Izinto Zokuklama Ubuchwepheshe be-DBC Substrate kanye Nezicelo Ze-Power Module

Ama-substrate e-Direct Bonded Copper (DBC) ayi-substrate yamandla asekelwe ku-ceramic aklanyelwe izinhlelo zokusebenza ezidinga amandla aphezulu kagesi, ukuhlukaniswa kukagesi, kanye nokusatshalaliswa kokushisa okuphumelelayo. Lo mhlahlandlela uchaza ukuthi ayini ama-substrate e-DBC, ukuthi akhiqizwa kanjani, ukuthi angena kuphi ekwakhiweni kwama-module kagesi kanye nokusebenza kwe-PCB okuthuthukisiwe, ukuthi aqhathaniswa kanjani ne-AMB/DPC/LTCC/HTCC, nokuthi yini okufanele uyifake ku-RFQ ukuze ugweme ukubambezeleka nokujikeleza kabusha.

Iyini i-DBC Substrate?

I-substrate ye-DBC (Direct Bonded Copper) iyi-substrate yamandla e-ceramic lapho ithusi lihlanganiswa khona ngqo kolunye noma zombili izinhlangothi zepuleti le-ceramic (ngokuvamile i-alumina, i-aluminium nitride, noma i-silicon nitride). Ngokungafani nama-PCB e-organic (isb., i-FR-4) athembele ezinhlelweni ze-resin kanye nama-foil ethusi alaminethiwe, i-DBC idala isixhumi esiqinile se-copper-ceramic esenzelwe ukunciphisa ukumelana nokushisa nokubekezelela ukujikeleza okunzima kokushisa.

Ama-substrate e-DBC ngokuvamile asetshenziswa njengesisekelo sikagesi nesokushisa samamojula kagesi kanye namapulatifomu okushisa anamandla aphezulu—asekela imikhondo yethusi ejiyile, ukuhlukaniswa kwamandla aphezulu, kanye nokusabalala kokushisa okuphumelelayo kusuka kumadivayisi e-semiconductor kuya ku-heatsink noma i-cold plate.

Uma umusha kulobu buchwepheshe, lokhu kubuka konke kwesisekelo sethusi esihlanganisiwe ngqo kuchaza isakhiwo esiyinhloko nokuthi kungani sisetshenziselwa ukuphathwa kokushisa okunamandla aphezulu.

Ama-DBC vs ama-PCB ajwayelekile: Lapho i-DBC ifanelana khona

Ama-substrate e-DBC avame ukuxoxwa ngawo kanye nama-PCB e-ceramic , kodwa aqondwa kangcono njenge-substrate yamandla kunokuba yibhodi lesifunda eliphrintiwe elijwayelekile.

• Ama-PCB avamile (FR-4, high-Tg FR-4, PTFE, njll.) i-excel ekuqondiseni i-dense routing, ukuxhumana kwe-multilayer, kanye nokusebenza kahle kwezindleko ze-electronics yesiginali/yokulawula.
• Izingxenye ze-DBC i-excellent ekuphathweni kokushisa kanye nobuningi bamandla aphezulu, ikakhulukazi lapho kudingeka khona ukuhlukaniswa kwethusi elijiyile kanye ne-ceramic.

Emikhiqizweni eminingi, i-DBC ihlanganiswe ohlelweni olubanzi: i-PCB yokulawula ilawula ukushayela kwe-logic kanye nesango, kuyilapho isisekelo se-DBC sisekela amadivayisi okushintsha amandla aphezulu (amamojula e-IGBTs/MOSFETs/SiC/GaN) kanye nezindlela zamandla kagesi. Ukuze uthole ukwakhiwa kwamabhodi avamile kanye nama-stackup, bheka izinsizakalo zethu zokukhiqiza i-PCB.

Indlela Ama-DBC Substrate Akhiqizwa Ngayo

Nakuba imininingwane yenqubo ihluka ngomkhiqizi, ukukhiqizwa kwe-DBC ngokuvamile kulandela lezi zigaba:

1. Ukulungiswa kwe-ceramic: Amapuleti e-ceramic ayakhethwa, ahlanzwe, futhi alungiselelwe ukuqinisekisa isimo sobuso esivumelanayo kanye nokuba yisicaba.
2. Ukubopha ngethusi: Amashidi/ama-foil ethusi ahlanganiswa ne-ceramic kusetshenziswa inqubo yokushisa okuphezulu ngaphansi komoya olawulwayo. Umgomo uwukuxhumana okuzinzile kwe-copper-ceramic okunamandla aphezulu okubopha kanye nokumelana okuphansi kokushisa.
3. Ukwenza iphethini: ithusi lihlelwe nge-photolithography kanye nokuqopha ukuze kwakhiwe izindlela zamanje, ama-pad, kanye nezindawo zokuhlukanisa.
4. Ukuqeda uphahla/ubuso: Ukuqeda kusetshenziswa ukuze kuhambisane nezidingo zokuhlanganisa (ukubopha ngocingo, ukugoqa, ukuthungela, njll.).
5. Ukuhlolwa kokugcina nokuhlolwa: ukuhlolwa kobukhulu, ukuhlolwa okubonakalayo, ukuhlolwa kokunamathela (njengoba kuchaziwe), ukuhlolwa kukagesi (njengoba kusebenza), kanye nokulethwa kwemibhalo/ukulandelelwa.

Ngenxa yokuthi i-DBC ihilela ukuphathwa kwe-ceramic kanye nethusi elijiyile, ukukhiqizwa kuthonywa kakhulu ukujiya kwethusi, i-geometry yesici, izidingo zokuhlukaniswa, kanye nokulawula ukuthamba/ukugoba. Ukuhlaziywa okuningiliziwe kwesinyathelo ngesinyathelo kuyatholakala kumhlahlandlela wethu wenqubo yokukhiqiza ye-DBC.

Izicelo Ezijwayelekile Ku-Power Electronics

Ama-substrate e-DBC asetshenziswa kabanzi lapho ukusebenza kokushisa kanye nokuhlukaniswa kumele kugcinwe isikhathi eside ngaphansi kokujikeleza kwamandla aphezulu:

• Amamojula wamandla we-IGBT kanye ne-MOSFET: ama-motor drive, i-traction, ama-inverter ezimboni, kanye nokuguqulwa kwamandla.
• Ama-elekthronikhi kagesi e-EV/HEV: ama-inverter okudonsa, amashaja asebhodini (i-OBC), ama-converter e-DC-DC.
• Abaguquli bamandla avuselelekayo: ama-inverter elanga, ama-converter amandla omoya.
• Amapulatifomu e-LED anamandla aphezulu kanye ne-laser: Ama-LED ahlanganisiwe ane-chip-on-board (COB), amamojula okukhanya okuphezulu.
• I-Aerospace nokuzivikela: izindawo ezishisayo ezinzima, ukudlidliza, izidingo zokuphila isikhathi eside emsebenzini.
• Imishini kagesi yezimboni kanye nemishini yokushisela: izindlela zamandla aphezulu kanye namapulatifomu okushisa aqinile.

Izinzuzo Eziyinhloko Nemikhawulo Esebenzayo

Imikhawulo yokuhlela: I-DBC ngokuvamile ayisetshenziselwa ukuqondisa i-high-layer-count, ukuxhumana kwedijithali okuqondile, noma imiklamo yesignali eyinkimbinkimbi ye-multilayer. Iyipulatifomu yamandla/yokushisa—ehambisana kahle nama-PCB ahlukene okulawula uma kudingeka.

Izinketho ze-DBC Ceramic: Al₂O₃ vs AlN vs Si₃N₄

Izinto eziyisisekelo ze-ceramic zingenye yezinto ezibaluleke kakhulu ekusebenzeni kanye nezindleko ekukhetheni i-DBC. Ukuze uthole ukuqhathanisa okujulile kwezinto ezigxile ezintweni, bheka i-DBC ceramic substrates.

I-Alumina (Al₂O₃)

• Amandla: uhlelo lokukhiqiza olungabizi kakhulu, olutholakala kabanzi, noluvuthiwe.
• Ukusetshenziswa okujwayelekile: amamojula amaningi wamandla ajwayelekile lapho ukusebenza kokushisa okukhulu kungeyona into evimbelayo.
• Ezohwebo: ukuhanjiswa kokushisa okuphansi uma kuqhathaniswa ne-AlN, ngakho-ke ukwenyuka kwezinga lokushisa okuphezulu kungenzeka ngobuningi bamandla aphezulu kakhulu.

I-Aluminium Nitride (AlN)

• Amandla: ukuhanjiswa kokushisa okuphezulu; kuyasiza lapho izithiyo zokushisa zikhawulela ukuminyana kwamandla.
• Ukusetshenziswa okujwayelekile: Ama-inverter okudonsa ama-EV, amamojula wamandla aphezulu, amapulatifomu okushisa adinga kakhulu.
• Ezohwebo: izindleko zezinto zokwakha eziphakeme kanye nezidingo zokulawula inqubo eziqinile uma kuqhathaniswa ne-Al₂O₃.

I-Silicon Nitride (Si₃N₄)

• Amandla: ukuqina okuhle kakhulu kwemishini kanye nokusebenza kahle kokujikeleza kokushisa; ngokuvamile kuyathandwa ezindaweni zokudonsa nokunyakaza ezinokwethenjelwa kakhulu.
• Ukusetshenziswa okujwayelekile: izinhlelo zokudonsa, izitimela, amamojula ezimoto lapho impilo ende yokugibela ibhayisikili ibaluleke khona.
• Ezohwebo: ngokuvamile izindleko ziphakeme kune-Al₂O₃; ukukhetha kuqhutshwa izidingo zokuthembeka nokuqina.

Ubukhulu Bethusi, Ukwenziwa Kwemidwebo, kanye Nezithiyo Zokuklama

I-DBC ivame ukusebenzisa ithusi elijiyile kune-PCB ejwayelekile. Lokhu kwenza kube lula ukuphatha amandla aphezulu kodwa kwethula imingcele ebalulekile yokwenza amaphethini:

• Umugqa/isikhala esincane: Ithusi elijiyile ngokuvamile lidinga iminonjana ebanzi kanye nesikhala esikhulu ngenxa yezici zokugoba.
• Incazelo yomphetho: Ukuqopha ithusi elisindayo kungadala amaphrofayili angaphansi kokusika kanye nodonga oluseceleni; ama-geometri ephedi kufanele acabangele ukubekezelelana kokukhiqiza.
• Ingcindezi yokushisa: Izindawo ezinkulu zethusi zingaba nomthelela ekucindezelekeni ngesikhathi sokujikeleza kokushisa; ukulingana (ibhalansi yethusi ephezulu/engezansi) kunganciphisa ukugoba kanye nokuhlushwa kokucindezeleka.
• Umklamo wokuhlukaniswa: Ama-voltage target aqhuba izidingo zokususwa kanye nokukhukhuleka. Amakhona abukhali kanye nezikhala ezincane kungandisa ingozi yokukhishwa kwengxenye ezindaweni ezinama-voltage aphezulu.

Uhlu lokuhlola olusebenzayo lwe-DFM (isigaba sokwakheka)

• Chaza I-voltage yokusebenza futhi ukumelana ne-voltage ama-targets kusenesikhathi (kulandela imithetho yokususa/yokukhumula).
• Cacisa ukujiya kwethusi futhi uqinisekise umugqa/isikhala esingenziwa nomhlinzeki ngaphambi kokuhambisa okokugcina.
• Gwema ukungalingani okukhulu kwethusi okungadingekile phakathi kwezingqimba eziphezulu nezingezansi.
• Sebenzisa ama-radii amakhulu futhi ugweme amakhona angaphakathi abukhali ezindaweni ezine-voltage ephezulu.

Ukuqedwa Komphezulu Nokuhambisana Komhlangano

Ama-substrate e-DBC avame ukusebenza njengesisekelo sezindlela zokuxhumanisa ze-semiconductor yamandla. Ukukhetha ukuqeda kwendawo kufanele kuhambisane nenqubo yokuhlanganisa engezansi.

Kumamojula anokwethenjelwa okuphezulu, ukulawula ukuhlanzeka, indlela yokupakisha, kanye nezimo zokugcina kungabaluleka njengokuqedwa ngokwako.

I-DBC vs AMB vs DPC vs LTCC/HTCC

I-DBC ingenye yezindlela zobuchwepheshe eziningana ezisekelwe ku-ceramic. Ukukhetha kufanele kusekelwe ezidingweni zamanje, zokushisa, ukulungiswa kwezici, kanye nezinhloso zokuthembeka.

Indlela Yokukhetha I-DBC Substrate Efanele

Ukukhethwa kwe-DBC kuyisinqumo esiguquguqukayo. Indlela ehlelekile iyasiza ekunciphiseni ubungozi bokuklama kabusha kanye nokufaneleka kwesivinini. Uma uhlola abathengisi, ukusebenza nomkhiqizi we-DBC substrate okhethekile kungasiza ekuvumelaniseni ukukhetha kwezinto ezibonakalayo, imikhawulo yephethini, kanye nezidingo zokuhlola ekuqaleni kwephrojekthi.

Isinyathelo 1: Chaza imigomo yokushisa

• Ukulahlekelwa amandla ngedivayisi ngayinye kanye nokwenyuka kwezinga lokushisa okuvunyelwe
• Indlela yokupholisa (i-heatsink, ipuleti elibandayo, i-convection ephoqelelwe)
• Isu le-interface (i-TIM, ukucushwa kwe-baseplate)

Isinyathelo 2: Chaza izidingo zokuhlukanisa ugesi

• I-voltage yokusebenza, ukukhuphuka/ukumelana nezidingo, umkhawulo wokuphepha
• Izidingo zokususa/zokweqa ngokusekelwe endaweni kanye nezindinganiso

Isinyathelo 3: Chaza iphrofayela yamanje

• Ugesi oqhubekayo kanye nogesi ophakeme
• Ukujikeleza kwe-thermal kanye nokulindela ukujikeleza kwamandla

Isinyathelo 4: Khetha i-ceramic ngokusekelwe emikhawulweni

• Izindleko ziyashesha: I-Al₂O₃ ivame ukulingana
• Kunqunyelwe ukushisa: I-AlN ivame ukukhethwa
• Ukuthembeka/ukuqina kunqunyelwe: I-Si₃N₄ ivame ukubhekwa njenge-

Isinyathelo 5: Qondanisa ukuqeda nenqubo yokuhlanganisa

Qinisekisa ukuthi isakhiwo sakho esingezansi sisebenzisa i-wire bonding, i-solder, i-sinter, noma ezinye izindlela zokuxhuma, bese uqhathanisa izidingo zokuqeda nokuhlanzeka ngokufanele.

I-Prototype kuya ku-Volume: Ukuthembeka, Ukuhlolwa, kanye nokulawulwa kwekhwalithi

Ukusuka ekukhiqizweni kweprototype kuya ekukhiqizweni kwevolumu kudinga ukuvala iziguquguquko ezithinta kakhulu isivuno kanye nokuthembeka. Uma udinga ukwakheka kwenani elincane ukuze kuqinisekiswe ngaphambi kokuma, indlela yeprototype ye-DBC substrate ezinikele isiza ukuqinisekisa ukukhiqizwa kanye nokulindela ukuhlolwa ngaphambi kokuzibophezela kwesilinganiso sokukhiqiza.

Izinto zokuthembeka zokulawula

• Ubuqotho besibopho: isikhombikubona esiqinile sethusi-sekaramiki kanye nokulawula inqubo okuqhubekayo
• Ukuthamba/ukugoba: ikhwalithi yokunamathisela kanye nokuhlanganiswa kwemodyuli
• Umklamo wokujikeleza kwe-thermal: i-geometry yethusi, ukulingana, kanye nezindawo ezishisayo zokugxilisa ingqondo ekucindezelekeni
• Isimo sobuso: ukulawulwa kwe-oxidation kanye nokuhlanzeka kwezinqubo zokubopha/zokuhlanganisa

Izinketho zokuhlola ezijwayelekile kanye nokuhlola (njengoba kuchaziwe)

• Ukuhlola okubonakalayo: amaphutha ebusweni, ikhwalithi yomphetho, ubuqotho bephethini
• Ukuhlolwa kobukhulu: uhlaka, ukujiya, izici ezibalulekile
• Ukuhlolwa kukagesi: ukuqhubeka/ukuhlukaniswa lapho kusebenza khona kumasekethe anephethini
• Isigaba esiphambene (uma kudingeka): ukuqinisekiswa kwesakhiwo kanye nezici zesikhombimsebenzisi sezindawo zokufaneleka
• Amadokhumenti: ukulandelelwa kwezindawo kanye namarekhodi okuhlola ahambisana nezidingo zomthengi

Uhlu Lokuhlola lwe-RFQ: Okufanele Uluhlinzeke Ukuze Uthole Izingcaphuno Ezisheshayo Nezinembile

Izingcaphuno ze-DBC ziyahlukahluka kakhulu ngoba ukwakheka kanye nokukhetha kwezinto ezibonakalayo kuqhuba kokubili ukukhiqizwa kanye nezindleko. Ukunikeza iphakheji ephelele ye-RFQ kuvimbela ukuphindaphinda nokuphindaphinda futhi kunciphisa amaphutha okucaphuna. Uma iphrojekthi yakho ihlanganisa izisekelo ze-ceramic namabhodi avamile, ukubuka konke kwethu kokukhiqiza i-PCB ye-ceramic kungakusiza ukuthi uvumelanise okulindelwe yinqubo kuzo zonke izinhlobo zokwakha.

Amafayela adingekayo

• Amafayela ephethini (i-Gerber noma okulinganayo) wezendlalelo zethusi
• Uhlaka lwemishini (olukhethwa yi-DXF) kanye namanothi okudweba
• Noma yiziphi izindawo ezikhethekile (ukugcina ngaphandle, imigodi yokufaka, izindawo ezibalulekile zokuvula)

Imininingwane edingekayo

• Izinto zobumba (Al₂O₃ / AlN / Si₃N₄) kanye nobukhulu
• Ubukhulu bethusi (phezulu/phansi; chaza ukuthi buhlukile yini)
• Imigqa/isikhala esincane kanye nezinhloso zokuvula ezincane (noma isidingo se-voltage ukuze kutholakale ukuvulwa)
• Isidingo sokuqeda umphezulu (nendlela yokuhlanganisa ehlosiwe)

Izicelo zezentengiselwano kanye nokuhlela

• Inani lesibonelo kanye nomthamo wonyaka olindelekile
• Isigaba sokwakha esiqondiwe (uhlobo lobunjiniyela / umshayeli wokuhlola / ukukhiqizwa ngobuningi)
• Izidingo zokuhlola/zokuhlola kanye nezidingo zemibhalo
• Iwindi lokulethwa okuqondiwe kanye nezinyathelo ezibalulekile

Cela Isilinganiso Se-DBC Substrate

Imibuzo Evame Ukubuzwa

1) Isetshenziselwani i-DBC substrate?

Ama-substrate e-DBC asetshenziswa njengezingxenyekazi zokuhlukanisa ukushisa kanye nogesi kuma-electronics kagesi. Ngokuvamile ahlala ngaphansi kwama-semiconductor kagesi kumamojula, adlulisela ukushisa ku-heatsink ngenkathi egcina ukuhlukaniswa kukagesi futhi esekela izindlela zamandla aphezulu.

2) Ingabe i-DBC ifana ne-PCB yobumba?

I-DBC uhlobo lwe-substrate yamandla esekelwe ku-ceramic. Ingahlelwa njengesekethe, kodwa isetshenziselwa kakhulu ukusebenza kwamandla/ukushisa kunokusebenzisa umzila oyinkimbinkimbi wezingqimba eziningi otholakala kuma-PCB avamile.

3) Ngingakhetha kanjani phakathi kwe-Al₂O₃ ne-AlN ye-DBC?

Khetha i-Al₂O₃ uma izindleko nokutholakala kuyizinto eziyinhloko kanti izidingo zokushisa ziphakathi. Khetha i-AlN uma ukushabalaliswa kokushisa kuyisici esivimbelayo futhi kudingeka ukuhanjiswa kokushisa okuphezulu ukuze kuncishiswe izinga lokushisa lokuhlangana.

4) I-Si₃N₄ ikhethwa nini?

I-Si₃N₄ ivame ukucatshangelwa lapho ukuqina komshini kanye nokuphila isikhathi eside kokujikeleza kokushisa kubalulekile—njengokubambelela kanye nezimo ezisindayo—lapho ukuqina nokuthembeka kuqhuba khona umklamo.

5) Yiluphi ulwazi oluthinta kakhulu isikhathi sokulethwa kwe-DBC kanye nezindleko?

Izinto ezibalulekile ezibangela lokhu kuhlanganisa uhlobo lwe-ceramic kanye nobukhulu, ukujiya kwethusi, i-geometry yesici (umugqa/isikhala), ukuqeda ubuso, izidingo zokuhlola/imibhalo, kanye nobuningi. Ama-voltage/ukuhlukaniswa okucacile nawo athinta imikhawulo yesakhiwo kanye nokwehla.

6) Ingabe i-DBC ingasekela ukubopha kwentambo kanye nokunamathisela i-die?

Yebo, kodwa ukuhambisana kuncike ekukhetheni ukuqeda, isimo sobuso, kanye nokulawula ukuhlanzeka. Kubalulekile ukucacisa izindlela zakho zokuxhuma nokuxhuma kusenesikhathi ukuze ukuqeda kanye nokulawula inqubo kuhambisane nezidingo zakho zokuhlanganisa.

7) I-DBC iqhathaniswa kanjani ne-AMB?

I-DBC isetshenziswa kabanzi futhi ingabizi kakhulu ezinhlelweni eziningi zamandla. I-AMB ingakhethwa ngenxa yamandla aphezulu ebhondi kanye nezidingo ezithile zokuthembeka okuphezulu, ngokuvamile ngezindleko eziphakeme kanye nezici zenqubo ezahlukene.

8) Yini okufanele ngiyithumele ku-RFQ ukuze ngigweme ukubambezeleka?

Thumela amafayela ephethini yethusi, uhlaka lwe-DXF, uhlobo/ukujiya kwe-ceramic, ukujiya kwethusi, imfuneko yokuqeda, imigomo ye-voltage/yokuhlukanisa (noma ukuhlukaniswa okuncane), inani le-prototype kanye nevolumu elindelekile, kanye nanoma yiziphi izidingo zokuhlola/zemibhalo.