Intuthuko Ezisetshenziswa Ze-PCB Eziguqukayo kanye Nokukhiqiza

Eminyakeni yamuva nje, umhlaba wama-PCB aguquguqukayo (amabhodi esekethe aphrintiwe) uye wabhekana nokukhula okuphawulekayo nokuthuthuka kwezobuchwepheshe. Lokhu kuthuthukiswa kuholele ekwenyukeni kwesabelo semakethe kanye nezinhlelo zokusebenza ezinwetshiwe ngenxa yezinzuzo ezingokwemvelo zokuguquguquka, ubuncane, kanye nomklamo ongasindi. Kulesi sihloko esibanzi, sizohlola izinto eziyisisekelo ezisetshenziswa kuma-PCB avumelana nezimo, ukuthuthukiswa kokusebenza kwawo, kanye nesimo esiguqukayo sobuchwepheshe bokukhiqiza be-PCB obuguquguqukayo.

Ukuthuthukisa ukusebenza nge-Substrate Materials

Ukusebenza kwama -PCB aguquguqukayo kuncike kakhulu ezimpahleni zezinto ezisetshenziswayo. Ama-substrate adlala indima ebalulekile njengoba esebenza njengabathwali bomqhubi kanye nezindawo zokuvikela umswakama phakathi kwamasekethe. Ngaphezu kwalokho, kumele abonise ikhono lokugoba nokugoba, okubalulekile kuma-PCB aguquguqukayo.

Izinto ezisetshenziswa kakhulu ze-substrate zama-PCB aguquguqukayo zifaka ifilimu ye-Polyimide (PI) kanye nefilimu ye-Polyester (PET), kanye namanye amafilimu e-polymer afana ne-Polyethylene Naphthalate (PEN), i-Polytetrafluoroethylene ( PTFE ), kanye ne-Aramid nawo athola izinhlelo zokusebenza. Ukukhetha izinto ze-substrate kufanele kusekelwe ekuhlolweni okucophelela kokusebenza kwazo kanye nokusebenza kahle kwezindleko.

Ifilimu yePolyimide (PI).

Ifilimu ye-Polyimide, i-thermosetting resin, iyinto ehamba phambili ye-substrate ye-flexible copper-clad laminates (FCCL). Ngokungafani nama-resin amaningi we-thermosetting, i-PI ayithambisi noma igeleze kumazinga okushisa aphezulu, iyenze ifanelekele ngokukhethekile ama-PCB aguquguqukayo. I-PI inokumelana nokushisa okuphezulu kanye nezici zikagesi ezinhle kakhulu. Nokho, ine-drawback mayelana nokumunca umswakama namandla okudabula. Amafilimu e-PI athuthukisiwe anomumo ophansi kakhulu wokumunca umswakama ku-0.7%, uma kuqhathaniswa nezinga elijwayelekile elingu-1.6%. Ziphinde zibonise ukuzinza kwe-dimensional okuthuthukisiwe, nokubekezelelana kwehliswe kusuka ku-±0.04% kuya ku-±0.02%.

Ifilimu yePolyester (PET).

I-PET resin inikeza ukusebenza okuhle komshini nogesi. Umkhawulo wayo oyinhloko ukumelana kwayo nokushisa okungalungile, okuyenza ingafaneleki ukuhlanganiswa okuqondile nezinqubo zokuhlanganisa. Nokho, ukusebenza kwe-Polyethylene Naphthalate (PEN) kuphakeme kunokwe-PET kodwa kuyasilela ezimfanelweni ze-PI, okuyenza ibe enye indlela efanelekile kwezinye izinhlelo zokusebenza.

I-Liquid Crystal Polymer (LCP)

Kumadizayini e-compact RF kanye ne-high-frequency flex, i-Highleap ingabuyekeza futhi iphrojekthi yokukhiqiza ye-LCP PCB eceleni kwephakheji ye-flex stackup kanye ne-assembly.

Ukuze kubhekwane nemikhawulo ye-Polyimide substrates, i-Liquid Crystal Polymer (LCP) isivele njengenye indlela ethembisayo. I-LCP iwumsebenzi we-thermoplastic ongacutshungulwa kube amafilimu amancane afanele ama-PCB. Ibonisa ukumuncwa komswakamo ophansi (0.04%) kanye ne-dielectric constant engu-2.85 (1GHz), okuyenza ifanelekele amasekhethi edijithali anemvamisa ephezulu. Izakhiwo ze-LCP, okuhlanganisa ukuhambisana kwe-high-frequency, ukuzinza kwe-thermal dimensional, kanye nokumuncwa komswakama ophansi, kuholele ekwamukelweni kwayo ekukhiqizeni i-PCB eguquguqukayo.

Izisetshenziswa ze-Halogen-Free Substrate

Imboni ye-elekthronikhi ibone ushintsho oluya ekuzibophezeleni kwemvelo. Imithetho efana ne -RoHS (Ukunciphisa Izinto Eziyingozi) kanye ne-WEEE (Imishini Kagesi Neye-elekthronikhi Engasetshenzisiwe) ivimbele ukusetshenziswa kwezinto eziyingozi kumadivayisi kagesi. Ngenxa yalokho, izinto ze-substrate ezingenayo i-halogen ezihambisana nezidingo zemvelo ziye zathuthukiswa futhi manje zisetshenziswa kabanzi kuma-PCB aqinile naguquguqukayo.

Izinto eziguqukayo ze-Substrate

Njengoba isidingo sama-PCB aguquguqukayo siqhubeka nokukhula, imizamo yocwaningo nentuthuko iyaqhubeka yokuhlola izinto ezintsha ze-substrate ezingathuthukisa ukusebenza kwamasekethe aguquguqukayo. Njengoba kunezinhlobo ezingaphezu kuka-2000 zamafilimu epulasitiki asebenzayo atholakala emhlabeni wonke, akungabazeki ukuthi kukhona indawo yokuthola izinto ezingadlula imingcele yomklamo we-PCB oguquguqukayo.

Iqhaza Le-Adhesive kuma-PCB Aguqukayo

Kwakhiwe nge-polyimide flex ezidinga uhlelo lokunamathela oluchaziwe, inqubo ye-DuPont Pyralux LF flexible-circuit iyisithenjwa esiwusizo sezinto ezithile ngaphambi kokuba ukwakhiwa kukhishwe.

I-Adhesive iyingxenye ebalulekile kuma-PCB aguquguqukayo, njengoba inesibopho sokubopha ucwecwe lwethusi nefilimu yento engaphansi. Izinamathiselo zihlukaniswa ngezigaba ezahlukahlukene, okuhlanganisa i-PI resin, i-PET resin, i-modified epoxy resin, ne-acrylic resin. Phakathi kwalokhu, i-epoxy resin eguquliwe kanye ne-acrylic resin isetshenziswa kakhulu ngenxa yamandla azo okunamathela aphezulu.

I-Two-Layer PI Substrate Material

I-laminate ye-copper-clad eguquguqukayo yendabuko (FCCL) ngokuvamile iqukethe izendlalelo ezintathu: i-polyimide, i-adhesive, ne-copper foil. Kodwa-ke, isendlalelo sokunamathisela kwesinye isikhathi singaba nomthelela omubi ekusebenzeni kwama-PCB aguquguqukayo, ikakhulukazi ngokuya ngokusebenza kukagesi nokuzinza kwe-dimensional. Ukuze kubhekwane nalolu daba, i-CCL enezingqimba ezimbili eguquguqukayo (2L-FCCL) ngaphandle kokunamathela iye yathuthukiswa. Le ntuthuko ayithuthukisi nje kuphela ukuhambisana kwemvelo kwama-PCB aguquguqukayo kodwa futhi ihlangabezana nezidingo zokudayiswa ngaphandle komthofu ngokukhuphula izinga lokushisa lisuka ku-220°C liye ku-260-300°C. Ukuqhathanisa phakathi kwe-2L-FCCL enganamatheli kanye ne-3L-FCCL enamathelayo kunikezwa kuThebula 1 ngezansi.

Izindlela ezintathu ezivame ukusetshenziselwa ukukhiqiza i-2L-FCCL:

1. I-Electroplating
2. Ifilimu enamathela
3. Isililo

Indlela ngayinye inezinzuzo zayo futhi ikhethwa ngokusekelwe ezidingweni ezithile. I-Electroplating, ngokwesibonelo, ifanele ukukhiqizwa okugoqekayo kanye nezinto zokwakha ze-substrate ezacile, enikeza isixazululo esingabizi kakhulu. Ukufakwa kwefilimu kuhle kakhulu ekukhiqizweni kwevolumu enkulu, okunikeza ukusebenza kahle kwezindleko. I-Lamination, ngakolunye uhlangothi, ihamba phambili ekwakhiweni kwamabhodi anezinhlangothi ezimbili.

I-Liquid Crystal Polymer (LCP) Substrate Material

I-Liquid Crystal Polymer (LCP) iwumthombo we-substrate entsha uma kuqhathaniswa efuna ukubhekana nemikhawulo ye-polyimide substrates. Ifilimu ye-LCP imbozwe nge-foil yethusi futhi icindezela ngokushisayo ukuze yenze ama-laminates (CCL) anecala elilodwa noma amabili. Ama-CCL asuselwa ku-LCP anikezela ngezakhiwo ezihlukile, okuhlanganisa izinga eliphansi lokumunca amanzi elingu-0.04% kuphela kanye ne-dielectric engaguquki ehambisana namasekhethi edijithali anemvamisa ephezulu (2.85 at 1GHz). Izakhiwo ze-LCP zikwenza kube ukukhetha okuhle kwezinhlelo zokusebenza zemvamisa ephezulu kuma-PCB aguqukayo.

I-Halogen-Free Flexible Substrate Materials

Imithethonqubo yezemvelo iphoqe imboni yezogesi ukuthi ishintshele ezintweni ezingaphansi kwe-halogen-free substrate. Kusukela ngo-2003, i-EU isebenzise imithetho ye-RoHS kanye ne-WEEE, ebeka imingcele ekusetshenzisweni kwezinto eziyisithupha eziyingozi futhi ilawula ukucutshungulwa kokulahlwa kwempahla kagesi nekagesi. Le mithetho ibe nomthelela ezintweni ezisetshenziswa kuma-PCB, okuhlanganisa nama-PCB aguquguqukayo. Ngenxa yalokho, izingxenye ezihlukahlukene zama-PCB aguquguqukayo, njenge-FCCL, i-coverlay, i-prepreg, imaski ye-solder, namabhodi okuqinisa, kufanele ahlangabezane nokumelana nomlilo kanye nezidingo ze-halogen.

Intuthuko ku-Copper Foil

I-Conductivity iyisici esibalulekile kuma-PCB aguquguqukayo, futhi i-copper foil isebenza njengento yokuqala yokuqhuba. Ngaphezu kwethusi, ngezinye izikhathi kusetshenziswa izinto ze-alloy ezifana ne-aluminium, nickel, igolide nesiliva. Ukukhethwa kwe-foil yethusi kuncike ekusetshenzisweni okuqondile kanye nendlela yokukhiqiza.

Electro Deposit (ED) Copper Foil

I-ED copper foil ingenye yezinto ezisetshenziswa kakhulu zokuqhuba kuma-PCB aguquguqukayo. Ibonakala ngesakhiwo sekristalu esikalini sezinhlanzi, okuholela ku-foil yethusi ebushelelezi enokuqina okuhle. I-ED ye-copper foil ifaneleka kahle kuma-PCB aguquguqukayo adinga ukuguquguquka okuphezulu.

I-Rolled and Annealed (RA) I-Copper Foil

Ngakolunye uhlangothi, ucwecwe lwethusi lwe-RA, luhlanganisa isakhiwo sekristalu esiyikholomu, okuholela ekwakhiweni okulinganayo futhi okuyisicaba. Lolu hlobo lwe-foil yethusi lulungele izinqubo ze-roughening kanye ne-etching. Ucwecwe lwethusi lwe-RA luvame ukusetshenziswa kuma-PCB aguquguqukayo aphezulu.

Izidingo Ezikhulayo Ku-Copper Foil

Njengoba isidingo sama-PCB aguquguqukayo aphezulu anezingqimba ezinhle kusukela ku-40μm kuya ku-50μm sikhuphuka, izidingo ezintsha zifakwa ekukhiqizeni ucwecwe lwethusi. Lezi zidingo zifaka phakathi ukuhwalala okuphansi kwendawo kanye namafoyili ethusi amancane kakhulu ukuze kuhlangatshezwane nezidingo zokukhiqizwa kwe-PCB yevolumu enkulu.

I-Conductive Silver Paste

Ukwenziwa kwe-PCB eguquguqukayo kuhilela ukusetshenziswa kwe-inki e-conductive, ephrintwa kufilimu evikelayo ukuze kwakheke izintambo noma izendlalelo zokuvikela. I-conductive silver paste iyinto eyinhloko esetshenziselwa le njongo. Kubalulekile ukuthi isendlalelo se-conductive esiphrintiwe sibonise ukumelana okuphansi, siqinisekise uxhumano oluqinile, futhi sigcina ukuguquguquka. Ukwengeza, inqubo yokuphrinta kufanele isebenze kalula, futhi ukuphulukiswa kufanele kusheshe.

I-conductive silver paste yesimanje ihlangabezana nalezi zidingo, ivumela ukwakheka kwamaphethini okuqhuba ku-thermosetting noma amafilimu e-polymer e-thermoplastic, izindwangu, nephepha. Lobu buchwepheshe budlulela nasekudaleni ihluzo ezisetshenziswa emikhiqizweni ye-RFID. Imikhiqizo yokugcina equkethe i-conductive silver paste ihlolwe ngokuqinile ukuze kugcinwe izinga lokushisa eliphezulu, ukumelana nomswakama, kanye nokusebenza kwamabhayisikili okunezinga lokushisa eliphezulu neliphansi. I-conductive silver paste ihambisana nezidingo zokuvikela imvelo kanye nokusebenza kahle kwezindleko.

I-Photosensitive Polyimide (PI) Coverlay

Izembozo zosiko ze-PI/okunamathelayo ziye zabhekana nemikhawulo ekuhlangabezaneni nezimfuneko zokuminyana okuphezulu, ukuzinza kobukhulu, kanye nama-PCB avumelana nezimo ezemvelo. Ukuphendula, i-Photo-Imageable Coverlay (PIC) yenziwe. I-PIC, kuye nge-epoxy eguquliwe noma ama-acrylic resins, ithole ukuduma ngenxa yokulungiswa kwayo okuphezulu, amandla amahle kakhulu okubopha, kanye nokuguquguquka. Kodwa-ke, lawa ma-PIC anemikhawulo, okuhlanganisa ukuzinza kwe-dimensional ephansi kuma-PCB aphezulu, izinga lokushisa eliphansi lengilazi (Tg), kanye nokumelana nokushisa okulinganiselwe.

Isiphetho

Ama-PCB aguqukayo asehambe indlela ende mayelana nezinto zokwakha kanye nobuchwepheshe bokukhiqiza. Ukuthuthuka kwezinto ezisetshenziswa ngaphansi kwe-substrate, ama-foil ethusi, ama-conductive pastes, kanye ne-coverlay kuvuleke amathuba amasha ama-PCB anomthamo omkhulu, ama-high-frequency, kanye nemvelo evumelana nezimo. Njengoba isidingo sama-elekthronikhi aguquguqukayo siqhubeka sikhula, kuyacaca ukuthi imizamo eqhubekayo yocwaningo nentuthuko izoholela ekwakhiweni okusha kwezinto zokwakha nezinqubo.

Ukukhiqiza i-PCB evumelana nezimo ephumelelayo nethembekile, cabanga ukufinyelela ku-Highleap Electronic. Ngesipiliyoni esingaphezu kweminyaka eyishumi ekukhiqizeni i-PCB eguquguqukayo, sikuhlomele ukuhlangabezana nezidingo zakho futhi sikunikeze izixazululo zekhwalithi ephezulu. Xhumana nathi namuhla ukuze uxoxe ngokwenziwa kwebhodi lakho lesifunda elivumelana nezimo kanye nezidingo zomhlangano noma ucele ikhotheshini ye-PCB eguquguqukayo. Ikusasa lezinto zikagesi eziguquguqukayo liqhakazile, futhi silapha ukuze sikusize uphilise imibono yakho emisha.