Iphakheji ye-IC: Umhlahlandlela Wobuchwepheshe Ophelele

1. Isingeniso

Iphakheji ye-IC isebenza njengesixhumi esibalulekile phakathi kwama-semiconductor dies kanye nezinhlelo ze-elekthronikhi. Ihlinzeka ngemisebenzi ebalulekile ehlanganisa ukuxhumana kukagesi, ukuvikelwa komshini, ukushabalaliswa kokushisa, kanye nokuvikela imvelo. Njengoba amadivayisi kagesi edinga ukusebenza okuphezulu, ukuminyana okukhulu kwe-I/O, kanye nokuphathwa kokushisa okuthuthukisiwe, ukubaluleka kobuchwepheshe bephakheji ye-IC kuyaqhubeka nokukhula.

Izitayela zamanje zemboni—eziqhutshwa ukuxhumana kwe-5G, umthwalo womsebenzi wobuhlakani bokwenziwa, kanye ne-electronics yabathengi eyinkimbinkimbi kakhulu—ziqhubekisela phambili ukwakheka kwamaphakheji e-IC emazingeni aphezulu okuhlanganisa kanye nezakhiwo eziyinkimbinkimbi kakhulu. Lo mhlahlandlela uhlola izisekelo zamaphakheji e-IC, izinhlelo zokuhlukanisa, izinto zokwakha, izinto ezicatshangelwayo zokuklama, kanye nezinqubo zokukhiqiza.

2. Iyini iPhakheji ye-IC?

2.1 Incazelo Eyisisekelo Yephakheji ye-IC

Iphakheji ye-IC yisakhiwo sendlu esihlanganisa idayisi ye-semiconductor, okwenza ikwazi ukuhlanganiswa nezinhlelo ezinkulu ze-elekthronikhi. Iphakheji inezingxenye eziningana ezibalulekile: idayisi (equkethe i-active circuitry), uhlaka lwe-lead noma i-substrate yokuhambisa ugesi, izakhiwo zokubopha (izibopho zentambo noma ama-bumps) zokuxhumanisa idayisi nephakheji, kanye ne-mold compound noma i-encapsulant yokuvikela.

Idayi ngokwayo iyisakhi se-silicon esisebenzayo, kuyilapho iphakheji ye-IC iguqula le chip ebuthakathaka ibe yiyunithi eqinile, ethengiswayo efanelekile ukuhlanganiswa kwe-PCB . Lo mehluko uyisisekelo—iphakheji inquma ukuthi idayisi ixhumana kanjani nomhlaba wangaphandle.

2.2 Imisebenzi Eyinhloko Yephakheji ye-IC

Ukuxhumana kukagesi

Iphakheji ye-IC isungula izindlela zikagesi ezithembekile phakathi kwama-bond pad e-die kanye nokuxhumeka kwesistimu yangaphandle. Lokhu kufaka phakathi ukulethwa kwamandla, ukuxhumana komhlaba, kanye nokuhanjiswa kwesignali. Ikhwalithi yokuxhumana ithinta ngqo ubuqotho besignali, ikakhulukazi ekusetshenzisweni kwesivinini esikhulu lapho i-inductance ye-parasitic kanye ne-capacitance kuba yizinto ezibalulekile.

Ukuvikelwa Kwemishini

Ama-semiconductor dies abuthakathaka ngokwemvelo futhi asengozini yokulimala komshini. Iphakheji ye-IC inikeza ukwesekwa kwesakhiwo, ivikela i-dies ekucindezelekeni ngokomzimba ngesikhathi sokuhlanganiswa, ukuphathwa, kanye nempilo yokusebenza. Lokhu kuvikelwa kufinyelela ekumelaneni nokudlidliza kanye nokumuncwa komthelela ezicelweni ezidinga amandla.

Ukushisa Okushisayo

Ukushisa okukhiqizwa yi-circuitry esebenzayo kumele kuqhutshwe kahle kude ne-di ukuze kulondolozwe ukusebenza nokuthembeka. Imiklamo yephakheji ye-IC ihlanganisa izindlela zokushisa—ama-heat slugs, ama-thermal vias, nama-pads avele—ukuze kube lula ukudluliselwa kokushisa kuma-PCB noma kuma-heat sinks angaphandle.

Ukusekelwa Kwesiginali Ubuqotho

Izinhlelo zokusebenza ezivame kakhulu nezisheshayo zidinga ukuphathwa ngokucophelela kwezindlela zesignali ngaphakathi kwephakheji ye-IC. Ama-parasitic ephakheji (i-inductance, i-capacitance, ukumelana) kumele ancishiswe futhi alawulwe ukuze kulondolozwe ikhwalithi yesignali, kuncishiswe ukuxoxa, futhi kusekelwe amazinga edatha eqondiwe.

Ukuhlanganiswa Kwezinga Lesistimu

Izakhiwo zesimanje zamaphakheji e-IC zisekela kakhulu ukuhlanganiswa kwe-multi-die ngokusebenzisa izindlela ze-System-in-Package (SiP), Package-on-Package (PoP), kanye nezindlela ze-3D stacking. Lokhu kulungiselelwa kuvumela ukuhlanganiswa okungafani kwama-node enqubo ahlukene kanye nezinhlobo zamadivayisi ngaphakathi kwesigaba esisodwa sephakheji.

2.3 Izindlela Zokuhlela Iphakheji ye-IC

Ngokucushwa Kokuhola

Amaphakheji e-IC ahlukaniswa ngamalungiselelo awo angaphandle okuhola: i-through-hole (DIP), i-gull-wing (QFP, SOP), i-J-lead (PLCC), kanye ne-area array (BGA, LGA). Ukucushwa ngakunye kunikeza ukuhwebelana okuhlukile ngokuya ngobuningi be-I/O, ubunzima bokuhambisa i-PCB, kanye nezidingo zokukhiqiza.

Ngendlela Yokuxhumana

Ukuxhumeka kwe-die-to-package kuchaza enye i-axis yokuhlukaniswa: ukubopha ngentambo (izintambo zegolide, zethusi, noma zesiliva), i-flip-chip (ama-solder bumps noma izinsika zethusi), kanye nezindlela ezisekelwe kungqimba lokusabalalisa kabusha (ukupakisha kwe-wafer ezingeni le-fan-in kanye ne-fan-out). Lezi zindlela ziyahlukahluka ekusebenzeni kukagesi, izici zokushisa, kanye nesakhiwo sezindleko.

Ngobukhulu Besakhiwo

Ukuhlukaniswa kobukhulu kuhlukanisa i-2D (i-single-die, i-planar), i-2.5D (esekelwe ku-silicon interposer), kanye ne-3D (ebekwe ngokuqondile) izakhiwo zephakheji ye-IC. Izindlela zobukhulu obuphezulu zivumela ukuhlanganiswa okukhulu kodwa zethula ubunzima obengeziwe bokukhiqiza kanye nezinselele zokuklama.

3. Izinhlobo Eziyinhloko Zephakheji ye-IC

3.1 Izinhlobo Zephakheji Yendabuko Ye-IC

I-DIP (Iphakheji Emibili Engaphakathi)

The Iphakheji Ephakathi Kwe-Dual inemigqa emibili ehambisanayo yezintambo ezidlulayo ezivela emzimbeni wepulasitiki noma we-ceramic. Amaphakheji e-DIP asalokhu evame kakhulu ekwenzeni ama-prototyping, izinhlelo zokusebenza zemfundo, kanye nezinhlelo ezidinga ukufakwa kwezingxenye ngesandla. Imikhawulo ifaka phakathi ukuminyana kwe-I/O okuphansi kanye nonyawo olukhulu, okunciphisa ukusetshenziswa emiklamo yesimanje yokuminyana okuphezulu.

I-SOP / SOIC / TSOP

Amaphakheji Amancane Ohlaka (i-SOP, i-SOIC, i-TSOP) amelela ukuvela komqondo we-DIP obekwe phezu komhlaba. Lezi zinhlobo zamaphakheji e-IC zifaka ama-lead ephiko le-gull afanele ukuhlanganiswa kwe-SMT okuzenzakalelayo, okuvumela ubuningi bebhodi obuphezulu kunezinye izindlela zokungena. Izinhlobo ze-TSOP ezinamaphrofayili amancane zivame ukusetshenziswa kwimemori lapho imikhawulo yokuphakama ibalulekile khona.

I-QFP (Iphakheji Le-Quad Flat)

Amaphakheji Ane-Flat yelula ama-lead kuzo zonke izinhlangothi ezine, okwandisa kakhulu inani le-I/O elitholakalayo. Amaphakheji e-QFP asekela inani lama-lead elivela kumaphini angu-32 kuya kwangu-300 ngama-pitch amancane njengo-0.4mm. Kodwa-ke, ukuhlanganiswa kwe-QFP okune-pitch encane kudinga imishini yokubeka eqondile kanye nezinqubo ezilawulwayo zokugeleza kabusha ukuze kuvinjelwe amaphutha okubopha kanye nokubeka amatshe ethuneni.

3.2 Izinhlobo zephakheji ye-IC enobuningi obuphezulu

I-BGA (I-Ball Grid Array)

Amaphakheji e-Ball Grid Array sebenzisa uhla lwamabhola e-solder ngaphansi kwephakheji ukuze uxhume ugesi. Lokhu kulungiselelwa kwephakheji ye-IC kunikeza ukuminyana okuphezulu kwe-I/O, ukuhlakazeka kokushisa okuthuthukisiwe nge-ball array, kanye nezindlela zikagesi ezimfushane uma kuqhathaniswa namaphakheji ane-peripheral lead. Izinhlobo ezivamile zifaka phakathi i-FBGA (fine-pitch), i-LBGA (low-profile), kanye nokulungiselelwa okuningi okuqondene nohlelo lokusebenza.

I-CSP (Iphakheji Yesikali Se-Chip)

Amaphakheji e-Chip Scale agcina indawo engaphansi kwe-120% yendawo yokufa, okunciphisa ukusetshenziswa kwe-PCB kwezindlu. Ubuchwepheshe be-CSP buhlanganisa izindlela zokupakisha zendabuko kanye nezinga le-wafer, bunikeza ukusebenza kahle kukagesi ngezinto ezincishisiwe ze-parasitic. Imikhawulo yokuklama ifaka phakathi amakhono okusabalalisa kabusha okulinganiselwe kanye nokucatshangelwa kokuphathwa kokushisa kwezicelo zamandla aphezulu.

3.3 Ubuchwepheshe Bephakheji Ye-IC Ethuthukisiwe

I-Flip-Chip Packaging

Amaphakheji e-IC e-Flip-chip aqondisa i-die ibheke phansi, exhuma ngqo kwi-substrate ngama-solder bumps noma izinsika zethusi. Le ndlela iqeda ukugeleza kwe-wire bond, inciphisa ubude bendlela yesignali, futhi ivumela ukusatshalaliswa kwamandla okufanayo. Ukusebenza kahle kukagesi nokushisa kwe-Flip-chip kwenza kube ukukhetha okuthandwayo kwama-processor asebenza kahle kakhulu, ama-GPU, namadivayisi e-RF.

Ukupakisha kwe-Fan-In vs Fan-Out

Amaphakheji Ezinga Le-Wafer Lase-Fan-In (WLP) avimba izendlalelo zokusabalalisa kabusha ngaphakathi kwe-die footprint, afanele amadivayisi e-I/O aphansi. Ubuchwepheshe be-Fan-Out WLP (FOWLP) njenge-eWLB kanye ne-InFO bandisa indawo yokusabalalisa kabusha ngale kwe-die perimeter, bevumela ukuminyana okuphezulu kwe-I/O ngaphandle kwe-substrate ephilayo. Lezi zindlela zephakheji ye-IC ziphumelela kakhulu ezinhlelweni zokusebenza zeselula nezinemvamisa ephezulu ezidinga ifomu elincane.

Ukwakhiwa Kwephakheji ye-2.5D ne-3D IC

Amaphakheji e-IC e-2.5D athuthukisiwe asebenzisa ama-interposer e-silicon ane-Through-Silicon Vias (TSV) ukuze axhumanise ama-dies amaningi ngokuvundlile. I-3D packages stack ifa ngokuvundlile ngokuxhumeka kwe-TSV phakathi kwezingqimba. Lezi zakhiwo zivumela ukuhlanganiswa kwe-High Bandwidth Memory (HBM) kanye nokuhlanganiswa kwe-chiplet okungafani okubalulekile kuma-accelerator e-AI kanye izinhlelo zokusebenza zekhompyutha ezisebenza kahle kakhulu.

Isifinyezo Sokuvela Kwephakheji ye-IC

Ukuqhubekela phambili kusuka ku-DIP kuya ku-QFP, i-BGA, i-flip-chip, i-fan-out, kuya kuzakhiwo ze-3D kubonisa imizamo eqhubekayo yemboni yokwandisa ubuningi bokuhlanganiswa, ukuthuthukisa ukusebenza kukagesi, kanye nokubhekana nezinselele zokushisa. Isizukulwane ngasinye sobuchwepheshe bephakheji ye-IC sakha phezu kwezinto ezintsha zangaphambilini ngenkathi sethula amakhono amasha ezidingweni zesicelo ezivelayo.

4. Izinto Zokupakisha ze-IC kanye Nezakhiwo Zenqubo

4.1 Izinto Ezingaphansi Kwephakheji Ye-IC

Izingxenyana ze-BT Resin

Izisekelo ze-resin ze-Bismaleimide-Triazine (BT) zinikeza ukuzinza okuhle kakhulu kobukhulu, ukumuncwa komswakama okuphansi, kanye nezakhiwo zikagesi ezithembekile. Izisekelo zephakheji ye-IC ezisekelwe ku-BT zisetshenziswa kabanzi kumadivayisi eselula, kuma-electronics abathengi, kanye nezinhlelo zokusebenza ezijwayelekile ze-BGA lapho ibhalansi yokusebenza kwezindleko ibalulekile.

I-ABF (Ifilimu Yokwakha i-Ajinomoto)

Ubuchwepheshe be-ABF buvumela ukuhanjiswa kwemigqa emincane/indawo encane ebalulekile kuma-substrate ephakethe le-IC athuthukile. Izici ze-ABF ezisezingeni eliphezulu kanye nobuchwepheshe bukagesi zisekela ukuxhumana okuxinene okudingwa ngabaprosesa abasebenza kahle kakhulu. Ukuqhubeka nokulungiswa kwezinto ze-ABF kubhekana nezidingo ezikhulayo zobubanzi bomugqa obungaphansi kwe-10μm.

Izakhiwo Zokuxhumanisa Ezinobuningi Obuningi

Izakhiwo ze-substrate ezifana ne-HDI zifaka ama-microvia, ama-blind vias, nama-billed vias ukuze kufezwe umzila onezingqimba eziningi ngaphakathi kobukhulu be-substrate obulinganiselwe. Lezi zakhiwo zivumela ubuningi bezintambo ezidingekayo emiklamo yephakheji ye-IC ethuthukisiwe esekela izinkulungwane zokuxhumeka kwesignali.

4.2 Izinqubo Zokuxhumanisa Kuphakheji Ye-IC

I-wire Bonding

Ukubopha ngentambo kusalokhu kuyindlela eyinhloko yokuxhumanisa iphakheji ye-IC ngenxa yokuguquguquka kwayo kanye nokusebenza kahle kwezindleko. Ukubopha ngentambo yegolide kunikeza ukusebenza okuthembekile kodwa ngezindleko eziphezulu zezinto zokwakha. Ukubopha ngentambo yethusi kunikeza ukonga okukhulu kwezindleko kanye nokuqhuba kukagesi okuthuthukisiwe, yize kudinga ukulawulwa kwenqubo okuqinile ukuvimbela ukulimala kwephedi yesibopho.

Ukuqhumisa Ama-Flip-Chip

I-Flip-chip bumping ifaka ama-solder alloys (ngokuvamile i-SnAgCu) noma izakhiwo zethusi kuma-die bond pads. I-Bump pitch iye yanda kancane kancane kusukela ku-200μm kuya ngaphansi kwama-50μm ezinhlelweni zephakheji ye-IC ezithuthukisiwe. Izinto ezigcwalisa ngaphansi kwe-underfill zivikela ukuxhumana kwe-bump ekucindezelekeni kwe-thermomechanical ngesikhathi sokusebenza.

Isendlalelo Sokusatshalaliswa Kabusha (RDL)

Ubuchwepheshe be-RDL busabalalisa kabusha izindawo ze-die pad ukuze kuhlangatshezwane nezidingo zokuxhumeka kwezinga lephakheji. Izendlalelo eziningi ze-RDL ekwakhiweni kwephakheji ye-IC ethuthukisiwe zivumela ukuhanjiswa okuyinkimbinkimbi phakathi kwama-die pad aphezulu kanye nokuxhumeka kwebhodi okuphansi. I-RDL iyisisekelo sezindlela zokupakisha eziphuma ku-fan.

4.3 Izinto Zokufaka I-Cupsulation

I-Mold Compound kanye ne-EMC

I-Epoxy Molding Compound (EMC) inikeza isivikelo somshini kanye nokuvalwa kwemvelo kwamaphakheji e-IC. Izakhiwo ze-EMC zanamuhla zilinganisela izici zokugeleza kokugcwalisa ngokuphelele imigodi, ukumuncwa komswakama ophansi, kanye nama-coefficients okukhulisa ukushisa afanayo ukuze kuncishiswe ukucindezeleka kwephakheji.

Izinto Zokungagcwalisi Ngaphansi

Ama-epoxies agcwalisa ngaphansi agcwalisa igebe phakathi kwama-flip-chip dies nama-substrate, esakaza ukucindezeleka kwe-thermomechanical kuyo yonke i-interface ye-die-substrate kunokuba akugxilise ekuxhumekeni kwe-bump ngayinye. Ukukhetha okufanele ukugcwalisa ngaphansi kubalulekile ekuthembekeni kwephakheji ye-IC ezindaweni zokujikeleza kokushisa.

4.4 Izakhiwo Zokuphathwa Kokushisa

Ama-Heat Slugs nama-Thermal Pads

Ama-heat slugs ayizinto zensimbi ezihambisa ukushisa ezihlanganiswe kumaphakheji e-IC ukuze ziqhube ukushisa kusukela kudayi kuya ebusweni bephakheji. Ama-thermal pad abonakalayo ngaphansi kwephakheji ahlinzeka ngendlela eqondile yokushisa eya endaweni engaphansi ye-PCB. Lezi zici zibalulekile kumaphakheji e-IC anamandla adinga ukukhishwa kokushisa okuphumelelayo.

Izixazululo Ezithuthukisiwe Zokushisa

Amaphakheji e-IC asebenza kahle kakhulu angafaka ama-heat spreader ahlanganisiwe (i-IHS) noma ama-interface aqondile e-die-to-heatsink. Ukulungiselelwa kwe-package-on-heat-spreader kuthuthukisa ukumelana nokushisa kusukela ekuhlanganeni kuya endaweni, okubalulekile ekugcineni amazinga okushisa okusebenza ezinhlelweni zamandla aphezulu.

5. Izinto Okucatshangelwayo Ngokuklanywa Kwephakheji ye-IC

5.1 Ukusebenza kukagesi

Ubuqotho Besiginali (SI)

Ukuhlaziywa kobuqotho besignali kuhlola indlela izimuncagazi zephakheji ye-IC ezithinta ngayo ikhwalithi yesignali. Izinto ezibalulekile ezikhathazayo zifaka phakathi ukungaqhubeki kwe-impedance, ukukhuluma phakathi kwezindlela zesignali eziseduze, kanye nomsindo obangelwa ukuzindla. Imiklamo yephakheji ye-IC esheshayo idinga umzila wokulandelela ngokucophelela, izakhiwo ze-impedance ezilawulwayo, kanye namasu okuqeda afanele.

Ubuqotho Bamandla (PI)

Umklamo wenethiwekhi yokulethwa kwamandla uqinisekisa ukuphakelwa kwamandla kagesi okuzinzile kudayi ngaphansi kwezimo zomthwalo oguquguqukayo. Ukubekwa kwe-capacitor yokuhlukanisa izinga lephakheji ye-IC, umklamo wamandla/wendiza yomhlaba, kanye nokusabalalisa konke ukulawulwa kwamandla kagesi okuthinta kanye nomkhawulo womsindo. Umsindo wokushintsha ngesikhathi esisodwa (SSN) kumele uphathwe ngokwakhiwa okufanele kokusabalalisa amandla.

Ukuthuthukiswa Kwemvamisa Ephakeme

Amaphakheji e-RF kanye ne-millimeter-wave IC adinga i-inductance encishisiwe ye-parasitic kanye ne-capacitance. Imigqa yokudlulisa i-impedance elawulwayo, izakhiwo zokuvikela umhlabathi, kanye nokubekwa ngokucophelela kuyizinto ezibalulekile zokuklama. Ukukhethwa kwezinto ze-substrate zephakheji (ama-dielectric aphansi) kuthinta kakhulu ukusebenza kwemvamisa ephezulu.

5.2 Umklamo Wokushisa Wephakheji Ye-IC

Amamethrikhi Okumelana Nokushisa

Amapharamitha okumelana nokushisa i-θJA (ukuhlangana-ukuya-endaweni ezungezile) kanye ne-θJC (ukuhlangana-ukuya-endaweni ezungezile) alinganisa ukusebenza kokushisa kwephakheji ye-IC. Amanani aphansi abonisa izindlela zokudlulisa ukushisa ezisebenza kahle kakhulu. Ukukhetha iphakheji kumele kuqinisekise ukuthi amazinga okushisa e-junction ahlala ngaphakathi kwezidingo zedivayisi ngaphansi kwezimo zokusebenza ezimbi kakhulu.

Izinselele Zokwenza Izinto Zibe Zincane

Amaphakheji e-IC amancane agxilisa ukushisa ngaphakathi kwevolumu encane, okwandisa ubuningi bokushisa. Izinto Zokuxhumana Ezishisayo (i-TIM) phakathi kwamaphakheji nama-heat sink kumele zikhethwe ngokucophelela ukuze kuncishiswe ukumelana kwe-interface. Izixazululo zokushisa zezinga lesistimu ziba zibaluleke kakhulu njengoba izinketho zezinga lephakheji zinqunywa yifomu.

5.3 Ukucindezeleka Kwemishini Nokuthembeka

Imiphumela Yokungafani kwe-CTE

Umehluko we-Coefficient of Thermal Expansion phakathi kwe-silicon die, i-IC package substrate, kanye ne-PCB kudala ukucindezeleka ngesikhathi sokuvakasha kwezinga lokushisa. Lokhu kungafani kwe-CTE kuqhuba ukukhathala kwamalunga e-solder, ukuqhekeka kwe-die, kanye nokwehluleka kwe-delamination. Ukwakheka kwephakheji kumele kuhambisane nalezi zingcindezi ngokukhetha izinto kanye nokwenza ngcono i-geometric.

Izindlela Zokwehluleka Ezivamile

Ukwehluleka okuvamile kwephakheji ye-IC kufaka phakathi ukuhlukanisa i-die-attach, ukukhushulwa kwe-wire bond, ukuqhekeka kwe-solder joint, kanye nokuqhekeka kwe-encapsulant. Ukuqonda izindlela zokwehluleka kuqondisa ukukhethwa kwezinto, imithetho yokuklama, kanye nokuhlolwa kwezimfanelo zokuthembeka. Ukuhlolwa kokuphila okusheshayo kuqinisekisa ukusebenza kwephakheji ye-IC ngaphansi kwezimo zokucindezeleka ezimele izindawo zokusetshenziswa kwensimu.

5.4 Umklamo Wokwenziwa Kahle

Ukuhambisana kwe-SMT

Imiklamo yephakheji ye-IC kumele ivumelane nezinqubo zokuhlanganisa ze-SMT okuhlanganisa ukuphrinta kokunamathisela i-solder, ukubekwa kwezingxenye, kanye nokushintshwa kwe-solder. I-geometry yephethini yomhlaba, i-pad pitch, kanye nemininingwane ye-package coplanarity iqinisekisa ukwakheka okuthembekile kwe-solder joint ngesikhathi sokukhiqizwa kwevolumu.

Izinto Okucatshangelwayo Ngenqubo Yokugeleza Kabusha

Izinhlobo ezahlukene zamaphakheji e-IC zinokubekezelela okuhlukahlukene kokushisa okuphinde kugeleze kanye ne-thermal gradients. Amazinga okuzwela umswakama (MSL) anquma izidingo zokuphathwa nokubhaka ngaphambi kokuhlanganiswa. Izinto zomzimba wephakheji, izinamathiseli ezinamathiselwe ngodayi, kanye namakhemikhali esikhunta kumele zisinde ekuvezweni kaningi kokuphinde kugeleze ngaphandle kokuwohloka.

6. Inqubo Yokukhiqiza Iphakheji ye-IC

6.1 Ukulungiselela Idayi

Ukunciphisa i-Wafer

Ukugaya ngemuva kunciphisa ukujiya kwe-wafer kusuka ku-700-800μm kuya ku-50μm kumaphakheji e-IC athuthukile. Ama-Thinner dies athuthukisa ukusebenza kokushisa futhi avumela ukucushwa kwe-stacked die. Ukulawula inqubo kubalulekile ukuvimbela ukuqhekeka kwe-die nokugcina ukujiya okufanayo kuyo yonke i-wafer.

I-Wafer Dicing

Ukusika kuhlukanisa ama-dies ngamanye ku-wafer ecutshunguliwe kusetshenziswa ukusaha ama-blade, ukusika nge-laser, noma ukugoba nge-plasma. Ikhwalithi yokusika ithinta ubuqotho bomphetho we-die kanye ne-assembly yield elandelayo. I-die attach film (DAF) ingasetshenziswa ngaphambi kokusika kwezinye izilungiselelo zephakheji ye-IC.

6.2 Ukuxhumanisa kanye nokuxhumana

Inqubo Yokunamathisela I-Die

I-die attach ibopha i-silicon die ku-IC package substrate noma kuhlaka lwe-lead isebenzisa ama-epoxy adhesives, i-solder, noma ama-eutectic alloys. Ukukhethwa kwezinto ze-die attach kulinganisela ukuhanjiswa kokushisa, amandla okunamathela, kanye nezidingo zokumunca ukucindezeleka. I-die attachment engenamsebenzi ibalulekile ekusebenzeni okuthembekile kokushisa kanye nokwemishini.

Ukubopha Ngentambo Nokunamathisela I-Flip-Chip

Ukubopha ngentambo kudala ukuxhumana ngokusebenzisa ukushisela kwe-ultrasonic/thermosonic kwezintambo ezincane phakathi kwama-die pads kanye nama-package leads. Ukuhlanganisa i-flip-chip kuhilela ukugeleza kabusha okukhulu kwama-bumps akhiwe ngaphambilini ukudala ukuxhumana ngasikhathi sinye. Zombili lezi zinqubo zidinga ukulungiswa okunembile kanye namapharamitha okubopha alawulwayo ukuze kuhlanganiswe iphakheji ye-IC ethembekile.

6.3 Inqubo Yokufaka I-Capsulation

Ukudlulisa Nokucindezela Ukubumba

Amandla okubumba okudlulisa afudumeza i-EMC ezimbotsheni zesikhunta eziqukethe amayunithi ephakethe le-IC ahlanganisiwe. Ukubumba kokucindezela kusebenzisa ingcindezi ekwakhiweni kokubumba okubekwe ngaphambilini, okufanele amaphakheji amancane namafomethi amakhulu ephaneli. Ukwakheka kwesikhunta kanye namapharamitha enqubo kulawula ukwakheka kwe-void, ukushanela ucingo, kanye nokugoba kwephakheji.

Ukupakishwa Kwezinga Lephaneli

Ukukhiqizwa kwephakheji ye-IC ephuma ku-Fan kusebenzisa kakhulu ukucutshungulwa kwezinga lephaneli kuma-substrate anefomethi enkulu (isb., 600mm × 600mm). Le ndlela ithuthukisa ukusebenza kahle kokukhiqiza kanye nesakhiwo sezindleko uma kuqhathaniswa nokucutshungulwa kwezinga le-wafer. Ukulawulwa kwe-warpage yamaphaneli kanye nokunemba kokubekwa kwe-die kuyinselele ebalulekile yenqubo.

6.4 Ukukhiqizwa Kwezingxenyana Ezingaphansi Kwesakhiwo

I-Layer Stack-up Design

Inani lezingqimba ze-substrate zephakheji ye-IC lisukela ezingqimbeni ezimbili kuya kwezingaphezu kwamashumi amabili kuye ngezidingo zomzila. Ukwakheka kwe-stack-up kuchaza isignali, amandla, kanye nokuhlelwa kwezingqimba zomhlabathi okuthuthukisa ukusebenza kukagesi kanye nokuzinza kwemishini. Izinto zengqimba eziyinhloko kanye nokwakheka kwazo zikhethwa ngokusekelwe ezidingweni zikagesi nezokushisa.

Ukwakheka kwe-Microvia kanye nokuqedwa kobuso

Ukubhoboza nge-laser kudala ama-microvia avumela ukuxhumana kwesendlalelo kuya kwesendlalelo kuma-substrate ephakethe le-IC elinobukhulu obuphezulu. Ngokusebenzisa ububanzi obungaphansi kuka-75μm kusekela ubuningi bomzila obuthuthukisiwe. Ukuqeda kwendawo—i-ENIG (i-Electroless Nickel Immersion Gold), i-OSP (i-Organic Solderability Preservative), kanye nezinye—kuvikela ama-pad futhi kuqinisekisa ukuthi i-solderable iyasebenza.

6.5 Ukuhlolwa kanye nokuqinisekiswa kwekhwalithi

Ukuhlolwa Kwegesi Nokubukwayo

Imishini Yokuhlola Ezenzakalelayo ( i-ATE ) yenza ukuqinisekiswa kukagesi kokusebenza kwephakheji ye-IC. Ukuhlolwa kwe-X-ray kwembula amaphutha angaphakathi njengezikhala ze-solder kanye nokungalingani kwe-wire bond. I-Confocal Scanning Acoustic Microscopy (CSAM) ithola ukuqhekeka kanye nokuqhekeka kwangaphakathi okungabhubhisi.

Ukuthembeka Ukuhlolwa

Ukuhlolwa kweziqu kuqinisekisa ukuthembeka kwephakheji ye-IC ngezimo zokucindezeleka ezisheshayo. Ukujikeleza kwezinga lokushisa (T/C), Impilo Yokusebenza Yokushisa Okuphezulu (HTOL), ukuhlolwa komswakama, kanye nokushaqeka komshini kuhlola ukusebenza kwesikhathi eside. Imiphumela yokuhlolwa isungula izilinganiso zokuthembeka futhi ihlonza izindlela ezingase zihluleke.

7. Amathrendi Esikhathi Esizayo Kubuchwepheshe Bephakheji ye-IC

7.1 Ukwakhiwa kwe-Chiplet kanye nePhakheji ye-IC Ethuthukisiwe

Ukuhlanganiswa kwe-Modular Chiplet

Ukwakhiwa kwe-Chiplet kuhlukanisa ama-SoC e-monolithic abe amabhlogo amancane asebenzayo axhunywe ngobuchwepheshe bephakheji ye-IC ethuthukisiwe. Ukumiswa kwe-Universal Chiplet Interconnect Express (UCIe) kuvumela i-ecosystem ye-chiplet yabathengisi abaningi. Le ndlela ithuthukisa isivuno, ivumela ukuxubana kwama-node enqubo angafani, futhi isheshise isikhathi sokuya emakethe.

Ukuhlanganiswa Okungafani

Amaphakheji e-IC athuthukile ahlanganisa ubuchwepheshe obuhlukahlukene—i-logic, inkumbulo, i-analog, i-RF, izinzwa—ngaphakathi kwezinhlangano ezihlanganisiwe. Lokhu kuhlanganiswa okungafani kunikeza ukusebenza kwezinga lesistimu okungenakwenzeka ngezindlela zezingxenye ezihlukene ngenkathi kugcinwa ukuguquguquka ekukhetheni ubuchwepheshe kwebhulokhi ngayinye yokusebenza.

7.2 Izinto Ezivelayo Zephakheji ye-IC

Ukuvela Kwemvelo kwe-ABF

Ubukhulu bomugqa/isikhala sezinto ze-ABF zesizukulwane esilandelayo ngaphansi kuka-5μm, okusekela ukwanda kobuningi bokuxhumana kwephakheji ye-IC. Izinhlobo ze-dielectric ezilahlekelwa kancane zibhekana nezidingo zohlelo lokusebenza oluvame kakhulu. Abaphakeli bezinto bayaqhubeka nokuthuthukiswa ukuze bahlangabezane nezidingo ze-node yobuchwepheshe be-semiconductor ezithuthukayo.

Ukuthuthukiswa Kwe-Glass Substrate

Ama-substrate engilazi anikeza ukuzinza okuphezulu kobukhulu, ukuthamba, kanye nezakhiwo zikagesi ezivame kakhulu uma kuqhathaniswa nezinye izindlela eziphilayo. Ukuthuthukiswa kwemboni esebenzayo kubhekana nezinselele zokucubungula ingilazi zezinhlelo zokusebenza zephakheji ye-IC. Ama-interposer nama-substrate asekelwe engilazini angavumela izixazululo zokupakisha ezisebenza kahle zesizukulwane esilandelayo.

7.3 Ukukhiqizwa Kwephakheji Ye-IC Yezinga Lephaneli

Ukucubungula Okunefomethi Enkulu

Ukupakishwa kwezinga lephaneli kwandisa imiqondo yokukhipha uphethiloli kumaphaneli amakhulu angunxande, okuthuthukisa kakhulu ukusebenza kahle kwemishini kanye nokusebenza kahle kwezindleko. Ukulungiswa kwemishini kanye nezinqubo kulungisa izinselele ezithile zephaneli okuhlanganisa ukuphathwa kwe-warpage kanye nokuqondaniswa kwe-die-to-panel. Lokhu kuthuthuka kokukhiqiza kusekela ukwehliswa kwezindleko zephakheji ye-IC yezinhlelo zokusebenza ezinomthamo omkhulu.

7.4 Izidingo Zephakheji ye-IC Esebenza Kakhulu

Izidingo ze-AI kanye ne-HPC

Izisheshisi zobuhlakani bokwenziwa kanye nezinhlelo zekhompyutha ezisebenzayo kakhulu ziqhuba izidingo zephakheji ye-IC ziye ku-bandwidth eyeqile, ukusatshalaliswa kokushisa, kanye namakhono okulethwa kwamandla. Ukuhlanganiswa kokupholisa okuthuthukisiwe, ukulungiswa kwenethiwekhi yokulethwa kwamandla, kanye nokuxhumana okuphezulu kakhulu kuveza izixazululo zephakheji ye-IC yesizukulwane esilandelayo yale mithwalo yemisebenzi enzima.

Package choices and assembly constraints

A package defines more than its outline. Pin assignment, pad geometry, thermal paths and inspection access need to match the approved component and assembly process.

I-8. Isifingqo

Ukupakishwa kwe-IC kuchaza indlela i-silicon die exhunywe ngayo ngogesi, ivikelwe ngomshini, futhi iphathwa ngayo ngokushisa. Kusukela ku-QFP kanye ne-BGA kuya ku-flip-chip, i-fan-out, kanye nezakhiwo ze-3D, ukukhetha ukupakishwa kuthinta ngqo ubuqotho besiginali, ukulethwa kwamandla, ukushabalaliswa kokushisa, kanye nokuthembeka kwesikhathi eside. Njengoba ukusebenza kanye nobuningi bukhuphuka, izinhlelo zezinto ezifana ne-ABF substrates, ukuxhumana okuthuthukisiwe, kanye nama-encapsulants aqinile ziba zibalulekile ekuziphatheni kwesistimu iyonke.

Isiqondiso esiwusizo sonjiniyela:

• Khetha amaphakheji ngokusekelwe ezidingweni zikagesi nezokushisa, hhayi isici sefomu kuphela.

• Hlanganisa iphakheji kanye nomklamo wokuhlanganisa we-PCB kusenesikhathi ukuze ugweme i-SI/PI kanye nokuhambisa izithiyo.

• Buyekeza idatha yokuthembeka bese ucabangela ukucindezeleka komshini, ikakhulukazi kumadivayisi ane-pitch encane noma enamandla amakhulu.

Ukuqonda okucacile kwezisekelo zephakheji ye-IC kusiza ukuqinisekisa ukusebenza okuzinzile futhi kunciphisa izingozi zokuklama ezingezansi.