Qonda ukuthi iyini i-ENIG Black Pad nokuthi ungayigwema kanjani?

I-ENIG (i-Electroless Nickel Immersion Gold) Black Pad ibhekisela ephutheni elithile elenzeka enqubweni yokukhiqiza amabhodi wesekethe aphrintiwe (ama-PCB) asebenzisa ukuqeda kobuso be -ENIG . Lokhu kwehluleka kubonakala ngokwakheka kokubonakala okumnyama noma okumnyama kungqimba lwe-nickel, okuvame ukutholakala ngaphansi kwengqimba yegolide kuma-PCB aqediwe yi-ENIG. Isenzakalo se-black pad sithinta kakhulu ukushintshwa kanye nokuthembeka kwama-PCB, njengoba kubeka engcupheni ubuqotho bamalunga e-solder phakathi kwe-PCB kanye nezingxenye.

Yini ebangela i-ENIG Black Pad?

Udaba lwephedi elimnyama ngokuvamile lubangelwa izinkinga enqubweni yamakhemikhali ngesikhathi sesiteji se-nickel plating. Izinto ezinomthelela kulokhu kuphazamiseka zihlanganisa:

I-Phosphorus Eningi Ku-Nickel Bath

Inkinga eyinhloko ivamise ukulandelela emuva kuzimo ezingaphakathi kwendawo yokugezela ye-nickel, okuqukethwe kwe-phosphorus eningi okuba yinto eyinhloko ekhathazayo. I-Phosphorus yengezwa ku-nickel ukwandisa ukumelana nokugqwala kanye nobulukhuni. Kodwa-ke, lapho okuqukethwe kwe-phosphorus kweqa uhla olufanele (imvamisa engu-7% -11%), kungaholela kungqimba lwe-nickel olushwabene futhi olunezimbotshana olujwayele ukugqwala. Phakathi nezinqubo ze-soldering noma zokugeleza kabusha, lezi zindawo zisengozini kakhulu, futhi ungqimba lwe-nickel olungasebenzi lungaphuka kalula, luveze ungqimba lwe-nickel olungaphansi “olumnyama” futhi lunikeze igama elibi.

Umthelela Wezinqubo Eziningi Zokugeleza Kabusha

Izinqubo zokugeleza kabusha eziningi zibhebhethekisa isimo sephedi elimnyama ngokuqhubeka nokuncibilikisa i-nickel ukusuka phezulu, ngaleyo ndlela kwandise isilinganiso se-phosphorus-to-nickel ngaphezu komkhawulo. Umjikelezo ngamunye olandelayo wokugeleza kabusha ungahlubula i-nickel eningi, ushiye ngemuva ukugcwala okuphezulu kwe-phosphorus. Lokhu kwakheka okushintshiwe kwenza buthaka ubuqotho besakhiwo se-nickel futhi kuthuthukise ukwakheka kwephenomenon yephedi elimnyama.

Ukucwiliswa Kwegolide Okudlulele

Esinye isici esinomthelela inani legolide elifakwe phakathi nenqubo yokucwiliswa kwegolide. Amazinga e-IPC ancoma ukujiya kwegolide okungamayintshi amancane angu-2-4 ukuze kuqinisekiswe ukusebenza kahle. Nokho, ukuze kuhlangatshezwane nezidingo ezithile noma ukuqinisekisa ubuncane bamayintshi amancanyana angu-3 egolide, abakhiqizi bangase baguqule ikhemistri ukuze kusheshiswe izinga lokubekwa kwegolide. Le nqubo esheshiswayo ingaholela “ekuwohlokeni kwe-hyper-corrosion” kongqimba lwe-nickel. Njengoba inqubo yokubeka igolide iyazibekela imingcele ngokwemvelo—ukuma uma yonke i-nickel eveziwe isimboziwe—ukuphoqelela ungqimba lwegolide olujiyile kungase kudale ukugqwala kwe-nickel ngokweqile, kuphinde kubeke engcupheni ukukhubazeka kwephedi elimnyama.

Izixazululo Zokunciphisa Izingozi Ze-Black Pad

Ukuhlolwa kanye Nokuhlonza

Ukuhlola Okubonakalayo: Njalo hlola ingaphezulu lamabhodi aqediwe ukuze uthole izimpawu zephedi elimnyama, njengezakhiwo eziqhekekile noma izindawo ezingahleliwe. Ukungabikho kwama-spikes namabhande amnyama eduze kwemingcele ye-nickel kungabonisa ukuthi iphedi elimnyama lingase lingabi yinkinga.
Amasu Okuhlola Okuthuthukile: Sebenzisa amasu athuthukile okubona nokuskena ukuze uhlonze izimpawu ezicashile zephedi elimnyama okungenzeka lingabonakali ngeso lenyama.

I-Nickel Bath Management

I-Stoichiometry Control: Lawula ngokunembile i-stoichiometry yokugeza ye-nickel ukuze ugcine isilinganiso esilungile se-nickel negolide. Le bhalansi ibalulekile ekuvimbeleni okuqukethwe kwe-phosphorus okweqile okunomthelela ku-black pad.
I-pH Level Monitoring: Gada izinga le-pH lebhavu le-nickel eduze. Izinga le-pH linomthelela ekutheni ingakanani i-phosphorus ecwecwe futhi ingaba yisici esinqumayo kukhwalithi ye-nickel layer.
Ukugcinwa Kokugeza Kwe-Nickel: Ukugcinwa njalo kokugeza kwe-nickel, okuhlanganisa ukususwa kokungcola kanye nokuzinzisa ukwakheka kokugeza, kubalulekile. Ukusebenzisa ama-chelating agents kanye nezinzinzisi kungasiza ekuvimbeleni ukukhishwa kwe-nickel ngaphambi kwesikhathi kubhavu.

Ukwelashwa kwangaphambili kanye neKhemistry Yokugeza

Ukuhlanza Okuphelele: Sebenzisa izinqubo eziqinile zokwelapha zangaphambi kokukhipha amafutha, izinsalela, nokunye ukungcola endaweni ye-PCB ngaphambi kokuqoshwa. Lesi sinyathelo siqinisekisa indawo ehlanzekile yokucwenga kahle.
Ukuthuthukisa Ikhemistri: Lungiselela ikhemistri yokugeza ye-nickel, okuhlanganisa nokusetshenziswa ngokucophelela kwezikhanyisi namaleveli, ukuze kuthuthukiswe isendlalelo se-nickel esiyiyunifomu nengenasici.

Okunye Ukuqeda

Ukuhlolwa kwezinye izindlela: Kuzinhlelo zokusebenza lapho ubungozi bephedi emnyama iphathelene ikakhulukazi, cabangela okunye ukuqedwa kwendawo okungabonisi ukuthambekela okufanayo kulokhu kuphazamiseka. Izinketho ezifana ne-Immersion Silver, OSP (Organic Solderability Preservatives), kanye ne-LEad-Free HASL kungaba ezinye izindlela ezisebenzisekayo kuye ngezidingo ezithile zohlelo lokusebenza.

Ukuqinisekiswa Komthengisi

Ukuqinisekisa Ikhwalithi: Qinisekisa ukuthi noma yimuphi umhlinzeki wesevisi we-ENIG unenqubo elawulwa kahle yokugeza kwe-nickel yakhe futhi uthobela izindinganiso zekhwalithi eziqinile. Ukuqinisekiswa kwezinqubo zabahlinzeki, okuhlanganisa indlela yabo yokunakekela ukugeza kanye nokwelashwa kwangaphambili kwe-PCB, kubalulekile ekwehliseni ubungozi bephedi elimnyama.

Ukuze uthole isibuyekezo esiphelele sokukhiqiza, sebenzisa lesi sihloko kanye nokukhiqizwa kwe-FPC kanye nokukhiqizwa kwe-PCB okuqinile lapho uhlola izidingo ze-stackup, ukuhlanganiswa, noma ukuhlolwa.