Umkhiqizi we-PCB we-Edge Server we-High-Speed ​​​​& AI Edge Computing

Uma uklama iseva yomphetho — umshini wokusebenza omfushane we-1U/2U, i-node yezimboni eqinile, noma ibhokisi lokubala le-5G eliyimfihlo — i-PCB ayiseyona impahla. Ithwala imizila ye-PCIe Gen4/Gen5, amabhasi e-DDR4/DDR5, i-multi-gigabit Ethernet, kanye nama-VRM anamandla aphezulu kuyi-chassis evame ukungabi nokupholisa okusebenzayo, isebenza amahora angama-24 ngosuku, izinsuku eziyi-7 ngesonto, futhi ihlala ekhabetheni eceleni kwefektri noma umbhoshongo weseli. Ukukhetha umenzi we-PCB weseva yomphetho ofanele kuthinta ngqo imingcele yesignali yakho, i-headroom yakho yokushisa, izinga lokwehluleka kwensimu yakho, kanye nesikhathi sakho sokumaketha.

I-Highleap Electronic iyifektri yokukhiqiza i-PCB kanye ne-PCB eseGuangzhou enamabhodi okwakha i-server, ukuxhumana, kanye ne-hardware yokulawula yezimboni iminyaka engaphezu kwengu-15. Leli khasi liyireferensi esebenzayo yonjiniyela be-hardware kanye nabaphathi bezinsizakalo abahlola abahlinzeki be-PCB be-edge server — lokho esikwakhayo, lokho esikulinganisayo, nokuthi yini okufanele usithumelele yona uma usukulungele ukucaphuna.

Lokho i-PCB ye-Edge Server Ekufanele Iphile Ngempela

I-PCB yeseva yomphetho akuyona inguqulo encane yebhodi le-datacenter le-hyperscale. Imikhawulo ihlukile:

• Indawo yokusabalalisa — izindawo zeselula, amakhabethe efektri, izindawo zokuthengisa ezingaphandle kwesitolo, amasango ezimoto. Indawo ezungezile ingashukuma kusukela ku-0°C kuya ku-55°C, ukudlidliza kungokoqobo, futhi izihlungi zothuli zivame ukuba ukuphela kokulawulwa kokushisa.
• Isici sefomu — i-1U emfushane, ububanzi obuyisigamu se-1U, umphetho ovulekile we-OCP, noma izivalo ezenziwe ngokwezifiso eziya ekilasini elincane le-ITX. Indawo ye-PCB izinzile; inani lezingqimba kanye nobuningi bomzila kubamba ubunzima.
• Ubuningi besignali exubile — i-CPU/SoC ene-PCIe Gen4/5, i-DDR4/5, i-BMC, ama-PHY amaningi angu-10G/25G, i-M.2 NVMe, kanye nokufakwa kwamandla kwe-PoE noma i-48V konke kwabelana ngebhodi elilodwa.
• Umjikelezo wempilo omude — amakhasimende ezokuxhumana kanye nezimboni alindele iminyaka engu-7-10 yenkonzo yasensimini, hhayi umjikelezo wokuvuselela weminyaka emi-3 wemikhiqizo yabathengi.

Lezi zithiyo zisunduza ama-PCB eseva asemaphethelweni ekubalweni kwezingqimba eziphakeme kunalokho okushiwo usayizi we-chassis, ama-stackup ahlanganisiwe okulahlekelwa okuphansi/ama-FR-4, i-impedance elawulwayo kuyo yonke inethi yesivinini esikhulu, kanye nokuqedwa kwendawo okukhethiwe ukuze kube nokuthembeka kwejoyinti le-solder kunokubukeka kobuhle.

Amandla Okukhiqiza i-Edge Server PCB e-Highleap

Ishidi lethu eliphelele lamandla e-PCB eliqinile libala yonke ipharamitha, kodwa izinto ezingezansi yizo ezivame ukwenziwa yimiklamo yeseva yomphetho:

• Ukubalwa kwesendlalelo: Izendlalelo ezi-4 kuya kwezingama-60. Amabhodi amaningi e-edge server ahlala phakathi kwezendlalelo eziyi-10 nezingama-22.
• Ukujiya kwebhodi: 0.4 mm kuya ku-6.0 mm; ama-stackup ajwayelekile ekilasini leseva angu-1.6–3.2 mm.
• Isisindo sethusi: 0.5 oz yangaphakathi / 1 oz yangaphandle yemiklamo enesignali esiminyene, kufika ku-10 oz ithusi elinzima kwezindiza zamandla ezingama-48V kanye nezingxenye zokulungisa.
• Ukulandelela / isikhala: kwehle kufike ku-2.5 mil / 2.5 mil ezingqimbeni zangaphakathi ze-fan-out ngaphansi kwe-0.5 mm pitch BGAs.
• I-Microvia: ama-microvia abhobozwe nge-laser afinyelela ku-0.075 mm (3 mil), abekwe ndawonye noma abekwe eceleni, asekela i-2-N-2 kanye ne-3-N-3 Ama-HDI stackup kokuqhekeka kwe-SoC ne-CPU.
• Ukulawulwa kwe-impedance: okune-single-end ±5 Ω (≤50 Ω) noma ±7% (>50 Ω), umehluko ±7%, okwanele i-PCIe Gen4/Gen5, DDR5, kanye ne-25G Ethernet.
• Ukubhola emuva: isilawuli se-stub sibe ngu-±0.1 mm ukuze uthole ama-diagram ahlanzekile emizileni engu-25 Gbps+.
• Ukuqedwa kwendawo: ENIG, ENEPIG, isiliva lokucwiliswa, igolide eliqinile (lezikhala zamakhadi ezitholakala ngomunwe onqenqemeni), i-OSP yokugijima okungabizi kakhulu.

Ezingxenyeni ezinesivinini esikhulu sakha njalo nge- Panasonic Megtron 6 , Megtron 7 , ITEQ IT-968 , TU-883 , kanye ne-Isola Tachyon-class laminates, kuma-stackups ahlanzekile noma ahlanganisiwe. Ezingxenyeni ze-RF noma ezinqunyiwe ngesikhathi, sihlanganisa i-FR-4 nge-laminate ekhethekile ene-low-loss noma i-laminate ekhethekile ene-low-loss.

Ukukhetha Okuhlanganisiwe Nokwezinto Ezibonakalayo Okusindisa Imali Ngaphandle Kokubulala Imingcele

Umehluko wezindleko phakathi kwe-full-Megtron-7 stackup kanye ne-hybrid (ukulahlekelwa okuphansi kuphela ezingqimbeni zesignali ezinesivinini esikhulu, i-mid-Dk FR-4 ezindizeni) ungaba ngu-30–40% ebhodini elinezingqimba ezingu-16. Umehluko wokusebenza, uma i-hybrid iklanywe kahle, uvame ukuba ngaphakathi kwesabelomali se-PCIe Gen4 kanye ne-25G SerDes.

Amabhodi e-Edge server awadingi kakhulu izinto ezinamandla kakhulu kuzo zonke izendlalelo. Iqoqo elijwayelekile eliqashelwa ngezindleko esilicaphunayo libukeka kanje:

• Isiginali ephezulu nephansi: i-laminate ephakathi kokulahlekelwa (isb. i-TU-872 SLK noma i-IT-968) yokuqhuma kwe-SerDes.
• Amabhangqa angaphakathi asheshayo: i-core yokulahlekelwa okuphansi (i-Megtron 6 noma elinganayo) kuphela ezingqimbeni ezingu-2–4 eziphethe ukusebenza kwe-PCIe/Ethernet okude.
• Izindiza zamandla nezinkomba: i-FR-4 ejwayelekile (ikilasi le-Isola 370HR), enikeza ukusebenza okuningi kwe-dielectric kwe-capacitance yendiza.
• I-sub-stackup yethusi elisindayo: 2–3 oz ithusi ezingqimbeni zokusabalalisa ze-12V/48V.

Ithimba lethu lobunjiniyela liqhuba lokhu kushintshana kwezinto ezibonakalayo njengengxenye yokubuyekezwa kwethu kwe-DFM ngaphambi kohlobo lokuqala — uthola isincomo esibhaliwe, hhayi ingubo ethi “sebenzisa lokho okusithumelele kona.” Bheka ikhasi lethu lenqubo ye-DFM ukuze uthole lokho esikuhlolayo.

Layisha i-Gerber yakho ukuze ibukezwe nge-Stackup

Ubuqotho Besignali: Lokho Esikudingayo Kumafayela Akho Okuklama

Ukuze sinikeze amamajini e-PCIe Gen5 (32 GT/s) noma i-25G/56G Ethernet abikezelwayo ku-PCB yeseva enqenqemeni, sidinga ama-impedance target, hhayi ukuqagela. Indlela esheshayo eya esihlokweni sokuqala esihlanzekile ukusithumela:

• Ukukhishwa kwe-Gerber X2 noma i-ODB++
• Umdwebo we-stackup onamanani e-target impedance ngesendlalelo ngasinye (esinesiphetho esisodwa kanye nomehluko)
• Ifayela lokubhoboza elinezincazelo zohlobo lwe-(through, blind, washed, microvia)
• Amanothi okwenziwa achaza ukuphela kwendawo, umbala wemaski odayisiwe, isikrini sesilika, kanye nanoma yikuphi ukujula kokubhoboza ngemuva
• Kwa-PCBA: I-BOM enezinombolo zezingxenye zomkhiqizi, ifayela le-CPL/Pick-and-Place, kanye nobuningi

Sakha amakhuphoni e-impedance kuwo wonke amaphaneli futhi sinikeza imibiko ye-TDR ngokuthunyelwa ngokuzenzakalelayo kwamabhodi angaphezu kwezingqimba ezingu-8 noma ngamanethi e-impedance alawulwayo.

Ukuhlanganiswa kwe-PCB ye-Edge Server: Kusukela ku-Prototype kuya ku-Volume

Siyifektri yokuhlanganisa i-PCB fab kanye ne-PCB assembly, okubalulekile kwihadiwe yeseva enqenqemeni ngoba ama-fan e-BGA kanye nezixhumi ezinenani eliphezulu ezilawula la mabhodi azinawo amandla amaningi okuphatha amaphutha okuhambisa izinto/ukuhlanganisa.

• Ububanzi bosayizi wezingxenye: 01005 ubuncane kuya kuma-BGA amakhulu angaphezu kwesikwele esingu-50 mm.
• Inani eliphakeme kakhulu lama-BGA: phansi ku-0.35 mm. Sivame ukubeka ama-BGA e-pitch angu-0.4 mm kanye no-0.5 mm asetshenziswa kuma-CPU e-edge-class, ama-FPGA kanye nama-ASIC ashintshanayo. Bheka eyethu Amandla okuhlanganisa i-BGA.
• Cindezela-lingana: Izixhumi ze-PCIe-edge-finger kanye ne-backplane ezixinene kakhulu ezinamandla okufaka alawulwayo.
• Ukuhlolwa: I-3D SPI, i-AOI enezinhlangothi ezimbili, i-X-ray kuyo yonke i-BGA kanye nengxenye eqediwe phansi, kanye ne-ICT noma i-flying probe.
• Ukuhlela nokuhlola: uhlelo lwe-in-circuit lwe-BMC, i-EEPROM, kanye nezingxenye zokucushwa; ama-rig okuhlola asebenzayo akhelwe ngokwezidingo zakho.
• Ukwakhiwa kwebhokisi: ukuhlanganiswa kwe-chassis, ama-harnesses ekhebula, kanye nokuhlolwa kwe-FAT uma ufuna i-PO eyodwa emboza lonke uhlelo lokusebenza — bheka eyethu ibhokisi lokwakha umhlangano service.

Inani leprototype (amabhodi angu-1-20) lithunyelwa ezinsukwini zokusebenza ezingu-7-14 ze-PCB kuphela, izinsuku zokusebenza ezingu-15-25 zamayunithi ahlanganiswe ngokugcwele uma izingxenye sezikhona. Ukugijima kwevolumu kucashunwa ngokwesisekelo sephrojekthi ngayinye kuye ngokuthi i-stackup kanye nobunzima be-BOM.

Amabhodi Eseva Yokuhlola Ukuthembeka Okufanele Adlule Ngaphambi Kokuthumela

Amakhasimende e-Telecom kanye nezimboni azocela okukodwa noma ngaphezulu kwalokhu okulandelayo — singakwakhela konke futhi sinikeze imibiko yokuhlola:

• I-IPC-6012 Isigaba 2 noma Isigaba 3 ukwamukelwa kwe-PCB okuqinile, kuye ngokuthi ikhasimende lakho lokugcina lifuna izinga lokuthembeka eliphezulu.
• I-IPC-A-610 Class 2/3 ukuze kwamukelwe ijoyinti le-solder ngemva kokuhlanganiswa.
• Ukuhamba ngebhayisikili okushisayo: −40°C kuya ku-+85°C, imijikelezo engu-500–1000, yama-node angaphandle noma angalawulwa onqenqemeni lwendawo.
• Ukushaqeka kokushisa nokushisa okumanzi ngokwephrofayili ye-JEDEC yezingxenye ezikhona.
• Ukumelana ne-CAF: ifanele amabhodi ezindaweni ezinomswakama ezinephimbo elincane.
• Ukuhlaziywa kwe-Microsection ezintweni zokuqala zokubopha ubukhulu, ukuhlelwa kwezingqimba, kanye nokuqina kwebharele.

Kungani ama-OEM e-Edge Server Esebenza ne-Highleap Electronic

Asisibo isitolo se-PCB esishibhile kakhulu e-Alibaba futhi asisibo isitolo esithengisa kakhulu kuphela esinohlelo lokuphatha lwamasonto angama-20. Siphakathi nendawo edingekayo yizinhlelo zeseva yonqenqema: ukulawulwa kwenqubo yebanga leseva, ubunjiniyela bangempela be-DFM, ukuhlanganiswa okuhle + ngaphansi kophahla olulodwa, kanye nokuguquguquka kwevolumu ukusuka kumodeli wamabhodi ama-5 kuya ekukhiqizweni kwamayunithi angu-5,000 emgqeni ofanayo.

Amanye amakhasi e-Highleap angase abe usizo ngenkathi uhlela iphrojekthi yakho:

• I-Server Motherboard PCB Assembly
• I-AI Server PCB Manufacturing
• Izixazululo ze-PCB Zokuxhumana
• High Frequency PCB
• I-Turnkey PCB Assembly

Thola Isilinganiso Sephrojekthi Yakho ye-Edge Server PCB

Sithumelele amafayela akho e-Gerber noma e-ODB++, i-stackup target yakho, i-BOM yakho (uma udinga ukuhlanganiswa), kanye nenani lakho. Uzothola umbiko obhaliwe we-DFM kanye nentengo ye-PCB kuphela noma i-PCBA ephelele zingakapheli izinsuku ezingu-1-2 zebhizinisi. Sisebenza ekilasini lakho le-IPC, uhlu lwakho lwezinto, kanye nosuku lwakho lokulethwa — hhayi kukhathalogi ejwayelekile.

Qala Isilinganiso se-PCB se-Edge Server Manje noma xhumana nethimba lethu lobunjiniyela ukuze nixoxe ngemibuzo ye-stackup, i-impedance, noma yokuhlanganisa ngaphambi kokuthi ulayishe amafayela.