8-ungqimba PCB Standard Stacking Technology kanye Nezinselele Design

I-PCB enezingqimba ezingu-8 inikeza amandla engeziwe okuhambisa izinhlelo zedijithali ezisheshayo, izilawuli zezimboni, imishini yokuxhumana kanye nemikhiqizo kagesi eyinkimbinkimbi. Kodwa-ke, ukwengeza izingqimba zethusi kukodwa akuqinisekisi ukusebenza kahle kukagesi noma ukukhiqizwa okulula. Umphumela uncike ekunikezelweni kwezingqimba, ukwakhiwa kwe-dielectric, ukuqhubeka kwe-reference-plane, ngezakhiwo kanye nokubekezelelana kokukhiqiza.

Kwabanjiniyela behadiwe kanye namaqembu okuthenga e-OEM, inhloso ukuthuthukisa isakhiwo esinezingqimba eziyisishiyagalombili esihlangabezana nezidingo zikagesi ngaphandle kokwethula ubunzima bokukhiqiza obungadingekile. I-Highleap Electronics inikeza izinsizakalo zokwenziwa kwe-PCB kanye nokuhlanganiswa kwe-PCB, isekela amaphrojekthi kusukela ekubuyekezweni kobunjiniyela kuya ekukhiqizeni. Lo mhlahlandlela uchaza izinqumo zokuhlanganisa, izinselele zokwenziwa kanye nezidingo zekhotheshini ezibalulekile ngaphambi kokuba i-PCB enezingqimba eziyisishiyagalombili ingene ekukhiqizweni.

1. Umklamo we-PCB Stackup Wezingqimba Eziyi-8 Wokukhiqiza

I-PCB stackup enezingqimba ezingu-8 kumele yenze okungaphezu kokwamukela izingqimba zethusi eziyisishiyagalombili. Idinga ukuhlinzeka ngezindiza zokubhekisela zesignali ezifanele, isikhala esanele somzila, ukusatshalaliswa kwamandla okusebenzayo kanye nokwakhiwa okulinganiselayo okungakhiqizwa ngaphakathi kokubekezelelana okudingekayo. Kubathengi be-PCB, i-stackup kufanele ibuyekezwe njengomklamo kagesi kanye nencazelo yokukhiqiza ngaphambi kokuba ibhodi liqale ukukhiqizwa.

Indlela Yokuhlela Izingqimba Zethusi Eziyisishiyagalombili

Ibhodi elijwayelekile elinezingqimba eziyisishiyagalombili lingasebenzisa izendlalelo ezine zesignali kanye nezendlalelo ezine ezihlobene nomhlaba noma amandla, yize ukwabiwa kwangempela kuncike ekuminyaneni kwe-routing, izidingo ze-interface kanye nezidingo zokusatshalaliswa kwamandla. Ukucushwa kokuqala okungenzeka kube khona yilokhu:

Lokhu kuyisabelo sezendlalelo ezibonisa isibonelo, hhayi indinganiso yokukhiqiza enezendlalelo eziyisishiyagalombili ebanzi. Eminye imiklamo idinga ukwabiwa okuhlukile kwezingqimba zesiginali, zomhlabathi kanye namandla. Ukuhlelwa kokugcina kufanele kubonise izixhumanisi ezibalulekile, ukwakheka kwamandla, imikhawulo yomzila kanye nokusebenza kukagesi okudingekayo.

Kumiklamo yesivinini esikhulu, ubudlelwano phakathi kwesignali eseduze kanye nezendlalelo zokubhekisela budinga ukunakwa okukhethekile. Lapho isignali ishintsha izendlalelo nge-via, indlela yayo yokubuya kwamandla kumele ihlale isebenza. Ushintsho olungahlelwanga kahle lungandisa ukuphazamiseka kwe-electromagnetic noma lubhidlize ubuqotho besignali, noma ngabe i-geometry yokulandelela ngokwayo ibonakala yamukelekile.

Ubukhulu be-dielectric kanye ne-Impedance elawulwayo

Ukulawulwa kwe-impedance kuncike ebubanzini bomkhondo, ukujiya kwethusi, izakhiwo ze-dielectric kanye nebanga eliphakathi komqhubi wesignali kanye nendiza yayo yokubhekisela. Umzila ohlukile udinga futhi ukucatshangelwa kwesikhala esiphindwe kabili kanye nesakhiwo se-dielectric esizungezile.

Umkhondo ohanjiswa phezu kwendiza yomhlaba eseduze ngokuvamile uzodinga i-geometry ehlukile kuneyodwa enokuhlukaniswa okukhulu kwendiza yokubhekisela. Ngenxa yalokho, ukwakhiwa okujwayelekile okunezingqimba eziyisishiyagalombili akufanele kuthathe indawo ngokuzenzakalelayo ye-stackup esetshenziswa ngesikhathi sokuklama ubuqotho besignali.

Ngaphambi kokwenza, unjiniyela kanye nomenzi kufanele baqinisekise:

• Qondisa amanani kanye nokubekezelelana kwe-impedance okunesiphelo esisodwa kanye nokwehluka.
• Isendlalelo sokubhekisela esihlotshaniswa nesendlalelo ngasinye sesignali esibalulekile.
• Ubukhulu be-dielectric obudingekayo kanye nezakhiwo ze-laminate.
• Ubukhulu bethusi obuqediwe kanye ne-trace geometry.
• Kungakhathaliseki ukuthi amakhuphoni e-impedance, ukuhlolwa kanye nemibiko kuyadingeka.

Uma ukwakhiwa kwezinto eziphakanyisiwe noma kwe-dielectric kuhlukile kumklamo wokuqala, i-impedance ephumelayo kufanele ibuyekezwe ngaphambi kokuba ushintsho luvunyelwe. Noma yikuphi ukulungiswa kokulandelela i-geometry noma i-stackup kufanele kubhalwe phansi kunokwenziwa ngaphandle kwemvume yamakhasimende.

Ubukhulu bebhodi eliyinhloko, elilungiselelwe kusengaphambili kanye neliqediwe

I-PCB enezingqimba eziyisishiyagalombili ngokuvamile yakhiwa ngama-cores ambozwe ngethusi kanye nezinto zokubopha ezilungiselelwe kusengaphambili. Inhlanganisela yazo ithinta ukujiya okuqediwe, isikhala se-dielectric, ukuziphatha kwe-lamination kanye nokutholakala kwezinto.

Ubukhulu obuqediwe obungu-1.6 mm bungafanelana nemiklamo ethile enezingqimba eziyisishiyagalombili, kodwa akufanele kucatshangwe ukuthi bufanele ibhodi ngalinye. Ukuxhumana kwezixhumi, ubukhulu bendawo, ukubekwa kwezingxenye kanye nezidingo zikagesi kungabeka imingcele ehlukene.

Ukubuyekezwa kokukhiqiza kufanele kuqinisekise ukujiya nokubekezelelana okuqediwe, isisindo sethusi sesendlalelo ngasinye, ukwakhiwa kwe-core kanye nokwangaphambi kokulungiswa, kanye nanoma yiziphi izidingo zezinto ezishisayo noma zikagesi eziqondene nohlelo lokusebenza. Lezi zithiyo kumele zaneliswe ndawonye kunokwenziwa ngcono kwepharamitha eyodwa yodwa.

Yiziphi Izibuyekezo ze-Highleap Ngaphambi Kokwenza Izinto?

Ukuze uthole i-PCB enezingqimba eziyisishiyagalombili elungele ukukhiqizwa, isibuyekezo se-stackup kufanele sixhumanise umklamo kagesi nezidingo zangempela zokukhiqiza. Lokhu kufaka phakathi ukuhlola izabelo zezendlalelo, imininingwane yezinto, isikhala se-dielectric, imikhawulo yokubhoboza, ukuvuleka kwethusi kanye nobukhulu bebhodi eliqediwe.

Uma umklamo uhlanganisa umzila we-BGA ominyene, ama-vias angaboni noma agqitshwe, ukubhoboza emuva noma ezinye izinqubo ezikhethekile, lezi zici kufanele zibuyekezwe kanye nokwakhiwa kwezingqimba eziphakanyisiwe. Zingathinta ukulandelana kokukhiqiza, ikhono lenqubo, isikhathi sokuhola kanye nezindleko.

I-Highleap Electronics ingabuyekeza amafayela okukhiqiza anikeziwe kanye nezidingo ze-stackup njengengxenye yokuhlolwa kokukhiqiza kwephrojekthi ethile. Bheka isevisi yethu ye-PCB layer stackup kanye nomhlahlandlela wokukhetha izinto ze-PCB ukuze uthole ulwazi oluhlobene nobunjiniyela.

Inhloso ukuhlonza izingxabano ezingaba khona ngaphambi kokuba kukhishwe amathuluzi okukhiqiza, ukuze ukwakhiwa kwebhodi elicashuniwe kubonise ukusebenza kukagesi okuhlosiwe kanye nezidingo zokukhiqiza.

2. Izinselele Eziyinhloko Zokukhiqiza Ekwenziweni Kwe-PCB Ezinezingqimba Eziyi-8

Ukwenziwa kwe-PCB enezingqimba eziyisishiyagalombili kudinga ukulawulwa okuhlelekile kokubhaliswa kwezingqimba zangaphakathi, i-lamination, ukubhoboza kanye ne-geometry yebhodi eliqediwe. Lezi zici ziba zibaluleke kakhulu lapho umklamo uqukethe umzila wokuphunyuka we-BGA oqinile, ama-capture pad amancane, izindawo ezivulekile noma izimpawu zokuvimbela ezilawulwayo.

Ukubhaliswa Kwezingqimba Zangaphakathi Nokubhoboza

Zonke izendlalelo zethusi kumele zihlale zihambisana nokubekezelelana kokukhiqiza okucacisiwe. Ukubhaliswa okungalungile kunganciphisa imingcele yendandatho ejikelezayo, kuthinte ukuvuleka kanye nokwehla ngokuthembeka. Ingozi iyanda lapho umklamo uhlanganisa amaphedi amancane, amaphethini okubhoboza aminyene kanye nesikhala esilinganiselwe sethusi.

Ngaphambi kokukhiqiza, umenzi kufanele abukeze izimbobo zokubhoboza zibe yithusi, izidingo zendandatho ehlanganisiwe kanye nemingcele yokubhalisa edingekayo ekwakheni okukhethiwe. Ama-vias angaboni, ama-vias angcwatshwe kanye nokubhoboza ngemuva kufanele kuchazwe ngokucacile ngoba angaletha izidingo ezengeziwe zenqubo.

Ikhwalithi Yokulayina kanye Nokuthamba Kwebhodi

Ukukhetha okuyinhloko kanye nokulungiselela kusengaphambili, ukugeleza kwe-resin, ukusatshalaliswa kwethusi kanye nokulawulwa kwe-lamination kuthinta ikhwalithi yokwakhiwa okuqediwe kwezingqimba eziningi. Ukulawulwa kwenqubo okunganele kungabangela amaphutha angaphakathi noma ukungazinzi kobukhulu.

Ukugoba kwebhodi kanye nokusonta nakho kudinga ukunakwa lapho i-PCB kumele ilingane nendawo ebiyelwe ngomshini noma idlule ekugelezeni kabusha kwe-SMT. I-stackup elinganayo iyindawo yokuqala ewusizo, kodwa ukusatshalaliswa kwethusi, izakhiwo zezinto, i-geometry yebhodi kanye nokuvezwa kokushisa nakho kuthinta ukuba yisicaba.

Ukungaguquguquki kanye Nokuvumelana Kokukhiqiza

I-stackup esetshenziswe ekwakhiweni kumele ihambisane nokwakhiwa okusetshenziswa ekukhiqizeni. Izinguquko ezingakabuyekezwa ku-laminate, isikhala se-dielectric noma i-geometry yethusi zingathinta i-impedance futhi zenze ibhodi elenziwe lingahambisani nezibikezelo zikagesi zokuqala.

Kumaphrojekthi alawulwayo, vumelanani ngamanani aqondiwe, ukubekezelelana, izindlela zokuqinisekisa kanye nezidingo zokubika ngaphambi kokukhiqiza. Lapho kuphakanyiswa khona ukushintshana kwezinto noma ukulungiswa kwe-stackup, thola imvume yobunjiniyela ngaphambi kokusetshenziswa.

3. Izindleko Zokukhiqiza ze-PCB Ezinezingqimba Eziyi-8 kanye Nokubuyekezwa kwe-DFM

Izindleko ze-PCB enezingqimba eziyisishiyagalombili zincike kokungaphezu kwenani lezingqimba zayo. Ubukhulu bebhodi, ukukhethwa kwe-laminate, ukujiya kwethusi, izidingo zokubhoboza, ngezakhiwo, ukuqeda ubuso, ukubekezelelana, ukuhlolwa kanye nobuningi be-oda konke kuthinta ikhotheshini yokugcina.

Lapho Izindleko Zokukhiqiza Zingancishiswa Khona

• Buyekeza ngokusebenzisa ubunzima: Sebenzisa izimbobo ezivamile ezifakwe amapulangwe uma izidingo zikagesi nezomzila zikuvumela. Izakhiwo ezithuthukisiwe kufanele zixazulule inkinga yomklamo ochaziwe.
• Qinisekisa izidingo zezinto ezibonakalayo: Cacisa i-laminate ethile uma kudingeka izakhiwo zayo zikagesi, zokushisa noma zokuthembeka. Qinisekisa ezinye izindlela ngaphambi kokwamukela ezinye.
• Setha ukubekezelelana okusebenzayo: Sebenzisa izidingo eziqinile zobukhulu, ukubhoboza kanye ne-impedance lapho umklamo uzidinga khona, kunokunciphisa zonke izici ngokungadingekile.
• Thuthukisa ukusetshenziswa kwephaneli: Buyekeza ubukhulu bebhodi, ukucushwa kwe-array kanye nobuningi be-oda ngenkathi ulondoloza izidingo zokuphathwa kwe-assembly kanye nokuhlolwa.
• Qhathanisa izingcaphuno ezilinganayo: Qinisekisa ukuthi wonke umhlinzeki ubeka amanani afanayo e-stackup, izisindo zethusi, ukuqeda kobuso, ububanzi bokuhlola kanye nemigomo yokulethwa.

Ukulungiswa kwezindleko akufanele kuze ngezindleko zobuqotho besiginali, ukuthembeka noma imininingwane yokukhiqiza evunyiwe. Ukonga okuwusizo kakhulu yilabo abasusa ubunzima obungadingekile ngenkathi kulondolozwa izidingo zokusebenza kwebhodi.

Ulwazi Oludingekayo Ukuze Kutholakale Isilinganiso Esinembile

Ukuze unciphise ukubambezeleka kwekhotheshini, lungisa amafayela e-Gerber noma e-ODB++, idatha yokubhoboza ye-NC, umdwebo we-stackup, ubukhulu bebhodi, ukujiya okuqediwe, izinsimbi zethusi, izidingo ze-laminate, ukuqeda kwendawo kanye nobuningi be-oda. Faka imininingwane yokulawula i-impedance kanye nezidingo zenqubo ekhethekile lapho kufanele khona.

Cela umenzi ukuthi abhale phansi noma yikuphi ukuqagela, okungafakwanga noma ezinye izindlela eziphakanyisiwe. Ukuze ukhiqize okuphindaphindiwe, chaza futhi ukwephulwa kwamanani, izindleko zobunjiniyela zesikhathi esisodwa kanye nendawo lapho isikhathi sokuhola esicashuniwe siqala khona.

Ukuze uthole ukuhlela okwengeziwe kwesabelomali, bheka umhlahlandlela wethu wezindleko zokwenziwa kwe-PCB . Imininingwane ephelele yenza kube lula ukuqhathanisa abahlinzeki ngesisekelo esifanayo sokukhiqiza.

4. Izinsizakalo Zokwakha Nokuhlanganisa I-PCB Ezinezingqimba Eziyi-8

Ngemikhiqizo edinga amabhodi wesekethe agcwele abantu, ukwenziwa kanye nokuhlanganiswa kufanele kucatshangelwe ndawonye. Izinyathelo zezingxenye, ukubekwa kwe-BGA, ukufakwa kwamaphaneli, imaski yokusoda, ukuqeda kwendawo kanye nokufinyelela kokuhlola kungathinta ukuhlanganiswa ngisho nalapho i-PCB engenalutho ihlangabezana nezidingo zayo.

I-Highleap Electronics inikeza izinsizakalo zokukhiqiza i-PCB kanye nokuhlanganisa i-PCB yemikhiqizo kagesi enezingqimba eziningi. Kuye ngezidingo zephrojekthi, ububanzi bungafaka phakathi ukwenziwa kwe-PCB, ukuthola izingxenye, i-SMT kanye nokuhlanganisa imbobo, i-AOI, ukuhlolwa kwe-X-ray kanye nokuhlolwa kokusebenza.

Ngaphambi kokukhipha i-oda le-PCBA, lungisa i-BOM, idatha yokukhetha nokubeka, imidwebo yokuhlanganisa kanye nemiyalelo yokuhlola efanele. Qinisekisa ukubuyekezwa kwebhodi kanye nemininingwane yezingxenye ukuze ukwenziwa nokuhlanganisa kusekelwe kumklamo ofanayo ovunyiwe.

Ukuze uthole ukwesekwa kokukhiqiza okuhlanganisiwe, hlola isevisi yethu yokuhlanganisa i-PCB kanye namakhono okuhlanganisa i-PCB.