I-Power Semiconductor PCB Design yamamojula Amandla

Isingeniso: Iqhaza Lamandla Semiconductor PCB ku-Modern Electronics

Amamojula we-semiconductor yamandla asebenza njengomgogodla wezimoto zikagesi zesimanje, iziguquli zezimboni, nezinhlelo zamandla avuselelekayo. I-PCB ye-semiconductor yamandla isebenza njengokungaphezu kweplathifomu yokuxhumana elula. Ihlinzeka ngesikhathi esifanayo ukuqhutshwa kukagesi, izindlela zokushisa ezishisayo, i-dielectric isolation, nokuzinza kwemishini ngaphansi kwezimo zokusebenza ezinzima.

Amadivayisi kagesi ahlukene abeka izidingo ezihlukile ekwakhiweni kwe-PCB. Amamojula e-IGBT adinga amandla okuphatha amanje aqinile kanye nokuphatha okushisayo okumaphakathi. Imiklamo esuselwe ku-MOSFET idinga ukunakwa ngokucophelela kuzici zokushintshwa kwemvamisa ephezulu. Ama-semiconductors e-Wide-bandgap afana ne-SiC ne-GaN asebenza emazingeni okushisa aphezulu kanye namaza okushintshashintsha, adinga izinto ezithuthukisiwe ze-substrate kanye nezakhiwo ezishisayo ezithuthukisiwe zokuqaliswa kwemojula yamandla ethembekile ye-PCB.

I-Power Semiconductor PCB Configurations and Structures

I-PCB Yethusi Ewugqinsi Yezinhlelo Zokusebenza Zamanje Eziphakeme

Ama-PCB ethusi agqinsile asebenzisa izisindo zethusi ezisukela ku-3oz ukuya ku-10oz isendlalelo ngasinye ukuze asekele amaza aphezulu aqhubekayo anokulahlekelwa okuncane kokumelana. Lawa mabhodi anika amandla umzila oqondile wamandla ngaphandle kwemigoqo yebhasi yangaphandle kumiklamo yemojuli ye-IGBT ye-PCB. I-copper mass eyandisiwe inomthelela ekusakazeni ukushisa endaweni yonke yebhodi.

I-Metal Core PCB kanye ne-IMS Technology

Ama-PCB e-Metal core anezendlalelo zesisekelo se-aluminium noma se-copper ezinikeza ukuhanjiswa kokushisa okuphezulu uma kuqhathaniswa nokwakhiwa okujwayelekile kwe-FR-4. Ukucushwa kwe-insulated metal substrate (IMS) kubeka ungqimba oluncane lwe-dielectric phakathi kwephethini yesekethe kanye ne-metal core. Lesi sakhiwo sifanelana nezinhlelo zokusebenza zamandla aphakathi lapho izidingo zokushisa zidlula khona amakhono avamile.

I-DBC ne-AMB Substrates yamadivayisi e-Wide-Bandgap

Ikhopha eboshiwe eqondile (i-DBC) ihlanganisa izingqimba zethusi eziwugqinsi ezibopha ngokuqondile ezintweni zobumba ngaphandle kwezingqimba zokunamathela. I-Active metal brazing (AMB) izuza imiphumela efanayo kusetshenziswa izinqubo ezihlukene zokuhlanganisa. Zombili izinhlobo ze-substrate ziphethe amazinga okushisa okusebenza aphakeme kanye nezidingo zokushibilika ezishisayo ze-SiC PCB nezinhlelo zokusebenza ze-GaN PCB.

I-Multilayer kanye ne-Hybrid Stack-ups

Amamojula anamandla ayinkimbinkimbi ngokuvamile asebenzisa ukumiswa kwezendlalelo eziningi ezihlukanisa ukulandelelwa kwamandla aphezulu kumasiginali azwelayo wedrayivu yesango. Ukwakhiwa kwe-Hybrid kuhlanganisa izendlalelo ezijwayelekile ze-FR-4 zomzila wesiginali nama-cores ensimbi ashunyekiwe ukuze kusatshalaliswe amandla. Le ndlela ithuthukisa izindleko ngenkathi ihlangabezana nezidingo zokusebenza ezahlukahlukene kuso sonke isitaki semojula yamandla ye-PCB.

Idizayini kagesi ye-Power Semiconductor PCB

Umthamo Wamanje Wokuthwala kanye Nokulawula Okubambezelayo

Idizayini ye-PCB ye-semiconductor yamandla iqala ngezibalo zobubanzi bokulandelela ngokusekelwe ezidingweni zamanje kanye nokukhuphuka kwezinga lokushisa okwamukelekayo. Ugqinsi lwethusi luthonya ngokuqondile umthamo wamanje, ngezinga lethusi elingu-4oz ukuya ku-6oz lemizila yamandla eyinhloko. Ukulandelela okubanzi kunciphisa ukulahlekelwa okuphikisayo kanye nokwehla kwamandla kagesi ngaphansi kwezimo zomthwalo ogcwele.

Imiphumela Yokushintsha Imvamisa Ephakeme ku-MOSFET PCB

Ukuhlelwa kwe -MOSFET PCB kumele kubhekane nokufakwa kwe-parasitic kanye ne-capacitance ethinta ukusebenza kokushintsha. Imizila yokushayela kwesango idinga umzila we-impedance olawulwayo onendawo encane ye-loop. Ukufakwa kwe-Power loop kubangela ukushaqeka okukhulu kwe-voltage ngesikhathi sokushintsha kokushintsha. Ukubekwa okuhlelekile kwama-capacitor ahlukanisayo kanye nezindlela zokubuya ezilungiselelwe kunciphisa lezi zinsalela.

I-Kelvin Connections kanye ne-Voltage Sensing

Izinzwa zamanje ezinembile zidinga izindlela zokuxhuma ze-Kelvin ezihlukanisa izindlela zamanje nezilandelanayo. Izinzwa ezinezintambo ezine ziqeda umthelela wokumelana nokuxhuma ekunembeni kokulinganisa. Inzwa ezinikele ilandelela umzila ngokuqondile kumatheminali edivayisi ngaphandle kokwabelana ngethusi namaza kagesi.

Izidingo zokuhlukaniswa kwe-High-Voltage

Ama-electronics asebenza ngama-voltage adinga i-creepage ethize kanye namabanga okukhipha phakathi kwamakhondakta. Amazinga okuphepha achaza isikhala esincane esisekelwe kumazinga kagesi kanye namadigri okungcola. Isakhiwo semojula yamandla se-PCB kufanele sivumelane nalezi zidingo ngenkathi sikhulisa ukuminyana kwesekhethi.

Ukuphathwa Okushisayo ku-Power Semiconductor PCB

I-Copper Eshumekiwe kanye Ne-Via Technologies

Amasu okuphatha ukushisa asebenzayo e-PCB ye-semiconductor yamandla afaka:

• Ukushumeka uhlamvu lwemali yethusi – Izixuku zethusi eziwugqinsi ngaphansi kwezakhi zisakaza ukushisa eceleni ngaphambi kokudlulisela kumasinki okushisa.
• Ukwakhiwa ngephedi - Izimbobo ezishisayo ezigcwele ithusi zisusa ukumelana negebe lomoya ngaphansi kwezinyathelo zedivayisi.
• I-Thermal nge-arrays - Ama-Vis amaningi adala izindlela ezishisayo ezishisayo ezingenasici ngokuqina kwebhodi.
• Ukuhlanganiswa kwesisekelo sensimbi - Izisakazi zokushisa ezigcwele indiza zihlinzeka ngokusebenza okuphezulu okushisayo kwezicelo zamandla aphezulu.

Ama-Ceramic Substrates Athuthukile e-SiC PCB

I-ceramics ye-thermal conductivity ephezulu inikeza ukusebenza okuphezulu kwezinhlelo zokusebenza ze-PCB ze-semiconductor yamandla:

• I-Aluminium nitride (AlN) - I-Thermal conductivity esondela ku-180 W/mK inika amandla ukususwa kokushisa okusebenzayo kumadivayisi we-SiC.
• I-Silicon nitride (Si₃N₄) - Ihlinzeka ngokuqina komshini ngokusebenza okushisayo okulungele imihlangano ye-GaN PCB.
• Ukukhweza idayizi okuqondile - Iqeda izinto zokusebenzisana ezishisayo ezimaphakathi ukuze kuncishiswe ukumelana nokushisa okuphelele.

Ukulingisa Okushisayo kanye Nokuhlaziywa Kwebhayisikili Yamandla

Imodeli yokushisa yesici esiphelile ibikezela amazinga okushisa okuhlangana futhi ihlonze izindawo ezishisayo ngaphambi kokwenziwa kwesibonelo. Ukuhlaziya okushisayo kwesikhashana kuhlola ukushintsha kwezinga lokushisa ngesikhathi sokuhamba kwamandla okushayela izindlela zokuhluleka kokukhathala. I-coefficient ye-Material ye-thermal expansion (CTE) engafaniyo idala ukucindezelwa komshini phakathi nohambo olushisayo.

Ukuthuthukisa Indlela Yokuqeda Ukushisa

Idizayini esebenzayo yokushisa idala izindlela ezimelana kancane ukusuka ekuhlanganeni kwe-semiconductor ngokusebenzisa ukuxhumana kwe-solder, ama-substrates, nezinto zokusebenzisana ezishisayo ukuya kumasistimu okupholisa azungezile. Amadizayini e-PCB okukhipha ukushisa anciphisa inombolo nokujiya kwezindawo zokusebenzelana kuyilapho ekhulisa izindawo zokuthintana kanye nokusetshenziswa kokushisayo kwempahla.

Ukukhetha Okubalulekile Kwemojuli Yamandla PCB

Izinketho ze-Dielectric Material

Izinto ezijwayelekile ze-FR-4 zanela ama-PCB wemojuli yamandla asebenza ngaphansi kuka-130°C anezidingo zefrikhwensi emaphakathi. I-High-Tg laminates efana ne-FR-408HR inweba amabanga okusebenza ukuya ku-180°C amazinga okushisa engilazi yokuguqulwa. Ama-substrates e-Polyimide amelana nokusebenza okuqhubekayo ngaphezu kuka-200°C, adingekayo ukuze kufakwe i-SiC ne-GaN die.

Isisindo Sethusi kanye Nekhwalithi Yokucwenga

Ukukhetha ugqinsi lwethusi okuyisisekelo kulinganisa umthamo wamanje ngokumelene nezindleko zempahla nokuba yinkimbinkimbi kokwenziwa. Izisindo zethusi eziqediwe zisebenza ekuhlanganisweni okwengeziwe ngesikhathi sokwakheka nokuqedwa kwendawo. Amabhodi ethusi asindayo adinga izinqubo ezikhethekile zokuqopha kanye nezikhathi zokucubungula ezandisiwe.

I-Surface Finish Selection ye-Power Semiconductor PCB

Electroless nickel immersion gold (ENIG) ihlinzeka ngokuthengiswa okuhle kakhulu kanye nezindawo zokubopha ngocingo zokuhlanganisa amandla semiconductor PCB. Isiliva lokucwiliswa kanye ne-organic solderability preservative (OSP) ukuqedwa kwehlisa izindleko kodwa kudinga ukugcinwa ngokucophelela. Ukufakwa kwegolide okuqinile kusebenzisa izixhumi zonqenqema zamanje kanye nezinhlelo zokuthintana ezishelelayo.

I-Advanced Bonding Technologies

I-Sintered silver die attach idala amabhondi angenalutho ane-thermal ephezulu kanye ne-electrical conductivity uma kuqhathaniswa namasoda omdabu. Ama-solder asezingeni eliphezulu agcina ubuqotho bemishini ngaphansi kokuhamba ngamabhayisikili emazingeni okushisa aphakeme. Ukukhetha indlela yokuhlanganisa kunomthelela kukonke ukuthembeka kwemojuli yamandla.

Ukuthembeka Nokuhlolwa Kwe-Power Semiconductor PCB

Ukuhlolwa kwe-Power Cycling kanye ne-Thermal Cycling

Ukuhamba ngebhayisikili kagesi kusebenza ukulayishwa kukagesi okuphindaphindiwe okukhiqiza imijikelezo yokushisisa nokupholisa emele ukusebenza kwensimu. Amazinga okuhlola acacisa amaleveli amanje, ngezikhathi, kanye nokushintshashintsha kwezinga lokushisa ngokusekelwe kuzimfuneko zohlelo lokusebenza. Kokubili ukuhlolwa kukhomba izindlela zokukhathala ezithinta amalunga e-solder kanye ne-substrate delamination.

Ukuhlolwa kwe-High-Voltage Withstand

Ukuhlolwa kwe-HiPot kusebenzisa ama-voltage adlula amazinga okusebenza ajwayelekile ukuze kuqinisekiswe ubuqotho bokwehlukanisa phakathi kwamasekhethi angawodwa. Ama-voltage okuhlola ngokuvamile afinyelela izikhathi ezingu-1.5 kuya kwezingu-2 ku-voltage osebenzayo ngezikhathi ezithile. Ukuhlolwa kokukhipha okuyingxenye kuthola ukwehluleka kokufakwa kwe-incipient ngaphambi kokuhlukana okuphelele.

Izindlela Zokuhlaziya Ukwehluleka

Izindlela zokuqinisekisa ukuthembeka okubalulekile ze-PCB ye-semiconductor yamandla zihlanganisa:

• Ukuphambana kwezigaba - Idalula imininingwane yokwakha yangaphakathi futhi iveze izindlela zokwehluleka ezingabonakali ekuhlolweni kwangaphandle.
• Isithombe se-X-ray - Ihlonza ama-voids emalungeni e-solder kanye ne-delamination phakathi kwezingqimba zempahla ngaphandle kokuhlolwa okulimazayo.
• Iskena i-acoustic microscopy - Ithola ukuqhekeka nokuhlukaniswa kobuso ukuze kuqinisekiswe ukwethembeka kwesikhathi eside.

Amandla Semiconductor PCB Izicelo

I-Electronic Vehicle Power Electronics

Ama-inverter e-EV aguqula amandla ebhethri le-DC abe yi-AC yesigaba esithathu ukuze kulawulwe imoto ngokusebenza kahle okungaphezu kuka-95%. I -PCB ye-inverter kumele iphathe amakhulu ama-ampere ngenkathi igcina ukuzinza kokushisa ngaphansi kokusebenza okuqhubekayo. Ukwamukelwa kwe-silicon carbide kuma-inverter okudonsa kudinga ubuchwepheshe obuthuthukisiwe be-PCB ye-semiconductor yamandla.

Ama-Industrial Drives nama-Solar Inverters

Amadrayivu efrikhwensi aguquguqukayo alawula isivinini sezimoto zezimboni ngokulawula amandla okunembe kuwo wonke amabanga okusebenza abanzi. Iziguquli zelanga ziguqula okukhiphayo kwe-DC photovoltaic kube amandla e-AC avunyelaniswe ngegridi anokulandelela amaphuzu aphezulu kakhulu. Ukwakhiwa kwe-PCB okuklanyelwe amandla kagesi kubhekana nalezi zidingo ezidingekayo.

Ezokuxhumana kanye ne-UPS Systems

Ingqalasizinda yezokuxhumana idinga ukuguqulwa kwamandla okuthembekile okunemigomo eqinile esebenza kahle. Izinsiza zamandla ezingaphazamiseki zivikela imithwalo ebalulekile ngoshintsho olungenamthungo phakathi kwezinsiza kanye nemithombo yamandla ebhethri. Lezi zinhlelo zisebenzisa amamojula athuthukile we-semiconductor yamandla afakwe kumihlangano ye-PCB ye-inverter ekhethekile.

Isiphetho

Idizayini ye-PCB ye-semiconductor yamandla idinga ukuthuthukiswa ngokucophelela kokusebenza kukagesi, ukuphathwa kwe-thermal, nokuthembeka kwempahla ukuze kuhlangatshezwane nezidingo eziqinile zama-electronics amandla esimanje. Amadivayisi ane-wide-bandgap ayaqhubeka nokuphusha imingcele yokusebenza kuyilapho ukwakhiwa kwethusi eliwugqinsi, ama-metal core substrates, nezisekelo zobumba zibhekana nezidingo ezithile zohlelo lokusebenza.

I-Highleap Electronics iletha izixazululo eziphelele ze-PCB ze-semiconductor:

• Amakhono okwenziwa kwe-PCB athuthukile - Ukushumeka kwethusi eliwugqinsi, ukucutshungulwa komgogodla wensimbi, nokuhlanganiswa kwe-ceramic substrate ngezidingo ezishisayo.
• Ubuchwepheshe be-Wide-bandgap - Izinqubo ezikhethekile zokukhiqiza ze-SiC PCB kanye nokuqaliswa kwe-GaN PCB ezinokwethenjelwa okuqinisekisiwe.
• Izitifiketi zekhwalithi - Imisebenzi eqinisekisiwe ye-ISO 9001 kanye ne-IATF 16949 iqinisekisa ikhwalithi engaguquki yezicelo zezimoto nezezimboni.
• Izinsizakalo zomhlangano ezigcwele ze-PCB - Ukusuka ekuthengeni ingxenye kuya ekuhlolweni kokugcina, ukusekela ukukhiqizwa kwamamojula wamandla aphelele.

Xhumana nethimba lethu lobunjiniyela ukuze uxoxe ngezidingo zakho ze-PCB ze-semiconductor yamandla bese uthola ukuthi izinqubo zethu eziqinisekisiwe ziletha kanjani ukusebenza okudingwa yimiklamo yakho.