Izimpumputhe Nokungcwatshwa Nge-PCB Quote Guide yamaBhodi e-HDI

I-blind infilled nge-PCB quote idinga imininingwane yobuchwepheshe kakhulu kune-standard through-hole board quote ngoba inqubo yokukhiqiza ihilela imijikelezo eminingi ye-lamination elandelanayo, i-laser enembile noma ukubhoboza ngomshini ezigabeni ezahlukene, kanye nezidingo zokubhalisa ungqimba oluyinkimbinkimbi. Ngokungafani nama-PCB avamile lapho isethi yepharamitha ye-quote eyodwa yanele, i-blind and infilled ngamabhodi idinga ulwazi oluqondile lwe-stackup olufaka phakathi ukuthi yiziphi izingqimba ngayinye exhumanisa uhlobo, indlela yokubhoboza yesigaba ngasinye se-via, ubukhulu bemigodi eqediwe, imikhawulo yesilinganiso, nokuthi ngabe kusetshenziswa ukucushwa okuhleliwe noma okuhlanganisiwe. Ukuqonda ukuthi yini eqhuba izindleko - nokuthi yiluphi ulwazi umenzi aludingayo ukuze anikeze i-quote enembile - kuqinisekisa ukuthi uthola amanani abonisa izidingo zangempela zokukhiqiza kunezilinganiso ezigcinayo ezinama-expectation margins amakhulu.

Thola Impumputhe Yakho Ingcwatshwe Ngesilinganiso Se-PCB Manje

1. Ukuqonda Izimpumputhe Nokungcwatshwa Ngobuchwepheshe: Kungani Ubunzima Bezisho Bukhula

1.1 Umehluko Oyisisekelo Othinta Isilinganiso

Ku-PCB evamile enezimbobo ezidlulayo kuphela, umenzi ubhoboza yonke inqwaba ngemva kokubhoboza kokugcina emsebenzini wokubhoboza owodwa. Imodeli yezindleko ilula: indawo yebhodi × inani lezendlalelo × isisindo sethusi + izindleko zokubhoboza (imigodi × ubukhulu besici) + i-plating + ukuqeda ubuso. Ukunemba kwesilinganiso kuphezulu ngoba iziguquguquko zenqubo zivinjelwe kahle.

Amabhodi afihliwe futhi angcwatshwe ngamabhodi ashintsha kakhulu lo modeli. Izendlalelo ezihlanganisiwe ezingcwatshwe nge-3-6 ebhodini elinezingqimba ezingu-8 kumele zibholwe ku-sub-composite ye-L3-L6 ngaphambi kokuba leyo ngxenye encane iboshwe ngamabili ezingqimba zangaphandle. I-blind via esuka ku-L1 iye ku-L4 kumele ibholwe ngemva kokuba izendlalelo zangaphandle zingcwatshwe nge-laminate kodwa ayikwazi ukungena ngale kwe-L4. Lokhu kudala inqubo yokwakha elandelanayo:

• Isiteji 1: Yenza ama-cores wezendlalelo zangaphakathi ngama-via angcwatshwe
• Isiteji 2: Ama-cores e-Laminate ane-prepreg yokwakha ama-sub-assemblies
• Isiteji 3: Drill ama-vias angaboniyo ezinhlanganisweni ezincane (nge-laser noma ngomshini)
• Isiteji 4: Ama-vias angaboni epuleti
• Isiteji 5: Ama-sub-assembly e-Laminate aye ezingqimbeni zangaphandle
• Isiteji 6: Drill imigodi edlulayo (uma ikhona) ngokusebenzisa inqwaba egcwele
• Isiteji 7: Ukuqinisekiswa kokulawulwa kokuphazamiseka kanye nokuhlolwa kukagesi

Isigaba ngasinye sethula izindleko ezithile zenqubo, isivuno, kanye nesikhathi sokuhola. Umenzi akakwazi ukunikeza ikhotheshini enembile ngaphandle kokwazi uhlelo oluqondile lokuxhumana ngoba i-layer pair ngayinye egqitshwe ngesendlalelo idinga umjikelezo wokubhoboza noweplati ohlukile, futhi i-blind via configuration ngayinye inquma ukuthi ukubhoboza nge-laser (okubizayo, okusheshayo, ububanzi obuncane) noma ukubhoboza ngomshini (izindleko eziphansi, ububanzi obukhulu, imikhawulo yokujula) kungenzeka.

1.2 Ukuhlukaniswa kwe-HDI kanye Nemiphumela Yesilinganiso

Izinga le-IPC-2226 lichaza amazinga obunzima be-HDI:

Uma ucela ikhotheshini, kufanele ucacise uhlobo lwe-HDI noma unikeze ithebula eliphelele lokuxhumana. Isicelo esingacacile se-“HDI enezingqimba ezingu-8 ene-blind vias” singachaza ibhodi yohlobo I (izindleko eziphakathi) noma ibhodi yohlobo VI (izindleko eziphakeme ezingu-4 ×). Umenzi akanakucaphuna ngokunembile ngaphandle kwalolu hlobo.

1.3 Kungani Intengo Ejwayelekile “Ngesikwele Sesentimitha” Ingasebenzi Kwabangaboni Abangcwatshwe Ngamabhodi

Izingcaphuno ezijwayelekile ze-PCB zivame ukusebenzisa amafomula alula: intengo eyisisekelo nge-intshi yesikwele × i-multiplier yokubala ungqimba × isici sesaphulelo sobuningi. Le ndlela ayiphumeleli uma kufihlwe/kungcwatshwe ngamabhodi ngoba:

• Izindleko zibusa ngokubala: Ibhodi elingu-50×50 mm elinama-vias angu-200 abholwe nge-laser libiza ngaphezu kwebhodi elingu-100×100 mm elinama-vias angu-50 angaboni, naphezu kokuba nendawo iyingxenye eyodwa kwezine.
• Imijikelezo ye-lamination ikala ngendlela engaqondile: Ukusuka emijikelezweni emibili ye-lamination (Uhlobo I) kuya kwemijikelezo emi-4 (Uhlobo III) akuphindi kabili izindleko - kwandisa izindleko ngo-2.5–3× ngenxa yokuphindaphinda kwesivuno kanye nesikhathi senqubo.
• Indlela yokubhoboza inquma isakhiwo sezindleko: Ukubhola nge-laser kunezindleko zokusetha eziphezulu kodwa kunezindleko eziphansi ngomgodi ngamunye; ukubhola ngomshini kunezindleko zokusetha eziphansi kodwa kunezindleko eziphezulu ngomgodi ngamunye ngenxa yokuguguleka kwamathuluzi kanye nesikhathi sokujikeleza.

Impumputhe enenjongo efihliwe ngesilinganiso se-PCB kumele iqondene nomsebenzi, ibalwe kusukela ku-geometry yangempela ye-stackup kanye nezidingo zokuxhumanisa.

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2. Yiluphi ulwazi oludingekayo ukuze uthole umuntu ongaboni kahle ongcwatshwe ngesilinganiso se-PCB?

2.1 Idatha Yobuchwepheshe Ebalulekile

Ulwazi oludingekayo okungenani ukuze kube nokunemba kwesilinganiso:

• Ukuqoqwa okuphelele: Inani lezingqimba, izisindo zethusi ngengqimba ngayinye, ubukhulu be-dielectric phakathi kwezingqimba, uhlobo lwezinto (i-FR4 ejwayelekile, i-Tg ephezulu, i-halogen-free, noma izinto ezilawulwayo ze-Dk)
• Ngethebula lokuxhumana: Ngohlobo ngalunye lwe-via (imbobo edlulayo, i-blind L1-L3, i-blind L8-L6, i-billed L3-L5, njll.), chaza inani, usayizi wembobo oqediwe, kanye nosayizi wephedi
• Indlela yokubhoboza ekhethwayo: I-laser, mechanical, noma "ukukhetha komkhiqizi ngokusekelwe ekuthuthukisweni kwezindleko"
• Izidingo zokugcwalisa: Akukho, kufakwe i-resin, kugcwele ithusi, noma kunesivalo
• Imikhawulo yesilinganiso sokubukeka: Isilinganiso esiphezulu sokujula nobubanzi ongasamukela (sithinta ukukhiqizwa kanye nokukhiqiza)
• Umkhondo/isikhala esincane: Okubaluleke kakhulu ezingqimbeni zangaphandle lapho ama-blind via pads kufanele alingane khona phakathi kwemigqa
• Ekupheleni kwendawo: I-ENIG, isiliva lokucwiliswa, i-OSP, noma igolide eliqinile (kuthinta ukuthembeka kwephedi ngokungaboni)
• Ubuningi: Uhlobo lwesibonelo (5–10), umshayeli wendiza (50–100), ukukhiqiza (500+), nokuthi ngabe ulindele yini ukuthi ama-oda aphindaphindwayo
• Ikilasi lekhwalithi: I-IPC Class 2 noma i-Class 3 (I-Class 3 idinga ukuhlolwa kwe-X-ray okungu-100% kwama-blind vias, okwengeza izindleko ezinkulu)

2.2 Ulwazi Oluthinta Kakhulu Izindleko Kodwa Oluvame Ukushiywa Ngaphandle

• Ama-via ahlanganisiwe vs. ahlanganisiwe: Ama-via angaboni kahle ahlanganisiwe (lapho i-via ku-L1-L2 iqondanisa khona ngqo ngenhla kwe-via ku-L3-L4) adinga ngokugcwalisa kanye nokuhlelwa phakathi kwezigaba ze-lamination, okwengeza u-$0.50–$2.00 nge-via ngayinye. Ama-via ahlanganisiwe (ahlukaniswe ngo-≥0.3 mm) agwema le ndleko.
• Izidingo ze-in-pad: Uma ama-vias kufanele angene ngaphakathi kwama-pads e-BGA noma e-QFN, adinga ukugcwaliswa kwethusi kanye nokuhlelwa kabusha — engeza u-$0.20–$0.80 nge-vias ngayinye kuye ngobubanzi.
• Ukubhoboza emuva emigodini edlulayo: Ngokuvamile kuchazwe ukuthi kususwe ngama-stubs kumasignali esivinini esikhulu. Imbobo ngayinye ebholwe ngemuva ingeza u-$0.005–$0.015 kusilinganiso.
• Ukujiya kweBhodi: Uma ubukhulu bebhodi eliphelele buchazwe njengemfuneko (isb., 1.0 mm ± 0.1 mm), lokhu kuvimbela ukukhethwa kwe-dielectric futhi kungaphoqa ama-cores amancane, okuthinta izindleko kanye nokukhiqizwa.
• Ukulawulwa kwe-impedance: Ukulawulwa kwe-impedance ezingqimbeni zangaphakathi ezixhunywe yi-vias ezingcwatshwe kudinga ukulingisa ukulayisha kwe-vias okunamandla — abanye abakhiqizi bayakhokhisa ngalo msebenzi wobunjiniyela

2.3 Ulwazi Ongalukhetha Oluvumela Ukuthuthukiswa Kwezindleko Ku-Quote

Uma unikeza okulandelayo, umenzi anganikeza ezinye izindlela ezingabizi kakhulu:

• Ukuvumelana nezimo zedizayini: “Ingamukela ukwehluka okungu-±10% ekujikeni kwebhodi eliqediwe” noma “Ububanzi obuphakathi kungaba ngu-0.15–0.25 mm, okuthandwa ngumklami kwakuyi-0.20 mm kodwa akubalulekile” kunikeza umenzi ithuba lokuthuthukisa ukusetshenziswa kwezinto.
• Isibikezelo sevolumu: "Isibonelo manje, 500/ngenyanga ku-Q3" sivumela umenzi ukuthi aphakamise amasu okunciphisa imali ye-NRE noma ukutshalwa kwezimali kwamathuluzi okunciphisa izindleko ngeyunithi ngayinye ngobuningi
• Ukuguquguquka kwesikhathi sokuhola: “Isibonelo siyadingeka ezinsukwini eziyi-7, kodwa ama-oda okukhiqiza angaba isikhathi sokuhola sezinsuku eziyi-15” kuvumela umenzi ukuthi ahlanganise ama-oda akho okukhiqiza neminye imisebenzi, okunciphisa izindleko zokusetha
• Izidingo zokuhlola: Uma unekhono lokuhlola ugesi ngaphakathi endlini, ungakhetha ukuhlolwa ngokubona kuphela endlini ye-PCB, unciphise into yomugqa wokuhlola

3. Izingxenye Zesilinganiso: Ukuhlanekezela Isakhiwo Sezindleko

3.1 Ukwahlukaniswa Kwezinto Eziqondile Zempumputhe Ejwayelekile Engcwatshwe Ngesilinganiso Se-PCB

Ukuqonda okubalulekile: ku-Hlobo I HDI, ukubhoboza kanye nokufaka i-lamination ndawonye kumele u-23-37% wezindleko. Ku-Hlobo III, kumele u-35-52%. Yingakho ngokubala kanye nobunzima bokufaka i-lamination bubusa ukulinganisa izindleko.

3.2 Izindleko Ezifihliwe Ezivela Ezicaphunweni Kodwa Ezingachazwa Njalo

• Isengezo sokubekezelela ukubhaliswa: Izimpumputhe/ezigqitshwe ngamabhodi zidinga ukubhaliswa okuqinile kwesendlalelo kuya kwesendlalelo (± 0.075 mm vs. ± 0.15 mm kumabhodi ajwayelekile). Abakhiqizi bafeza lokhu ngezinhlelo zokubhalisa ukubhoboza nge-X-ray, ezifaka inkokhelo yephaneli ngayinye engu-$2–$8 kuye ngenani lesendlalelo.
• Ukuhlaziywa kwesigaba esincane: Kumabhodi e-first article noma e-Class 3, umenzi angenza ukuhlukaniswa okubhubhisayo kwama-blind vias ukuqinisekisa ikhwalithi ye-barrel plating. Lokhu kubiza u-$50–$150 ngesampula ngayinye futhi ngezinye izikhathi kufakwa ku-NRE, ngezinye izikhathi njengento ehlukile yomugqa.
• Ukumodela kwe-Impedance: Ama-vias angcwatshwe adala ukungaqhubeki emikhondweni ye-impedance elawulwayo. Abakhiqizi abanamakhono athuthukile e-DFM bamodela ukulayisha kwe-vias futhi balungise ububanzi be-trace ngaphambi nangemuva kwe-vias ukuze balondoloze i-impedance. Lo msebenzi wobunjiniyela ubiza u-$100–$500 kuye ngobunzima.
• I-premium yesikhathi sokucindezela i-lamination: I-lamination enezigaba eziningi ibopha umthamo wokucindezela. Ngesikhathi sesikhathi esiphezulu, abakhiqizi bangakhokhisa "i-premium yomthamo" engu-5-15% ngamabhodi adinga imijikelezo engaphezu kwemibili ye-lamination.

3.3 Intengo Yevolumu kanye Nesikhathi Sokusebenza Kwesilinganiso

Izingcaphuno ze-PCB ezifihliwe zisebenza izinsuku ezingama-30-60 ngenxa yokuguquguquka kwentengo yezinto ezibonakalayo kanye nokwabiwa kwamandla okucindezela. Ukwephulwa kwentengo ngokuvamile kwenzeka ku:

• Izingcezu ezingu-5–10 (uhlobo lwesibonelo): I-NRE ilayishwe ngokugcwele, akukho saphulelo sevolumu yezinto ezibonakalayo
• Izingcezu eziyi-25–50: I-NRE incishisiwe kancane, ukusetshenziswa kwephaneli kuyathuthuka
• Izingcezu eziyi-100–300: I-NRE ayinakwa ngeyunithi ngayinye, ukusetshenziswa kwephaneli ephelele, amanani entengo yezinto ezibonakalayo aqala
• Izingcezu ezingaphezu kuka-500: Ukuthuthukiswa kwenqubo (ukuhlanganisa amaphaneli amaningi ngomjikelezo ngamunye we-lamination), ukusebenzisa amathuluzi azinikele, izindleko eziphansi kakhulu ngeyunithi ngayinye

Kuma-oda aphindaphindwayo, abakhiqizi bavame ukunikeza amanani “e-blanket PO” lapho i-NRE ikhokhwa kanye bese wonke ama-oda alandelayo zingakapheli izinyanga eziyi-12 athola amanani okukhiqiza ngaphandle kokucaphuna kabusha.

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4. Ukucushwa kwe-HDI Stackup kanye nomthelela wazo emananini

4.1 Umehluko Wezindleko Zokuqoqwa Okulinganayo vs. Okungalingani

Kulula ukukhiqiza i-stackup elinganayo (isakhiwo sesendlalelo esifanayo phezulu nangaphansi) ngoba:

• Ukucindezeleka kwe-lamination kuyalinganisela (kunciphisa ingozi ye-warpage)
• Izinhlelo zokubhoboza zingasebenzisa ukulingana kwesibuko (kunciphisa isikhathi sokusetha)
• Zombili izinhlangothi zingabelana nge-blind efanayo ngokusetha ukubhoboza

I-stackup engalingani (isb., ama-vias angaboni ohlangothini oluphezulu kuphela, awekho ama-vias angaboni phansi) isindisa izindleko zokubhoboza nge-laser ohlangothini olungezansi kodwa iletha ingozi ye-warpage, edinga isikhathi esengeziwe sokucindezela i-lamination kanye nethusi elikhudlwana ohlangothini olungeyona i-via ukuze kulinganiswe ukucindezeleka. Umehluko wezindleko uvame ukuba phezulu ngo-5-10% kuma-stackup angalingani emabhodini anezingqimba ezine noma ezinezingqimba eziyisithupha, awanakwa emabhodini anezingqimba ezingu-10+ lapho ubunzima be-stackup obukhona bubusa khona.

4.2 Amasu Okwakha Ngokulandelana kanye Nemiphumela Yezingcaphuno

Amasu amathathu avamile okwakha amabhodi e-HDI ayinkimbinkimbi:

Uma ucela ikhotheshini, chaza isu lokwakha uma umklamo wakho udinga indlela ethile. Uma unokuguquguquka, chaza “ukukhetha komkhiqizi ngezindleko eziphansi kakhulu” — eminye imiklamo ebonakala ifuna Uhlobo III ingaklanywa kabusha njengoHlobo II ngokunikezwa kwezingqimba okuhlakaniphile, kwehlise izindleko ngo-30–50%.

4.3 Ngokugcwalisa Nokuhlela: I-Cost Multiplier Yama-Stacked Microvias

Ama-blind vias angagcwalisiwe anesikhala somoya esinciphisa ukuthembeka futhi sivimbele ukunqwabelana. Ngezinketho zokugcwalisa:

• Ipulaki ye-resin: Gcwalisa nge-epoxy resin. Izindleko: $0.05–$0.15 nge-via ngayinye. Kwanele izinhlelo zokusebenza eziningi. Ivumela izinga elilodwa lokufaka (nge-via phezu kwe-via).
• Ukugcwaliswa kwethusi (ngokusebenzisa iplati): Ithusi le-electroplate ukuze ligcwaliswe ngokuphelele nge-via. Izindleko: $0.20–$0.60 nge-via. Kuyadingeka nge-via-in-pad ngaphansi kwe-BGA. Inika amandla ukufakwa kwezinga eliningi. Kudinga ukuhlelwa kabusha (okungeziwe $0.10–$0.20 nge-via).
• Ukugcwaliswa kokunamathiswa okuqhubayo: Ukunamathisela okuhambisayo okuprintiwe esikrinini ku-via. Izindleko: $0.08–$0.25 nge-via. Kusetshenziswa kuma-electronics ashibhile. Akuthembekile kakhulu kunokugcwalisa ngethusi.

Uma umklamo wakho unama-blind vias angu-500 futhi udinga ukugcwaliswa ngethusi + ukuhlelwa kabusha, lokho kunezela u-$150–$400 ezindlekweni zebhodi. Kuma-oda aphansi lokhu kungabusa isilinganiso sezindleko.

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5. Ukucatshangelwa Kwesikhathi Sokuhola Ekungcwatshweni Okungaboni Ngezilinganiso ze-PCB

5.1 Isikhathi Esijwayelekile Sokuhola vs. Izinketho Ezisheshayo

Isikhathi sokuhola se-blind/singcwatshwe ngamabhodi sisethwa yisikhathi somjikelezo wokulamina (i-lamination ngayinye idinga izinsuku ezingu-1-2 kufaka phakathi isikhathi sokucindezela kanye nokupholisa) kanye nomthamo wokubhoboza nge-laser. Ngokungafani nama-PCB ajwayelekile lapho isikhathi sokuhola singancishiswa khona ngo-50% ngentengo ye-premium, izikhathi zokuhola ze-HDI zinomkhawulo oqinile ongaphansi lapho kungekho mali yokusheshisa engacindezela isheduli.

5.2 Izici Zesikhathi Sokuhola Ngaphandle Kokulawulwa Komkhiqizi

• Ukutholakala kwezinto ezibonakalayo: Izinto ezikhethekile ezine-Tg ephezulu noma ezine-Dk ephansi zingaba nezikhathi zokuhola zamaviki angu-2-4 ezivela kumhlinzeki we-laminate. Uma umklamo wakho udinga i-Panasonic Megtron 7 noma i-Isola Astra MT77, qinisekisa isitoko sezinto ngaphambi kokuthatha isikhathi sokuhola esijwayelekile.
• Umthamo wokubhoboza nge-laser: Ukubhoboza nge-laser kuyisithiyo ezicini eziningi ze-HDI. Ngesikhathi sesizini esiphezulu (Septhemba-Novemba sezinto zikagesi zabathengi), imigqa yokubhoboza nge-laser ingangeza izinsuku ezingu-3-5 esikhathini sokuhola esicashuniwe.
• Uhlu lokuhlola lwe-X-ray: Amabhodi ekilasi lesi-3 adinga ukuhlolwa kwe-X-ray okungu-100% kwama-vias angaboni angabhekana nokubambezeleka komugqa wokuhlola ngezikhathi ezimatasa.
• Shipping: Ukuthunyelwa kwamanye amazwe kwama-prototype kungathatha izinsuku ezingu-3-7. Ukuthunyelwa okusheshayo ngendiza kunezela u-$50–$200 kuye ngobukhulu bebhodi kanye nesisindo.

Uma ucela ikhotheshini, cela umenzi ukuthi acacise ukuthi yiziphi izingxenye zesikhathi sokuqalisa eziqinile nokuthi yiziphi ezincike ekutholakaleni kwezinto noma imishini.

5.3 Izinqumo Zokuklama Ezifinyeza Isikhathi Sokuhola

• Sebenzisa izinto ezigcwele: I-FR4 TG170 igcwele. I-Megtron 6 ingadinga i-oda elikhethekile. Qinisekisa isimo sesitoko sezinto ezibonakalayo.
• Gwema ngokugcwalisa: Ama-blind vias angagcwalisiwe asusa isinyathelo esisodwa senqubo (izinsuku ezingu-2-3). Uma umklamo wakho ungabekezelela ama-vias angagcwalisiwe, chaza lokhu.
• Yamukela iKlasi 2 lamaphrothokholi: Ukuhlolwa kweKilasi 2 kuwukuhlolwa okubonakalayo + kukagesi. Ikilasi 3 lengeza ukuhlaziywa kwesigaba esincane kanye ne-X-ray eyi-100%, kwenezela izinsuku ezi-2-4.
• Ukubhoboza ngomshini kwama-vias amakhulu angaboni: Uma ububanzi bokubhoboza kwakho buyi-≥0.20 mm futhi ukujula ku-≤0.80 mm, ukubhoboza ngomshini kushesha kune-laser (akukho sikhathi sokusetha) futhi kungase kuphuze izinsuku ezingu-1-2 ngaphambi kwesikhathi sokuhola.

6. Indlela Yokuhlola Nokuqhathanisa Izimpumputhe Eziningi Ezingcwatshwe Ngezilinganiso ze-PCB

6.1 Ngale Kwentengo Yeyunithi: Izindleko Eziphelele Zobunikazi

Izingcaphuno ezintathu zezimpumputhe ezifanayo ezingcwatshwe ebhodini:

• Umhlinzeki A: $45/ibhodi, isikhathi sokuhola sezinsuku eziyi-12, iKlasi 2, ukuhlolwa okubonakalayo kuphela
• Umhlinzeki B: $52/ibhodi, isikhathi sokuhola sezinsuku ezingu-15, iKlasi 3, ukuhlolwa kwe-X-ray okungu-100%, umbiko wesigaba esincane ufakiwe
• Umhlinzeki C: $38/ibhodi, isikhathi sokuhola sezinsuku eziyi-10, iKlasi 2, akukho ukuhlolwa kwe-X-ray, inzuzo "yomzamo omuhle kakhulu"

Intengo yeyunithi ephansi kakhulu (uMhlinzeki C) ingaba nezindleko eziphezulu kakhulu uma isivuno siphansi. Uma amabhodi angu-15% ehluleka ukuhlolwa kukagesi endlini yakho yokuhlanganisa, izindleko zakho ezisebenzayo zingu-$38 ÷ 0.85 = $44.70/ibhodi kanye nezindleko zoku-oda kabusha izinto ezishintshwayo kanye nokubambezeleka kweshejuli.

Intengo ephezulu yeyunithi yomhlinzeki B ifaka phakathi ukuqinisekiswa okuqinisekisa izindleko zama-oda okukhiqiza. Umhlinzeki A umele indawo ephakathi nendawo efanelekela ama-prototypes lapho ukulahlekelwa okuthile kwesivuno kwamukeleka khona.

6.2 Uhlu Lokuhlola Lokuqhathanisa Izilinganiso

6.3 Amafulegi Abomvu Angcwatshwe Ngama-blind Ngezilinganiso ze-PCB

• Isilinganiso sinikezwe ngaphandle kwesicelo ngethebula lokuxhumana: Kubonisa ukuthi umhlinzeki uqagela ubunzima kunokuba abale kusukela ezidingweni zangempela
• Akukho okushiwo ngokuhlolwa kwe-X-ray: Ikhwalithi yokungaboni kahle ayikwazi ukuqinisekiswa ngokubona. Ukungabikho kokuhlolwa kwe-X-ray esilinganisweni kusikisela ukulawulwa kwekhwalithi okubuthakathaka
• Intengo yeyunithi engehli kakhulu kusukela ezingcezu eziyi-10 kuya kweziyi-100: Kubonisa ukuthi i-NRE ikhokhelwa ngokuphindaphindiwe kunokuba ikhokhwe
• Isikhathi sokuhola sifushane kunezinga lomkhakha lohlobo lwe-HDI: Kungase kubonise ukuthi umhlinzeki ubukela phansi ubunzima benqubo
• Isilinganiso sisebenza izinsuku ezingu-15-30 kuphela: Kungabonisa amanani ezinto ezingazinzile noma imikhawulo yamandla

Cela Isiphofu Sakho Esinemininingwane Esingcwatshwe Ngesilinganiso se-PCB

7. Ukungcwatshwa Kwakho Okungaboni Ngesilinganiso se-PCB esivela ku-Highleap Electronics

I-Highleap Electronics igxile ekwenziweni kwe-HDI eyinkimbinkimbi futhi inikeza izingcaphuno ezicacile, ezihlelwe ngokwezigaba ezenzelwe ukwenza izinqumo zobunjiniyela:

7.1 Inqubo Yesicelo Sekhotheshini

• Layisha amadokhumenti e-Gerber + stackup: Ithuluzi le-DFM elizenzakalelayo le-Highleap likhipha inani lezingqimba, ngezinhlobo, kanye nokuxhumana
• Okuzenzakalelayo ngokuhlukaniswa: Uhlelo luhlukanisa i-L1-Ln engaphakathi kwembobo, engaboni, efihliwe i-Lx-Ly futhi luveza noma yiziphi izinkinga zokukhiqiza
• Ukuthuthukisa indlela yokubhoboza: Ngohlobo ngalunye lwe-via, uhlelo luncoma i-laser vs. mechanical ngokusekelwe kububanzi, ukujula, kanye nezindleko
• Amanani entengo eningi: Izilinganiso ezinikezwe ngezingcezu eziyi-10, 25, 50, 100, 250, 500 ezibonisa ukukhokhwa kwemali kwe-NRE kanye nezaphulelo zevolumu
• Ezinye iziphakamiso ze-stackup: Uma umklamo wakho wohlobo lwesithathu ungahlelwa kabusha njengohlobo lwesibili ngokushintsha ungqimba, ithimba lobunjiniyela be-Highleap linikeza ukuqhathanisa izindleko

7.2 Okufakiwe Embonweni Ombozwe Nge-Highleap Blind Nge-Quote

• Ukuhlukaniswa kwezinto zomugqa: Izinto zokwakha, ukucutshungulwa kwengqimba yangaphakathi, imijikelezo ye-lamination, ukubhoboza nge-laser, ukubhoboza ngomshini, ukucwebezela, ukuhlola, i-NRE — ngayinye icashunwe ngokwehlukana
• Izindleko ezithile: Izindleko nge-blind ngayinye ngobubanzi bobubanzi, izindleko nge-layer span ngayinye, ngezindleko zokugcwalisa uma zikhona
• Ububanzi bokuhlola: Okujwayelekile (ikhuphoni kagesi + impedance) uma kuqhathaniswa nokuthuthukisiwe (engeza i-X-ray) uma kuqhathaniswa neKlasi 3 (engeza ingxenye encane), ngamanani ezingeni ngalinye
• Ukucaca kwesikhathi sokuhola: Umugqa wesikhathi wenqubo obonisa izinsuku ezibekelwe izendlalelo zangaphakathi, imijikelezo ye-lamination, ukubhoboza, ukuplata, kanye nokuhlola
• Izibikezelo zenzuzo: Izingcaphuno ze-Highleap zithatha isivuno esingaphezulu kuka-98% futhi zizibophezela ekulethweni kwenani eliphelele. Uma kuvela izinkinga zesivuno, ukushintshwa kunikezwa mahhala.
• Izincomo zokwenza ngcono umklamo: Uma ukusetshenziswa kwephaneli kungathuthukiswa ngokushintsha ubukhulu bebhodi elingu-1-2 mm, noma uma ngokubeka kuvumela ukucushwa okuhleliwe esikhundleni sokuqongelela (ukonga ngezindleko zokugcwalisa), lokhu kumakwe ngokulinganiswa kokulondolozwa kwezindleko

7.3 Ukuguqulwa Kwesilinganiso Esisheshayo Kwabangcwatshwe Izimpumputhe Ngamabhodi

• Ukuguqulwa kwesilinganiso esijwayelekile: Kungakapheli amahora angama-24 we-Hlobo I/II HDI ngezinto ezijwayelekile
• Isilinganiso se-HDI esiyinkimbinkimbi: Kungakapheli amahora angu-48 ohlobo lwesithathu/i-IV oludinga ukuhlaziywa kobunjiniyela
• Izingcaphuno zosuku olufanayo ziyatholakala: Ngezicelo zephrothokholi eziphuthumayo ngokulungiswa okujwayelekile kwe-stackup

7.4 Ukuqinisekiswa Kwesilinganiso kanye Nokukhiya Amanani

• Ukufaneleka kwesilinganiso: Izinsuku ezingama-60 zezinto ezijwayelekile, izinsuku ezingama-90 uma ikhasimende linikeza impahla ethunyelwe
• Uhlelo lwe-Blanket PO: Ngokukhiqiza okuphindaphindiwe, i-Highleap inikeza izikhiye zentengo zezinyanga eziyi-12 zezinto zokwakha kanye nokucubungula (i-NRE ikhokhwe kanye, isebenza kuwo wonke ama-oda)
• Izaphulelo zesibopho sevolumu: Uma ikhasimende lizibophezele ekubhaliseni amabhodi angaphezu kwe-1,000 ezinyangeni ezingu-12, isaphulelo esengeziwe esingu-8–15% sisetshenziswa emananini okukhiqiza

Inqubo yesilinganiso se-Highleap yenzelwe ukuhlinzeka ngokusobala kobuchwepheshe kanye nesiqondiso sokuthuthukisa izindleko okudingeka amaqembu okuthenga enze izinqumo ezinolwazi ngamabhodi e-HDI ayinkimbinkimbi.