Ukukhiqizwa kwe-PCB Yokuqapha Ukushisa Okuqhubekayo Kwezinzwa Zokushisa Ezigugile Esikhumbeni

I-PCB yokuqapha izinga lokushisa eqhubekayo kufanele yakhelwe njengengxenye yesekethe yokushisa. Inzwa yokunemba, ithusi eligobile, ingcina, isiqinisi, ibhethri, umsakazo, ishaja kanye nendawo ebiyelwe konke kudala izindlela zokushisa. Uma lezo zindlela zingalawulwa, i-IC yenzwa enembile kakhulu ingalinganisa ngokuphindaphindiwe ukuzifudumeza esikhundleni sokushisa kwesikhumba okuhlosiwe.

I-Highleap Electronics ikhiqiza izinhlangano eziqinile, eziguquguqukayo neziqinile eziklanywe ngamakhasimende ze-electronics ezigqokwayo nezezokwelapha. Ngemikhiqizo yokushisa eqhubekayo, ukugxila ekukhiqizeni ukugcina i-geometry yokwahlukaniswa kokushisa, ukwakhiwa kwe-flex, ukubekwa kwenzwa, ubunikazi be-BOM obubalulekile kanye nokuhlanganiswa okuphindaphindwayo kusukela ekukhiqizweni kweprototype kuya komthamo.

I-PCB Iyingxenye Yendlela Yokulinganisa Ukushisa

Ukuze uthole i-monitor eqhubekayo yokushisa kwesikhumba, i-sensor ayilinganisi izinga lokushisa lomzimba elingabonakali; ilinganisa izinga lokushisa layo ngemva kokuba ukushisa kudlule esikhumbeni, ku-glue, e-enclosure, i-PCB copper, i-sensor package kanye nomoya ozungezile. Yonke indlela yokushisa exhunywe ku-sensor ingahlukanisa lokho kulingana. Lokho kwenza i-PCB geometry ibe yingxenye yeketanga lokulinganisa.

Iphutha elivamile ukubeka inzwa yokushisa yedijithali enembile ebhodini eliyinhloko elicebile ngethusi bese ucabanga ukuthi incazelo yenzwa engu-±0.1 °C ichaza ukunemba kwesistimu. Uma ibhethri, umsakazo noma isilawuli sishisa indiza efanayo yethusi, inzwa ingabika ngokwethembeka izinga lokushisa lezinto zikagesi esikhundleni sendawo yesikhumba ehlosiwe.

Khetha Isici Sefomu Esigqokwayo Esizungeze Umngcele Wokushisa

Ama-patch, i-wristband kanye nama-monitor esitayela se-module adala ukuxhumana okuhlukile kokushisa. I-PCB kanye ne-mechanical stack kufanele zikhululwe ndawonye ukuze umenzi azi ukuthi yiziphi izilinganiso nezinto ezibaluleke kakhulu ekulinganisweni.

Yakha i-Sensor Island ukuze ikwazi ukumelana nokushisa okuphezulu kuma-elekthronikhi ayinhloko

I-Analog Devices ishicilele isibonelo se-patch esiqinile nesiguquguqukayo sokushisa komzimba lapho iminonjana yethusi emincane kanye nesifunda esiguquguqukayo esinokushisa okuphansi kwandisa ukumelana nokushisa phakathi kwenzwa yokunemba kanye nezinye izinto zikagesi. Leyo yindlela efanele yokucabanga: ukuxhumana kukagesi akufanele kudale intambo yokushisa engahlosiwe.

• Imikhondo emincane/emide: Ngaphakathi kwemingcele yokwenziwa, nciphisa ingxenye yethusi phakathi kwesiqhingi senzwa kanye ne-elekthronikhi ezifudumele uma isikhombikubona sikagesi sikuvumela.
• Ukuthululwa komhlabathi: Ungagcwalisi ngokuzenzakalelayo indawo yesensa ngethusi. Indiza enkulu ingathuthukisa isisekelo sikagesi ngenkathi ilimaze ukuhlukaniswa kokushisa.
• Nge: Ama-vias okushisa ngaphansi kwenzwa yokushisa angaba yingozi uma ehlanganisa inzwa nesendlalelo esifudumele noma isiqinisi.
• Indawo ye-Stiffener: Iziqinisi ze-FR-4, ezingagqwali noma ze-polyimide zishintsha kokubili ukugoba kanye nokugeleza kokushisa; imiphetho yazo kufanele ibe yingxenye yemodeli yokushisa.
• Isitaki esigoqekile: Ubukhulu be-polyimide, inhlaka kanye nesisindo sethusi kufanele kulawulwe ngoba izinguquko zokukhiqiza zishintsha isisindo sokushisa kanye nokuqhuba.

Kungani umdwebo wokwenziwa kufanele uhlanganise ubukhulu obubucayi bokushisa?

Uma intamo encane, i-sensor island noma i-copper keep-out inesibopho sokuhlukanisa ukushisa, kufanele iphathwe njenge-geometry esebenzayo elawulwayo kunokuba iphathwe njenge-cosmetic routing. Izinguquko ze-DFM ezikhulisa ithusi, zengeza ukweba noma ezishukumisa isiqinisi zingashintsha impendulo yokushisa noma ngabe ukuxhumana kwe-net kungashintshi.

Susa Ukushisa Okuzifudumezayo Nokushisa Kwerediyo Kude Nenzwa

Ama-monitor aqhubekayo achitha isikhathi esiningi sempilo yawo ezimweni zamandla aphansi, kodwa ukudluliselwa okungenantambo okuvamile, ukubhala kwe-flash kanye nokushaja kungadala ukushaya kokushisa kwendawo. Inzwa ebekwe eceleni kwe-radio SoC noma i-PMIC ingabonisa ukuqhuma kokushisa okuphindaphindayo okuhlobene nomsebenzi we-firmware.

• Yenza i-MCU isebenze: Gcina iprosesa yendawo ilele phakathi kokulinganisa uma uhlelo lokusebenza luvuma.
• Idatha yebhafa: Ukulayishwa okungenantambo kweqembu kunganciphisa isikhathi sokusebenza komsakazo, kodwa ukushaya kwenhliziyo okuhambisanayo kufanele kusabonakala.
• Ukushaja okuhlukile: Uma umkhiqizo ungashajwa kabusha, nquma ukuthi ukubika izinga lokushisa ngesikhathi sokushaja kuyasebenza noma kumiswe ngamabomu.
• Dlulisa ibhethri kude: Ithusi elikhipha amandla aphezulu akufanele lidlule entanyeni yesenzwa.
• Sebenzisa ibanga lokushisa: Ukuhlukaniswa ngokomzimba ekugoqeni ngokuvamile kusebenza kangcono kunokuzama ukulinganisa ukushisa ngemva kokuba indawo ebiyelwe isiqediwe.

Phatha i-Adhesive, i-Encapsulation kanye ne-Moisture Protection njengezinto zokulinganisa

I-patch yesikhumba idinga ukunamatheliswa ngomshini kanye nokuvikelwa kwemvelo, kodwa ungqimba ngalunye olwengeziwe lushintsha ukumelana nokushisa kanye nesikhathi esingaguquki. Umhlinzeki wezinto zikagesi udinga ulwazi lwe-stack olukhishwe uma luthinta ukwenziwa noma ukuhlanganiswa kwebhodi/ukugoba.

I-Prototype enezivivinyo zokushisa ezidalula amaphutha e-PCB

I-EVT yokuqapha izinga lokushisa kufanele ishintshe ngamabomu izimo zikagesi ngenkathi okokufaka kokushisa kugcinwe kuzinzile. Lokhu kwembula ukuthi i-PCB iyathonya yini ukufundwa. Ukuhlolwa okuwusizo kufaka phakathi ukuvala umsakazo uma kuqhathaniswa nokusebenza komsakazo, ishaja engaxhunyiwe uma kuqhathaniswa nokushaja, ibhethri elisha uma kuqhathaniswa neliphansi, inzwa egobile uma kuqhathaniswa nokugoba ku-radius yomkhiqizo, kanye ne-PCBA engenalutho uma kuqhathaniswa nokuvalelwa/ukunamathela okukhishwe.

Ithimba lobunjiniyela kufanele libhale phansi kokubili ukufundwa kwenzwa yokunemba kanye namazinga okushisa okubhekisela ku-simulator yesikhumba, emoyeni ozungezile kanye naku-electronics eyinhloko. Umphumela owodwa "wokunemba ekushiseni kwegumbi" ungafihla i-gradient yokushisa eba yinto ebalulekile ekushiseni okuphezulu noma ngesikhathi sokushaja.

Ukuphindaphinda Kokukhiqiza Kuxhomeke Kokungaphezu Kwe-IC Yenzwa

Uma umklamo usuzinzile ngokwezinga lokushisa, ukukhiqiza kufanele kulondoloze indlela efanayo yokushisa ezindaweni eziningi. Yilapho ukwenziwa nokulawulwa kokuhlanganiswa kuba khona okubalulekile.

• I-geometry yethusi: Isinxephezelo se-etch akufanele sishintshe ngokungahlosile intamo encane yokushisa ngaphezu kokubekezelelana okukhishwe.
• Ukwakhiwa kwe-Flex: Isisindo sethusi, i-polyimide, i-coverlay, i-glue kanye ne-stiffener kumele kufane ne-stack evunyiwe.
• Ukushisela inzwa: Ukushintshwa kwe-solder noma ukuthambekela kwephakeji okweqile kushintsha ukuthintana komshini futhi kungashintsha ukuhlanganiswa kokushisa kwendawo.
• Ukuhlanza: Umswakama osele noma ovaleleke eduze kwendawo yokuzwa ungathinta ukuthembeka kwesikhathi eside kanye nokuxhumana okubonakalayo.
• Ukulandeleka kwezingxenye: Indawo yesenzwa yokunemba kanye nokubuyekezwa kufanele kuhlale kulandelelwa lapho uhlelo lwekhwalithi ye-OEM ludinga khona.

I-Highleap ingakha ama-flex assemblies , i-rigid-flex PCB kanye namabhodi aqinile aqinile amadivayisi agqokwayo ane-DFM kanye nokuhlolwa kokukhiqiza.

Ukuhlolwa Kokusebenza Kwezinga Lebhodi Kufanele Kuhlole Ukuziphatha Kokushisa, Hhayi Ukuthi Kunembile Emtholampilo

Imishini yokukhiqiza ingaqinisekisa ukusebenza kwe-elekthronikhi kanye nokugeleza kwe-catch assembly. Akufanele ichazwe njengenye indlela yokuqinisekisa izinga lokushisa ledivayisi eliqediwe.

I-Highleap ingasebenzisa ukuhlolwa kokusebenza kwe-PCBA isebenzisa i-firmware enikezwe amakhasimende, izinto ezifakiwe kanye nemikhawulo yokwamukelwa. I-OEM ihlala inesibopho sokuqondanisa izinga lokushisa lesikhumba nanoma iyiphi i-metric yokushisa komzimba/yomzimba efunwayo kanye nokuqinisekiswa kwemitholampilo/komthetho.

Lawula Isikhathi Sokushisa Esihlala Njalo kanye Nokunemba Okungaguquki

Ukuqapha okuqhubekayo kuncike ekutheni inzwa ilandela ngokushesha kangakanani umthombo wokushisa ohlosiwe, hhayi nje kuphela inani lokugcina elizinzile. I-encapsulant ejiyile, isiqhingi esikhulu sethusi noma i-stiffener ingadala ukuguquguquka kwesikhathi sokushisa okuhamba kancane okushelela izinguquko zangempela zokushisa futhi kulibazise ama-alamu noma ukutholwa kwezitayela.

I-OEM kufanele ichaze impendulo eguquguqukayo ehlosiwe bese igcina isisindo sokushisa se-sensor stack silawulwa. Ngesikhathi se-EVT, hambisa i-simulator yesikhumba noma i-thermal plate phakathi kwamazinga okushisa aziwayo bese uqhathanisa isikhathi sokuphendula se-sensor engenalutho, i-flex ehlanganisiwe, i-adhesive stack kanye ne-enclosure eqediwe. Lokhu kuveza ukuthi yiluphi ungqimba olubusa i-lag.

Hlanganisa ama-PVT Lots ne-Thermal Golden Unit

Ukuze kube nokuguquguquka okuzwela ukulinganisa, kuyasiza ukugcina amayunithi egolide avela ekwakhiweni kwe-DVT/PVT okufanelekile. Inhloso yokukhiqiza akukhona ukuphoqa wonke amayunithi ukuthi afunde izinga lokushisa elifanayo emoyeni ovulekile; kodwa ukukhombisa ukuthi inqubo yokukhiqiza ekhishwe iphinda ikhiqize ukuziphatha kokushisa okuvunyelwe ngaphakathi kwemikhawulo echaziwe.

Uhlelo lokuxhumana olusebenzayo lungaqhathanisa i-sensor offset kumazinga okushisa epuleti elilodwa noma amabili alawulwayo, isikhathi sokuphendula nesinyathelo esincane, i-delta yokuzifudumeza engasebenzi/esebenzayo kanye nokusetshenziswa kwamanje. Uma ukushintshaniswa kwezinto kamuva kushintsha enye yalezo zilinganiso, ithimba lobunjiniyela linobufakazi bokuthi indlela yokushisa ishintshile ngisho nangaphambi kokuba kuphindwe ukuqinisekiswa kwedivayisi ephelele.

Ukuxhumana kwelothi kubaluleke kakhulu uma umkhiqizo usebenzisa i-flex ngoba i-copper etch, i-coverlay, i-glue kanye ne-stiffener konke kuyizinto ezithinta uchungechunge lokulinganisa. I-OEM kufanele icacise ukuthi yimiphi yaleyo mininingwane yokwakha eqandisiwe futhi engadlula ekulawulweni kwenqubo evamile yomhlinzeki ngaphandle kokufaneleka kabusha.

Idatha ye-RFQ Yokukhiqizwa kwe-PCB Yokuqapha Ukushisa Okuqhubekayo

Ukuze uthole ikhotheshini ewusizo, chaza ngokucacile izici ezibucayi ekushiseni. I-RFQ evamile ye-PCB ingase ithuthukise i-geometry enikeza inzwa ukusebenza kwayo kokulinganisa.

• Ukwakhiwa kwe-thermal: indawo yesensa, indawo yokuxhumana ehlosiwe, izindawo zomthombo wokushisa kanye nokugcinwa kokushisa.
• I-Flex/rigid-flex stack: izinto zokwakha, isisindo sethusi, isembozo, ingcina, izinti, irediyasi egobile kanye nokubekezelelana okulinganayo.
• I-BOM Eqondile: inzwa yokushisa, i-MCU/umsakazo, ibhethri, ishaja kanye nezinye izindlela ezivunyiwe.
• Imikhawulo yokuhlanganisa: izidingo zokumboza/ukufihla, ukugcwalisa/ukuvala izikhala, ukuhlanza kanye nokuhlanzeka kokuthintana nokukhanya/nesikhumba.
• Ukuhlela/ukuhlolwa: i-firmware, ifomethi yedatha ye-serial/calibration, izinga lokushisa lokuhlola ireferensi kanye nemikhawulo yokupasa/yokwehluleka.
• Amarekhodi ekhwalithi: ukulandeleka kwenqwaba, ukusampula ukuhlolwa, i-QMS yezokwelapha kanye nokulindela kokulawula ushintsho.