Izinhlobo Zephakheji ze-BGA Zokuklama Nokuhlanganisa i-PCB

I -ball grid array (i-BGA) iyiphakheji yokufaka ebusweni exhuma ebhodini ngegridi yamabhola e-solder ngaphansi kwengxenye esikhundleni sama-lead azungeze unqenqema lwayo. Lelo lungiselelo livumela ukuxhumana okuningi endaweni encane ngokusebenza kahle kukagesi nokushisa, yingakho ama-BGA ebusa amaprosesa anamuhla, inkumbulo, nama-IC ayinkimbinkimbi. Kunezinhlobo eziningana, ipulasitiki, i-ceramic, i-tape, i-fine-pitch, i-chip-scale, i-flip-chip, nokuningi, ngayinye inezinzuzo zayo. Lo mhlahlandlela uchaza izinhlobo eziyinhloko ze-BGA, izimfanelo zazo ezibalulekile, nokuthi zisho ukuthini ekuhlanganiseni, ekuhloleni, nasekuklanyweni kwebhodi. Ekuhlanganisweni kwebhodi lesekethe le-micro-BGA , i-package pitch kanye ne-ball geometry kumele kucatshangelwe kanye nephethini yomhlaba, ukwakheka kwe-stencil kanye nokuhlolwa okuhlanganisiwe okufihliwe.

Iyini iphakheji ye-BGA?

I-BGA ibeka ukuxhumana kwayo njengeqoqo lamabhola e-solder phansi kwephakheji. Uma ibhodi seliphinde ligeleza, lawo mabhola ayancibilika futhi ahlangane nama-pad afanayo, akha uxhumano lukagesi nolwemishini.

Kungani ifomethi ikhona

Amaphakheji anomthofu aphelelwa yindawo njengoba i-I/O ibala ukukhuphuka, ngoba umthofu ungena kuphela nxazonke. Igridi yamabhola isebenzisa lonke uhlangothi olungaphansi, ngakho-ke i-BGA inikeza ukuxhumana okuningi endaweni efanayo, ngezindlela ezimfushane ezisiza ukusebenza kukagesi kanye nokuxhumana okukhulu kokushisa kokususa ukushisa. Ukushintshana ukuthi amalunga afihliwe, okwakha konke mayelana nokuhlanganiswa nokuhlolwa.

Lapho kusetshenziswa khona ama-BGA

Amaprosesa, imemori, ama-FPGA, namanye amadivayisi ane-I/O ephezulu cishe wonke angama-BGA. Ukusebenza nawo ngokuzethemba kuyingxenye yokuhlanganiswa kwe-PCB yesimanje , ikakhulukazi emabhodini aqinile, asebenza kahle kakhulu.

Izinhlobo zamaphakheji e-BGA (i-PBGA, i-CBGA, i-FBGA, i-FCBGA)

Ilebula elithi “BGA” lihlanganisa umndeni wamaphakheji ahlobene ahluka kakhulu ngezinto ezingaphansi komhlaba kanye nendlela idayisi elinamathiselwe ngayo.

Umehluko omkhulu yi-substrate (ipulasitiki, i-ceramic, noma i-tape), kungakhathaliseki ukuthi idayisi ifakwe i-flip-chip (i-FCBGA, ukuze isebenze kahle kakhulu), nokuthi ngabe ingxenye inamabhola, i-LGA iyawa futhi ithole i-solder yayo kusuka ku-paste yebhodi. I-PoP isu lokupakisha elihlanganisa amadivayisi ukuze kulondolozwe indawo yebhodi. Uhlobo olufanele luvame ukunqunywa yi-chip okufanele uyisebenzise, ​​hhayi ukukhetha kwamahhala.

Amaphakheji e-BGA vs Leaded (QFP kanye ne-QFN)

Kuyasiza ukubona ukuthi ama-BGA akuphi uma kuqhathaniswa namaphakheji ahamba phambili njenge-QFP ne-QFN.

Ama-BGA ayanqoba ngobuningi be-I/O kanye nokusebenza kukagesi nokushisa, yingakho amadivayisi anenani eliphezulu lamaphini kanye nesivinini esikhulu ewasebenzisa. Ukushintshana phakathi kokuhlola (i-X-ray esikhundleni sokubuka), ukuphinda usebenze (umoya oshisayo kanye nokuphinda usebenzise i-reball esikhundleni se-iron), kanye nebhodi eliyinkimbinkimbi kakhulu. Ngokubalwa kwamaphini aphansi iphakheji elinophawu lingase libe lula; ukukhetha kuvame ukulandela ingxenye. Noma ngabe yikuphi, ukuhlela indawo kanye nokuhlanganiswa ngesikhathi sokubuyekezwa komklamo kugcina iphakheji ekhethiwe ikhiqizwa.

I-BGA Pitch kanye neBall Count

I-pitch, isikhala esiphakathi nendawo samabhola, yisici esithinta kakhulu ukuthi kunzima kangakanani ukwakha nokuhlanganisa i-BGA.

Njengoba iphimbo lincipha, awusakwazi ukuhambisa umkhondo phakathi kwamabhola, ngakho-ke ibhodi idinga izendlalelo ezengeziwe, ama-via amancane, futhi ngokuvamile nge-in-pad. Ngakho-ke ama-BGA aphithizela kahle asunduza umklamo uye kumasu e-HDI asetshenziswa ekukhiqizeni ngesivinini esikhulu kanye nokuxinana okukhulu. Ukubalwa kwamabhola aphezulu kwenza lokhu kube nzima, njengoba ibhola ngalinye lidinga umzila wokuphuma. Engxenyeni ekhonjwe njenge-uBGA, ukubuyekezwa komhlangano wephakheji ethile ye-uBGA kufanele kusebenzise umdwebo wangempela wengxenye kanye nokuhlelwa kwebhola kunokuba kuqedwe inqubo egameni lephakheji.

Ukwakheka Kwebhola le-BGA kanye Nokuzwela Komswakama

Amaqiniso amabili abalulekile mayelana nama-BGA athinta indlela aphathwa ngayo futhi athengiswa ngayo.

• Ingxubevange yebhola. Ama-BGA anamuhla asebenzisa amabhola angenawo umthofu (i-tin-silver-copper), abeka izinga lokushisa eliphakeme lokugeleza kabusha; izingxenye ezindala zingasebenzisa amabhola anomthofu.
• Ukuzwela komswakama (MSL). Ama-BGA ayazwela umswakama: umswakama omuncwayo ungavutha ube umusi ngesikhathi sokugeleza kabusha futhi wonakalise iphakethe (“popcorning”), ngakho izingxenye zilinganiswa nge-MSL futhi zibhakwe ngaphambi kokuhlanganiswa uma zivezwe.

Ukuhlonipha ukuphathwa kwe-MSL, ukugcina izingxenye zomile futhi zibhakwa lapho kudingeka, kuyisinyathelo esiyisisekelo kodwa esibalulekile. Ukuyeqa kungaphula amaphakheji ngesikhathi sokugeleza kabusha kungakhathaliseki ukuthi yonke inqubo inhle kangakanani, yingakho yakhelwe ekugelezeni okulawulwayo kokuhlanganiswa.

Indlela Ama-BGA Ahlanganiswa Ngayo

Ukubeka i-BGA kuyinto evamile emugqeni ozenzakalelayo, kodwa kuncike ezintweni ezimbalwa ezihamba kahle.

• I-stencil kanye ne-paste. I-stencil eklanywe kahle ifaka ivolumu efanele yokunamathisela kuphedi ngayinye.
• Ukubekwa. Ingxenye ibekwe phezu kwamaphedi ayo; ayidingi ukulungiswa okuphelele ngenxa yephuzu elilandelayo.
• Iphrofayili yokugeleza kabusha. Iphrofayili elawulwayo iyancibilikisa amabhola; ukucindezeleka kobuso bese kudonsa iphakheji ukuze ivumelane (“ukuzigxilisa”).
• Ibhalansi yokushisa. Iphrofayili kumele ivumelane nobunzima bebhodi ukuze ibhola ngalinye lifinyelele izinga lokushisa ndawonye.

Ukuzigxilisa kungenye yezimpawu ezinhle ze-BGA, amabhola ancibilikisiwe adonsela iphakethe endaweni yalo. Kodwa kusebenza kuphela nge-paste deposit enhle kanye nephrofayili ehambisana nebhodi, okunzima kakhulu emabhodini asindayo anjenge- metal-core assemblies . Ukuthola iphrofayili efanele okokuqala ngqa yikho okwenza i-BGA assemblies ithembeke.

Indlela Amajoyinti E-BGA Solder Ahlolwa Ngayo (i-X-Ray)

Ngenxa yokuthi wonke amalungu afihliwe ngaphansi kwephakheji, awukwazi ukwahlulela i-BGA ngamehlo. I-X-ray iyithuluzi lokuhlola eliyinhloko.

Ukugoba kanye nokuhlangana kwebhodi kuyimbangela evamile: uma iphakethe noma ibhodi ligoba lapho liphinde ligeleza, amabhola asekhoneni noma aphakathi angase angawathinti ama-pad awo, okubangela ukuvuleka noma ukukhubazeka kwekhanda elisecaleni. I-X-ray yembula lezi zinkinga ezifihliwe, futhi emabhodini abalulekile kuyisinyathelo esidingekayo, akuyona inketho. Ukuhlola okubonakalayo kungaqinisekisa kuphela imiphetho yomugqa wangaphandle, hhayi amalunga ngokwawo.

Ukuklama i-PCB yamaPhakheji e-BGA

Ukuthembeka kwe-BGA kusekelwe kakhulu ekwakhiweni kwebhodi, ngaphambi kokuba kubekwe ingxenye eyodwa.

Indlela yokubaleka kanye nama-via

Ibhola ngalinye lidinga indlela yokuphuma. Ebholeni elikhulu, kuyasebenza umkhondo omfushane "wethambo" oya endaweni ephakathi kwamabhola. Ebholeni elincane akukho ndawo, ngakho-ke i-via-in-pad, i-egcwele futhi evalwe ngqo ebholeni, iba yinto edingekayo, okudinga ukwenziwa kwe-HDI.

Umklamo wephedi ne-stencil

Uhlobo lwephedi (i-solder-mask-defined vs non-solder-mask-defined) kanye ne-stencil aperture kuthinta ukuma nokuthembeka kwamalunga, futhi kufanele kulandele iphakheji kanye neziqondiso zokuhlanganisa. Lena yimininingwane ehlolwa ukubuyekezwa komklamo wokukhiqiza ngaphambi kokwenziwa.

Ukufakwa kanye nokwakhiwa

Ukubalwa kwezingqimba zokushayela ze-BGA ezisezingeni eliphansi, ezibalwe ngebhola eliphezulu, izakhiwo ze-microvia, kanye nokubekezelelana kokubhalisa, konke kunqunywe ngesikhathi sokukhiqiza i-PCB . Ukuklama ibhodi kanye ne-BGA escape ndawonye kugwema ingxenye engenakuthuthwa noma ithengiswe ngokwethembeka.

Ukuvuselelwa kwe-BGA kanye nokuBuyiselwa kabusha

Ama-BGA angasuswa futhi afakwe esikhundleni sawo, kodwa inqubo ikhethekile.

• Ukususwa. Isiteshi sokuvuselela umoya oshisayo noma i-infrared siphinda sigeleze amabhola afihliwe ukuze iphakethe liphakanyiswe liqonde phezulu.
• Ukuphinda udlale ibhola. Ukuze usebenzise kabusha i-BGA, kufakwa amabhola amasha nge-stencil kanye ne-preform, okubuyisela i-array.
• Ukuqinisekisa. Amalunga aphinde alungiswa ahlolwa nge-X-ray, njengoba engabonakali.

Ukuphinda usebenzise i-reball kuvamile kumadivayisi abizayo noma aphelelwe yisikhathi, kodwa kudinga imishini efanele kanye nephrofayili elawulwayo. Emikhiqizweni eminingi, ukuthola i-assembly yokuqala ngendlela efanele, ngokunamathisela okuhle, iphrofayili, kanye nomklamo, kungcono kakhulu kunokuphinda usebenzise ama-BGA, futhi lokho kuvumelana kubaluleke kakhulu ekuhlanganisweni kwevolumu ephezulu.

Thola Isilinganiso Somhlangano we-BGA

Ama-BGA eza ngezinhlobo eziningi, ipulasitiki, i-ceramic, i-fine-pitch, i-chip-scale, i-flip-chip, i-LGA, kanye ne-PoP, kodwa abelana ngamajoyinti afihliwe, asekelwe ebholeni adinga ukwakheka okucophelelayo, iphrofayili yokulawula ukugeleza kabusha, kanye nokuhlolwa kwe-X-ray. Khetha uhlobo olufunwa yi-chip yakho, klama indlela yokuphuma ukuze ifane ne-pitch, bese uqinisekisa nge-X-ray. Ungafunda kabanzi mayelana ne-Highleap Electronics kanye nekhono lethu lokuhlanganisa i-BGA.

imibuzo ejwayelekile ukubuzwa

Iyini iphakheji ye-BGA?

I-ball grid array iyiphakheji yokumisa phezu kwebhodi exhuma ebhodini ngegridi yamabhola e-solder ngaphansi kwayo esikhundleni sama-lead azungeze unqenqema lwayo. Lokhu kuhlanganisa ukuxhumana okuningi endaweni encane esebenza kahle kagesi nokushisa, yingakho ama-processor, imemori, nama-IC ayinkimbinkimbi eyisebenzisa.

Yiziphi izinhlobo eziyinhloko ze-BGA?

Ipulasitiki (PBGA), i-ceramic (CBGA), i-tape (TBGA), i-fine-pitch (FBGA), i-chip-scale (uBGA/CSP), i-flip-chip (FCBGA), i-land grid array (LGA, enama-pads hhayi amabhola), kanye ne-package-on-package (PoP, ehlanganisa amadivayisi). Ziyahlukahluka kakhulu ngezinto ezingaphansi komhlaba kanye nendlela idayisi enamathiselwe ngayo.

Uyini umehluko phakathi kwe-BGA ne-LGA?

I-BGA ifika namabhola e-solder asevele ekhona ephaketheni, kuyilapho i-LGA inezindawo eziyisicaba futhi ingenawo amabhola, ithola i-solder yayo kusuka ku-paste ephrintiwe ebhodini ngesikhathi sokuhlanganiswa. Ngaphandle kwalokho womabili angama-grid-array, amaphakheji axhunywe phansi futhi abelana ngezinto ezifanayo zokuqondisa nokuhlola.

Kungani ama-BGA edinga ukuhlolwa kwe-X-ray?

Ngenxa yokuthi amalunga e-solder ahlala ngaphansi kwephakheji futhi awabonakali, i-X-ray iyindlela kuphela yokuqinisekisa ukuthi akhona. Iveza ukugoba, ukubopha, umcamelo ongaphakathi, kanye namalunga avulekile, ikakhulukazi lawo abangelwa ukugoba kwephakheji noma kwebhodi. Emabhodini abalulekile, i-X-ray iyisinyathelo sokuhlola esidingekayo kunokuba kube ngokuzithandela.

Yiliphi iphimbo elibhekwa njengephimbo elihle, futhi kungani libalulekile?

Ama-pitch angaba ngu-0.5 mm nangaphansi ayi-pitch encane. Abalulekile ngoba awusakwazi ukuhambisa umkhondo phakathi kwamabhola, ngakho-ke ibhodi lidinga izendlalelo ezengeziwe, ama-microvia, kanye ne-via-in-pad, okuliqhubela ekwakhiweni kwe-HDI. Ama-pitch amakhulu (1.0 kuya ku-1.27 mm) anezindlela ezijwayelekile.

Kuyini i-via-in-pad futhi idingeka nini?

I-Via-in-pad ibeka i-via ngqo ngaphakathi kwe-BGA pad, i-via igcwele futhi ivaliwe ukuze ikwazi ukudayiswa. Iyadingeka endaweni encane, lapho kungekho khona indawo yokuphuma kwe-dog-bone kuya ku-via eceleni kwebhola. Idinga ukwenziwa kwe-HDI futhi yengeza izindleko kodwa ivumela ukuhanjiswa okuqinile.

Ingabe i-BGA ingasuswa futhi isetshenziswe kabusha?

Yebo, ngokushintsha umoya oshisayo noma i-infrared ukuze uyisuse kanye nokuphinda usebenzise amabhola amasha ngaphambi kokusebenzisa kabusha, kulandelwe ukuqinisekiswa kwe-X-ray. Kuvamile ezingxenyeni ezibizayo noma eziphelelwe yisikhathi, kodwa kudinga imishini efanele kanye nephrofayili elawulwayo. Ekukhiqizeni, ukuhlanganiswa kokuqala okufanele kungcono kunokuphinda usebenzise ama-BGA.

Kufanele ngisebenzise nini i-BGA esikhundleni sephakheji eholelekile?

Sebenzisa i-BGA uma ingxenye inenani eliphezulu le-I/O noma idinga ukusebenza kahle kukagesi nokushisa kwegridi egcwele engaphansi, yingakho ama-processor nama-FPGA ezisebenzisa. Ukuze uthole inani eliphansi lamaphini, iphakheji ene-lead efana ne-QFP noma i-QFN ingaba lula ukuyihlanganisa, ukuyilungisa ngesandla, nokuhlola. I-chip okumele uyisebenzise ivame ukuyinquma.