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Buyela kubhulogi

Ukuqinisekisa Ukusebenza Okuhle Ekwenzeni Ikhamera ye-FPC: Izinkinga Zekhwalithi Namaphuzu Okulawula

Ikhamera FPC Manufacturing

Njengoba i-FPC yekhamera ngokuvamile inamaphedi aminyene futhi idinga ukuqiniswa ngamashidi ensimbi, kuzoba nokungajwayelekile kwekhwalithi okuhlukahlukene. Ngakho-ke ungalawula kanjani lezi zinkinga zekhwalithi?

1. Ikhwalithi engavamile lapho uhlanza ifilimu yokumboza

1. I-solder pad ihlanganiswe (ifilimu yokumboza ifakwe ku-pad engenhla noma i-glue iphuphuma kakhulu), okuholela kumphumela omubi we-welding;

2. Ukufaka imigqa evuzayo: Ngenxa yokuthi amaphedi aminyene futhi amasekhethi ayinkimbinkimbi, kunzima ukuba nendawo yokukhulisa amaphedi ekwakhiweni, okuholela esikhaleni esincane phakathi kwama-pads (unqenqema olungaphandle lwefilimu embozayo) kanye ama-circuits aphansi njenge-0.075mm. , lobu bukhulu buyinselele kakhulu ukuze iso lenyama lilingane nefilimu yekhava, ngakho-ke ukuvuza kuvame ukuvela, okwenza kube lula kumakhasimende ukuba abe nama-micro short circuits ngesikhathi sezinqubo ze-SMT ne-CMOS, okungukuthi, amaphuzu e-solder axhunywe kumjikelezo. , kodwa kunzima ukukubona. , izinto ezingathandeki amakhasimende ahlangabezana nazo ngemva kokufakwa zihlanganisa ukunqanyulwa, izindawo ezikhanyayo, izithunzi, ukuphazamiseka, izindawo ezifile, amabala kawoyela, ukuvuza kokukhanya, imigqa evundlile neqondile, amaribhothi, abomvu nokuluhlaza, akukho mpendulo, akukho sithombe, njll. inkimbinkimbi futhi empeleni ibangelwa Ukubangelwa amasekhethi amafushane ama-micro-short solder ye-SMT okubangelwa izintambo zokubopha ezivuzayo.

Izindlela zokuthuthukisa: Njengoba ukunemba kwe- inki yemaski ye-solder yokunyathelisa kuphezulu, futhi uwoyela wemaski ye-solder ungathatha indawo yezakhiwo zikagesi nezemishini zefilimu emboza indawo yephedi, le nqubo ingasetshenziswa ukuyithatha indawo yayo. Uyinki we-PSR9000 we-Sun Company uvame ukusetshenziswa. Uma ikhasimende lingavumi, Uma usebenzisa uwoyela we-solder resist, ungasebenzisa ifilimu ekhethekile yesembozo sekhamera ye-FPC (inani le-glue overflow lincane), bese usebenzisa i-TPX esikhundleni sefilimu yokukhululwa evamile ngesikhathi se-lamination ukuze unciphise inani le-glue overflow evela kwifilimu yesembozo ngangokunokwenzeka.

Ikhwalithi engavamile ngesikhathi somhlangano wokuqinisa amapuleti ensimbi

I-FPC yekhamera izofakwa nengxenye ye-CMOS, entekenteke kakhulu. Ngenxa yalesi sizathu, amashidi ensimbi ngokuvamile akhethwa ukuqinisa ngemuva kwe-FPC ukusekela nokuvikela izingxenye. Izinkinga ezilandelayo zivame ukuhlangana nazo lapho kwenziwa amashidi ensimbi e-laminating ukuze kuqiniswe:

1. Amandla e-peel anganele wokuqiniswa kweshidi lensimbi: Igrisi izosetshenziswa ngesikhathi sokucutshungulwa kweshidi lensimbi. Uma amafutha engasuswa (okusele), ukunamathela kuzothinteka ngemuva kokuthi kusetshenziswe iglue, okuholela ekungeneni kwamandla e-peel;

Isu Lokuthuthukisa: Ngaphambi kokunamathisela iglu eshidini lensimbi, sebenzisa isisombululo se-NaOH ukuze uyihlanze (ukuze kube lula ukusebenza kweqembu, ingxenye yokuhlubula ngemuva komugqa we-DES ingasetshenziswa ukuyiqedela), bese uyigeza bese uyomisa ngamanzi ahlanzekile. Ngesikhathi esifanayo, ubuso bebhodi le-FPC kumele buhlanzwe kahle ngotshwala. Ngemva kokuba ukuqinisa ishidi lensimbi sekuhlanganisiwe futhi kucindezelwe, kumele kubhakwe ku-150°C ihora eli-1 ukuze iglue iqine ngokuphelele. Lapho ubhaka, qaphela ukuthi ungafaki imikhiqizo ukuze ugweme amazinga okushisa angalingani. , kungcono ukusebenzisa i-rack yesendlalelo ukuqinisekisa izinga lokushisa lokubhaka elifanayo.

2. Ukuphambuka kokuqiniswa kweshidi lensimbi: Ukuqondanisa ngesandla kweshidi lensimbi kuzoba nomthelela ekuhlanganiseni kwekhasimende. Ikakhulukazi, ukuqiniswa kweshidi lensimbi elinezimbobo ezikhuphukayo kuzobangela izimbobo ezifaka ikhava ukuthi zithinte umhlangano wekhasimende;

Isu Lokuthuthukisa: Sebenzisa i-jig ukuze ubeke kahle bese uhlanganisa amashidi ensimbi ukuze uqinise. I-jig ingenziwa nge-acrylic noma insimbi, kanye nezikhonkwane eziningana zokubeka ezibekwe ngokuvundlile.

3. I-Glue iyachichima lapho ishidi lensimbi liqiniswa futhi licindezelwa: I-glue yeshidi lensimbi izogeleza ngaphansi kwezimo zokushisa eziphakeme kanye nezimo ezicindezelayo ngesikhathi sokuqothula, okwenza i-glue igcwale. Ezimweni ezimbi kakhulu, kungabangela ishidi lensimbi ukuthi liqinise izimbobo zokubeka futhi lithinte umhlangano wekhasimende;

Amasu okuthuthukisa: Umgodi weshidi lensimbi kufanele ube mkhulu kancane kunomgodi we-FPC ngesikhathi sokuklama, ushiye isikhala sokuthi inhlaka igeleze ukuze ingasavimbi umgodi. Ubukhulu buxhomeke ebangeni eliphakathi komphetho womgodi kanye nokubukeka komkhiqizo. Ngokuvamile, kungcono ukuba mkhulu kuno-0.1-0.15mm. .

Ngezinqumo zokukhiqiza ezihlobene, i-Highleap iphinde ibhale phansi ukukhiqizwa kwe-PCB kanye nokuhlolwa kukagesi kwe-PCB , okungasiza ekuvimbeleni amanothi angacacile kuphakheji yesilinganiso.

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