Iphakheji ye-LGA: Isakhiwo, Izinzuzo, kanye Nomhlahlandlela Wokuklama we-PCB

1. Isingeniso: Kungani Iphakheji ye-LGA Ibalulekile Kuma-elekthronikhi Esimanje

Isidingo sokubalwa okuphezulu kwe-I/O, isivinini sesignali esisheshayo, kanye nokuphathwa kokushisa okuthuthukisiwe kuyaqhubeka nokuthuthukisa ukupakishwa kwe-semiconductor. Amaphakheji endabuko afana ne -QFP abhekene nemikhawulo ekuxineni kwephini kanye nobuqotho besignali kumaza aphezulu, kuyilapho amaphakheji e-BGA , nakuba esebenza kahle, ethula izinselele ezihlobene nokuhlolwa kanye nokusebenza kabusha kwejoyinti le-solder.

Iphakheji ye-Land Grid Array (LGA) ibhekana nalezi zithiyo ngendlela ehluke ngokuphelele: ama-contact pad ensimbi ayisicaba ngaphansi kwephakheji, asuse amaphini avelele noma amabhola okusonga. Lo mklamo uvumela ukuxhumana ngengcindezi yesokhethi noma ukusonga kwe-PCB ngqo, okunikeza onjiniyela ukuguquguquka ezinhlelweni zokusebenza eziphezulu.

Lesi sihloko sihlola isakhiwo sephakheji ye-LGA, izinzuzo, imikhawulo, imiphumela yokuklama i-PCB, kanye nezimo zohlelo lokusebenza.

2. Iyini iPhakheji ye-LGA?

2.1 Incazelo Yephakheji Ye-LGA

I-LGA imele i-Land Grid Array. Ngokungafani namaphakheji anezintambo ezivelele noma amabhola e-solder anamathiselwe, iphakheji ye-LGA inezinhlobo eziningi zama-pads ensimbi ayisicaba (awela) ebusweni bayo obungaphansi. Ukuxhumeka kukagesi kwenzeka ngenye yezindlela ezimbili: ukucindezela komshini okuvela kusokhethi ye-LGA enokuxhumana okugcwele intwasahlobo, noma ukugoqa ngqo kuma-pads e-PCB ahambisanayo. Ukungabikho kwezakhiwo zebhola noma zephini engxenyeni ngokwayo kudlulisela ubunzima bokuxhumeka kusokhethi noma enhlanganweni yebhodi.

2.2 Indlela i-LGA Ehluke Ngayo Ku-PGA Ne-BGA

Umehluko ukhona lapho isakhiwo sokuxhumana sikhona. Amaphakheji e-Pin Grid Array (PGA) anamaphini anamathiselwe engxenyeni efaka emigodini yesokhethi. Amaphakheji e-Ball Grid Array (BGA) aphethe amabhola e-solder aphinde ageleze kuma-PCB pads ngesikhathi sokuhlanganiswa. Amaphakheji e-LGA ashintsha lo mbono: zonke izakhiwo zokuxhumana eziphakanyisiwe zikhona kusokhethi noma ohlangothini lwe-PCB, okushiya iphakheji inama-flat pads kuphela. Lo mehluko wokwakha uthinta izindlela zokuhlanganisa, izinqubo zokufaka esikhundleni, kanye nezinketho ze-interface yokushisa.

3. Isakhiwo Sephakheji Ye-LGA Nezingxenye Zayo

3.1 Ama-Contact Pads Aphansi

Ingxenye engezansi yephakheji ye-LGA inikeza uhlu oluningi lwama-pads ensimbi, avame ukuqedwa nge-nickel/gold (Ni/Au) plating yokumelana nokushiswa kwe-oxidation kanye nokuxhumana okuthembekile. Lawa ma-pads ahlelwe ngephethini yegridi enamanani e-pitch avame ukuba ngaphansi kwe-1mm. Ngokungafani namaphakheji e-BGA lapho amabhola e-solder ehlinzeka ngokuzivumelanisa ngesikhathi sokugeleza kabusha, ama-pads e-LGA adinga indawo eqondile yomshini njengoba kungekho ndlela yokuzigxilisa phakathi nesikhathi sokuhlanganiswa.

3.2 Izixhumi Ezingaphansi kanye Nezangaphakathi

Ngaphezulu kwe-contact array kuhleli i-package substrate, eyakhiwe nge-organic laminate noma izinto ze-ceramic kuye ngezidingo zokusebenza. I-die inamathela kule substrate ngokubopha ucingo noma ukuxhumana kwe-flip-chip. Amaphakheji e-LGA asebenza kahle kakhulu ngokuvamile asebenzisa ubuchwepheshe be-flip-chip ukuze athole izindlela ezimfushane zesignali kanye nezici zikagesi ezingcono. I-substrate ihambisa izimpawu kusukela ku-die iye kuma-contact pad angaphandle ngezingqimba eziningi zangaphakathi.

3.3 Ukwakhiwa Kwesistimu Yesokhethi

Ezinhlelweni ezisekelwe kusokhethi, isokhethi le-LGA lakha ingxenye ebalulekile yesistimu. Oxhumana nabo abalayishwe ngentwasahlobo ngaphakathi kwesokhethi bacindezela iphakethe lapho indlela yokugcina ifaka umthwalo. Le ndlela ngokuvamile ifaka ipuleti lomthwalo kanye nohlelo lwe-lever olusabalalisa amandla ngokulinganayo kubo bonke oxhumana nabo. Ikhwalithi yesokhethi inquma ngqo ukumelana koxhumana nabo, ukuthembeka kwesikhathi eside, kanye nemijikelezo yokusebenza ephezulu.

4. Izinzuzo Zobuchwepheshe Bephakheji Ye-LGA

4.1 Ubuningi be-I/O obuphezulu

Ngaphandle kwamabhola e-solder athatha isikhala esiqondile, amaphakheji e-LGA afinyelela ama-pad pitches aqinile kanye nokubalwa okuphezulu kwe-I/O ngaphakathi kwezinyathelo ezilinganayo. Le nzuzo yobuningi ibalulekile kuma-processor anamuhla nama-ASIC adinga izinkulungwane zokuxhumeka. Onjiniyela bangasebenzisa ukusebenza okwengeziwe ezindaweni zebhodi ezivinjelwe ngenkathi begcina ukuguquguquka komzila wesignali.

4.2 Ukusebenza Okuthuthukisiwe Kukagesi

Isakhiwo sephakheji ye-LGA sinciphisa ukungena kwe-parasitic ngokususa ubude bebhola noma bephini endleleni yesignali. Ukuxhumeka okufushane kuhumusha ekunciphisweni kokungaqhubeki kwe-impedance kanye nokuqina kwesignali okuthuthukisiwe kumaza aphezulu. Kuzinhlelo zokusebenza ezifuna i-jitter ephansi kanye nemiphetho yesignali ehlanzekile, le nzuzo kagesi ithinta ngqo imingcele yokusebenza kwesistimu.

4.3 Izinzuzo Zokushisa Nezomshini

Amaphakheji e-LGA avumela ukunamatheliswa kwe-heatsink ngqo esivalweni sephakheji ngaphandle kwezakhiwo eziphakathi nendawo ezibeka engcupheni ukudluliselwa kokushisa. Ukuxhumeka okusekelwe kusokhethi kusabalalisa ukucindezeleka komshini ngokulinganayo, kunciphisa ukucindezeleka kwendawo okubangela ukukhathala kwamalunga e-solder kuma-BGA assemblies. Lokhu kulungiselelwa kuthuthukisa ukuthembeka kwesikhathi eside ngaphansi kwezimo zokujikeleza kokushisa.

4.4 Ukushintshwa Kwengxenye

Amaphakheji e-LGA afakwe kusokhethi avumela ukushintshwa kwama-chip ngaphandle kokusebenza kokushintshwa noma ukususwa kwe-solder. Leli khono liba usizo ezindaweni zokuthuthukiswa, amapulatifomu eseva adinga ukuthuthukiswa kwensimu, kanye nezinhlelo zokuhlola lapho ukushintshaniswa kwezingxenye kwenzeka khona njalo. Inqubo yokufaka esikhundleni engonakalisi inciphisa isikhathi sokulungisa futhi iqeda umonakalo webhodi obangelwe ukuvuselelwa.

5. Izinselele kanye nemikhawulo yamaphakheji e-LGA

5.1 Izidingo Zokulungiswa Komhlangano

Amaphakheji e-LGA awanalo isici sokuzivumelanisa esinikezwa ukucindezeleka kobuso be-solder ekuhlanganisweni kwe-BGA. Ukunemba kokubekwa kuncike ngokuphelele ekuqondeni kwemishini yokukhetha nokubeka kanye nokubekwa kwephedi ye-PCB. Izidingo zokubambisana kokubili kwephakheji kanye nebhodi ziba nzima kakhulu, njengoba izindawo ezingalingani ziphumela ekuxhumekeni okuvulekile.

5.2 Izindleko Zesokhethi Nobunzima

Amasokhethi e-LGA asezingeni eliphezulu anokuxhumana okuthembekile kwentwasahlobo amelela ukwengezwa okukhulu kwezindleko ze-BOM. Lawa masokhethi ahlala ezindaweni zebhodi ngale kwesisekelo sephakheji futhi aneza izinyathelo zokuhlanganisa. Ngezinhlelo zokusebenza ezibucayi noma imiklamo encishisiwe yesikhala, i-overhead yesokhethi ingase ibe ngaphezu kwezinzuzo zokushintsha.

5.3 Izinselele Zokusoda Okuqondile

Uma amaphakheji e-LGA ehlanganiswa ngqo kuma-PCB kunokuba ahlanganiswe, ifasitela lenqubo liyancipha kakhulu. Ivolumu yokunamathisela i-solder, ukwakheka kwe-stencil aperture, kanye nokulawulwa kwephrofayili yokugeleza kabusha kudinga ukubekezelelana okuqinile kunezinqubo ezifanayo ze-BGA. Ukuhlolwa nakho kuba nzima kakhulu, njengoba isithombe se-X-ray samajoyinti ephedi ayisicaba sinikeza ukuhlolwa okuncane okucacile kunokuxhumana okumise okwebhola.

5.4 Ukuzwela Kokungcola

Izindawo zokuthintana ezisicaba zamaphakheji e-LGA zisengozini yothuli, i-oxidation, kanye nokungcola kokuphatha. Ngokungafani namajoyinti e-solder akha izibopho ze-metallurgical, ukuxhumana kwengcindezi kudinga izindawo ezihlanzekile ukuze kuxhunywe okungamelani kakhulu. Izindawo zokuhlanganisa kanye nezimo zokugcina zidinga ukulawulwa kokungcola okuqinile uma kuqhathaniswa namaphakheji ahlanganiswe unomphela.

6. Izinto Okucatshangwayo Ngokuklama Nokuhlanganisa i-PCB Ngamaphakheji e-LGA

6.1 Izidingo Zokuklama Amaphedi e-PCB

Ukuhlelwa kwephedi ye-LGA kudinga imininingwane eqondile yokufanisa iphakheji yokulawula ubukhulu. Ukukhethwa kokuqedwa kwendawo kuthinta ukuthembeka kokuthintana, kanti i-ENIG (i-Electroless Nickel Immersion Gold) iyisinqumo esiyinhloko ngenxa yezakhiwo zayo eziyisicaba, ezithengiswayo, kanye nezingamelani ne-oxidation. Ukulingana kwephedi kulo lonke unyawo kumele kuhlale ngaphakathi kokubekezelelana okuqinile ukuqinisekisa ukuthi bonke othintana nabo bahlanganyela kahle ngaphansi kwengcindezi yesokhethi.

6.2 Izilawuli Zenqubo Yokuhlanganisa

Kuzinhlelo zokusebenza ze-LGA ezifakwe i-solder, ukufakwa kwe-solder paste kudinga ivolumu ehambisanayo kanye nokumbozwa kuwo wonke ama-pads. Ubukhulu be-stencil kanye ne-geometry yokuvula kuthinta ngqo ukwakheka kwamalunga. Amaphrofayili okugeleza kabusha kumele avumelane nesisindo sokushisa samaphakheji e-LGA ngenkathi egcina amafasitela afanele isikhathi esingaphezu koketshezi. Ukuhlolwa kokugeleza kabusha kuncike kakhulu ezinhlelweni ze-X-ray, njengoba ukuhlolwa okubonakalayo kungakwazi ukuhlola ukuxhumana kwama-pad afihliwe.

6.3 Ukuqhathaniswa ne-BGA Assembly

Nakuba i-BGA assembly izuza ngokuzivumelanisa kwebhola le-solder kanye ne-geometry yamalunga ehambisanayo, i-LGA assembly incike kakhulu ekuqondeni kokubekwa kwemishini. Ukuhlolwa kwe-BGA kungahlola ukubhidlika kwebhola kanye nesimo nge-X-ray, kuyilapho i-LGA joints iveza amaphrofayili athambile anezici ezingahlukaniseki kakhulu. Lokhu kwehluka kudinga izindlela zokuqinisekisa inqubo ezilungisiwe kanye nezindlela zokuhlola zokusetshenziswa kwe-LGA.

7. Izicelo Ezijwayelekile Zamaphakheji E-LGA

Ubuchwepheshe bephakheji ye-LGA busetshenziswa kakhulu ezinhlelweni zokusebenza ezifuna ukusebenza okuphezulu kanye nokuthuthukiswa okungenzeka kwensimu.

• Ama-CPU nama -GPU aphezulu – Ubuningi be-I/O obuphezulu kanye nezindlela zokushisa ezisebenza kahle zisekela amapulatifomu edeskithophu namaseva asebenzisa kakhulu ukusebenza.

• Amaprosesa esikhungo sedatha - Amaphakheji e-LGA afakwe isokhethi avumela ukuthuthukiswa kwamaprosesa nokuvuselelwa kwehadiwe ngaphandle kokufakwa kwebhodi eligcwele.

• Amaprosesa enethiwekhi kanye nama-ASIC okuxhumana - Imiphumela ephansi ye-parasitic kanye nokuxhumana okufushane kusekela ubuqotho besignali ye-multi-gigabit.

• Izinhlelo zokulawula zezimboni – Imiklamo ye-LGA esekelwe kusokhethi inikeza ukuguquguquka kokuthuthukiswa, ukuqinisekiswa, kanye nokusekelwa komjikelezo wokuphila isikhathi eside.

• Imishini yokuhlola ezenzakalelayo (i-ATE) – Ukushintshana kwezingxenye kanye nokusebenza kokuxhumana okuphindaphindwayo kwenza kube lula ukuhlola nokulungisa imisebenzi.

Sekukonke, amaphakheji e-LGA ayathandwa ezinhlelweni lapho ukuminyana okuphezulu kwe-I/O, ukusebenza kukagesi, kanye nokulungiselelwa kahle kuvumela ukuba kube yinkimbinkimbi yesokhethi kanye nokuhlanganiswa.

8. Izindlela Zokukhetha Iphakheji ye-LGA

Izinqumo zobunjiniyela mayelana nokwamukelwa kwephakheji ye-LGA kufanele zihlole izici eziningana.

• Izidingo zokubalwa kwe-I/O kanye nobuningi - Nquma ukuthi izinzuzo zokuxhumeka kwe-LGA ezinobuningi obukhulu ziyavumelana yini nokwakheka okwengeziwe kanye nobunzima bokuhlanganiswa.

• Imigomo yokuvama kwesignali kanye nobuqotho - Hlola ukuthi izindlela ezimfushane zokuxhumanisa ziletha izinzuzo zokusebenza ezilinganisekayo ngamanani edatha ahlosiwe.

• Isu lokujikeleza kwesistimu kanye nokuthuthukisa - Hlola isidingo sokushintsha insimu lapho ukhetha phakathi kokusetshenziswa kwe-LGA okune-socket kanye nokusetshenziswa kwe-direct-solder.

• Amandla okukhiqiza kanye nokubekezelelana - Qinisekisa ukuthi ukunemba kokwenziwa kwe-PCB kanye nezinqubo zokuhlanganisa zingasekela ngokuthembekile izidingo ze-LGA.

• Izindleko eziphelele - Izindleko zokulinganisela, ukulawulwa kwenqubo okuqinile, kanye nemiphumela engaba khona yenzuzo ngokumelene nokusebenza kanye nenzuzo yesevisi.

Ukukhethwa kwephakheji ye-LGA kuyisinqumo sokushintshana okumele sivumelanise izinto eziza kuqala kugesi, kwemishini, kokukhiqiza, kanye nomjikelezo wokuphila ezingeni lesistimu.

9. Isiphetho: Inani Lephakheji ye-LGA kanye nemingcele Yesicelo

Ubuchwepheshe bephakheji ye-LGA bumelela ikhambi eliqondiwe lezinhlelo zokusebenza ze-semiconductor ezisebenza kakhulu, lapho izidingo ze-I/O, ubuqotho besiginali, kanye nokukhetha kokuklama kokushayela kokuguquguquka kwengxenye.

Ukwakhiwa kwe-flat-pad kunikeza izinzuzo zangempela ekusebenzeni kukagesi kanye nokuphathwa kokushisa ngenkathi kuvumela ukushintshwa kwezingxenye ezingonakalisi ekucushweni kwe-socket. Kodwa-ke, lezi zinzuzo ziza nezidingo ezengeziwe zokunemba kokuhlanganiswa, izindleko eziphezulu ze-socket, kanye namafasitela enqubo amancane okusetshenziswa kwe-direct-solder.

I-LGA ayiyona engcono ngokwemvelo kune-BGA noma ezinye izinhlobo zamaphakheji—kunalokho, ikhonza izidingo ezithile zobunjiniyela lapho izici zayo zihambisana nezinhloso zesistimu. Ukwamukelwa ngempumelelo kuncike ekufaniseni amakhono e-LGA nezidingo zohlelo lokusebenza, amakhono okukhiqiza, kanye nezidingo zomjikelezo wokuphila.