Umkhiqizi we-PCB we-Optical Module wezinhlelo ze-400G, 800G kanye ne-1.6T

I-Highleap Electronics inikeza ukukhiqizwa kwe-PCB yemodyuli ye-optical kanye nokuhlanganiswa kwe-PCB kwehadiwe ye-optical eshesha kakhulu echazwe ngamakhasimende. Ububanzi bethu bokukhiqiza buhlanganisa ama-PCB aqinile anezingqimba eziningi, izinhlelo zezinto ezilahlekelwa kancane, isekethe yokulawula i-impedance, ukuxhumana kwe-HDI, izici zethusi eziqondile, ukubhoboza ngokunemba kanye nokuqedwa kwendawo ethile. Sisekela ukwakhiwa kobunjiniyela, ama-oda okuhlola kanye nokukhiqiza okuphindaphindiwe kwiphakheji yokukhiqiza evunyiwe kunokuthengisa ibhodi ejwayelekile okuthiwa ifanelana nayo yonke ipulatifomu ye-optical-module.

Ezinhlelweni zokuthuthukiswa kwe-400G, 800G kanye ne-1.6T, izidingo zesivinini esikhulu zingenza ushintsho lokukhiqiza olubonakala luncane lube lubalulekile kwezentengiselwano. Ukushintshaniswa kwe-laminate, izici zethusi-foil, ukubekezelelana kwe-dielectric, ngezakhiwo kanye nokucubungula kokuphela kwendawo kungathinta ukwakhiwa okukhishwe. Ukubuyekezwa kwethu kobunjiniyela kuvumelanisa lezi zidingo nomzila wokukhiqiza obhaliwe ngaphambi kokuba i-Highleap iqinisekise intengo ye-oda, ukwenzeka kanye nesheduli yokulethwa.

Amakhasimende angacela ukwenziwa kwebhodi elingenalutho noma ikhotheshini ye-PCBA ehlanganisiwe. Nikeza amafayela okuklama akhishwe, ishejuli yezinto zokwakha kanye ne-stackup, isignali echaziwe kanye nezidingo zokuhlola, ivolumu elindelekile kanye nanoma yimaphi amafayela okuhlanganisa ukuze ikhotheshini ibonise i-PCB yangempela ye-optical-module.

Ukukhiqizwa kwe-PCB ye-Optical Module yama-Platform amaningi e-Hardware

I-Highleap inikeza ama-PCB enziwe ngokwezifiso ehadiwe ye-optical-module esetshenziswa emikhiqizweni yesikhungo sedatha, inethiwekhi yefayibha kanye ne-telecom. Insizakalo yethu yokukhiqiza ayiboshelwe ilebula elilodwa le-transceiver housing noma le-marketing data-rate: amabhodi amabili achazwa ngokuthi “ama-PCB e-module angu-800G” angasebenzisa izakhiwo ezahlukene zemizila kagesi, amaphakheji ezingxenye, uhlaka lwebhodi kanye nezinqubo zokukhiqiza. Umdwebo webhodi okhishwe unquma ukuthi yini esiyikhiqizayo.

Ngezinhlelo ze-module ze-OEM, singasekela ukulandelana kwamasampula angaphambi kokukhiqiza, ukwakheka kweziqu kanye nokuphindaphinda kwezindawo. Esigabeni sokuqala, umsebenzi wokukhiqiza uvame ukugxila ekuqinisekiseni ukutholakala kwe-laminate, ukusebenza kwe-stackup kanye nokuxhumana kwabantu abaningi. Ngemva kokuqandisa umklamo, ukugcizelela kuya ekubambeni izinto ezivunyiwe, i-impedance geometry, ukujiya kwebhodi, ukuqeda, isivuno kanye nokulandelela okuhambisanayo kuwo wonke ama-oda okukhiqiza.

Lezi yizigaba zephrojekthi ezihlukile, hhayi izindlela zokupheka zezinto eziqinile. Asisho ukuthi yonke imikhiqizo engu-400G isebenzisa i-laminate eyodwa noma ukuthi ilebula engu-1.6T inquma ngokuzenzakalelayo ukwakheka kwe-microvia eyodwa ethile. Ngezidingo zokwenziwa komkhiqizo othile, i-Highleap iphinde igcine ulwazi oluhlukile kuma- PCB e-optical module angu-800G kanye nama-PCB e-optical module angu-1.6T.

Izinhlelo Zepulatifomu Ezinemingcele Ehlukene Yokufaneleka

I-Highleap inikeza ama-PCB e-optical-module kuzincazelo zomkhiqizo ezikhishwe amakhasimende zezinhlelo ze-module ezisheshayo, kufaka phakathi amaphrojekthi okuthuthukisa nokukhiqiza e-400G, 800G kanye ne-1.6T. I-oda lilawulwa ukubuyekezwa kwepulatifomu ngqo: inani lemizila lodwa alisho ukuthi yiliphi i-laminate, ubukhulu be-PCB, isakhiwo sokuphuma kwephakheji noma imibhalo yokuhlola edingekayo. Uhlelo olulodwa lungagcizelela iziteshi zokulahlekelwa okuphansi ezikhiqizwayo ebhodini elivamile lezingqimba eziningi; olunye lungahlanganisa amadivayisi okucubungula isignali e-fine-pitch, i-HDI elandelanayo nezinto ezixubile. Sicaphuna ukwakhiwa kokwenziwa okuvunyiwe, hhayi "i-stackup ejwayelekile ye-800G."

Ukwakhiwa kwentuthuko, izandiso zepulatifomu kanye nezinhlelo zokukhiqiza eziphindaphindwayo nakho kuyahlukahluka kwezentengiselwano. Iphrojekthi entsha ingadinga ukubuyekezwa kwezakhiwo eziningana ze-laminate ezifanelekile, kuyilapho umkhiqizo okhishwe ungavimbela ukushintshwa okungenza kube nzima ukuhlukaniswa kwesiteshi. Uma ipulatifomu yemodyuli isuka kumhlinzeki weprototype iye ekukhiqizweni okuphindayo, i-Highleap ibuyekeza amazinga ezinto ezivunyiwe, izindlela zekhuphoni kanye namanothi okukhiqiza ngaphambi kokubeka intengo yokudluliselwa. Ukutholakala kwebanga le-CCL elishintshayo akwenzi lokho ngokwako kube yibanga elamukelekayo kwi-OEM.

Kumabhodi emoduli aqondene nomshini kanye nesixhumi, isevisi yethu ye-PCB ye-transceiver ye-optical eyenziwe ngokwezifiso ihlanganisa izidingo ezihlukile zomsingathi kanye nokulingana kwe-enclosure.

Ukuxhumanisa Izidingo Zepulatifomu Nezinto Ezilethwayo ze-PCB

Sihlukanisa ukuvunyelwa kwe-laminate/stackup, ukwenziwa kwebhodi elingenalutho kanye nokuhlanganiswa kwebhodi elinabantu abaningi. Kumaphrojekthi anesabelomali sikagesi esihlanganisiwe, ikhotheshini yokwenziwa ingakhomba ukwakhiwa kwe-dielectric okuceliwe kanye namakhuphoni okuhlola okwenziwa okuvunyelwene ngawo, kodwa ayikwazi ngokwayo ukuqinisekisa isiteshi sikagesi semojuli esiqediwe. Uma iphrojekthi idinga nokuhlanganiswa kwe-SMT, ikhasimende lithumela i-BOM yokuhlanganiswa, imininingwane yephakheji kanye nenqubo yokuhlola ukuze leyo misebenzi ikwazi ukucashunwa ngokwehlukana. Lo mehluko usekela inkontileka yokukhiqiza ethembekile ngenkathi kugcinwa ububanzi buhambisana nalokho ifektri engakuqinisekisa.

Izinto ze-PCB Ezilahlekelwa Kancane, Ukulawulwa Kokuqoqwa kanye Nokwenziwa Kwendlela Yesignali

I-Highleap ikhiqiza ama-PCB e-optical module ngokumelene nezinto ezikhishwe kanye nokwakhiwa kukagesi, kunokuba inikeze "i-laminate" eyodwa ejwayelekile "ephansi yokulahlekelwa" kuwo wonke amaphrojekthi e-400G, 800G noma i-1.6T. Ekukhiqizweni kwe-module yesivinini esikhulu, ukusebenza kwe-signal-path kungancika ekuhlanganisweni kwezakhiwo ze-dielectric, iphrofayili yobuso bethusi, i-trace geometry, izindiza zokubhekisela, ukuguqulwa okufakwe amapulangwe kanye nokubekezelelana kokukhiqiza. Ngayinye yalezo zinto ezifakiwe kumele ihlale ilandelelwa ku-stackup evunyelwe yikhasimende.

Inselele yokukhiqiza akukhona nje ukuthenga i-laminate eqanjwe ngegama. Ibanga elicacisiwe kumele litholakale ngokuhlanganiswa okusebenzayo kwe-core kanye ne-prepreg noma i-bondply, futhi noma yikuphi ukwakhiwa kwezinto ezixubile kumele kuhlolwe ukuhambisana okucindezelwe, ukujiya kanye nokuqina kobukhulu. Indawo eshintshayo efana nayo ingase ingakhiqizi isikhala esifanayo se-dielectric noma ukuziphatha kokulahlekelwa kokufakwa. Ngakho-ke ukulingana komhlinzeki kanye nokushintshaniswa kwezinto kuyizinqumo zobunjiniyela, hhayi izinguquko zokuthenga ezivamile.

Izinto Ezibalulekile kanye Nokulawula Okuhlanganisiwe Kokukhiqizwa Kwe-PCB Ye-Optical Module

• Imininingwane ye-laminate kanye ne-bonding ekhishwe: Thola amamaki aqondile ezinto zokwakha, izakhiwo ze-dielectric ezifanele, uhlelo lwe-resin/bonding, ubukhulu kanye nezinye izinto ezivunyelwe. I-Highleap ingabuyekeza ukutholakala kokuthengwa kanye nokuhlanganiswa kwe-lamination okuphakanyisiwe kwesakhiwo esivunyiwe. Uma ikhasimende selivele liqinisekisile isiteshi noma isethi yezinto zokwakha ezithile, umuntu ozongena esikhundleni uthunyelwa ukuze avunyelwe kunokungeniswa buthule ngesikhathi sokuntuleka.

• Iphrofayili yefoyili yethusi kanye nejiyometri yomqhubi: Iphrofayili yethusi, ukujiya kwefoyili eyisisekelo, isinxephezelo sokugcina sethusi kanye nokugqwala kungathinta ukuncishiswa kwesiginali kanye nokuvinjelwa okubonakalayo. Umdwebo ocela ifoyili ethile ephansi noma isisindo sethusi udinga ukusho izendlalelo ezilawulwayo. Ukulungiswa kwenqubo okuhloswe ekukhiqizweni kumele kuhlolwe ngokuhambisana nezidingo zokulahlekelwa kanye nokuvinjelwa okuchaziwe, ikakhulukazi eziteshini ezibucayi.

• Ukulingana kwe-Core, prepreg kanye ne-layer: Isheduli ye-layer kufanele ivumelanise ukuhlukaniswa kwe-dielectric, ukusatshalaliswa kwethusi, ukujiya okuphelele kanye nomzila wangempela we-lamination. Umdwebo obukeka ufana ne-symmetric awuqinisekisi ngokuzenzakalelayo ukukhiqizwa lapho imindeni ehlukene ye-dielectric ixubene. Ngaphambi kokukhishwa kwephaneli, isakhiwo kufanele sibe nezinto zokucindezela ezichaziwe kanye nezinhloso zokulawula ukujiya ezifanele ukukhiqizwa okuphindaphindiwe.

• I-geometry ye-Impedance kanye nokuqhubeka kwe-reference-plane: Ama-impedance ane-single end kanye ne-differential target kufanele axhunywe ezingqimbeni ezifanele kanye nomsebenzi wobuciko ovunyiwe. Izinguquko kububanzi bomugqa, ubukhulu be-dielectric noma i-geometry ye-reference-plane zingashintsha umphumela kagesi. Ifektri ingaphakamisa isinxephezelo noma ukulungiswa okubuyekeziwe, kodwa umnikazi womklamo kagesi kumele avume izinguquko kumanethi alawulwayo kanye nanoma yikuphi ukucushwa kwekhuphoni okuhlobene.

• Amarekhodi ezinto kanye nokuphathwa kokushintsha kwezakhi: Kuma-oda aphindaphindwayo, ishejuli yezinto kanye nokushintsha okuvunyiwe kufanele kugcinwe ngokubuyekezwa kwebhodi. Ubunikazi bezakhi kanye namanye amarekhodi okulandelela anikezwa uma kudingeka ngokwencazelo yokuthenga. Uku-oda kabusha inani elifanayo lezingqimba ezijwayelekile ngesistimu ehlukile ye-dielectric kungadinga ukuvuselelwa kweziqu zikagesi futhi akufanele kuphathwe njengoku-oda kabusha okuvamile.

• Ububanzi bokuqinisekisa ugesi: Amakhuphoni okulawula ukuvimba, ukuhlonza izinto kanye nezilinganiso ezihlobene nokulahlekelwa ezinikezelwe zixazulula imibuzo eyahlukene yokwamukelwa. Ukudlula ikhuphoni lokuvimba akuqinisekisi ukulahlekelwa kokufakwa kwemojuli ehlanganisiwe, futhi ukuhlolwa kwebhodi elingenalutho akuqinisekisi amandla okukhanya noma i-BER. Uma kudingeka amakhuphoni okulinganisa engeziwe, imibiko noma imikhawulo, i-geometry yawo, indlela, isampula kanye nezindleko kuyavunyelwana ngazo ngaphambi kokwenziwa.

Gcina Isisekelo Sezinto Ezilodwa Kusukela Kumodeli Kuya Ekukhiqizweni Kwevolumu

Insizakalo yokwenziwa kwe-PCB ephansi yokulahlekelwa yi -Highleap inikeza umongo wamandla afanele wokwakhiwa kwebhodi elingenalutho. Kuhlelo lwemodyuli olusheshayo, ukukhishwa okusebenzayo kufanele kuxhume irekhodi lezinto ezibonakalayo, ukubuyekezwa kwe-stackup, uhlelo lwe-impedance kanye nobufakazi bokuhlola obudingekayo. Lokho kwenza ukudluliselwa komthombo kamuva, izinguquko zesidingo kanye nezinqumo zokungalandeli imithetho kube lula ukubikezela ngaphandle kokufuna isabelomali sesixhumanisi esiqinisekisiwe esivela egameni le-laminate kuphela.

I-HDI, ama-Microvia, Ukucutshungulwa Komugqa Omuhle kanye Nezici Zokuxhumana Kwezingxenye

Amabhodi e-optical module avame ukuhlanganisa amaphakheji anenani eliphezulu, izingxenye zamandla aminyene kanye nokuguqulwa kwesivinini esiphezulu okulawulwayo ngaphakathi kohlaka oluncane lwemishini. I-Highleap ibuyekeza amamephu e-microvia, amaphethini omhlaba, i-geometry yethusi kanye nokubhaliswa kwesendlalelo kuya kwesendlalelo ngaphambi kokuqinisekisa umzila wokukhiqiza we-HDI. Amanye amaphrojekthi adinga ukuxhumana okubhobozwe nge-laser kanye nokwakheka okulandelanayo; amanye angenziwa kusetshenziswa imigodi evamile efakwe amapulangwe. Umklamo wangempela, hhayi ilebula yesilinganiso sokudlulisa, unquma ukuthi iyiphi inqubo edingekayo.

Ukubuyekezwa kokukhiqiza okuphumelelayo kuphinde kucabangele ukusebenzisana okulula ukuphuthelwa kukho ematafuleni amakhono ahlukene. Ubuciko obuhle, ama-drill amancane, ithusi elisindayo lendawo kanye nezakhiwo ezigcwele nge-pad zingase zitholakale zodwa kodwa zidale iwindi lenqubo elihlanganisiwe elincane. Ukuqina kwezinto ezibonakalayo, isilinganiso se-drill, ubukhulu be-plating, i-geometry ye-pad kanye nesivuno esilindelekile kumele kucatshangelwe ndawonye ngaphambi kokuba i-oda libekwe intengo futhi lihlelwe.

Imisebenzi Yokukhiqiza I-HDI Ebucayi kanye Nobuningi Obuningi

• Ukumapha kwe-laser-via kanye nokuxhumeka kwezendlalelo: I-microvia ngayinye engaboni noma uxhumano olufihliwe ludinga ungqimba lokuqala oluchazwe ngokucacile, ungqimba lokuma, i-geometry yomhlaba oqondiwe kanye nesigaba sokulamina esihlosiwe. Imidwebo ye-stack kanye nedatha yokubhoboza ye-NC kufanele kuvumelane. Ukwakheka okulandelanayo kungangeza izigaba zokuthwebula izithombe, ukulamina, ukubhoboza kanye nokufaka amaplati, ngakho-ke isicelo esichazwa kuphela ngokuthi “i-HDI enezendlalelo ezingu-8” asinazo izincazelo ezanele zentengo elawulwayo noma isikhathi sokuhola.

• Izakhiwo ze-microvia ezihlanganisiwe uma kuqhathaniswa nezakhiwo ze-stacking: Ukwakheka okuvunyiwe kuthinta ukuhambisana, ukugcwalisa, ukubopha kanye nokufaneleka. Izakhiwo ezihlanganisiwe zingaba nokucatshangelwa okuhlukile kokuthembeka kwezakhiwo ezihlanganisiwe, ikakhulukazi ngaphansi kokujikeleza kokushisa. I-Highleap ihlola inhlanganisela ehlongozwayo ngokumelene nohlelo lwezinto kanye nobubanzi bokuhlola obuvunyelwene ngabo; ukuguqula isakhiwo esisodwa sibe esinye kuyishintsho lomklamo oludinga ukuvunyelwa.

• Ukuqhekeka kwe-BGA kanye nomugqa/isikhala esincane: Ngaphansi kwe-DSP exinene noma enye iphakheji ye-fine-pitch, ububanzi bomqhubi, i-clearance, i-annular ring kanye nokubekwa kwayo kumele kufane nephethini yangempela yomhlaba we-PCB. Umthetho we-2/2 mil otholakala ngobuchwepheshe ungase ubeke ezinye izilawuli zokuthwebula izithombe kanye nokuqopha futhi akufanele kusetshenziswe ekuqondisweni okungabalulekile ngaphandle kwesizathu. Ezinye izindlela zobunjiniyela kumele zigcine izidingo zikagesi ezikhishwe.

• Usayizi wokubhoboza, isilinganiso sesici kanye nokususwa kwangaphakathi: Ithuluzi lomshini elingu-0.20 mm alilingani nomgodi oqediwe ongu-0.20 mm. Ubukhulu bebhodi, ukugoba, inani lemigodi kanye nokususwa okuncane kwethusi kuthinta ukukhiqizwa kanye nokusetshenziswa kwawo. Ezindaweni ezingaxinene kakhulu, ukubhoboza okukhulu kungathuthukisa i-margin yenqubo, kodwa kuphela lapho i-geometry yephedi, izidingo zemigodi egobekile kanye nomzila wekhasimende kuvumela ushintsho.

• Ukugcwaliswa nge-in-pad, ukuhlelwa kwe-planar kanye ne-copper cap: Imbobo evulekile ngaphansi kwe-solderable pad egobile kahle iyingozi yokugoba i-solder; ukugoba nge-solder-mask noma ukuxhuma akusikho ngokuzenzakalelayo okuthatha indawo ye-flat, copper-covered pad. Uma umklamo udinga i-vias ezigcwalisiwe nezimboziwe, inqubo ifaka ukulungiswa okwengeziwe, ukugcwalisa, ukwelapha, ukulinganisa, ukwenziwa kwensimbi kanye nokuhlolwa okufanele. Imininingwane yokwelashwa nge-via ifanele kokubili imibhalo yokwenziwa kanye neyokuhlanganiswa.

• Ubufakazi bokuvinjelwa kanye nokukhululwa okuphelele: I-AOI engaphakathi, ukuhlukaniswa okuncane lapho kuchazwe khona, ukuqinisekiswa kokugoba, ukuhlolwa kokuqhubeka/ukuhlukaniswa kukagesi kanye nokulinganiswa kwe-impedance kufeza izinjongo ezahlukene. Ukuhlolwa kwe-E okuphumelelayo akukwazi ukukhombisa ukulingana kwe-cap, ubuqotho be-plated-barrel noma ukusebenza kokulahlekelwa ngokwakho. Noma yiluphi uhlelo lokuhlola olukhethekile luvunyelwene ngalo ngokumelene nezingozi zangempela zokwehluleka kanye nezinqubo zokwamukelwa kwamakhasimende ngaphambi kokuthunyelwa.

Gcina Ubunzima be-HDI Ngaphakathi Komzila Wenqubo Ovunyelwe

Ububanzi bokukhiqiza be-HDI PCB ye-Highleap buhlanganisa izinketho zokucubungula ezihlobene. Ku-PCB yemojula yokukhiqiza ye-optical, izidingo zokusayinwa ngemephu, i-stackup, i-pad finish kanye ne-assembly kumele zihlale zihambisana. Imfuneko ye-BGA vias egcwaliswe nge-resin ingashintsha kokubili intengo yokukhiqiza kanye nosuku lokuthunyelwa, ngakho lezo zici kufanele ziqinisekiswe ngaphambi kokuba i-oda lokuthenga lamukelwe.

Ubukhulu be-PCB ye-Optical Module, Ukuqedwa Komphezulu kanye Nokuhlanganiswa Kwemishini

Ibhodi elihlangabezana nezidingo zalo zokuhlanganisa kumele futhi lihlangabezane nezimo zokuhlanganiswa kwemojuli. I-Highleap ikhiqiza ngokwezidingo zohlaka olunikeziwe, ubukhulu kanye nobukhulu bendawo, kufaka phakathi izixhumanisi zekhadi noma ibhodi nebhodi lapho kuchazwe khona. Lezi zidingo ziba zibaluleke kakhulu lapho ibhodi kumele livumelane nendlu encane, i-datum yokuxhuma, i-interface yokushisa kanye nokubekwa kwezingxenye eziphakeme.

Lapho i-interface kagesi isebenzisa umphetho wokuxhumana ocwebezelwe, umdwebo kufanele ukhombe ukuphela kokuxhumana okugugile, ukujiya kanye ne-geometry. Oxhumana nabo be-Hard-gold connector kanye nama-ENIG solder pads kuyizinto ezahlukene zokukhiqiza futhi kungadinga izinyathelo zenqubo ezihlukene. Ikhotheshini kufanele imboze inhlanganisela yangempela yokuqeda, hhayi inqubo eyodwa yegolide ebhodini. Ama-Fine-pitch component pads angase futhi abeke okukhethekile ngokwelashwa, izidingo zokuvula i-solder-mask noma ukuthamba kwendawo okuqediwe okuthinta kokubili ukwenziwa kanye nokwamukelwa kokuhlanganiswa.

Izinkinga zokushisa kumele zihunyushwe zibe izici ezikhiqizwayo: ukusatshalaliswa kwethusi, ama-array asebenzisa ukushisa, ukujiya kwebhodi okuvunyelwe, izindawo zokuthintana zendawo kanye nokuvuleka kwemishini. Umhlinzeki akakwazi ukuqinisekisa ukusebenza kokupholisa kwemojuli ye-optical ephelele kusukela kumdwebo wokwenziwa kwe-PCB kuphela. Kodwa i-Highleap ingakhiqiza izici ze-PCB ezicacisiwe futhi izihlanganise nomdwebo wokuhlanganisa ovunyiwe lapho zombili izinsizakalo ziyalwa khona.

Uma indlu ikhawulela ubukhulu bomphetho, umnsalo kanye nokujika, noma ukulingana kwendawo, lezo zilinganiso kufanele zibizwe ngokucacile. Ukubekezelelana kobukhulu be-PCB okujwayelekile kungenzeka kungambozi isikhombimsebenzisi esithile se-optical-module. Indlela yokulinganisa edingekayo, imvamisa yokuhlola kanye nokubika kufanele kuvunyelwane njengengxenye yokwamukelwa kokukhiqiza, kugwenywe izingxabano ngemva kokuba amayunithi ehlanganiswe abe yizindlu.

Ukulingana Kwephakheji Encane Nokucubungula Ukuxhumana

Ama-PCB e-optical-module asheshayo angaba nemingcele eqinile yokuxhumana kwephakeji nebhodi, okuhlanganisa ukuxhumana okuqondile, izingxenye ezincane, ukugcinwa kwenhlangano encane noma ukuthamba kwebhodi okulawulwayo. I-Highleap ibuyekeza umdwebo we-datum wangempela womshini, hhayi nje ubukhulu obuqediwe. Oxhumana nabo bomphetho oqinile begolide eliqinile abafakwe ngokukhetha, uma kuchazwe, badinga incazelo yenqubo ehlukile kusuka ku-ENIG kuma-solder pads. Indawo yabo yokubeka, ukujiya, i-bevel yomphetho kanye nezidingo zokulinganisa kumele zifakwe ku-RFQ yokuqala.

Ubukhulu obuqediwe kanye nomnsalo/ukusonta kuyahlolwa kucatshangelwa ukwesekwa kwe-assembly. I-PCB ingase ihlangabezane ne-stackup yayo evamile kodwa isenokuphazamiseka kwendawo okwedlulele kwephakheji encane ye-fine-pitch noma i-module enclosure. Uma iklayenti libona izingxenye ezibalulekile noma izici zokuhlanganisa, uhlelo lokwamukela umkhiqizo lungagxila ekulinganisweni kulezo zilinganiso, ngendlela evunyelwene ngayo yokusampula kunokuhlola ukubukeka okujwayelekile.

Izici Zokushisa Uma Ziqhathaniswa Nokusebenza Kukagesi

Ukuthululwa kwethusi kanye namasimu okushisa adlula ngokushisa kungasiza ekudluliseni ukushisa kusuka kumadivayisi asebenzayo, kodwa asebenzisana nezindiza zokubhekisela ezisheshayo kanye namaphethini okuphuma kwephakheji. Lapho umklamo okhishwe yikhasimende udinga izinhlamvu zemali zethusi, izisindo zethusi ezixubile noma izicucu ezingavamile, lezo zinqubo ezikhethekile kumele zibuyekezwe ukuze kutholakale ukuthi zingenziwa yini futhi zicashunwe ngokwehlukana. I-Highleap ingahlola ukuthi ukwakhiwa okunjalo kuyahambisana yini ne-substrate ekhethiwe kanye ne-stackup, kodwa isici sokushisa asifakiwe ngokuzenzakalelayo ngoba nje iphrojekthi ibizwa ngokuthi i-PCB yemojuli yokukhanya.

Ukuqinisekiswa Kokukhiqiza kanye Nekhwalithi Yokukhiqiza Ephindaphindwayo

Kumabhodi e-optical-module, ikhwalithi ichazwa yincazelo yokukhiqiza eyamukelekile—hhayi ngenani lezivivinyo ezibalwe encazelweni yokumaketha. Indlela yokukhiqiza ye-Highleap ingafaka ukuhlolwa kwengqimba yangaphakathi, i-AOI, ukuhlolwa kobuqotho bembobo ehlanganisiwe, ukuhlolwa kukagesi kwebhodi eliqediwe kanye nokulinganisa okucacisiwe ngamakhasimende. Lapho kudingeka khona, amakhuphoni e-impedance, izingxenye ezincane, amarekhodi ezinto noma imibiko yobukhulu obubalulekile iyalungiswa ngokuya ngohlelo lokuhlola oluvunyelwene ngalo.

Ukwakhiwa kwento yokuqala noma kweziqu kufanele kusungule inhlanganisela evunyiwe ye-laminate, i-foil, i-stackup, i-plating, nge-processing, i-solder mask, i-surface finish kanye ne-board outline. Uma uhlelo lwekhasimende selukhishwe, izinguquko zokukhiqiza kumele zihlolwe ukuthi zithinta yini. Ukushintsha ibanga le-laminate, iphrofayili ye-foil, ukulandelana kwe-bonding noma ukujiya kwethusi ngaphandle kwemvume kungenza kube nzima ukucabanga ngemuva kwemiphumela kagesi eyamukelwe ngaphambilini.

I-Highleap isebenza kusukela ekubuyekezweni kwamafayela alawulwayo kanye namanothi okwenziwa avunyelwene ngawo ama-oda aphindaphindwayo. Singaxoxa ngokufakwa kwezinto, inani lokukhishwa eliningi, amashejuli okubikezela kanye nokupakishwa kokulethwa njengengxenye yohlelo lokuhweba. Kwezinto ezikhethekile ezilahlekelwa kancane, ukubonakala kwesidingo sokuqala kuyasiza ngoba ukuthengwa kwezinto kanye nokufaneleka kungaba yimingcele ebaluleke kakhulu kunesikhathi sokubhoboza noma sokusika i-PCB.

Uma i-PCBA ifakiwe, uhlelo lokwamukela umkhiqizo kufanele luhlukanise ukuqinisekiswa kokwenziwa kwebhodi elingenalutho kusuka ekusebenzeni kwe-SMT kanye nanoma yikuphi ukuhlolwa okwengeziwe kukagesi. Insizakalo yethu yokuhlanganisa i-PCB ye-transceiver ye-optical ingacashunwa ngamabhodi anabantu abaningi achazwe ngamakhasimende. Ukuqondaniswa kwemodyuli ephelele ye-optical, izilinganiso ze-optical kanye neziqu ze-BER kuyizidingo zephrojekthi ezihlukile, hhayi nje ngoba i-PCB isetshenziswa kumodyuli ye-optical.

Kusukela Ekuvunyelweni Kwesihloko Sokuqala Kuya Kuma-Lots Aphindaphindwayo

Ukuvunyelwa kwephrothokholi kusungula ukuthi inhlanganisela ethile yezinto zokwakha, ithusi, ukubhoboza, ukubhaliswa kanye nezinqubo zokuqeda kungahlangabezana nomdwebo wekhasimende. Kuye ngohlelo oluchaziwe, iphakheji yokuhlola ye-Highleap ingafaka i-AOI yengqimba yangaphakathi, ukuhlolwa kokugcina kukagesi, ukuhlolwa kobukhulu, ukulinganiswa kwesigaba esiphambene kanye nemiphumela yekhuphoni ye-impedance. Indlela, usayizi wesampula kanye nenqubo yokwamukela kufanele kuvunyelwane ngayo kuphakheji yokuthenga. Ubufakazi bebhodi elingenalutho abuqinisekisi umdwebo wamehlo we-optical module oqediwe, izinga le-bit-error noma amandla okukhanya.

Uma kwakhiwa kabusha, i-stackup evunyiwe kanye nokubuyekezwa kuhlala kuyireferensi. Uma i-foil yethusi, i-laminate noma i-prepreg ingatholakali, ukufakwa esikhundleni kuyaphakanyiswa ukuze kubuyekezwe ngaphambi kokuba kufakwe. Izinguquko ezishintsha isiteshi noma isikhombimsebenzisi sephakheji akufanele zifihlwe ngaphakathi kwamanothi okuthenga. Ukuhlonza indawo, ukulandelelwa kwezinto kanye nemibhalo yokulethwa kungalinganiswa ngokuya ngohlelo lwekhwalithi lwe-OEM; akuwona wonke amabhodi adinga imibiko efanayo, ngakho-ke i-Highleap icaphuna ubufakazi bangempela obuceliwe.

Izindleko Nezikhathi Zokuhola Ezithinta Ukuqhubeka Kokukhiqiza

I-PCB yemodyuli yesivinini esikhulu ingadinga ukubhukha kusenesikhathi kwezinto ezichazwe ngokulahlekelwa okuncane. Ngakho-ke, izingcaphuno zokukhiqiza kufanele zihlukanise isikhathi sokuhola sezinto esikhathini sokucubungula kwasefektri. Ukwakheka okulandelanayo, ukubhoboza emuva, ukugcwalisa nge-microvia kanye nokufaka iplatingi ekhethiwe kungaletha izinyathelo ezingacindezeli ngokuqondile ku-oda lokusheshisa. Ngomkhiqizo oqhutshwa ukubikezela, ukuvumelana ngamakhefu enani kanye nezinye izinto ezivunyelwe kusiza ukuzinzisa ukutholakala ngaphandle kokwenza buthaka imininingwane elawulwa yikhasimende.

Cela Isilinganiso Sokukhiqiza se-PCB se-Optical Module ngokwezifiso

Ukuze uthole ikhotheshini yokukhiqiza, nikeza amafayela akamuva e-Gerber X2, ODB++ noma alinganayo avunyiwe, idatha ye-NC drill, i-layer stackup kanye nesheduli yezinto zokwakha, ukujiya okuqediwe, izinsimbi zethusi, okukhethekile ngamanothi kanye nethebula le-controlled-impedance. Faka umdwebo we-module noma we-carrier onezici ezibalulekile kanye nezidingo zokuqeda ubuso. Uma uhlelo oluthile lwe-laminate, i-foil noma i-bonding luyimpoqo, luchaze ngebanga bese usho imithetho yokushintsha.

Uchungechunge lwe-RFQ olulungele ukukhiqizwa

1. Khipha ishejuli ye-laminate neye-dielectric evunyiwe, iphrofayili yethusi kanye nezidingo ze-impedance.
2. Amamephu wezendlalelo zokunikeza ama-laser vias, ama-pads agcwele, i-backdrilling kanye nanoma yiziphi ezinye izixhumanisi ezikhethekile.
3. Chaza imibiko yokwamukelwa kokukhiqiza, amasampula kanye nesidingo esilindelekile sokuhlola ukukhiqiza.
4. Thumela noma yiziphi ezinye izindlela zokufaneleka okucacile kunokuba uziphathe njengezinye izindlela zokushintsha ezizenzakalelayo.

Ukuze uqhathanise isilinganiso kanye nokuhlela uhlelo, chaza inani le-prototype, inani lokuhlola, ivolumu ephindaphindayo elinganisiwe, ubufakazi bokuhlola obudingekayo, isimo sokubuyekeza kanye nosuku lokuthunyelwa okuqondiwe. Maka ukucutshungulwa okungejwayelekile njengokwakheka okulandelanayo, ama-vias agcwaliswe nge-resin futhi avaliwe, i-plating ekhethiwe, izikhala ezikhethekile, i-backdrilling kanye ne-dimensional tolerances. Lapho i-oda lifaka i-PCBA, engeza i-BOM, idatha yokubeka, ukudweba komhlangano, imithwalo yemfanelo yokuthola kanye nokuhlolwa okuvunyiwe.

I-Highleap Electronics ingabuyekeza iphakheji ephelele yokukhiqiza, ihlonze imibuzo yenqubo noma yezinto ezibonakalayo, futhi inikeze ikhotheshini ngokusekelwe kububanzi bebhodi elingenalutho noma ibhodi elihlanganisiwe elivunyelwene ngalo. Cela ukwenziwa kwe-PCB yemojula ye-optical module kanye namanani okuhlanganisa kanye nemininingwane yephrojekthi yakho. Ikhotheshini ephumayo ixhunywe endleleni yokukhiqiza yangempela kanye nezinto ezilethwayo, kunokuba kube yintengo ejwayelekile enamathiselwe kwilebula yesilinganiso sedatha.

Isilinganiso Esimelene Nokubuyekezwa Kwepulatifomu Elawulwayo

Umbuzo wokukhiqiza kufanele ufake uphawu lwezinto kanye nebanga eliqondile lapho ukujiya okuqediwe, ukuhlanganiswa kanye nokuhlosiwe kuqediwe khona, izidingo zethusi kanye ne-dielectric, imininingwane yesiteshi/impedance, imephu yokuxhumana, kanye nawo wonke amanothi okubhoboza, ukugcwalisa, ukufaka isivalo kanye nokwemboza ngemuva. Imininingwane yemishini efana nemingcele yokuxhumana kwegolide, izikhundla zokufaka, ukugcina kanye nobukhulu obuqediwe obubalulekile kufanele kuxhunywe ekubuyekezweni okufanayo kwe-PCB. Uma kudingeka ikhuphoni yokuhlola noma umbiko wokuthobela umthetho, faka indlela kanye nomkhawulo wokwamukelwa esikhundleni sesicelo esijwayelekile "sokuhlolwa kwesivinini esikhulu."

Uma i-Highleap izohlinzeka ngamabhodi ahlanganisiwe, nikeza i-BOM ekhishwe kanye nezinye izindlela ezivunyiwe, amafayela okuhlanganisa, izidingo zokuphathwa kwezingxenye kanye nencazelo yokuhlolwa kwezinga lebhodi. Ikhotheshini yokugcina ingabe isikhomba ukwenziwa okuhlukile, izingxenye, izindleko zokuhlanganisa kanye nokuhlola. Ngezinhlelo ze-400G, 800G kanye ne-1.6T ezinezibuyekezo eziningi, faka ilebula ku-RFQ ngayinye ngephrojekthi ethile kanye nokubuyekezwa komklamo ukuze izilinganiso kanye namarekhodi okukhiqiza ahlale efana.