Ukuphathwa Okushisayo kuma-PCB weSemiconductor: Amasu Wokuklama Wezicelo Ezinamandla Aphezulu

Isingeniso

Njengoba ubuningi bamandla edivayisi ye-semiconductor kanye namazinga okuhlanganiswa eqhubeka ekhuphuka, ukuphathwa kokushisa kube yinselele ebalulekile yokuklama kubunjiniyela be-PCB besimanje. Ukuphathwa kokushisa okuphumelelayo kuma- PCB e-semiconductor kubalulekile ukuqinisekisa ukuthembeka kanye nokuzinza kwesikhathi eside ekusetshenzisweni kwamandla aphezulu kanye nokuxinana okuphezulu.

Amandla okuphatha kahle ukushisa kude nezinto ezibalulekile athinta ngokuqondile ukusebenza kwedivayisi, ubuqotho obuhlangene be-solder, kanye nobude bempilo bohlelo besistimu. Lesi sihloko sihlola amasu okuklama okushisayo afakazelwe okuhlanganisa ukwakhiwa kwesisekelo sensimbi se-PCB, ukushumeka uhlamvu lwemali yethusi, ama-thermal array nge-in-pad, kanye nokusetshenziswa kongqimba lwethusi obukhulu. Ukuqonda lobu buchwepheshe kwenza onjiniyela bakwazi ukukhetha izixazululo ezifanele zezinhlelo zokusebenza ezithile ze-semiconductor.

Kungani Ukuphatha Okushisayo Kubalulekile kuma-Semiconductor PCB

Ukunqwabelana kokushisa kumasekhethi we-semiconductor kwehlisa ngokuqondile ukusebenza futhi kusheshisa ukwehluleka kwengxenye. Amazinga okushisa aphakeme e-junction anciphisa isivinini sokushintshwa kwe-transistor, akhuphule ukuvuza kwemisinga, futhi agudluze amapharamitha kagesi ngaphezu kokubekezelela okwamukelekayo. Kuma-semiconductors amandla afana nama-IGBT nama-MOSFET, ukushisa okudlulele kubangela izimo ezishisayo ezingase zicekele phansi amadivayisi ngaphakathi kwama-millisecond.

I-Thermal Stress kanye ne-Failure Mechanisms

Ukucindezeleka okushisayo kudala izindlela eziningi zokuhluleka kulo lonke umhlangano. I-coefficient of thermal expansion (CTE) ayihambelani phakathi kwezinto zokwakha i-cyclic strain ngesikhathi sokuguquguquka kwezinga lokushisa, igxile kumajoyinti e-solder futhi ibangele ukusakazeka kokuqhekeka. I-delamination yephakheji kwenzeka lapho ukunamathela kobuso obuhlangene kwehluleka ngaphansi kokuhamba ngebhayisikili okushisayo, okufaka engozini kokubili ukusebenza kukagesi nokushisayo.

Izidingo Zezinga Lokusebenza

Ama-PCB ebanga labathengi ngokuvamile asebenza ngaphansi kuka-85°C, kuyilapho amabhodi okupakisha e-semiconductor kufanele agcine ukusebenza emazingeni okushisa ahlanganayo angaphezu kuka-150°C. Amamojula wamandla ezinhlelo zokusebenza zezimoto nezezimboni abhekana nezinga lokushisa elifinyelela ku-125°C nezindawo ezishisayo zasendaweni ezisondela ku-175°C. Lezi zimo ezinzima zenza idizayini ye-PCB yokuqeda ukushisa ibaluleke kakhulu kumasistimu abalulekile emishini.

Izindlela Zokukhipha Ukushisa ku-PCB Design

Ukuqonda izindlela ezishisayo eziyisisekelo kunika amandla idizayini ye-PCB yokuphatha okushisayo. Ukushisa kugeleza ngezindlela ezintathu eziyinhloko kuma-PCB we-semiconductor, ngayinye idinga ukulungiselelwa okukhethekile komklamo.

Ukuqhuba Ngezendlalelo Zethusi

Izendlalelo zethusi zisebenza njengama-conductor ashisayo ezakhiwo ze-PCB. Ukwenyusa ugqinsi lwethusi ukusuka ku-1 oz ukuya ku-3 oz noma ukusinda kunciphisa ngokuqondile ukumelana nokushisa ezindizeni ezivundlile. Ukushisa kusakazeka eceleni kuzo zonke izindiza zethusi ngaphambi kokudlulela ezinhlelweni zokupholisa zangaphandle, ezinezendlalelo zangaphakathi ezinikela ngokuphawulekayo lapho zixhunywe kahle nge-thermal ngezakhiwo.

Izindlela ezishisayo ezimile ezine-Via Arrays

I-Thermal vias idala iziteshi zokushisa eziqondile ngokusebenzisa izendlalelo ze-dielectric:

• Ukukhipha ukushisa okuqondile - Imiklamo ye-Via-in-pad ngaphansi kwezingxenye inciphisa ubude bendlela eshisayo
• Ukucushwa kwamalungu afanayo aminyene - Amaphethini okuphakama angu-0.3mm asebenza njengamakholomu ethusi aqinile lapho egcwaliswe kahle
• Ukubekwa okulungiselelwe - I-Strategic positioning ibhalansisa izidingo zikagesi nokusebenza okushisayo

Ukushisa Ukusabalala Ngokusebenzisa Izinto Eziyisisekelo

Izinto ze-Dielectric zinikeza amabhodlela ashisayo ngenxa ye-conductivity ephansi ngokwemvelo uma kuqhathaniswa nethusi. I-FR4 ejwayelekile inikezela nge-thermal conductivity cishe ku-0.3 W/m·K, kuyilapho ama-laminates akhethekile asebenza kahle afinyelela ku-1-2 W/m·K. Ukukhethwa kwezinto eziyisisekelo kuthinta kakhulu ukumelana nokushisa okuphelele, ikakhulukazi ezindaweni ezincane ze-dielectric phakathi kwemithombo yethusi neyokushisa.

I-Advanced Thermal Management Technologies ye-Semiconductor PCBs

I-Metal Base PCB (IMS PCB)

Ukwakhiwa kwe-Metal base PCB kusebenzisa i-aluminium noma i-copper substrates njengezisekelo zesakhiwo. Isitaki esijwayelekile siqukethe isendlalelo sesisekelo sensimbi (ugqinsi oluyi-1-3mm), i-thermal conductive dielectric insulation (0.1-0.2mm), kanye nongqimba lwesekethe yethusi. Lokhu kulungiselelwa kufeza amanani e-thermal conductivity angaphezu kuka-2 W/m·K, kunciphisa kakhulu ukumelana nokushisa.

Izakhiwo ze-IMS PCB zinikeza ukusebenza okuhle kakhulu ngezindlela eziningana:

• Indlela eshisayo emfishane – Ukugeleza kokushisa okuqondile kusuka ezingxenyeni ezithile kuya esisekelweni sensimbi kunciphisa izinga lokushisa lokuhlangana
• Ukusabalala kokushisa okufanayo - I-substrate yensimbi enkulu isakaza imithwalo eshisayo kuyo yonke indawo yebhodi
• Ukukhweza okuhlanganisiwe - Isisekelo sensimbi sisebenza kanyekanye njengesisakazi sokushisa kanye nendawo yokunamathisela ye-chassis

Lezi zakhiwo zihamba kahle kakhulu kumabhodi abashayeli be-LED, amandla e-MOSFET ahlanganayo, namamojula okulawula izimoto adinga ukushisa okufanayo okusabalele ezindaweni ezinkulu.

I-Copper Coin PCB Technology

Ukushumeka uhlamvu lwemali yethusi kubhekana nezinselele zendawo ezishisayo ngokubeka amabhulokhi ethusi awugqinsi (0.5-3mm) ngaphansi ngokuqondile kwezingxenye zamandla aphezulu. Lezi zinhlamvu zemali zethusi zidala imigwaqo ewuthelawayeka eshisayo engamelana kancane ukusuka ekuhlanganeni kwedivayisi kuya endaweni engaphansi ye-PCB, okufakazela ukuthi isebenza kahle kakhulu emithonjeni yokushisa egxilile lapho izendlalelo zethusi ezijwayelekile zingakwazi ukunikeza ukusebenza okwanele okushisayo.

Ukukhiqiza kudinga ukucindezelwa okuqondile kanye nezinqubo zokuthungatha ukuze kuqinisekiswe ukucaba nokuhlangana okufanele. Izinhlamvu zemali zethusi kufanele zibekwe kahle futhi zilinganiswe nezinto ezizungezile ze-dielectric ukuvimbela i-warpage. Naphezu kobunzima bokwakha, ukuhlanganiswa kohlamvu lwemali yethusi kunciphisa ukumelana nokushisa kwe-junction-to-case ngo-40-60% uma kuqhathaniswa nokwakhiwa okujwayelekile.

Ukuqaliswa Kwengqimba Yethusi Eminyene

Imiklamo ye-PCB yethusi ewugqinsi isebenzisa izisindo zethusi ezingu-3 oz (105 μm) kuya ku-10 oz (350 μm) noma ezisindayo. Lezi zendlalelo zisebenzisa izinjongo ezimbaxambili: ukuthwala imithwalo yamanje ephezulu ngenkathi ihlinzeka ngokuqhutshwa kokushisa okuphezulu. Amasekhethi okuguqulwa kwamandla, abashayeli be-IGBT, nama-inverter okudonsa kwezimoto ngokuvamile asebenzisa ithusi eliwugqinsi ukuze kulawuleke kokubili izimfuno zikagesi nezishisayo.

Inqubo yokukhiqiza idinga amasu okunamathisela akhethekile kanye namapharamitha alungisiwe we-lamination ukuze kunxeshezelwe ukuhluka okubalulekile kobude be-axis engu-z. Naphezu kwezindleko zokukhiqiza ezikhulayo, imiklamo yethusi ewugqinsi iqeda isidingo sezinhlaka zokuphatha ezishisayo ezihlukene ezinhlelweni eziningi zamanje.

I-Thermal Via Arrays kanye ne-Heat Sink Interface

I-Thermal yamasu ngokubeka idala izindlela ezishisayo zokushisa ukusuka engxenyeni kuya kumasistimu okupholisa angaphandle. Ngokusebenzisa amaphethini angaphansi kwamaphakheji e-BGA namadivayisi kagesi ngokuvamile asebenzisa izimbobo zobubanzi obungu-0.3-0.5mm kusikhala esingu-0.8-1.2mm. Ama-vias agcwaliswe ngamapulaki ethusi ahlinzeka ngokusebenza kahle, nakuba nge-capping inikeza enye indlela engabizi kakhulu.

Ukuxhumana phakathi kwe-PCB namasinki okushisa angaphandle kudinga izinto ezisetshenziswayo ze-thermal interface (TIMs) ukugcwalisa izikhala zomoya ezincane ezingase ziphazamise ukudluliswa kokushisa. Amamojula wamandla we-SiC kanye nezikhulisi zemvamisa ephezulu zizuza ikakhulukazi ekushiseni okuthuthukisiwe ngamanethiwekhi agcina amazinga okushisa okuhlangana ngaphakathi kwamabanga okusebenza aphephile.

Ukucatshangelwa Okubalulekile Kokuqeda Ukushisa Okuphumelelayo

Ukukhethwa kwezinto ezingaphansi komhlaba kunquma ngokuyisisekelo imikhawulo yokusebenza kokushisa ekuphathweni kokushisa kwe-PCB ye-semiconductor:

• I-FR4 ejwayelekile – 0.3 W/m·K conductivity thermal, kwanele izinhlelo zokusebenza zamandla aphansi
• I-polyimide esebenza kahle kakhulu – 0.5-0.8 W/m·K, ifanele ukulayisha okushisayo okumaphakathi
• I-aluminium substrate – 1.5-2.0 W/m·K, inhle kakhulu ekusakazeni ukushisa okufanayo
• I-substrate yethusi – 3.5-4.0 W/m·K, ukusebenza okushisayo okuphezulu kwemiklamo yesisekelo sensimbi

I-Advanced Ceramic Substrates

Izisekelo ze-ceramic zimelela ikhambi eliphambili lezidingo zokushisa ezidlulele. I-aluminium nitride (AlN) ifinyelela ku-170-180 W/m·K, kuyilapho i-alumina (Al₂O₃) ihlinzeka ngo-24-28 W/m·K. Lezi zinketho ze-ceramic PCB zigcina izakhiwo ezinhle kakhulu ze-dielectric emazingeni okushisa aphezulu, okwenza zibe zilungele ama-amplifiers kagesi e-RF kanye namamojula wamandla aphezulu.

Isendlalelo sokufakwa kwe-dielectric kumiklamo yesisekelo sensimbi sidala ibhodlela le-thermal eliyinhloko. Ukwakhiwa kwe-polymer okuthuthukisiwe okunezigcwalisi ze-ceramic kufinyelele amanani e-thermal conductivity angu-2-5 W/m·K ezintweni ezilungele ukukhiqiza, nakuba ukulinganisa ukuqhutshwa kwe-thermal namandla e-dielectric kanye nezindleko kusalokhu kuwukuhweba okubalulekile kobunjiniyela.

Ukuthuthukiswa Kwedizayini Nokuhlola Ukuthembeka Kokushisa

Ukulingisa Okushisayo ku-PCB Design

Imodeli ye-Thermal Computational ikhomba izindawo ezishisayo futhi iqinisekise izindlela zokuklama ngaphambi kokwenziwa. Isofthiwe ye-Finite element analysis (FEA) ibala ukusatshalaliswa kwezinga lokushisa kuzo zonke izakhiwo ze-PCB, i-accounting ye-copper geometry, ngamaphethini, kanye nokushabalaliswa kwamandla kwengxenye. Ukulingisa kwesiteji sangaphambi kwesikhathi kunika amandla ukuthuthukiswa okuphindaphindiwe ngaphandle kokuphindaphinda kwe-prototype ebizayo.

Amapharamitha Wokuklama Okubalulekile Wokuphathwa Kwezishisayo

Ukukhethwa kogqinsi lwethusi kulinganisa ukusebenza okushisayo nezingqinamba zokukhiqiza kanye nezindleko. Ngokubeka kufanele kunikeze izindlela ezishisayo eziqondile ukusuka kumaphedi engxenye ukuya kuzingqimba zokusabalalisa ukushisa. Ubukhulu bephedi elishisayo kufanele budlulele ngalé kwezinyathelo zengxenye ukuze kusize ukusakazeka kokushisa kube ithusi elizungezile, kuyilapho ukuhlukaniswa kwengxenye kufanele kubangele ukuhlangana okushisayo phakathi kwamadivayisi aseduze.

Ukuqinisekiswa Kokusebenza Okushisayo

Ukuhlolwa kokuhamba ngebhayisikili okushisayo kuqinisekisa ukuthembeka okuhlanganyelwe kwe-solder nokuzinza kwempahla kuwo wonke amabanga okushisa okusebenza. Imephu ye-infrared thermal iveza ukusabalalisa kwangempela kwezinga lokushisa phakathi nokusebenza okunamandla, iqinisekisa amamodeli okulingisa kanye nokuhlonza izindawo ezishisayo ezingalindelekile. Ukuqinisekiswa kwethempelesha ye-Glass Transition (Tg) kuqinisekisa ukuthi izinto ze-dielectric zigcina ubuqotho besakhiwo emazingeni okushisa aphezulu okusebenza.

Izindawo Zokusebenza Ze-Thermal Management PCBs

Amamojula we-Power semiconductor ezinhlelo zokusebenza ze-IGBT kanye ne-MOSFET adinga izixazululo eziqinile zokushisa ukuze aphathe ukusebenza okuqhubekayo kwamandla aphezulu. Ama-inverter okudonsa izimoto kanye nama-motor drive ezimboni ngokuvamile asebenzisa imiklamo yesisekelo sensimbi noma yethusi elijiyile ehlanganiswe nokushumeka kohlamvu lwethusi ngaphansi kwamadivayisi okushintsha.

Izinhlelo zokukhanyisa ze-LED kanye nezinhlaka zezibani zezimoto zisebenzisa ama-PCB ensimbi ukuze zikhiphe ukushisa kuma-LED agcwele kakhulu. Ama-RF power amplifiers ezinhlelweni zokuxhumana kanye ne-radar adinga ama-PCB e-ceramic ukuze aphathe imithwalo yokushisa egxilile ngenkathi egcina ubuqotho besiginali kumaza aphezulu.

Amamojula wokuguqula i-DC/DC kanye namabhodi e-inverter azuza ekushiseni ngama-array adala izindlela eziningi zokukhipha ukushisa. Ukushabalaliswa kokushisa kumadivayisi e-semiconductor kuba yinto ebaluleke kakhulu njengoba ubuningi bamandla bukhuphuka emiklamo yokuguqula ehlanganisiwe yezinhlelo zokusebenza ze-elekthronikhi zamandla ezimboni.

Isiphetho

Ukuphatha okushisayo okusebenzayo kuma-PCB we-semiconductor kunquma ukuthembeka kwesistimu nokusebenza ezinhlelweni zamandla aphezulu. Ukukhetha phakathi kwesisekelo sensimbi se-PCB, ukushumeka kohlamvu lwemali yethusi, izendlalelo zethusi eziwugqinsi, noma okushisayo kusetshenziswa amalungu afanayo kuncike ezidingweni ezithile zokushisa, amaphethini wokusabalalisa amandla, kanye nemikhawulo yezindleko. Idizayini ephumelelayo yokushisa idinga ukuhlanganiswa kusenesikhathi kwalokhu kucatshangelwa kuzinqumo zesakhiwo se-PCB, ukuqinisekisa ukubekwa kwengxenye, ukusatshalaliswa kwethusi, nangokubeka umsebenzi ndawonye njengohlelo oluphelele olushisayo.

I-Highleap Electronics iletha izixazululo ezibanzi zokuphatha okushisayo:

• Ukushumeka uhlamvu lwemali yethusi - Ukubekwa okunembayo kanye ne-lamination yokuphathwa kwendawo eshisayo
• Ukwenziwa kwe-Metal base PCB - Imiklamo ye-aluminium ne-copper substrate enezendlalelo ze-dielectric ezenziwe kahle
• Imiklamo yethusi esindayo - Kufika ku-10 oz isisindo sethusi sezinhlelo zokusebenza zamanje neziphezulu ezishisayo
• Ukusekelwa kokulingisa okushisayo - Ukwenza ngcono kwedizayini nokuqinisekisa ngaphambi kokwenza
• Qedela izinkonzo zomhlangano - Kusukela ekukhiqizeni kwe-PCB ngokuhlanganisa nokuhlolwa kokugcina

Xhumana nethimba lethu lobunjiniyela ukuze nixoxe ngezidingo zokushisa zephrojekthi yakho elandelayo ye-elekthronikhi yamandla. Sinikeza ukubonisana ngokuklama kanye nobuchwepheshe bokukhiqiza ukuqinisekisa ukuthi ama-PCB akho e-semiconductor afinyelela ukusebenza okuhle kakhulu kokusatshalaliswa kokushisa.