Iphakheji ye-CSP: Umhlahlandlela Wobuchwepheshe Wokupakisha I-Chip Scale

1. Isingeniso: Kungani i-CSP Ibalulekile Kuma-elekthronikhi Esimanje

Izinto zikagesi zabathengi, izinto ezigqokwayo, kanye namadivayisi eselula ziyaqhubeka nokuncipha ngenkathi zifuna ukusebenza okwengeziwe. Lo mkhuba uqhubela ukupakisha kwe-IC ekujuleni kwe-I/O ngaphakathi kwezinyathelo ezincane. Amaphakheji endabuko njenge- QFP kanye ne-TQFP, avinjelwe ozimele be-lead abangaphandle, alwela ukuhlangabezana nalezi zidingo. Izilinganiso zawo zosayizi wephakheji zihlala zinkulu, zidla izindlu ze-PCB eziyigugu.

Iphakheji ye-CSP yavela njengesixazululo esibalulekile sokubopha idayisi engenalutho kanye nokupakishwa okuvamile. Ihlinzeka ngezinto ezicishe zibe usayizi ofanayo ngenkathi igcina ukukhiqizwa, ukuvivinywa, kanye nokuthembeka okudingwa yizindawo zokukhiqiza.

2. Iyini iPhakheji ye-CSP?

2.1 Incazelo Ejwayelekile

Iphakheji ye-CSP ichazwa ngokuyinhloko ngesilinganiso sosayizi wayo nedayi ye-silicon. Inqubo eyamukelwa embonini ithi ubukhulu bephakheji ye-CSP akufanele budlule indawo yedayi izikhathi eziyi-1.2. Le ncazelo yejiyometri ihlukanisa i-CSP kumaphakheji amakhulu avamile, kungakhathaliseki ukuthi ubuchwepheshe bokuxhumana kwangaphakathi busetshenziswa kanjani.

2.2 Umbono Wobunjiniyela

Ngokombono wobunjiniyela, iphakheji ye-CSP inikeza ifomethi ethengiswayo, evivinywayo, futhi elungele ukukhiqizwa ngenkathi inciphisa isijeziso sezinyawo ngaphezu kwe-silicon engenalutho. Ivumela izinqubo ezijwayelekile zokuhlanganisa i-SMT ngaphandle kokudinga ukuphathwa okukhethekile okudingwa ukufakwa kwe-die engenalutho.

2.3 Ukucaciswa Kwemingcele

Iphakheji ye-CSP inesikhundla esihlukile ohlelweni lokupakisha. Ihlukile kwidayi engenalutho, engenazo izivikelo ezivikelayo futhi idinga ukuhlanganiswa okukhethekile. Ihlukile futhi kumaphakheji ajwayelekile e-BGA angaba makhulu ngokuphindwe kaningana kunedayi yawo. I-CSP imelela ukuhlukaniswa kosayizi, hhayi isakhiwo esisodwa sokupakisha.

3. Izici Eziyinhloko Zamaphakheji E-CSP

3.1 Izinyathelo Ezincane

Isici esichazayo sanoma yiliphi iphakheji le-CSP ubukhulu bayo obuncane kakhulu. Njengoba ubukhulu bephakheji busondela kudayi uqobo, i-CSP inika amandla ukuminyana kwezingxenye okuphezulu kakhulu kuzakhiwo ze-PCB . Lokhu kubalulekile lapho indawo yebhodi ivinjelwe yizidingo zesici sefomu lomkhiqizo.

3.2 Ukuxhumana Okufushane Kukagesi

Amaphakheji e-CSP ngokwemvelo anezindlela ezimfushane zesignali phakathi kwe-die ne-PCB. Ubude obuncishisiwe bokuxhumana kunciphisa ukungena kwe-parasitic kanye nokumelana, kuthuthukisa ubuqotho besignali yezinhlelo zokusebenza zesivinini esikhulu futhi kunciphisa ukulahlekelwa kwamandla kumadivayisi asebenza ngebhethri.

3.3 Ukusebenza Okuthuthukisiwe Kwe-Thermal

Isakhiwo esiqinile samaphakheji e-CSP sakha izindlela eziqondile zokushisa kusuka ebhodini eliya kwelinye. Ngaphandle kohlaka olubanzi lwe-lead noma ama-substrate amakhulu asebenza njengezithiyo zokushisa, ukusebenza kahle kokusatshalaliswa kokushisa kuyathuthuka uma kuqhathaniswa namaphakheji endabuko e-lead.

3.4 Ubuningi be-I/O obuphezulu

Amaphakheji amaningi e-CSP asebenzisa ukuxhumana kwe-area-array kunezintambo ezingaphandle. Lolu hlelo—ngokuvamile amabhola e-solder noma ama-bumps asatshalaliswa phansi kwephakheji—luvumela ukubalwa okuphezulu kwe-I/O ngaphakathi kwesilinganiso esinqunyelwe esichaza ubuchwepheshe be-CSP.

4. Izinhlobo Ezivamile Zamaphakheji E-CSP

I-CSP iwuhlaka lokuhlukanisa oluhlanganisa izindlela eziningi zokusebenzisa. Izinhlobo eziyinhloko ziyahlukahluka ngezindlela zazo zokuxhumanisa kanye nochungechunge lokukhiqiza.

4.1 I-CSP Yesibopho Sezintambo

I-CSP yesibopho sentambo isebenzisa isibopho sentambo segolide noma sethusi sendabuko ukuxhuma ama-die pads ku-substrate encane. Le ndlela inikeza izindleko zokukhiqiza eziphansi futhi isebenzisa ingqalasizinda yokukhiqiza esemisiwe. Kodwa-ke, i-CSP yesibopho sentambo ibhekene nemikhawulo ekubalweni kwe-I/O kanye nokusebenza kwemvamisa ephezulu ngenxa yokungena kwentambo.

4.2 I-Flip-Chip CSP (FC-CSP)

I-FC-CSP iguqula indlela yokwakheka kwe-die, ixhumanisa ama-bump aseceleni asebenzayo ngqo kwi-substrate. Le ndlela ye-flip-chip isusa ama-wire loops, ihlinzeka ngokusebenza kahle kukagesi nokushisa okuphezulu. Amaphakheji e-FC-CSP ayathandwa kuma-processor asebenza kahle kakhulu kanye nezinhlelo zokusebenza ze-RF lapho ubuqotho besiginali bubaluleke kakhulu.

4.3 I-CSP Yezinga Le-Wafer (i-WLCSP)

I-WLCSP iqeda zonke izinyathelo zokupakisha ezingeni le-wafer ngaphambi kokuhlanganisa. Iphakheji ephumayo empeleni iyidayi ngokwayo enezendlalelo zokusabalalisa kabusha kanye namabhola okusoda asetshenziswayo. I-WLCSP ifinyelela usayizi wephakheji we-CSP omncane kakhulu kodwa idinga imithetho eqinile yokuklama i-PCB kanye nokulawulwa kwenqubo yokuhlanganisa.

Kubalulekile ukuqonda ukuthi i-WLCSP iyi-subset ye-CSP—akuwona wonke amaphakheji e-CSP asezingeni le-wafer, yize wonke ama-WLCSP efaneleka njenge-CSP ngokwencazelo.

5. Izinhlobo zephakheji ze-CSP vs Ezinye izinhlobo zephakheji ye-IC

Ukuqonda ukuthi i-CSP ihlobene kanjani neminye imindeni yamaphakheji kusiza ekucaciseni izindlela zokukhetha izinhlelo ezithile.

5.1 I-CSP vs i-BGA

I-CSP ichaza isigaba sosayizi; i-BGA ichaza ifomethi yesakhiwo. Iphakheji ye-ball grid array ifaneleka njenge-CSP kuphela uma ubukhulu bayo buhlangabezana nesilinganiso sosayizi we-1.2 × die. Ama-BGA amakhulu anezingqimba ezinkulu awela ngaphandle kwesigaba se-CSP naphezu kokwabelana ngesitayela esifanayo sokuxhumana.

5.2 I-CSP vs QFN

Amaphakheji e-QFN asebenzisa ama-peripheral pads avinjelwe emaphethelweni ephakheji. Lokhu kunciphisa ukukala kwe-I/O futhi kudinga amaphakheji amakhulu ukuze kubalwe amaphini aphezulu. Amaphakheji e-CSP anezixhumanisi ze-area-array anikeza ukukala okuphezulu kwe-I/O kanye nezinyathelo ezincane zokusebenza okufanayo.

5.3 I-CSP vs i-WLCSP

Lokhu kuqhathanisa kulungisa umbono ovamile ongaqondile. I-WLCSP imelela indlela eyodwa yokukhiqiza ngaphakathi kwesigaba esibanzi se-CSP. Ezinye izinhlobo ze-CSP—kufaka phakathi i-wire bond kanye nezinhlobo ze-flip-chip—zisebenzisa ukwakhiwa okusekelwe ku-substrate okuqediwe ngemuva kokusika i-wafer. I-CSP ihlanganisa zonke lezi zindlela; i-WLCSP iyinhloko yezinga le-wafer.

6. Izinto Okumelwe Zicatshangelwe Ekukhiqizeni Nokuhlanganisa Amaphakheji E-CSP

6.1 Umklamo we-PCB Pad

Amaphakheji e-CSP adinga ama-geometri ephedi aqondile anezimo eziqinile. Ukuvuleka kwemaski ye-solder, ubukhulu bephedi, kanye nokulungiselelwa kwe-via-in-pad kumele kuhambisane nezidingo ezithile zephakheji ye-CSP. Ama-pads achazwe ngemaski ye-non-solder (NSMD) avame ukucaciswa ukuze kuthuthukiswe ukuthembeka kwejoyinti le-solder.

6.2 Izinselele Zokushisela

Amabhola e-solder acwebezelayo kumaphakheji e-CSP adinga amaphrofayili okuphinda ageleze kahle. Ukushisa okunganele kubangela ukumanzisa okungaphelele; amazinga okushisa aphezulu ayingozi yokulimala. Ukuvumelana kwevolumu yokunamathisela kuba yinto ebalulekile njengoba osayizi bamabhola behla, okwenza ukwakheka kwe-stencil kanye nemingcele yokuphrinta kube yinto ebalulekile.

6.3 Imikhawulo Yokuhlola

Ukuhlolwa okubonakalayo akukwazi ukuqinisekisa amalunga e-solder afihliwe ngaphansi kwamaphakheji e-CSP. Ukuhlolwa kwe-X-ray kuyadingeka ukuqinisekisa ikhwalithi yokukhiqiza. Izinhlelo ze-X-ray ezizenzakalelayo kumele zixazulule amalunga ngamanye futhi zithole amaphutha afana nezimbobo, amabhuloho, kanye nezimo zekhanda elisecaleni.

6.4 Ukukhathazeka Ngokuthembeka

Amaphakheji e-CSP aveza izinto ezithile eziphathelene nokuthembeka okuhlanganisa ukucindezeleka kokujikeleza kokushisa, ukusebenza kokuhlolwa kokuwa, kanye nokusebenzisana kwe-package warpage ne-PCB flatness. Ukuxhumeka okuqondile kwe-die-to-board kusho ukuthi i-coefficient yokungafani kokwanda kokushisa idlulisela ngqo kumajoyinti e-solder kunakumaphakheji anezinhlaka zokuqondisa ezihambisanayo.

7. Izicelo Ezijwayelekile Zamaphakheji E-CSP

Ukukhethwa kwezicelo zamaphakheji e-CSP kulandela izici zawo zobuchwepheshe kunezigaba ezijwayelekile zemboni.

7.1 Amadivayisi Eselula Nagqokekayo

Imikhawulo yosayizi kuma-smartphone, ama-smartwatches, nama-earbud yenza amaphakheji e-CSP abe abalulekile. Umkhawulo omncane uhumusha ngqo imikhiqizo emincane noma ukusebenza okwandisiwe ngaphakathi kobukhulu obungaguquki. Ukusebenza kwamandla aphansi kuzuza ngokulahlekelwa okuncishisiwe kokuxhumeka.

7.2 Imemori Esheshayo Namaphrosesa

Izidingo zobuqotho besiginali kumemori ye-DDR, amaphrosesa ohlelo lokusebenza, kanye nezixhumi zesivinini esikhulu zisekela ukusetshenziswa kwe-CSP. Ukuxhumana okufushane kunciphisa ukuwohloka kwesiginali, okuvumela amazinga aphezulu edatha ngaphandle kokubeka engcupheni imingcele yesikhathi.

7.3 Ama-elekthronikhi Abathengi Anesikhala Esincane

Imikhiqizo lapho indawo ye-PCB ilinganiselwe kakhulu—njengezinzwa ze-IoT, izifakelo zezokwelapha, namakhamera amancane—isebenzisa amaphakheji e-CSP ukuze kufezwe ukusebenza okudingekayo. Ubuningi be-I/O obuphezulu buvumela amadivayisi ayinkimbinkimbi ngaphakathi kwesabelomali sosayizi esiqinile.

8. Izinzuzo kanye nemikhawulo yamaphakheji e-CSP

8.1 Izinzuzo

Amaphakheji e-CSP aletha izinzuzo ezilinganisekayo ekunciphiseni usayizi, ukusebenza kukagesi, kanye nobuningi bokuhlanganiswa. Umkhawulo omncane wenza umkhiqizo ube mncane. Izindlela zesignali ezimfushane zithuthukisa ukuziphatha kwemvamisa ephezulu. Ukuxhumeka kwendawo kusekela ukubalwa okuphezulu kwe-I/O kunezinye izindlela ze-peripheral-lead ezinobukhulu obufanayo.

8.2 Ukulinganiselwa

Ukwamukelwa kwe-CSP kuhilela ukushintshana kobunjiniyela. Ukuhlanganiswa kudinga ukulawulwa kwenqubo okuqinile kanye nemishini yokuhlola eyinkimbinkimbi kakhulu. Ukulungiswa kabusha kuba nzima noma kungasebenzi kwezinye izinhlobo ze-CSP. Ukwenziwa kwe-PCB kumele kusekele izici ezinhle kakhulu. Ukulungiswa kwezindleko zesistimu iyonke—hhayi nje izindleko zezingxenye—kunquma ukuthi i-CSP iletha inani eliphelele.

9. Isiphetho: Ukuqonda Ubuchwepheshe Bephakheji Ye-CSP Ngokufanele

Amaphuzu amathathu abalulekile afingqa ukuqonda okulungile kobuchwepheshe kwamaphakheji e-CSP.

Okokuqala, i-CSP ngokuyisisekelo iwukuhlukaniswa okusekelwe kusayizi. Inqubo yendawo ye-1.2× die ichaza isigaba, hhayi noma yiluphi ubuchwepheshe obuthile bokuxhumana noma inqubo yokukhiqiza.

Okwesibili, izinhlobo eziningi ezahlukene zamaphakheji ziwela ngaphansi kwesambulela se-CSP. Izibopho zentambo, i-flip-chip, kanye nokusetshenziswa kwezinga le-wafer ngayinye ifaneleka njenge-CSP uma ihlangabezana nesilinganiso sosayizi, naphezu komehluko omkhulu ekwakhiweni nasekusebenzeni.

Okwesithathu, ukukhethwa kwe-CSP kufanele kuvele ekuhlaziyweni kobunjiniyela bezinga lesistimu. Isinqumo sihilela ikhono le-PCB, ukuvuthwa kwenqubo yokuhlanganisa, izidingo zokuthembeka, kanye nezindleko eziphelele zobunikazi—hhayi nje ukucabanga ukuthi ukupakisha okuncane kungcono kakhulu ngokwemvelo.

Ukuqonda lokhu kuhlukanisa kwenza kube lula ukukhetha iphakheji ye-CSP efanele ngokusekelwe ezidingweni zangempela zohlelo lokusebenza kunezibikezelo ezijwayelekile mayelana nobuchwepheshe bokupakisha.