Incazelo Eningiliziwe Yezakhiwo Zesitaki Ezivamile ze-HDI PCB

Izakhiwo Ezivamile Zokwendlalela zamabhodi e-HDI PCB

Ama-PCB we-HDI (High-Density Interconnect) afaka ama-micro vias, ukulandelela ububanzi/isikhala esincane, nezendlalelo ezistakiwe, okuvumela ukuxhumana okuminyene kanye nomklamo ohlangene. Lezi zici zenza ama-HDI PCB afanele ukusebenza okuphezulu, izinhlelo zokusebenza ezinesikhala.

Izakhiwo Ezijwayelekile Zokwendlalela zama-HDI PCB:

1. 2+N+2 Isakhiwo: 2 izendlalelo zangaphakathi, N izendlalelo zangaphandle (ezisetshenziselwa amabhodi anezingqimba eziyi-6).
2. 3+N+3 Isakhiwo: 3 izendlalelo zangaphakathi, N izendlalelo zangaphandle (ezisetshenziselwa amabhodi anezingqimba eziyi-8).
3. 4+N+4 Isakhiwo: 4 izendlalelo zangaphakathi, N izendlalelo zangaphandle (ezisetshenziselwa ungqimba olu-10 nangaphezulu amabhodi).
4. 5+N+5 Isakhiwo: 5 izendlalelo zangaphakathi, N izendlalelo zangaphandle (ezisetshenziselwa ungqimba olu-12 nangaphezulu amabhodi).

Ama-Blind Vias: Ama-Blind vias axhumanisa izendlalelo zangaphakathi nezendlalelo zangaphandle, okunciphisa ukujiya kwe-PCB.

Ama-Bried Vias: Ama-Bried Vias adala ukuxhumana phakathi kwezingqimba zangaphakathi, okwenza kube ngcono ukusetshenziswa kwezingqimba.

Ngokuvamile, izimbobo eziyimpumputhe nezigqitshiwe zisukela ku-0.075 kuya ku-0.2 mm ububanzi futhi zidalwe kusetshenziswa izindlela ezifana nokubhoboza nge-laser, ukufakwa kwe-plasma, kanye ne-photosensitive etching, okuvame kakhulu ukubhola nge-laser.

Ama-HDI PCB, anezingxenye zawo zokuminyana okuphezulu nokuxhumana, alungele imiklamo eyinkimbinkimbi efana ne-5G, IoT, nezinhlelo zokusebenza zezimoto. Umklamo wabo wokupakisha wenziwa ngendlela oyifisayo ngokusekelwe ezidingweni ezithile zephrojekthi ngayinye.

Ibhodi Lesifunda Eliphrintiwe Eline-oda Lokuqala Elilula Eline-Laminated (Ibhodi Lokuqala Le-Laminated 6-layer, Isakhiwo sokupakisha ngu-(1+4+1))

Lolu hlobo lwesitaki se-HDI PCB, ikakhulukazi i-PCB elaminethiwe ye-oda lokuqala, ilula kakhulu, lapho ibhodi lezendlalelo eziningi elingaphakathi lingenazo izimbobo ezigqitshiwe futhi liqedwa ngokucindezela kanye. Nakuba kuyibhodi lebhodi elinezingqimba eziyisi-6 eline-oda lokuqala, inqubo yalo yokukhiqiza ifana kakhulu naleyo yomklamo we-PCB we-multilayer owenziwe kanye. Umehluko oyinhloko ukuthi kudinga ukubhola nge-laser ye-vias eyimpumputhe kanye nezinqubo eziningi.

Njengoba lesi sakhiwo sesitaki se-HDI PCB singenazo izimbobo ezigqitshiwe, izendlalelo zesi-2 nesesi-3 zingenziwa zibe i-PCB ewumgogodla ekukhiqizeni, futhi isendlalelo sesi-4 nesi-5 sisetshenziswa njengelinye ibhodi eliwumongo. Isendlalelo sangaphandle sengezwe ngesendlalelo se-dielectric kanye ne-foil yethusi, futhi phakathi nendawo yengezwe ngesendlalelo se-dielectric bese icindezelwa kanye, okuyinto elula kakhulu futhi enezindleko eziphansi uma kuqhathaniswa namabhodi ajwayelekile ajwayelekile okuqala.

Ibhodi Lesifunda Eliphrintiwe Le-oda Lokuqala Le-Laminated HDI (Ibhodi Lezendlalelo Eziyisi-6 ze-Laminated HDI, Isakhiwo Esistakiwe ngu-(1+4+1))

Isakhiwo salolu hlobo lwesitaki se-HDI PCB sithi (1+N+1), (N≥2, N silingana). Lesi sakhiwo siwumklamo ojwayelekile wamabhodi embonini ane-laminated oda lokuqala njengamanje. Ibhodi lezendlalelo eziningi elingaphakathi livale i-vias futhi lidinga ukucindezelwa kabili ukuze liqedele. Ngaphezu kwezimbobo eziyizimpumputhe, lolu hlobo lwebhodi elinongqimba olulodwa lwe-laminated nalo linezimbobo ezingcwatshwe.

Uma umklami engakwazi ukuguqula lolu hlobo lwe-HDI PCB lube uhlobo lokuqala olushiwo ngenhla lwe-PCB enama-oda yokuqala elula, kuyoba usizo kuzo zombili izinhlangothi zokuhlinzeka nezidingo. Ngemva kokusikisela kwethu, amakhasimende ethu amaningi akhethe ukushintsha ukwakheka kokunqwabelanisa kwamabhodi avamile we-HDI enziwe nge-aminated ye-HDI abe ebhodini elilula eline-oda lokuqala elifana nohlobo lokuqala.

Ibhodi Lesifunda Eliphrintiwe Lesibili Le-Laminated HDI Ephrintiwe (Ibhodi Lesibili Lezendlalelo ezingu-8 ze-Laminated HDI, Isakhiwo sokupakisha sithi (1+1+4+1+1))

Isakhiwo salolu hlobo lwesitaki se-HDI PCB sithi (1+1+N+1+1), (N≥2, N silingana). Lesi sakhiwo siwumklamo ojwayelekile wamabhodi e-HDI we-oda lesibili embonini okwamanje. Ibhodi lezendlalelo eziningi elingaphakathi livale i-vias futhi lidinga ukucindezelwa kathathu ukuze liqedele. Isizathu esiyinhloko salokhu ukuntuleka komklamo wembobo enqwabelene, okwenza ubunzima bokukhiqiza bulinganisele.

Kodwa-ke, njengoba kushiwo ngenhla, uma ama-vias angcwatshwe wezingqimba (3-6) elungiselelwe ama-vias angcwatshwe izingqimba (2-7), ukucindezela okukodwa kungancishiswa. Le nqubo yokwenza kahle ingaholela ekwehlisweni kwezindleko kuyilapho kugcinwa ubuqotho besakhiwo se-HDI PCB. Lolu hlobo lufana nesibonelo esingezansi.

Enye Ibhodi Yesifunda Esejwayelekile Eyenziwe Nge-Laminated HDI Ephrintiwe (Ibhodi Lesibili Lezendlalelo ezingu-8 ze-Laminated HDI, Isakhiwo sokupakisha sithi (1+1+4+1+1))

Isakhiwo salolu hlobo lwesitaki se-HDI PCB sithi (1+1+N+1+1), (N≥2, N silingana). Nakuba kuyisakhiwo sebhodi sebhodi le-HDI esine-oda lesibili, njengoba isikhundla se-vias esingcwatshwe singekho phakathi kwezingqimba (3-6) kodwa phakathi kwezingqimba (2-7), umklamo onjalo unganciphisa inani lokunyathelisa ngokukodwa, okwenza i-PCB yesibili elaminethiwe ye-HDI, ngokuvamile edinga inqubo yokucindezela okungu-3, ​​elungiselelwe inqubo yokucindezela okungu-2.

Nokho, lolu hlobo lwebhodi luveza obunye ubunzima ekwenziweni kwe-HDI PCB. Kukhona izimbobo eziyimpumputhe ku-(1-3) izingqimba, ezihlukaniswa zibe (1-2) kanye (2-3) nama-blind blinds ukuze kwenziwe. Kuyadingeka ukusebenzisa ngokugcwalisa ukwenza i-vias yangaphakathi eyimpumputhe yezendlalelo (2-3). Okusho ukuthi, i-inner blind vias ye-double-lamination lamination yenziwa ngokugcwaliswa. Imvamisa, ama-HDI PCB anokugcwaliswa abiza kakhulu kanti nobunzima bokukhiqiza nabo bukhulu kakhulu.

Ngakho-ke, kumabhodi ajwayelekile we-HDI ane-oda lesibili, kutuswa ukuthi umklamo wokupakisha kufanele ugweme ukusetshenziswa kwemigodi enqwabelene futhi uzame ukuguqula (1-3) i-vias eyimpumputhe ibe ngama-vias anyakazayo (1-2) ayimpumputhe kanye (2-3) angcwatshwe (ayimpumputhe) nge-vias. Abaklami be-HDI PCB abanolwazi bangakwazi ukusebenzisa lolu hlobo lokugwema nokwenza lula ukuklama noma ukulungiselelwa ukuze banciphise izindleko zokukhiqiza imikhiqizo yabo.

Enye Ibhodi Yesifunda Engajwayelekile Ye-Laminated HDI Printed Circuit Board (Ibhodi Lesibili Le-Laminated HDI 6-layer Board, Isakhiwo sokupakisha sithi (1+1+2+1+1))

Isakhiwo salolu hlobo lwesitaki se-HDI PCB sithi (1+1+N+1+1), (N≥2, N silingana). Nakuba kuyisakhiwo sebhodi le-laminated ye-oda lesibili, kukhona nezimbobo eziyizimpumputhe eziphambanayo, futhi amandla okujula kwezimbobo eziyizimpumputhe akhuphuka kakhulu. Ukujula kwezimbobo eziyimpumputhe zongqimba (1-3) kuphindwe kabili uma kuqhathaniswa nezivamile (1-2) zezimbobo eziyimpumputhe. Amakhasimende analo mklamo anezidingo zawo ezihlukile futhi awavumeli (1-3) izimbobo ezingaboni emehlweni ukuthi zenziwe zibe izimbobo eziyizimpumputhe ezistakiwe (1-2) (2-3).

Ngaphezu kobunzima bokubhoboza i-laser, ukucwila kwethusi okulandelayo (PTH) kanye ne-electroplating nakho kunzima. Ngokuvamile, abakhiqizi be-PCB abangenalo izinga elithile lezinga lobuchwepheshe bakuthola kunzima ukwenza amabhodi anjalo. Ubunzima bokukhiqiza buphakeme kakhulu kunalobo bamabhodi ama-laminated ajwayelekile okwesibili. Lo mklamo awunconywa ngaphandle uma kunezidingo ezikhethekile.

I-HDI Ene-Laminated Yesibili Enomklamo Wokupakishwa Kwemigodi Eyimpumputhe, Izendlalelo Ezingcwatshwe (2-7) Ngaphezu Kwezimbobo Eziyimpumputhe Ezistakiwe. (Ibhodi ye-Laminated HDI 8 ye-oda lesibili, Isakhiwo sokupakisha sithi (1+1+4+1+1))

Isakhiwo salolu hlobo lwesitaki se-HDI PCB sithi (1+1+N+1+1), (N≥2, N silingana). Lesi sakhiwo okwamanje sisetshenziswa kwamanye amabhodi ama-laminated wesibili embonini. Ibhodi lezendlalelo eziningi elingaphakathi livale izimbobo futhi lidinga ukucindezelwa kabili ukuze liqedele. Isizathu esiyinhloko siwukuthi kunomklamo wembobo estakiwe, othatha indawo yephuzu lesi-5 elishiwo ngenhla lomklamo wembobo eyimpumputhe yesiphambano.

Isici esiyinhloko salo mklamo ukuthi izimbobo eziyimpumputhe zidinga ukupakishwa ngaphezu kwezimbobo (2-7) ezingcwatshiwe, okwandisa ubunzima bokukhiqiza. Idizayini yembobo egqitshiwe kungqimba (2-7) inganciphisa ukunyibilika okukodwa, ithuthukise inqubo, futhi ifinyelele umphumela wokunciphisa izindleko.

I-HDI Ene-Laminated Yesibili Ene-Cross-layer Blind Hole Design (Ibhodi Lesibili Le-Laminated HDI 8-layer, Ukwakheka Kwesitaki ngu (1+1+4+1+1))

Isakhiwo salolu hlobo lwesitaki se-HDI PCB sithi (1+1+N+1+1), (N≥2, N silingana). Lesi sakhiwo okwamanje siyibhodi le-laminated lesibili elinezinga elithile lobunzima ekukhiqizeni embonini. Ngomklamo onjalo, ibhodi lezendlalelo eziningi elingaphakathi ligqibe izimbobo ezingqimbeni (3-6) futhi lidinga ukucindezelwa kathathu ukuze liqedele. Isizathu esiyinhloko ukuthi kukhona umklamo we-cross-layer blind hole, onobunzima obukhulu bokukhiqiza.

Kunzima kubakhiqizi be-HDI PCB ngaphandle kwamakhono athile obuchwepheshe ukwenza amabhodi ane-oda lesibili alamiwe. Uma le mbobo eyimpumputhe ye-cross-layer (1-3) isendlalelo senziwe kahle futhi sihlukaniswa saba yizimbobo eziyizimpumputhe (1-2) kanye (2-3), le ndlela yokuhlukanisa imigodi eyimpumputhe akuyona indlela yokupakisha eshiwo endaweni yesi-4 neyesi-6 ngenhla. Esikhundleni salokho, kuyindlela yokuhlukanisa imbobo eyimpumputhe, ezonciphisa kakhulu izindleko zokukhiqiza futhi yandise inqubo yokukhiqiza.

Ukuthuthukisa Ezinye Izakhiwo Ezinqwabelene Zamabhodi e-HDI

Izimiso ezifanayo zokwenza ngcono zingasetshenziswa ku-lamination ye-oda lesithathu kanye nezakhiwo zesitaki ze-HDI PCB eziphezulu ukuze kugwenywe imijikelezo yokugcwalisa engenasidingo. Ukushintsha ama-vias ukuze kukhishwe ama-vias astakiwe kunciphisa izinyathelo zokwenziwa futhi kuthuthukisa isivuno ngenqubo yokukhiqiza ye-HDI PCB.

Kubalulekile ukuqaphela ukuthi nakuba izitaki ze-HDI PCB zinikeza izinzuzo eziningi, futhi zidinga imihlahlandlela yedizayini ye-HDI PCB eyisipesheli nobungcweti bokukhiqiza. Abaklami kufanele bacabangele ngokucophelela izici ezifana nobuqotho besignali, ukuphathwa kwe-thermal, kanye nokwenziwa ukuze basebenzise ngokugcwele izinzuzo zobuchwepheshe be-HDI.

Ngaphezu kwalokho, ukusebenza eduze nabakhiqizi be-PCB abanolwazi kanye nezinsizakalo zokukhiqiza ze-HDI PCB ezithembekile kubalulekile ukuqinisekisa ukukhiqizwa kwe-HDI PCB okuphumelelayo.

I-HDI evamile inqwabelanisa kanje

Ukuqonda izakhiwo zesitaki ze-HDI PCB ezihlukene kunikeza abaklami ukuguquguquka okwengeziwe mayelana nokwabiwa kwesendlalelo, izinketho zomzila, nokubekwa kwengxenye. Lokhu kuvumela ukusetshenziswa kahle kwesikhala esitholakalayo kanye nokwenza kahle kwesakhiwo se-PCB.

Kungani Khetha i-Highleap Electronic ye-HDI PCB Production

I-Highleap Electronic igqama njengenketho ephambili yokukhiqizwa kwe-HDI PCB ngenxa yamakhono ayo okukhiqiza athuthukile kanye nobuchwepheshe obuningi kubuchwepheshe bokuxhumana obuxhumeke kakhulu. Izikhungo zethu ezisezingeni eliphezulu zihlome ngemishini yakamuva yokumba i-laser enembayo, i-plasma etching, nezindlela ezithuthukisiwe zokuzwela izithombe, okuqinisekisa ukuthi yonke i-HDI PCB ihlangabezana namazinga aphezulu kakhulu ekhwalithi nokusebenza.

Siqasha ithimba lonjiniyela abanekhono eliphezulu abangochwepheshe ekwenzeni ngcono imiklamo yokuhlanganisa ukuze kuthuthukiswe ubuqotho besiginali, ukulethwa kwamandla, kanye nokuphathwa kokushisa, ukuqinisekisa ukuthi ama-PCB akho e-HDI athembekile futhi ayasebenza kahle.

Ukwengeza, i-Highleap Electronic izibophezele ekunikezeni isevisi yamakhasimende eyingqayizivele nokusekelwa kuyo yonke inqubo yokukhiqiza. Kusukela ekuboniseni umklamo wokuqala kuya ekulethweni komkhiqizo wokugcina, sisebenzisana eduze namakhasimende ethu ukuze siqonde izidingo zawo ezithile futhi silethe izixazululo ezenziwe ngokwezifiso ezihlangabezana nezidingo zawo ezihlukile.

Ukuzinikela kwethu ekuthuthukiseni nasekuthuthukiseni okuqhubekayo kuqinisekisa ukuthi sihlala phambili ezindleleni zomkhakha kanye nentuthuko yezobuchwepheshe, sikunikeza izixazululo ze-HDI PCB ezisezingeni eliphezulu eziqhuba amaphrojekthi akho ngokuzethemba nangempumelelo.

I-HDI PCB Stackup Professional FAQ

1. Yiziphi izinto ezibalulekile zokucatshangelwa kokuthuthukisa ubuqotho besignali kuzitaki ze-HDI PCB?

Ukuze kuthuthukiswe ubuqotho besignali kuzitaki ze-HDI PCB, abaklami kufanele bagxile ekwehliseni i-crosstalk, ukulawula i-trace impedance, kanye nokuqinisekisa umzila wesiginali ofanele. Ukusebenzisa umzila olawulwayo wokuvinjwa, ukubhanqa okuhlukile komzila, nokugwema okungadingekile ngoshintsho kungathuthukisa kakhulu ikhwalithi yesignali.

2. Ukukhethwa kwezinto ezisetshenziswayo kuthinta kanjani ukusebenza kwama-HDI PCB?

Ukukhethwa kwezinto zokwakha ze-HDI PCBs, okuhlanganisa uhlobo lwe-dielectric ne-copper foil, kuthinta ngokuqondile ukusebenza kukagesi webhodi, ukuphathwa kwe-thermal, nokuzinza kwemishini. Izinto ze-dielectric ezisezingeni eliphezulu, ezilahlekelwa kancane zingathuthukisa isivinini sesignali futhi zinciphise ukulahlekelwa kwamandla, kuyilapho ithusi eliphezulu le-conductivity liqinisekisa ukulethwa kwamandla okuphumelelayo.

3. Yiziphi izinzuzo zokusebenzisa ama-microvias kumiklamo ye-HDI PCB?

Ama-Microvias kumadizayini we-HDI PCB avumela ukuminyana okuphezulu kwengxenye nokusebenza okuthuthukisiwe kukagesi ngokunika amandla imizila yesignali emifushane nokunciphisa inductance ye-parasitic. Futhi zisiza ukuxhumanisa kwezendlalelo eziningi, kuthuthukise ukwethembeka kukonke kwebhodi nobuqotho besignali.

4. Abaklami bangazilawula kanjani ngokuphumelelayo izinkinga ezishisayo kuma-HDI PCB?

Ukuphatha okushisayo okusebenzayo kuma-HDI PCB kungafinyelelwa ngokusebenzisa izimbobo ezishisayo, osinki okushisa, kanye nemiklamo efanele yokupakisha isendlalelo. Ukufaka izinto ezine-conductivity ephezulu ye-thermal nokuqinisekisa ukugeleza komoya okwanele emkhiqizweni wokugcina nakho kungasiza ekukhipheni ukushisa nokugcina izinga lokushisa elilungile lokusebenza.

5. Yiziphi izinselele ezivamile ekukhiqizeni ama-HDI PCB, futhi zingaxazululwa kanjani?

Izinselelo ezijwayelekile ekukhiqizeni ama-PCB we-HDI zifaka phakathi ukuqinisekisa ukubhobozwa okunembayo kwama-microvias, ukugcina ukuhleleka kongqimba, nokuzuza ikhwalithi yokucwala engaguquki. Lezi zinselele zingaxazululwa ngokusebenzisa amasu okubhola nge-laser athuthukile, izinyathelo eziqinile zokulawula ikhwalithi, kanye nokusebenza nabakhiqizi be-PCB abanolwazi abanobuchwepheshe obukhethekile kubuchwepheshe be-HDI.