Kungani Ukucwiliswa Kwegolide Negolide Kudingeka Kuma-PCB?

PCB Surface Treatment

• Ukwelashwa kwe-Antioxidant, ukufutha ngethini, ukufutha ngethayela elingenamthofu, ukucwebezeliswa kwegolide, ukufakwa kwe-tin, ucwecwe lwesiliva, ucwecwe lwegolide eliqinile, ucwecwe lwegolide olugcwele ibhodi, iminwe yegolide, i-nickel-palladium-gold.
• I-OSP (Okulondolozwa Kwezinto Eziphilayo): Izindleko eziphansi, ukuthengiselana okuhle, izimo zokugcina eziqinile, isikhathi esifushane sokugcina, inqubo evumelana nemvelo, i-solderability enhle, kanye ne-flatness.
• Ukufafaza uthayela: Amabhodi afakwe ngothayela ngokuvamile ungqimba oluningi (Izendlalelo ezingu-4-60) amasampula e-PCB anembe kakhulu, asetshenziswe ukuxhumana okuningi kwasekhaya okukhulu, ikhompuyutha, okokusebenza kwezokwelapha, amabhizinisi asemkhathini, namayunithi ocwaningo.
• Iminwe yegolide: Izingxenye zokuxhuma phakathi kwemojula yememori ne-memory slot kumojula yememori, lapho wonke amasignali athunyelwa khona. Yakhiwe ngezingcezu eziningi zokuthintana zegolide ezihlelwe njengeminwe ngenxa yokunameka ngegolide ngaphezulu.
• Ukukhiqiza Iminwe Yegolide: Kubandakanya ukusebenzisa ungqimba lwegolide ebhodini eligqoke ithusi ngenqubo ekhethekile. Igolide likhethwa ngenxa yokumelana ne-oxidation eqinile kanye ne-conductivity. Nokho, ngenxa yezindleko eziphezulu zegolide, izinkumbulo eziningi okwamanje zisebenzisa i-tin plating esikhundleni salokho, okwaqala ngawo-1990. “Iminwe yegolide” yamabhodi omama, izinkumbulo, amakhadi ezithombe, nezinye izisetshenziswa manje iningi lazo senziwe ngothayela, okunezinsiza ezisebenza kahle kakhulu zeseva/indawo yokusebenza eziqhubeka nokusebenzisa igolide, elibiza ngokwemvelo.

Kungani Sebenzisa Igolide-Plated Amabhodi

Ngokuhlanganiswa okwandayo kwama-IC, inani lamaphini e-IC liyakhula futhi liyancipha. Ubuchwepheshe bokufafaza ngethini eliqondile bukuthola kunzima ukushaya amajoyinti amancane e-solder abe yizicaba, okuletha ubunzima enkambisweni yokuhlanganisa i-SMT . Ngaphezu kwalokho, isikhathi sokuphila samabhodi afafazwe ngethini sifushane kakhulu. Amabhodi afakwe igolide axazulula lezi zinkinga.

Ngobuchwepheshe bokukhweza phezulu, ikakhulukazi ku-0603 kanye ne-0402 yezingxenye zokukhweza ezingaphezulu-ezincane, ukuqina kwamajoyinti e-solder kuthinta ngqo ikhwalithi yenqubo yokuphrinta ye-solder unama, enomthelela omkhulu kukhwalithi yenqubo yokuphinda i-solder yokugeleza kabusha. Ngakho-ke, ukufakwa kwegolide okugcwele ibhodi kuvame ukubonakala kubuchwepheshe bokukhweza obuphezulu bokuminyana kanye ne-ultra-small surface.

Phakathi nesigaba sokukhiqiza isilingo, ngenxa yezinto ezifana nokuthengwa kwengxenye, ibhodi ngokuvamile alithengiswa ngokushesha ngemva kokuba lifikile, kodwa ngokuvamile kufanele lilinde amaviki ambalwa noma ngisho nezinyanga ezimbalwa ngaphambi kokusetshenziswa. Impilo yeshelufu yamabhodi afakwe ngegolide yinde ngokuphindwe kaningi kunengxubevange ye-lead-tin, ngakho wonke umuntu uzimisele ukuwasebenzisa.

Ngaphezu kwalokho, izindleko zama-PCB agqitshwe ngegolide esigabeni sesampula zicishe zifane nalezo zamabhodi we-lead-tin alloy board. Kodwa-ke, njengoba izintambo ziba ziminyene kakhulu, ububanzi bomugqa kanye nokuhlukana sekufinyelele ku-2-4 mils. Lokhu kulethe inkinga yamasekhethi amafushane ezintambo zegolide: Njengoba imvamisa yesignali ikhula, umthelela womphumela wesikhumba ekudluliseni isignali phakathi kwezingqimba zokucwenga eziningi uba sobala kakhulu. Umphumela wesikhumba ubhekisela: ku-AC-frequency ephezulu, okwamanje ijwayele ukugeleza ebusweni bomqhubi. Ngokwezibalo, ukujula kwesikhumba kuhlobene nobuningi.

Kungani Usebenzisa Amabhodi Okucwiliswa Egolide

Ukuxazulula izinkinga ezingenhla zamabhodi egolide, ama-PCB asebenzisa ukucwiliswa kwegolide anezici ezilandelayo:

1. Ngenxa yokuthi isakhiwo sekristalu esakhiwe ngokucwiliswa kwegolide sihlukile kuleso sokucwecwa kwegolide, ukucwiliswa kwegolide kunombala ophuzi kunombala wegolide, amakhasimende aneliseke ngakho.

2. Ngenxa yokuthi isakhiwo sekristalu esakhiwe ngokucwiliswa kwegolide sihlukile kuleso sokucwecwa kwegolide, ukucwiliswa kwegolide kulula ukudayiswa kunokucwecwa kwegolide futhi ngeke kubangele ukonakala kwe-soldering, okuholela ezikhalazo zamakhasimende.

3. Ngenxa yokuthi amaphedi ebhodi lokucwiliswa kwegolide kuphela ane-nickel-gold, ukudluliswa kwesignali kumphumela wesikhumba kusengqimbeni yethusi futhi ngeke kuthinte isignali.

4. Ngenxa yokuthi ukwakheka kwekristalu lokucwiliswa kwegolide kuminyene kunaleso sokucwecwa kwegolide, mancane amathuba okuthi i-oxidize.

5. Ngenxa yokuthi kuphela amaphedi ebhodi lokucwiliswa kwegolide ane-nickel-gold, ngeke kube nezikhindi zezintambo zegolide, okuyizikhindi ezincane.

6. 5Ngenxa yokuthi amaphedi ebhodi lokucwiliswa kwegolide kuphela ane-nickel-gold, inhlanganisela ye-solder imelana emikhondo futhi ungqimba lwethusi luvikeleke kakhulu.

7. Uma ubunjiniyela be-CAM benza isinxephezelo, ukuhlukaniswa ngeke kuthinteke.

8. Ngenxa yokuthi isakhiwo sekristalu sokucwiliswa kwegolide sihlukile kulokho okucwecwa ngegolide, ukucindezeleka kwalo kulula ukulawula, okulungele kakhulu ukucutshungulwa kokubopha kwemikhiqizo eboshiwe. Ngesikhathi esifanayo, ngenxa yokuthi ukucwiliswa kwegolide kuthambile kunombala wegolide, amabhodi okucwiliswa kwegolide awakwazi ukumelana nokugqoka uma esetshenziswa njengeminwe yegolide.

9. Ubucaba nempilo yeshelufu yamapulangwe okucwilisa igolide kuhle njengalawo amapulangwe egolide.

Amabhodi Okucwiliswa Egolide vs. Amabhodi Okufaka Igolide

Eqinisweni, inqubo yokufaka igolide ingahlukaniswa ngezinhlobo ezimbili: igolide elifakwe ngogesi kanye negolide lokucwilisa. Ngenqubo yokufaka igolide, umphumela wayo wokusonta uncishisiwe kakhulu, kuyilapho umphumela wokusonta wegolide lokucwilisa ungcono kakhulu. Ngaphandle kokuthi umenzi udinga ukubopha, abakhiqizi abaningi bazokhetha inqubo yokufaka igolide lokucwilisa! Ngokuvamile, ukwelashwa okuvamile kwama-PCB kungokulandelayo: ukufaka igolide (igolide elifakwe ngogesi, igolide lokucwilisa), ukufaka isiliva, i-OSP , ukufutha ngethini (ngomthofu noma ngaphandle kwawo). Lokhu kwelashwa kungokwezinto ze -FR-4 noma ze-CEM-3, futhi kukhona ukwelashwa kwendawo kwezinto ezisekelwe ephepheni kanye nokugqoka kwe-pine rosin. Uma ukufakwa kwe-tinning okungekuhle (ukudla i-tin) kungafakwanga, izizathu zifaka phakathi ukukhiqizwa kwe-solder paste ngumenzi we-patch kanye nenqubo yezinto. Ngezinkinga ze-PCB, kunezizathu eziningana:

• Kungakhathaliseki ukuthi kukhona ifilimu kawoyela ku-PAN ngesikhathi sokuphrinta kwe-PCB, engavimba umphumela we-tinning; lokhu kungaqinisekiswa ngokuhlolwa kwe-tinning.
• Ukuthi ukuthambisa ku-PAN kuhlangabezana nezidingo zokuklama, okungukuthi, noma ngabe idizayini yephedi ye-solder ingaqinisekisa ngokwanele umphumela wokusekela wezingxenye.
• Ukuthi i-solder pad ingcolile yini, enganqunywa ngokuhlola ukungcoliswa kwe-ion.

La maphuzu amathathu angenhla ayizici ezibalulekile ezicatshangwa abakhiqizi be-PCB. Mayelana nezinzuzo kanye nokubi zezindlela ezimbalwa zokwelapha ezingaphezulu, ngayinye inamandla nobuthakathaka bayo! Ngokuphathelene nokucwecwa kwegolide, inganweba isikhathi sokugcina se-PCB, futhi izinguquko kuzinga lokushisa lendawo yangaphandle kanye nomswakama mancane kakhulu (uma kuqhathaniswa nezinye izindlela zokwelapha ezingaphezulu), futhi ingagcinwa isikhathi esingangonyaka; Ukwelashwa kwendawo yokufafaza ngethayela kungokwesibili, i-OSP ilandelayo, futhi lezi zindlela zokwelapha ezimbili ezingaphezulu zidinga ukunakwa okukhulu ekushiseni kwemvelo kanye nesikhathi sokugcina umswakama.

Ngokuvamile, ukwelashwa kwe-silver plating kuhluke ngandlela-thile, ngentengo ephezulu, izimo zokugcina eziqinile, ezidinga ukupakishwa ngephepha elingenaso isibabule! Futhi isikhathi sokugcina cishe izinyanga ezintathu! Mayelana nomphumela we-tinning, igolide lokucwiliswa, i-OSP, kanye nokufuthwa kukathayela kuyafana, futhi abakhiqizi babheka kakhulu ukusebenza kahle kwezindleko!