambisana kwe-CTE kunciphisa ukukhathala okuhlangene kwe-solder futhi kuvimbela ukwehluleka kwe-delamination okuvamise ukuhlupha ama-PCB-core wensimbi ngamazinga okunweba angafani. Amandla aphezulu e-dielectric anika amandla ukusebenza okuphephile kuma-voltage aphakeme ngenkathi kugcinwa isikhala esihlangene phakathi kokulandela okungaba khona okuphezulu.

I-Ceramic PCBs ye-LED Lighting Systems

Ama-chips e-LED aletha izinselele ezihlukile zokushisa ngenxa yokukhiqiza kwawo okugxilile kokushisa ezindaweni ezincane zokuhlangana. Ama-LED esimanje anokukhanya okuphezulu aguqula ngaphezu kuka-50% wamandla kagesi okufakwayo abe ukushisa, amazinga okushisa e-junction athinta ngokuqondile ukuphuma kokukhanya, ukuqina kombala, kanye nempilo yonke yokusebenza. Ama-substrates e-FR4 endabuko anikezela nge-thermal conductivity engaphansi kuka-0.5 W/m·K, edala amabhodlela okushisa aqinile.

Ukusebenza Okushisayo kuzinhlelo zokusebenza ze-LED

Ama-Ceramic PCBs wama-electronics amandla abhekana nale mikhawulo ngokunikeza ukuguquguquka okushisayo okufika ngokuphindwe izikhathi ezingu-340 ngaphezu kwe-FR4, okunika amandla ukukhishwa kokushisa okusheshayo kusuka kuma-junctions e-LED kuya kumasinki okushisa angaphandle. Ukusabalalisa ukushisa okuphakeme kunciphisa izinga lokushisa le-junction ngo-30-50°C uma kuqhathaniswa nama-PCB-core wensimbi, okunweba kakhulu ukugcinwa kwe-lumen nokungaguquguquki kombala.

Izizinda Zokusebenza ze-LED

Izizinda zokufaka izicelo ze-ceramic LED substrates zifaka:

• Ukukhanyisa phambili kwezimoto - Amalambu anamandla aphezulu kanye nezinhlelo zokukhanyisa eziguquguqukayo ezidinga ukusebenza okuphezulu okushisayo nokumelana nokudlidliza.
• Amaphaneli wokubonisa wangaphandle - Izikrini ze-LED ezinefomethi enkulu ezisebenza ezindaweni ezishisa kakhulu ezinokushisa kwelanga okuqondile.
• Amasistimu we-UV LED - Imishini yokwelapha kanye nezinhlelo zokuvala inzalo lapho ama-substrates e-AlN avumela ukusebenza kwe-UV enamandla amakhulu.
• Izibani ze-Horticultural grow light - Izinhlelo zokutshalwa kwezitshalo ezisebenza kahle kakhulu ezidinga ukukhishwa okungaguquki kwe-spectral phakathi nenkathi yokusebenza enwetshiwe.

Ama-PCB oCeramic we-Power Electronics namamojula e-IGBT

Amamojula e-IGBT kanye ne-power MOSFET amelela uhlelo lokusebenza oludinga kakhulu ubuchwepheshe be-PCB ye-ceramic, ngobuningi bamandla obusukela ku-watts angamakhulu amaningana kuya kumazinga e-kilowatt kumaphakheji amancane. Kulezi zinhlangano, ama-substrates e-ceramic asebenza imisebenzi emithathu ebalulekile: ukuhlinzeka ngendlela eyinhloko yokuqhuba ukushisa, ukugcina ukufudumala kukagesi phakathi kwamasekethe ane-voltage ephezulu kanye nezindawo zokupholisa ezisekelwe phansi, kanye nokuhlinzeka ngokusekelwa kwemishini kwezinqubo zokubopha i-die attach kanye ne-wire.

I-Silicon Nitride Performance Izinzuzo

I-Silicon nitride ceramic PCB ihamba phambili ezinhlelweni zemojula yamandla ngenxa yokuhlanganiswa kwayo okukhethekile kokusebenza okushisayo, amandla emishini, nokumelana nokushaqeka okushisayo. Izinto ezisetshenziswayo zimelana nokuhamba ngebhayisikili kwamandla ngaphandle kokuthuthukisa ama-microcracks, imodi yokwehluleka evamile kuma-alumina substrates ngaphansi kwama-gradient ashisayo aqinile.

Izicelo Zemojuli Yamandla

Izicelo ezijwayelekile ze-ceramic PCB kuma-electronics zifaka ama-traction inverter ezimoto zikagesi ne-hybrid, amadrayivu ezimoto zezimboni, iziguquli zelanga, ingqalasizinda eshajayo, izinto zikagesi ezingaphazamiseki, nemishini yokushisela. Ama-substrates anika amandla imiklamo yamamojula ahlangene ngokususa izinto ezisetshenziswayo ezishisayo ezimaphakathi nokunciphisa ukumelana nokushisa phakathi kwe-semiconductor junction kanye nesistimu yokupholisa.

Ukuqhathanisa Okubalulekile: I-Ceramic PCB Substrate Selection

Alumina Substrates

Izingxenye ze-Alumina zinikeza ikhambi elingabizi kakhulu lezinhlelo zokusebenza lapho ukushabalaliswa kwamandla kuhlala ngaphansi kwama-50 W/cm² kanti amazinga okushisa okusebenza ahlala ngaphansi kwama-200°C, okwenza zifaneleke kubashayeli be-LED, abaguquli bamandla aphansi, kanye nama-electronics asetshenziswa ngabathengi.

Aluminium Nitride Substrates

I-aluminium nitride iba yinto edingekayo lapho ukuhanjiswa kokushisa kuqhuba umklamo, ikakhulukazi kumamojula wamandla agcwele kakhulu noma kuma-LED acwebezelayo aphezulu lapho izinga lokushisa lokuhlangana kufanele lincishiswe khona. Ukuthuthuka okuphindwe kasikhombisa ekuhanjisweni kokushisa ngaphezu kwe-alumina kuqinisekisa iphrimiyamu yezindleko kuzinhlelo zokusebenza lapho ukuthembeka nokusebenza kubaluleke kakhulu.

I-Silicon Nitride Substrates

I-silicon nitride inikeza ukusebenza kokushisa okungcono kakhulu kune-alumina enezakhiwo ezinhle kakhulu zemishini ezimelana nokuqhekeka ngaphansi kokushaqeka kokushisa kanye nokucindezeleka kwemishini, okwenza kube ukukhetha okuthandwayo kwamamojula wamandla ezimoto nezimboni lapho ukuqina kubaluleke khona.

Ukucatshangelwa kokuklama nokuhlangana kwe-Ceramic PCB

Ukukhiqiza ama-PCB e-ceramic e-electronics kagesi kusebenzisa ubuchwepheshe obubili obuyinhloko bokwenza insimbi: I-Direct Bonded Copper (DBC) kanye ne-Direct Plated Copper (DPC). Ubuchwepheshe be-DBC bubopha ama-foil ethusi amakhulu kuma-substrate e-ceramic ngenqubo yoku-oxidation yokushisa okuphezulu, ngokuvamile kufinyelela ukuqina kwethusi kusuka kuma-micrometer angu-200 kuya kwangu-400 afanele ukusetshenziswa kwamandla kagesi aphezulu.

Ukuphathwa Kwezandiso Ezishisayo

Ukulinganisa okushisayo phakathi kwezinto ezisetshenziswayo kuso sonke isitaki somhlangano kudinga ukunakwa ngokucophelela ngesikhathi sokuklama. Ngenkathi ama-substrates e-ceramic ehambisana eduze ne-silicon chip CTE, izendlalelo zethusi eziboshiwe zethula ukungafani okukhiqiza ingcindezi ye-shear ngesikhathi sokuhamba ngebhayisikili. Abaqambi kufanele balandise ngalokhu kucindezeleka ngokukhetha ugqinsi lwethusi olufanele, ukukhetha okunamathiselwe okubalulekile, kanye nokwenza kahle kwenqubo yokuhlanganisa.

Ukwesekwa Kobunjiniyela Nokuqinisekisa

I-Highleap Electronics ihlinzeka ngokubuyekezwa okuphelele kokuklama kokwenziwa kwamaphrojekthi we-ceramic PCB, ukuhlola imiphumela yokulingisa okushisayo, ukwakheka kwephethini yethusi, nokuhambisana kwenqubo yomhlangano ngaphambi kokwenziwa kwesibonelo. Ukwesekwa kwethu kobunjiniyela kufaka phakathi isiqondiso sokukhethwa kwezinto, ukuqinisekiswa kwe-prototype ngesithombe esishisayo nokuhlola ukwethembeka, kanye nokuthuthukiswa kwenqubo yokukhiqiza ivolumu.

Isiphetho

I-Ceramic PCBs yama-electronics amandla imele ubuchwepheshe obuvumelayo obubalulekile kuzinhlelo zokusebenza zesimanje zamandla aphezulu kanye ne-LED lapho ama-substrates avamile engakwazi ukuhlangabezana nezidingo zokulawula ukushisa. I-thermal conductivity ephakeme kakhulu, ukufakwa kukagesi okuhle kakhulu, namandla aqinile ezinga lokushisa eliphezulu wezinto zobumba kuhumusha ngokuqondile ekuthembekeni okuthuthukisiwe kwesistimu, ukusebenza okuthuthukisiwe, kanye nokuphila okunwetshiwe kokusebenza.

Highleap Electronics Ceramic PCB Amakhono

• Ubuchwepheshe bezinto eziningi - Gcwalisa izixazululo ze-ceramic substrate ezihlanganisa i-alumina, i-aluminium nitride, ne-silicon nitride yezidingo ezihlukahlukene ezishisayo nezomshini.
• I-Metallization ethuthukisiwe - Kokubili ubuchwepheshe be-DBC kanye ne-DPC enogqinsi lwethusi ukusuka kuma-micrometer angama-35 kuye kwangama-400 ukuze kube namandla okuthwala amanje.
• Ukubambisana kwezobunjiniyela - Ukubuyekezwa kwe-DFM, ukuqinisekiswa kokulingisa okushisayo, isiqondiso sokukhetha izinto ezibonakalayo, nokusekelwa kokuhlolwa kokwethembeka kuyo yonke intuthuko.
• Ukukhiqiza umthamo - Ukukhiqizwa okwehlayo kusuka ku-prototype kuye kuvolumu ephezulu enekhwalithi engaguquki nezilawuli zenqubo eziqinile.

Xhumana ne-Highleap Electronics ukuze uxoxe ngokuthi ubuchwepheshe be-PCB be-ceramic bungathuthukisa kanjani ukwakheka kwakho kwe-elekthronikhi enamandla futhi busheshise isikhathi sokuthuthukiswa komkhiqizo wakho ngokusekelwa kwethu okuphelele kokukhiqiza nobunjiniyela.