Iyini i-wire bonding ku-PCB?

Kuyini i-Wire Bonding?

I-wire bonding iyindlela ebalulekile ekwenziweni kwe-semiconductor yokuxhuma amasekethe ahlanganisiwe (ICs) ezintweni zikagesi naphakathi kwama-PCB. Igqama ngokusebenza kahle kwayo kwezindleko kanye nokuqina ekwenzeni ukuxhumana. Kusetshenziswa izindlela zokushisela kanye namasu ahlukahlukene, ukubopha ngocingo kuhilela ukunamathisela izintambo zensimbi ngokunembile kuma-chips, okudinga ubuchwepheshe obuphezulu bobuchwepheshe ukuze kuqinisekiswe ukuxhumana okunembile nokuqinile. Ukuvela kwe-wire bonding kuye kwabhekana nokulinganiselwa kwezindlela ezindala zokuhlanganisa i-solder, okuthuthukisa ukwethembeka nokusebenza kwezinhlelo ze-semiconductor.

Ukubopha ngentambo kushintsha izidingo ze-PCB mayelana nokuqeda amaphedi, ukuhlanzeka, ukuhlanzwa kwesikhala, kanye nokuphathwa kwephakeji, ngakho-ke kufanele kuchazwe kanye nokukhetha ukuqeda kwendawo ye-PCB , kanye namadivayisi asebenzisa iphimbo elincane, izilawuli zokuhlanganisa amaphakeji ezithuthukisiwe.

Yiziphi izicelo?

Funny

Ekwenziweni kwamaselula, i-wire bonding, ikakhulukazi yamaphakethe ebhethri, inikeza izinzuzo ngaphezu kokushisela kwendawo okuvamile. Le nqubo, isebenzisa amandla e-ultrasonic, yenza ukuxhumana okuthembeke kakhudlwana futhi okungalimazi kakhulu phakathi kwamaseli ebhethri, okuthuthukisa ukuphila nokusebenza kwebhethri. Ibhekana nemikhawulo yokushisela indawo, njengamasekhethi amafushane angaba khona kanye nemiphumela engemihle ohlelweni lokuphatha amabhethri (BMS) ngenxa yamazinga okushisa aphezulu nokuxhumeka okuxekethile, okwenza ukuhlanganisa izintambo kube ukukhetha okuthandwayo kokuhlanganisa amaphakethe ebhethri embonini.

Izithuthi

Ezimotweni zikagesi, i-wire bonding isetshenziswa ezinhlelweni zokuphatha ibhethri ukuxhuma amaseli ebhethri ngamanye, ukuqinisekisa ukusatshalaliswa nokuphathwa kwamandla ngendlela efanele.
Ephaketheni lebhethri lemoto kagesi, ukuxhuma amaseli angama-cylindrical kubha yebhasi kumabhethri kuhlanganisa amasu ahlukahlukene afana ne-wire bonding, i-laser welding, kanye nokushisela indawo. I-wire bonding, isebenzisa amandla e-ultrasonic, yakha isibopho esiqinile se-athomu ngokususa ungqimba lwe-oxide ku-aluminium, okuthuthukisa ukwethembeka koxhumano. Le ndlela inenzuzo ikakhulukazi ekuthuthukiseni inqubo ngokusebenzisa imvelo yokuzikhawulela ye-aluminium oxide, iqinisekisa ukudluliswa kwe-electron okusebenzayo kokuxhumana okuhlala isikhathi eside.

Amadivayisi Ezokwelapha:

Kuma-pacemaker, i-wire bonding ixhuma ukujikeleza kokulawula kwedivayisi kumthombo wayo wamandla nama-electrode ezwa, okubalulekile ekusebenzeni okuthembekile. Emishinini yezokwelapha, i-wire bonding ibalulekile kumadivayisi afakelwayo njengama-pacemaker nama-defibrillators. Lawa madivayisi athembele ekubopheni izintambo ukuze axhume chip ye-silicon ngaphakathi kwedivayisi kumthombo wayo wamandla namatheminali okukhiphayo. Lokhu kuqinisekisa ukuthi idivayisi ingakwazi ukuqapha isigqi senhliziyo ngokunembile futhi ilethe amathonya kagesi lapho kudingeka, ngokwethembeka nokunemba okubalulekile ekuphepheni kwesiguli nokuphila isikhathi eside kwedivayisi.

I-Aerospace:

Kumasathelayithi, i-wire bonding isetshenziselwa ukuxhuma ama-solar cell array ezinhlelweni zokuphatha amandla, okubalulekile ekunikezeni amandla ezimeni zesikhala. Emkhathini, i-wire bonding isetshenziswa ezinhlelweni zesathelayithi, ikakhulukazi ukuxhuma amaphaneli elanga ohlelweni lokuphatha amandla. Lokhu kuqinisekisa ukudluliswa kwamandla okuphumelelayo kusuka kumaphaneli elanga kuya ezinhlelweni zesathelayithi, okubalulekile ekusebenzeni kwesikhathi eside kwesathelayithi endaweni enzima yendawo lapho ukwethembeka nokuqina kubaluleke kakhulu.

Ngezinqumo zokukhiqiza ezihlobene, i-Highleap iphinde ibhale phansi ukwesekwa kokukhiqiza kwe-elekthronikhi kanye nezingxenye zebhodi lesifunda , okungasiza ekuvimbeleni amanothi angacacile kuphakheji yesilinganiso.

Inzuzo ye-wire bonding

Ukunemba kwezingxenye ezincane.
Ukuminyana okuphezulu kokuxhumeka ngaphandle kwesikhala se-PCB esengeziwe.
Ukuncipha kwengcindezi yokushisa ezingxenyeni ezibucayi.
Ukuthembeka okuthuthukisiwe kwezinhlelo zokusebenza ezisebenza kahle kakhulu.
Ilungele ukuxhuma ama-ICs ngqo kwamanye noma ku-PCB ezindaweni eziqinile.

Inhloso eyinhloko yokuhlanganisa izintambo kubuchwepheshe, ikakhulukazi endaweni yezinhlelo zokusebenza ze-PCB ezinemvamisa ephezulu (ngaphezulu kwe-GHz), ukuqinisekisa ukuxhumana okuthembekile nokuqina phakathi kwama-chips nezixhumi. Ibalulekile ekugcineni ubuqotho bamasiginali kanye nama-voltage pulses abalulekile kuma-electronics wesimanje. I-wire bonding isekela ukuxhumana kwesikhathi sangempela phakathi kwezingxenye, ukunciphisa ukuhlanekezela kwesignali nokwenza lula ukudluliswa kwedatha ngesivinini esikhulu. Lokhu kuyenza ibaluleke kakhulu emikhakheni efana nokukhiqiza i-EV, lapho ukusebenza nokuthembeka kubaluleke kakhulu.

Izindlela zokuhlanganisa i-wire Bonding

• I-Thermosonic Bonding: Ihlanganisa ukushisa, amandla e-ultrasonic, namandla ukuze ibophe izintambo, ngokuvamile igolide noma ithusi, ku-substrate. Kuyindlela evame kakhulu, esetshenziswa kakhulu ekufakweni kwe-semiconductor.
• I-Ultrasonic Bonding: Isebenzisa ukudlidliza kwe-ultrasonic ngaphandle kokufaka ukushisa kwangaphandle (noma ukushisa okuncane) ukuze ibophe izintambo ze-aluminium, ezilungele izingxenye ezibucayi.
• I-Thermocompression Bonding: Ithembele ekushiseni nasekuphoqeni ukufeza isibopho, ngaphandle kwamandla e-ultrasonic, afanele izinhlelo zokusebenza ezithile lapho ukudlidliza kwe-ultrasonic kungase kube yingozi.

Izinto ezivamile ezisetshenziswa ekubopheni ucingo

• Igolide (Au): Incanyelwa ukusebenza kahle kwayo, ukumelana nokugqwala, kanye ne-ductility, iyenze ifanelekele ukubopha kwe-thermosonic.
• I-Aluminium (Al): Isetshenziselwa kakhulu ukuqhutshwa kwayo okuhle kukagesi kanye nezindleko eziphansi, ezifanele i-ultrasonic ne-thermocompression bonding.
• I-Copper (Cu): Ihlinzeka ngokusebenza okuphezulu kukagesi nokushisayo uma kuqhathaniswa ne-aluminium futhi isetshenziswa ngokuya ngamandla ayo okusebenza, nakuba idinga ukuphathwa ngokucophelela ngenxa ye-oxidation.

Izinto ezivamile ezisetshenziswa ekubopheni ucingo

• Igolide (Au): Incanyelwa ukusebenza kahle kwayo, ukumelana nokugqwala, kanye ne-ductility, iyenze ifanelekele ukubopha kwe-thermosonic.
• I-Aluminium (Al): Isetshenziselwa kakhulu ukuqhutshwa kwayo okuhle kukagesi kanye nezindleko eziphansi, ezifanele i-ultrasonic ne-thermocompression bonding.
• I-Copper (Cu): Ihlinzeka ngokusebenza okuphezulu kukagesi nokushisayo uma kuqhathaniswa ne-aluminium futhi isetshenziswa ngokuya ngamandla ayo okusebenza, nakuba idinga ukuphathwa ngokucophelela ngenxa ye-oxidation.

Inqubo yokuhlanganisa ucingo

• Ukwakhiwa Kwebhola: Ibhola elincane lakhiwa ekugcineni kocingo kusetshenziswa ilangabi lomlilo noma ukukhishwa kwe-electronic.
• Ukuqondanisa: Intambo iqondaniswe nephedi yokubopha ku-chip noma i-substrate.
• Ukubopha: Ibhola licindezelwa kuphedi kusetshenziswa ukushisa, amandla e-ultrasonic, noma kokubili.
• I-Loop Formation: Intambo iboshiwe iye endaweni yokubopha elandelayo ukuze kugcinwe ukuguquguquka nokunciphisa ingcindezi.
• Ukwakhiwa Kwebhondi Yesibili: Intambo iboshelwa kuphedi elilandelayo, futhi ucingo oludlulele luyanqanyulwa.

Inselele yokubopha izintambo

Ukuqonda uhlelo lokusebenza kanye nezici zemvelo kubalulekile ekuthembekeni kwebhondi yezintambo. Izinto ezifana nezinga lokushisa eliphakanyisiwe, umswakama, nokuhamba ngebhayisikili kwezinga lokushisa kungaholela ekuhlulekeni ngenxa yezinkinga ezifana nokwakheka kwenhlanganisela ye-intermetallic, ukugqwala (okuhlanganisa ukugqwala kwe-galvanic ezinhlelweni ze-Au-Al), kanye nengcindezi ye-thermomechanical evela ekungafaniseni kwe-CTE. Lezi zinselele zidinga ukuqonda okuphelele kwezinhlelo zensimbi nomthelela wemvelo ukuze kuthuthukiswe ukuqina nokusebenza kwebhondi yezintambo.