Izinto ze-PCB ze-AI Server: Ama-Laminate Aphansi Okulahlekelwa, Ukufakwa Kwezitaki, Umhlahlandlela Wokushisa kanye ne-PCBA

Ukukhetha izinto ze-PCB zeseva ye-AI akufani nokukhetha i-laminate ye-FR-4 evamile. Ihadiwe yeseva ye-AI ihlanganisa iziteshi ze-SerDes ezinesivinini esikhulu, ukulethwa kwamandla kwe-GPU noma i-accelerator, inani eliphezulu lezingqimba, umzila we-BGA oqinile, izindiza zethusi ezisindayo, ukulawulwa okuqinile kwe-impedance kanye nokuthembeka kokushisa kwesikhathi eside ohlelweni lwebhodi elilodwa. Uma kukhethwa izinto ze-PCB ezingalungile, inkinga ingase ibonakale njengokulahlekelwa kokufakwa, imidwebo yamehlo avaliwe, i-impedance engazinzile, ukuphakama kwezinga lokushisa ngokweqile, ngokukhathala, ingozi ye-CAF, i-warpage, amaphutha okuhlangana noma ukukhiqizwa okulibazisekile ngoba i-laminate edingekayo ayitholakali.

Lo mhlahlandlela ubhalelwe onjiniyela, izinkampani ezisafufusa zehadiwe, amaqembu okuthenga kanye nabaphathi bemikhiqizo abafuna izimpendulo ezisebenzayo zemibuzo efana nalokhu: Yikuphi okokusebenza kwe-PCB okufanele ngisebenzise ebhodini leseva ye-AI? Ingabe i-FR-4 yanele? Ngidinga nini i-Megtron, i-Tachyon, i-Astra, i-laminate ekhethekile ephansi yokulahlekelwa noma enye i-laminate ephansi yokulahlekelwa? I-Dk, i-Df, ukugoba kwethusi kanye nokuluka kwengilazi kuzithinta kanjani iziteshi ze-112G noma ze-224G? Yini okufanele ngiyibuze umenzi we-PCB ngaphambi kokumisa i-stack-up?

I-Highleap Electronics iyifektri yokukhiqiza i-PCB kanye ne-PCB assembly. Kumaphrojekthi e-AI server, i-GPU, i-accelerator, i-networking kanye ne-high-performance computing, indlela efanele akuyona ukukhetha igama lezinto ezihlukene. Izinto kumele zihlolwe kanye nesivinini sesignali, ubude besiteshi, inani lezendlalelo, isakhiwo se-impedance, isisindo sethusi, ngesakhiwo, inqubo ye-lamination, iphrofayili ye-soldering kanye nezidingo zephakheji yezingxenye.

Lokho Okudingeka Kuxazululwe Izinto ze-AI Server PCB

Amaseva e-AI abeka ukucindezeleka okungavamile ezintweni ze-PCB ngoba ibhodi aliyona nje into yokuthwala imishini yezingxenye. Liyingxenye yesiteshi sikagesi, inethiwekhi yokulethwa kwamandla, indlela yokushisa kanye nesakhiwo sokuthembeka. Izinto zithinta ngqo ukulahleka kwesiginali, ukuzinza kwe-impedance, ukujika kwesikhathi, ukwanda kokushisa, ukusinda kokushiswa kwe-solder kanye nomkhiqizo wokugcina.

I-PCB yezimboni evamile ingakhethwa ikakhulukazi nge-Tg, isisindo sethusi, ukujiya kwebhodi kanye nezindleko. I-PCB yeseva ye-AI idinga ukubuyekezwa okujulile kakhulu. Izinto kumele zisekele ukuxhumana kwedijithali okusheshayo phakathi kwama-GPU, ama-CPU, amadivayisi ememori, ama-retimers, amaswishi, ama-NIC, ama-backplanes, abalawuli besitoreji kanye namamojula wamandla. Ibhodi lingaqukatha izendlalelo eziningi, imijikelezo eminingi ye-lamination, ama-vias angaboni futhi agqitshwe, ukubhoboza emuva, umzila wokuphunyuka we-BGA ominyene kakhulu kanye nezindlela zamanje ezinkulu.

Iphuzu elibaluleke kakhulu ukuthi izinto ze-PCB zeseva ye-AI "ezingcono kakhulu" zincike emsebenzini webhodi. Ibhodi lesisekelo le-GPU, ikhadi le-accelerator, ibhodi lokushintsha, i-backplane, isilawuli sesitoreji kanye nebhodi lokusabalalisa amandla akudingi njalo i-laminate efanayo. Ukusebenzisa izinto ezilahleka kakhulu kuyo yonke indawo kungandisa izindleko ngokungadingekile. Ukusebenzisa i-FR-4 ejwayelekile ezingqimbeni ezibalulekile zesivinini esikhulu kungabangela ukwehluleka kukagesi. Uhlelo oluhle lwezinto luhlukanisa izendlalelo ezibalulekile ezingqimbeni ezingezona ezibalulekile futhi lwakha i-stack-up ehlangabezana nezidingo zobunjiniyela nezokukhiqiza.

Izidingo Zezinto Ezibalulekile Zamabhodi E-AI Server Ahlukene

Iseva ye-AI iqukethe izinhlobo eziningana ze-PCB. Ibhodi ngalinye linokulinganisela okuhlukile kobuqotho besiginali, ukulethwa kwamandla, umthwalo wokushisa kanye nokuzwela kwezindleko. Ngaphambi kokukhetha i-laminate, thola uhlobo lwebhodi kanye nezixhumi ezithwalayo.

Yingakho usesho lwe-“AI server PCB materials” lungenakuphendulwa ngegama elilodwa lezinto ezibonakalayo. Impendulo efanele iqala ngemephu yesignali. Yiziphi izendlalelo eziphethe ama-differential pairs angu-112G noma angu-224G? Yiziphi izinsalela ezimfushane ngokwanele ukubekezelela izinto ezibiza kancane? Yiziphi izendlalelo eziyinhloko amandla noma ukulawula ngesivinini esiphansi? Yiziphi izingxenye ezidinga isisindo sethusi esiphezulu? Yiziphi ama-BGA adinga i-HDI? Umkhiqizi we-PCB kufanele abukeze le mibuzo ngaphambi kokuncoma i-stack-up.

Indlela Yokukhetha Ama-Laminate Aphansi Okulahlekelwa Ama-PCB E-AI Server

Izakhiwo zezinto ezifunwa kakhulu zama-PCB eseva ye-AI yi -Dk kanye ne -Df . I-Dk, noma i-dielectric constant, ithinta i-impedance kanye nokubambezeleka kokusabalala. I-Df, noma i-dissipation factor, ithinta ukulahleka kwe-dielectric. Emafrikhwensini aphezulu, umehluko omncane ku-Df ungaba umehluko omkhulu ekulahlekelweni kwesiteshi, ikakhulukazi lapho ubude bokulandelela bude noma lapho isiteshi sihlanganisa izixhumi, ama-via, amaphakheji kanye nama-retimers.

Kuhadiwe yeseva ye-AI, ukukhethwa kwe-laminate kufanele kusekelwe kwisabelomali sesiteshi esiphelele, hhayi kuphela enanini ledatha. Izinto ezine-Df ephansi ngokuvamile zinikeza ukusebenza okungcono kokulahlekelwa, kodwa umphumela webhodi eliqediwe uncike nasekuqineni kwethusi, ukujiya kwe-dielectric, ukuluka kwengilazi, i-trace geometry, ngokusebenzisa ukuguqulwa, ukubhoboza emuva, ikhwalithi yesixhumi kanye nokubekezelelana kokukhiqiza.

Imindeni evamile yezinto ze-PCB ezisheshayo ezisetshenziswa kumaphrojekthi eseva, enethiwekhi kanye ne-HPC ifaka phakathi uchungechunge lwe-Panasonic MEGTRON, uchungechunge lwe-Isola Tachyon kanye ne-I-Tera, i-Isola Astra MT77, izinto ezikhethekile ze-laminate ezilahlekelwa kakhulu, izinto ze-AGC kanye nezinye izinhlelo ze-CCL ezilahlekelwa kakhulu. Kodwa-ke, amagama ezinto akufanele aphathwe njengokushintshana okuzenzakalelayo komunye nomunye. Ngisho noma izinto ezimbili zinamanani afanayo e-Df, zingahluka ku-Dk, inketho ye-copper foil, ukugeleza kwe-resin, ukutholakala kobukhulu, i-CTE, ukuziphatha kwe-lamination, amandla e-peel kanye nokunikezwa kwesikhathi eside.
Uma ukwakheka kweseva kucacisa i-MEGTRON M, Ukukhiqiza kwe-MEGTRON M ngezingqimba eziningi kufanele kuhlolwe ngokwakhiwa okuvunyiwe kunelebula lezinto ezisezingeni lomndeni.

I-Copper Foil, Indwangu Yengilazi, Uhlelo Lwe-Resin kanye Nomklamo Wokugoqa

Kwizinto ze-PCB zeseva ye-AI, i-laminate iyingxenye eyodwa kuphela yesilinganiso sokusebenza. I-foil yethusi, indwangu yengilazi kanye nohlelo lwe-resin kubaluleke ngendlela efanayo. Ukwehluleka okuningi kobuqotho besignali kwenzeka ngoba ithimba lokuklama lihlola i-Dk ne-Df kodwa alinaki ubulukhuni bomqhubi, i-glass weave skew noma ukuziphatha kwe-hybrid stack-up.

1. I-Copper foil: kungani i-HVLP ibalulekile

Kumaza amaningi e-GHz, ugesi wesignali ugeleza eduze kobuso bomqhubi. Ithusi eliqinile landisa indlela yamanje esebenzayo futhi landisa ukulahlekelwa ngumqhubi. Yingakho ama-PCB eseva ye-AI esheshayo evame ukudinga ithusi eliphansi kakhulu, ithusi le-VLP, ithusi le-HVLP noma izinketho ezifanayo zethusi elibushelelezi. Eziteshini ezinde ze-112G noma ze-224G, ukuba lukhuni kwethusi kungaba nomthelela omkhulu ekulahlekelweni kokufakwa.

Uma ubuyekeza i-foil yethusi, hlola:

• Kungakhathaliseki ukuthi izinto ezisetshenziswayo zisebenzisa ithusi elijwayelekile, i-RTF, i-VLP, i-HVLP noma ithusi le-HVLP3.
• Inani lobukhali elisetshenziswe kumodeli yobuqotho besignali.
• Ingabe inketho ye-copper foil iyatholakala yini ngobukhulu be-laminate obudingekayo kanye nesisindo sethusi.
• Ukuthi i-foil ekhethiwe igcina amandla anele okuxebuka ngemva kokwenziwa nokuhlanganiswa.
• Ukuthi umenzi we-PCB angakwazi yini ukulawula ukuqoshwa kwemigqa emincane edingekayo kanye nokubekezelelana kwe-impedance.

2. Indwangu yengilazi: ukugoba kanye nokuqina kwe-impedance

Ukuluka ngengilazi kudala ukuhlukahluka kwe-dielectric yendawo ngoba isignali ingadlula phezu kwamaqoqo engilazi nezindawo ezicebile nge-resin. Ngesivinini esiphansi lokhu kungamukeleka. Ngamazinga edatha yeseva ye-AI, ikakhulukazi kuma-differential pairs amade, ukugoba ngengilazi kunganciphisa i-timing margin kanye nokuvulwa kwamehlo.

Ama-stack-up eseva ye-AI avame ukusebenzisa ingilazi esakazekile, ingilazi ye-low-Dk noma izitayela zengilazi ezilukiwe ngesikwele ukudala indawo efanayo ye-dielectric. Ukuqondisa ama-differential pairs nge-engeli encane, ukusebenzisa izitayela ezifanele ze-prepreg nokugcina i-pair geometry ihambisana nakho kungasiza ekunciphiseni ukugoba. Lezi zinketho kufanele zixoxwe ngesikhathi sokuklama i-stack-up kunokuba kuxoxwe ngazo ngemva kokuthi ukwakheka kwe-PCB sekuqediwe.

3. Uhlelo lwe-resin: ukuziphatha kokushisa nokucubungula

Uhlelo lwe-resin luthinta i-Df, Tg, Td, ukumuncwa komswakama, ukumelana ne-CAF, ukugeleza kwe-resin kanye nekhwalithi ye-lamination. Kuma-PCB eseva ye-AI, i-resin kumele iphile ekuchayekeni okuningi kokushisa: i-PCB lamination, i-solder mask curing, i-surface finish processing, i-reflow soldering kanye nokusebenza kwesikhathi eside endaweni yeseva enokushisa okuphezulu.

Imibuzo ebalulekile ehlobene ne-resin ihlanganisa:

• Ingabe izinto ziyahambisana nemijikelezo eminingi ye-lamination?
• Ingabe izinto zine-Tg efanelekile kanye nokushisa kokubola kwephrofayili yokuhlanganisa?
• Ingabe inomswakama ophansi ukuze inciphise ukugeleza kabusha kanye nengozi yokuthembeka?
• Ingabe i-CAF ayimelani nezakhiwo eziqinile ezinama-voltage aphezulu noma ezinendawo encane?
• Ingabe i-prepreg inganikeza ukugeleza okwanele kwe-resin nxazonke zethusi elisindayo kanye nezendlalelo zangaphakathi eziyinkimbinkimbi?

4. Ama-stack-up ahlanganisiwe: ukusebenza ngaphandle kwezindleko ezingadingekile

Amabhodi amaningi eseva ye-AI asebenzisa ama-stack-up ahlanganisiwe. Izendlalelo ezibaluleke kakhulu zesivinini esiphezulu zisebenzisa izinto zokulahlekelwa okuphansi noma ezilahlekelwa kakhulu, kuyilapho izendlalelo zesivinini esiphansi noma zamandla/zokulawula zisebenzisa izinto ze-FR-4-class ezine-Tg ephezulu noma ezilahlekelwa kancane. Le ndlela inganciphisa izindleko, kodwa kumele iklanywe ngokucophelela.

Ukwakhiwa kwe-hybrid kudala imibuzo eyengeziwe yokukhiqiza:

• Ingabe izinto zokwakha zinamanani e-CTE ahambisanayo?
• Ingabe umjikelezo wokunyathelisa uzosebenza kuwo wonke ama-cores nama-prepregs ku-stack-up?
• Ingabe ukugeleza kwe-resin kuzokwanela nxazonke zezingqimba ezisindayo zethusi?
• Ingabe ibhodi lizohlala liyisicaba ngemva kokulamina futhi liphinde ligeleze?
• Ingabe umenzi angagcina ukubhaliswa kanye nokubekezelelana kwe-impedance kulo lonke ukwakhiwa?

I-hybrid stack-up akufanele iphathwe njengokushintshana okulula kokonga izindleko. Kufanele ilingiswe, ibalwe futhi ibuyekezwe ngumkhiqizi we-PCB ngaphambi kokukhishwa kwesakhiwo.

Izinselele Zokushisa, Ukulethwa Kwamandla kanye Nokuthembeka

Amabhodi eseva ye-AI anamandla amakhulu kakhulu. Ama-GPU, ama-accelerator, amaswishi anesivinini esikhulu, amadivayisi ememori, ama-VRM kanye namamojula e-optical noma enethiwekhi angadala izindawo ezishisayo zendawo. Ukukhethwa kwezinto ze-PCB kuthinta indlela ibhodi eliphatha ngayo ukushisa ngomshini nangogesi, noma ngabe indlela eyinhloko yokupholisa kuyi-heat sink, i-cold plate noma uhlelo lokupholisa oluwuketshezi.

Ukulethwa kukagesi kanye nokuhlela ithusi

Ukulethwa kwamandla kagesi aphezulu kudinga izindiza zethusi ezingamelani kakhulu, ngokucophelela ngokuklama kanye nokuhlukanisa okwanele. Kumabhodi e-AI accelerator nama-GPU, ukuhlela kwethusi akugcini nje ngokuba nobubanzi. Kuthinta nobukhulu bebhodi, ibhalansi ye-lamination, ukubhoboza, ukubopha, ukufana kwe-etching, ukusebenza kwe-warpage kanye ne-soldering.

Izinto ezibalulekile okufanele uzicabangele uma uletha amandla zihlanganisa:

• Isisindo sethusi esingaphakathi kanye nokusatshalaliswa kwendiza.
• Ukwehla kwe-voltage kanye nokumelana kwe-DC kwezindlela zamandla.
• Ukuphakama kokushisa okuzungeze ama-VRM, izikhonkwane zamandla ze-GPU kanye nezixhumi zamandla aphezulu.
• Ngokubala, ngosayizi, ukujiya kweplati kanye nokuziphatha kokwabelana kwamanje.
• Ukuthi izendlalelo zethusi ezisindayo zibangela ukuntuleka kwe-resin noma izikhala ze-lamination.

I-Z-axis CTE kanye nokuthembeka kwembobo embozwe nge-plated

Ama-PCB e-AI server anezinga eliphezulu angaba sengozini yokukhathala ngoba umgqomo wethusi oqoshiwe kanye ne-laminate kukhula ngamazinga ahlukene ngesikhathi sokujikeleza kokushisa. Izinto ezine-Z-axis CTE ephansi futhi elawulwa kakhulu zisiza ukunciphisa ukucindezeleka ezimbotsheni eziqoshiwe kanye nama-via. Lokhu kubaluleke kakhulu kuma-backplanes amakhulu, ama-midplanes, ama-switch board kanye nama-accelerator board abona ukushisa nokupholisa okuphindaphindiwe ngesikhathi sokusebenza.

Ama-vias okushisa, izinhlamvu zemali zethusi kanye nezindlela zokushisa zasendaweni

Amanye amabhodi eseva ye-AI adinga ukushisa ngama-array, izindawo zethusi ezisindayo, izinhlamvu zemali zethusi, izinto zokufaka zensimbi noma izici zokusabalalisa ukushisa ezisendaweni. Lezi zakhiwo kumele zihlelwe ngenqubo yezinto zokwakha kanye ne-lamination. Uhlamvu lwemali lwethusi noma indawo yethusi esindayo ingasiza ekususeni ukushisa, kodwa futhi ingadala ukungalingani kwe-CTE, ukungalingani kokugoqa noma izinkinga zokuthamba uma ingaklanyelwe ukukhiqizwa.

Ukwethenjwa kokumuncwa komswakama kanye nokugeleza kabusha

Ukumuncwa komswakama okuphansi kubalulekile kuma-PCB e-AI server athembekile kakhulu. Umswakama ngaphakathi kwe-laminate ungandisa ingozi yokuhlukanisa, ukulinganisa, ukuqhakaza noma ezinye izinkinga zokucindezeleka kokushisa ngesikhathi sokugoqa. Lokhu kuba kubaluleke kakhulu uma ibhodi lijiyile, linenani eliphezulu lezingqimba, izinto ezihlanganisiwe noma lihlanganiswe nama-BGA amakhulu kanye nezingxenye eziphezulu zokushisa.

Izinto Okufanele Uzicabangele Zokukhiqiza Nokuhlanganisa Ama-PCB

Izinto ezibukeka kahle kakhulu kudathashethi zisengahluleka ekukhiqizeni uma kunzima ukuzikhiqiza noma ukuzihlanganisa. Izinto ze-PCB zeseva ye-AI kumele zihlolwe kanye nenqubo ephelele yokukhiqiza: ukubhoboza, ukususa i-desmear, ukupenda, ukuthwebula izithombe, ukuqopha, ukugoba ngemuva, ukubhoboza ubuso, imaski yokuthunga, ukuqondisa, ukuhlolwa kukagesi kanye nokuhlanganiswa kwe-PCB kokugcina.

Izingozi zokukhiqiza i-PCB

Izingozi zokuhlanganisa i-PCB

Ngenxa yokuthi i-Highleap Electronics inikeza kokubili ukukhiqizwa kwe-PCB kanye nokuhlanganiswa kwe-PCB, ukubuyekezwa kwezinto kufanele futhi kufake inqubo ye-PCBA. Ibhodi leseva le-AI elijiyile elinama-BGA amakhulu, ithusi elisindayo, izixhumi zesisindo esiphezulu sokushisa kanye nezingxenye ezisheshayo ezizwelayo zingadinga iphrofayili yokugeleza kabusha eyenziwe ngokwezifiso kanye nokulawulwa kwe-warpage ngokucophelela.

• Ikhasi lokulwa le-BGA: Amaphakheji amakhulu e-GPU, i-CPU, i-FPGA noma amaswishi adinga ukuba flat kwebhodi okuhle kanye nokulawula ukugeleza kabusha okuzinzile.
• Ukungalingani kwesisindo sokushisa: Izindawo zethusi ezisindayo kanye nezixhumi ezinkulu zingadala ukushisa okungalingani ngesikhathi sokugoqa.
• Ukulawula umswakama: Ukubhaka, ukugcina kanye nokuphatha kungadingeka ukuze kutholakale ukuthembeka okuphezulu noma okuzwela umswakama.
• Inhlanzeko: Amabhodi anabantu abaningi angadinga ukulawulwa okuqinile kokungcola kwe-ionic ukuze kuncishiswe ukuvuza kanye nezingozi ezihlobene ne-CAF.
• Ukuhlolwa: Ukuhlolwa kwe-X-ray kubalulekile kuma-BGA, ama-via-in-pad kanye nama-solder joints afihliwe.
• Umkhawulo wokusebenza kabusha: Ukusebenza kabusha ama-BGA amakhulu kumabhodi eseva e-AI anenani eliphezulu kumele kuhlelwe ngokucophelela ngoba ukuchayeka ekushiseni okuphindaphindiwe kungacindezela i-laminate.

Ingozi Yokuphakelwa, Ukulawulwa Kwezindleko kanye Nokuhlela Komthombo Wesibili

Izinto ze-PCB zeseva ye-AI zivame ukuba nzima ukuzithola kunezingqimba ezijwayelekile. I-CCL esebenza kahle kakhulu, i-prepreg ekhethekile, i-HVLP copper foil kanye nezitayela ezithile zengilazi zingase zibe nezikhathi zokuhola ezinde, inani elincane le-oda noma imikhawulo yokwabiwa. Umklamo oncike ezintweni ezingavamile ezingenalutho oluvunyelwe ungalibazisa uhlelo oluphelele lwehadiwe.

Indlela ephephile kakhulu ukudala isu lezinto ezibonakalayo ngesikhathi sesigaba sokuklama, hhayi ngemva kokuba amafayela e-Gerber eseqediwe. Leli su kufanele lifake izinto ezikhethwayo, enye indlela evunyelwe, ukubuyekezwa kokutholakala, ukuqhathaniswa kwezindleko kanye nokuqinisekiswa kukagesi.

Iziqu zomthombo wesibili akusho ukuthi umane ufake omunye umkhiqizo esikhundleni sawo. Kusho ukuqinisekisa ukuthi izinto ezisetshenziswa esikhundleni sawo zingahlangabezana nezidingo ezifanayo zikagesi, ezishisayo, ezikamishini nezokukhiqiza. Kuma-PCB eseva ye-AI, ngisho nomehluko omncane ekujiyeni kwe-dielectric, i-Dk, i-Df, ubulukhuni bethusi noma ukuziphatha kwe-resin kungashintsha umphumela wokugcina.

Okufanele Ukuthumele I-Highleap Electronics Ukuze Kubuyekezwe Izinto Ezibalulekile

Ukuze uncome izinto ze-PCB zeseva ye-AI ezifanele, i-Highleap Electronics idinga okungaphezu kohlaka lwebhodi noma ifayela le-Gerber. Uma ukubuyekezwa kwezinto kuqala kusenesikhathi, kuba lula ukunciphisa izindleko, ukuthuthukisa isivuno nokugwema ukuklama kabusha.

Ukuze uthole isibuyekezo esisheshayo nesiwusizo, sicela uthumele ulwazi olulandelayo:

• Umsebenzi webhodi: Ibhodi le-GPU, ikhadi le-accelerator, i-switch PCB, i-backplane, i-motherboard, i-NIC, isilawuli sesitoreji noma ibhodi yamandla.
• Izinga ledatha eliqondiwe: Ukukhiqizwa kwe-PCIe, isivinini se-Ethernet, izinga le-SerDes, imfuneko ye-112G/224G noma esinye isikhombimsebenzisi esinejubane eliphezulu.
• Inani lezingqimba elilinganisiwe kanye nobukhulu bebhodi: Faka noma yiziphi izendlalelo ze-impedance ezidingekayo kanye nezindiza zamandla.
• Izinto ezikhethwayo: Uma umklamo wakho usuvele uchaza i-Megtron, i-Tachyon, i-Astra, i-specialty low-loss laminate, i-AGC, i-Shengyi noma enye i-laminate, nikeza inombolo yengxenye eqondile uma ikhona.
• Ithebula le-impedance elilawulwayo: Impedance enomphetho owodwa kanye nomehluko, ukubekezelelana, izendlalelo zokubhekisela kanye ne-trace geometry uma sekuchaziwe kakade.
• Ukufakwa kweqoqo noma ukufakwa kweqoqo lokuqala: Ubukhulu be-core/preg, isisindo sethusi kanye nokwabiwa kwesendlalelo ngesivinini esikhulu.
• Imininingwane ye-BGA: Iphimbo, inani lebhola, usayizi wephakheji, imfuneko ye-in-pad kanye nemikhawulo yomzila wokuphunyuka.
• Izidingo zamandla: Iziteshi zamandla aphezulu, isisindo sethusi, izindawo ezishisayo, ugesi wokuxhuma kanye nokwehla kwamandla kagesi.
• Ulwazi lomhlangano: I-BOM, ifayela lokubeka, amaphakheji amakhulu e-BGA, ama-thermal pad, ukuzwela kokugeleza kabusha kanye nezidingo zokuhlola.
• Uhlelo lokukhiqiza: Inani lesibonelo, ukwakhiwa kwesilingo, isibikezelo sokukhiqiza ngobuningi kanye nosuku lokulethwa okuhlosiwe.

Imibuzo Evame Ukubuzwa Ngezinto Ze-PCB Zeseva ye-AI

Yikuphi okubalulekile kwe-PCB kwamabhodi eseva ye-AI?

Akukho nto eyodwa engcono kakhulu kuwo wonke amabhodi eseva ye-AI. Amabhodi e-GPU, amabhodi okusheshisa, amabhodi okushintsha, ama-backplanes, ama-NIC kanye namabhodi kagesi anezidingo ezahlukene. Izendlalelo ezibucayi zesivinini esikhulu ngokuvamile zidinga ama-laminate aphansi, aphansi kakhulu noma aphansi kakhulu anethusi elibushelelezi. Izingxenye zokulawula zamandla noma zesivinini esiphansi zingasebenzisa izinto ze-FR-4 ezine-Tg ephezulu noma eziguquliwe uma izidingo zikagesi nezokushisa zikuvumela.

Ingabe ama-PCB eseva ye-AI angasebenzisa i-FR-4 ejwayelekile?

I-FR-4 ejwayelekile ingamukeleka ekulawuleni okunesivinini esiphansi, amandla alula noma izingxenye ezingabalulekile, kodwa ngokuvamile ayifaneleki ezindleleni ezinde ze-SerDes ezinesivinini esikhulu ezinhlelweni zeseva ye-AI. Kumashaneli esivinini esiphezulu angu-112G, 224G noma afanayo, umklamo ngokuvamile udinga i-laminate elahlekelwa kancane, ithusi elibushelelezi kanye nokuqina okungcono kwe-Dk.

Kungani i-Dk ne-Df zibalulekile ezintweni ze-PCB zeseva ye-AI?

I-Dk ithinta i-impedance kanye nokubambezeleka kokusabalala kwesignali. I-Df ithinta ukulahlekelwa kwe-dielectric. Kuma-PCB eseva ye-AI, iziteshi zesivinini esikhulu zisebenza ngezikhathi lapho ukulahlekelwa kwe-dielectric kanye nokulahlekelwa yi-conductor kunganciphisa khona i-margin yesignali. I-Dk ezinzile kanye ne-Df ephansi kusiza ukugcina i-impedance elawulwayo futhi kunciphise ukulahlekelwa kokufakwa.

Yiliphi i-foil yethusi okufanele lisetshenziswe kuma-PCB eseva ye-AI esheshayo?

Ama-PCB e-AI server asheshayo avame ukusebenzisa i-VLP, i-HVLP noma amanye ama-foil ethusi aphansi ukuze anciphise ukulahlekelwa yi-conductor. Uma ubuso bethusi bubushelelezi, kulapho ukulahlekelwa yi-conductor evame ukuba phansi khona. I-foil eqondile kufanele ikhethwe kanye ne-laminate, isivinini sesignali, ubude bokulandelela kanye nenqubo yokukhiqiza.

Kuyini i-glass weave skew futhi kungani kubalulekile?

Ukugoba kwengilazi kwenzeka lapho ama-trace amabili ku-differential pair ehlangabezana nezimo ezahlukene ze-dielectric ngenxa yesakhiwo sengilazi esilukiwe ku-laminate. Ngamazinga aphezulu edatha, lokhu kungadala ukungafani kwesikhathi futhi kunciphise umkhawulo wamehlo. Ingilazi esakazekayo, ingilazi ye-Dk ephansi, isitayela esifanele sokulungiselela kanye nesu lokuqondisa kungasiza ekunciphiseni le ngozi.

Ingabe ama-stack-up e-hybrid afanelekela ama-PCB eseva ye-AI?

Yebo, ukuhlanganiswa kwe-hybrid kuvamile lapho umklamo udinga ukulinganisela ukusebenza okusheshayo kanye nezindleko. Isihluthulelo ukubeka izinto ezilahlekelwa kancane kuphela lapho zidingeka khona futhi usebenzise izinto ezingabizi kakhulu kwenye indawo. Kodwa-ke, izinto ezihlanganisiwe kumele zibe nokuziphatha okuhambisanayo kwe-lamination, i-CTE kanye namafasitela enqubo yokukhiqiza.

Yiziphi izakhiwo zezinto okufanele zihlolwe ngaphandle kukaDkt noDf?

Izakhiwo ezibalulekile zifaka phakathi i-Tg, i-Td, i-T288, i-Z-axis CTE, ukumuncwa komswakama, ukumelana ne-CAF, amandla okuxebuka, okuqukethwe yi-resin, ubulukhuni be-copper foil, ukutholakala kwe-prepreg kanye nokuhambisana nemijikelezo eminingi ye-lamination. Lezi zakhiwo zithinta isivuno sokukhiqiza, ukuthembeka kokuhlanganiswa kanye nokusebenza kwesikhathi eside.

Ukukhethwa kwezinto kufanele kuxoxwe kusenesikhathi esingakanani nomkhiqizi we-PCB?

Ukukhethwa kwezinto kufanele kuxoxwe ngakho ngaphambi kokuhlelwa kokugcina noma nini lapho kungenzeka. Kuma-PCB eseva ye-AI, izinto zithinta ububanzi bokulandelela, isikhala, impedance, ukujiya kwesendlalelo, ngesakhiwo, ukubhoboza emuva kanye nezindleko. Uma izinto zishintshwa ngemva kokuhlelwa, ubuqotho be-stack-up kanye nesignali kungadingeka ukuthi kubalwe kabusha.

Yimaphi amafayela adingekayo ukuze kucashunwe izinto ze-PCB zeseva ye-AI?

Ukuze uthole isibuyekezo sekhotheshini kanye nobunjiniyela, thumela amafayela e-Gerber noma e-ODB++, ukuhlanganiswa kwe-stack, izidingo ze-impedance, ukukhetha kwezinto ezibonakalayo, amafayela okubhoboza, ubukhulu bebhodi, isisindo sethusi, ukuqeda kwendawo, i-BOM, ifayela lokukhetha nokubeka kanye nezidingo zokuhlanganisa. Uma umklamo ungewona owokugcina, ulwazi lokuqala lokuhlanganiswa kwe-stack kanye nesivinini se-interface lusasebenza.

Ingabe i-Highleap Electronics ingasiza kokubili ekwakhiweni kwe-PCB kanye nokuhlanganiswa kwe-PCB?

Yebo. I-Highleap Electronics isekela ukukhiqizwa kwe-PCB kanye nokuhlanganiswa kwe-PCB. Kumaphrojekthi e-AI server kanye nekhompyutha esebenza kahle, ukubuyekeza ukwenziwa kanye nokuhlanganiswa ndawonye kusiza ukunciphisa izingozi ezihlobene nokukhethwa kwezinto, i-warpage yebhodi, i-BGA soldering, isisindo sokushisa, ukuhlolwa kanye nesivuno sokukhiqiza.