Umhlangano we-PCB we-Heavy Copper we-Electronics yamanje ephezulu

I-Highleap Electronics inikeza izinsizakalo zokuhlanganisa i-PCB yethusi esindayo yama-elekthronikhi anogesi ophezulu, amabhodi okulawula amandla, amabhodi e-BMS, ama-elekthronikhi okushaja i-EV, amamojula kagesi ezimboni kanye nezinhlelo zokusebenza zokuphatha ukushisa. Ama-PCBA ethusi esindayo adinga ukuhlanganiswa phakathi kokwenziwa kwe-PCB, inqubo yokunamathisela, ukukhethwa kwezingxenye, indlela yamanje, ukwakheka kokushisa kanye nokuhlolwa. I-Highleap ikhiqiza futhi ihlanganisa amabhodi ngokuya ngamafayela avunyelwe amakhasimende, imidwebo, ama-BOM kanye nezidingo zokuhlola.

Ithusi elinzima livame ukubhekisela ekwakhiweni kwe-PCB kusetshenziswa ithusi elijiyile kunamabhodi esignali ajwayelekile. Isisindo esiqondile sethusi kufanele sichazwe njalo ku-stackup ngesendlalelo. Ibhodi lethusi elinzima aliphephile ngokuzenzakalelayo kugesi onikeziwe; umthamo wamanje uncike ekujiyeni kwethusi, ububanzi bomkhondo, indawo yendiza, ukuphakama kwezinga lokushisa okuvunyelwe, ukuhamba komoya, indawo yesendlalelo, izinto ze-substrate kanye nendawo yomkhiqizo. Umnikazi womkhiqizo kufanele aqinisekise ukusebenza kukagesi nokushisa ezingeni lesistimu.

Ukuze uthole amakhasi ephrojekthi ahlobene, bheka ukuhlanganiswa kwe-PCB kagesi kagesi, ukuhlanganiswa kwe-BMS PCB kanye nokuhlanganiswa kwe-PCB yeshaja ye-EV.

Amandla Okuhlanganisa i-PCB Yethusi Elikhulu

Indima yokukhiqiza ithusi elinzima

I-Highleap ingasekela ukwenziwa nokuhlanganiswa kwe-PCB yethusi esindayo lapho ukwakhiwa kuchazwe ngokucacile futhi ukwakhiwa kungaphakathi kwamandla okuvunyelwana ngawo. Umdwebo kufanele usho isisindo sethusi ngeleveli, ukujiya okuqediwe, ukuqeda kobuso, imaski yokubopha, i-hole plating, ubukhulu obubalulekile, izindawo zokuthwala ugesi kanye nezidingo zokuhlola. Uma ukuhlanganiswa kufakiwe, iphakheji kufanele futhi ibone izingxenye zamandla aphezulu, ama-terminal, izixhumi, izingxenye ezikhiqiza ukushisa kanye nezixhumi zemishini.

Ukusetshenziswa kwe-PCBA yethusi esindayo ejwayelekile

Ukuhlanganiswa kokukhiqiza nokuhlanganisa

Ithusi elinzima lishintsha kokubili ukukhiqizwa kwebhodi elingenalutho kanye nokuhlanganiswa. Ukuqopha ithusi elijiyile kudinga izibonelelo ezinkulu zokuklama kunethusi lesiginali encane. Izindawo ezinkulu zethusi zithinta ibhalansi yokugeleza kabusha. Amatheminali emigodi angadinga ukugcwaliswa kwe-solder okulawulwayo. Ama-thermal pad angadinga i-X-ray noma ukuhlolwa okukhethekile uma kudingeka. Ukuze uthole imiphumela emihle kakhulu, ithusi elinzima kufanele libuyekezwe njengenqubo ephelele ye-PCB kanye ne-PCBA kunokuthuthukiswa kwezinto ezilula.

Ubukhulu Bethusi Nezidingo Zokuthwala Ugesi

Umthamo wamanje uncike ekwakhiweni okugcwele

Isisindo sethusi siyingxenye eyodwa kuphela yomthamo wamanje. Umklami kufanele futhi acabangele ububanzi bomkhondo, indawo yethusi, inani lezendlalelo, ngobuningi, ukuphakama kwezinga lokushisa okuvunyelwe, izinga lokushisa elizungezile, isimo sokupholisa, ukujiya kwebhodi, imithombo yokushisa eseduze kanye nokugeleza komoya okuvalekile. I-IPC-2152 ivame ukusetshenziswa njengereferensi yomthamo wokuthwala ugesi ekwakhiweni kwebhodi eliphrintiwe, kodwa ukuqinisekiswa kokugcina komkhiqizo kuhlala kungumthwalo womnikazi womkhiqizo.

Umthelela womklamo wethusi ojiyile

Ithusi elijiyile lingathuthukisa ukuthwala ugesi kanye nokusabalala kokushisa, kodwa futhi lithinta umkhondo omncane kanye negebe, isinxephezelo se-etch, incazelo yemaski ye-solder, ubukhulu bebhodi kanye nezindleko. Izingxenye ezifingqiwe ezibekwe eduze kwezindawo zethusi elijiyile zingadala izinselele zokuhlanganisa. Uma ibhodi lihlanganisa izifunda zokulawula kanye nethusi elijiyile, ukwakheka kufanele kuhlukanise izingxenye ezizwelayo ezindaweni ezishisa kakhulu kanye nezindawo ezinobunzima obukhulu uma kungenzeka.

Ukwabelana ngendiza kanye nokwabelana ngendiza

Ugesi ungahamba phakathi kwezingqimba ngokusebenzisa ama-array noma izici ezifakwe ipulasitiki. Ngokubala, ububanzi, ukujiya kwe-plating kanye nokwakheka kunquma ukuthi ugesi kanye nokushisa kwabelwana kanjani. Uma i-via array iyingxenye yendlela yamanje, akufanele iphathwe njengokuthunga okuvamile. Umdwebo kufanele ukhombe okubalulekile ngamaqembu nanoma yikuphi ukugcwalisa, isivalo noma isidingo sokuhlola.

Ukuphathwa Kwezifudumezi kanye Nokukhipha Ukushisa

Ukushisa kusabalala ngethusi

Ithusi elisindayo lingasakaza ukushisa okuvela ezingxenyeni zamandla, kodwa alithathi indawo yomklamo ophelele wokushisa. Ukushisa kumele kuphume ebhodini ngezindiza zethusi, ama-via, ama-heat sink, ukuhamba komoya, ukuxhumana okuvalekile noma izinto zokuhlangana kokushisa. Uma ibhodi lithembele ku-baseplate noma ku-chassis, i-mechanical interface kumele ifakwe kumanothi okuhlanganisa.

Ama-vias okushisa kanye nama-pad avuliwe

Amadivayisi kagesi anama-pad avele obala angadinga ama-vias okushisa ngaphansi noma eduze kwephakheji. Umklamo we-Via kufanele ulinganisele ukudluliselwa kokushisa, ukuvaleka kwe-solder kanye nokukhiqizwa. Ama-vias avulekile ngaphansi kwama-pads angabangela ukugoba kwe-solder; ama-vias agcwele noma anezivalo anganezela izindleko kodwa athuthukise ukuhambisana kokuhlanganiswa. Ikhasimende kufanele lichaze isu le-via ngokusekelwe ezidingweni zomkhiqizo.

Isikhala sezingxenye ezizungeze imithombo yokushisa

Izingxenye ezizwela ukushisa ezifana nama-capacitor e-electrolytic, ama-sensor, ama-optocouplers kanye nama-IC amancane esignali kufanele abekwe kucatshangelwa ukuvezwa kokushisa. Kusukela ohlangothini lokukhiqiza, izikhala nazo ziyasiza ekuhloleni nasekulungiseni ukufinyelela. Amabhodi ethusi aqinile avame ukuba nezingxenye ezinkulu kanye nobunzima obukhulu bokushisa, ngakho-ke ukubekwa okuxinene kungandisa kokubili ukuthembeka kanye nengozi yokuhlangana.

Ukuhlanganiswa kwe-SMT kanye ne-Through-Hole kumaBhodi Ethusi Elinzima

Ibhalansi yokushisa kabusha

Izindawo zethusi ezisindayo zimunca ukushisa ngendlela ehlukile ezindaweni zesignali zethusi ezilula. Lokhu kungadala izimo zokungalingani kokunamathela kulo lonke ibhodi. Umklamo we-stencil, ukukhethwa kokunamathisela i-solder, iphrofayili yokugeleza kabusha, i-geometry yamaphedi kanye nokubekwa kwezingxenye kufanele kubuyekezwe. Amaphedi amakhulu ethusi angadinga ukukhululeka kokushisa noma ukuhlela inqubo kuye ngezidingo zikagesi nezokushisa.

Izingxenye zamandla ezisebenzisa imbobo edlulayo

Amabhodi ethusi aqinile avame ukusebenzisa izixhumi ezinezimbobo ezidlulayo, ama-terminal, ama-relay, ama-transformer kanye nama-capacitor amakhulu. Lezi zingxenye zingadinga ukushiswa ngamagagasi, ukushiswa okukhethiwe noma ukushiswa ngesandla okulawulwayo kuye ngomklamo nobuningi. Usayizi wembobo, indandatho ye-annular, ukujiya kwethusi kanye nokukhululeka kokushisa kuthinta ukushiswa kwe-solder. Uma iphesenti lokushiswa kwe-solder noma isidingo sokuhlola kuyimpoqo, kufanele kubhalwe kumbhalo wokudweba noma wokuhlanganisa.

Izinselele zokuhlola

Ithusi elinzima lingenza ukuhlolwa okubonakalayo kubaluleke kakhulu futhi ngezinye izikhathi kube nzima nakakhulu. Amalunga amakhulu e-solder, ama-hidden pad, ama-thermal pad kanye nemiphetho yethusi ejiyile kungadinga imiyalelo ethile yokuhlola. I-X-ray ingasetshenziswa amalunga akhethiwe afihliwe uma kudingeka yikhasimende. I-Microsection ingacelwa ukuze kuhlolwe imbobo ehlanganisiwe uma izidingo zokuthembeka zikuvumela lokho.

Izinselele Zokushisela, Ukugeleza Kabusha kanye Nokulinganisela Kokushisa

Ukushisa okukhulu kwethusi

Izindawo ezinkulu zethusi zingadonsa ukushisa kusuka ezinhlanganisweni ze-solder ngesikhathi sokugeleza kabusha noma ukushiswa ngembobo. Lokhu kungabangela ukumanzisa okunganele uma inqubo ingalungiswa. Ngesikhathi esifanayo, ukushisa kakhulu izingxenye ezincane ukuze kulungiswe kungadala ingozi yomonakalo. Inqubo elinganiselayo isebenzisa ukubuyekezwa komklamo kanye nezilungiselelo zenqubo kunokushisa ngokweqile.

Ukuhlela i-stencil kanye ne-solder paste

Amadivayisi kagesi, ama-thermal pad kanye nama-terminal amakhulu angadinga izimbobo ezikhethekile ze-stencil noma ukulawulwa kokunamathisela. Umgomo ukunikeza i-solder eyanele yokuthembeka kokushisa nokwemishini ngenkathi kugwenywa ukubopha, ukuntanta, ukugoba noma ukubopha i-solder. Uma umkhiqizo unemikhawulo eqinile ye-void, umkhawulo owamukelekayo kanye nendlela yokuhlola kufanele ichazwe yikhasimende.

Imikhawulo yokushisela ngesandla

Ukushisela ngesandla kungafaneleka kuma-prototype noma izingxenye ezikhethiwe, kodwa akufanele kucatshangelwe ukuthi kungaphindwa kakhulu ngaphandle kokuthi inqubo ilawulwa futhi ibhalwe phansi. Ama-terminal amakhulu, ithusi elijiyile kanye nesisindo esiphezulu sokushisa kungadinga ikhono lomsebenzisi kanye nokulawula ukushisa. Ekukhiqizeni, ukushisela okukhethayo noma amathuluzi kungaphindwa kakhudlwana uma umklamo uyisekela.

Ukuhlolwa Nokwethenjelwa

Izindawo okugxilwe kuzo ekuhlolweni

• Ikhwalithi yendawo yethusi kanye nomthamo wamandla aphezulu.
• Ikhwalithi embobeni ehlanganisiwe yama-terminals kanye nama-array.
• Ukugcwaliswa kwe-solder kanye nokumanzisa izingxenye zamandla ezimbobo ezidlulayo.
• Ikhwalithi ye-thermal pad solder yama-semiconductor anamandla.
• Izihlalo zesixhumi, ukuqondisa kanye nokususwa kwemishini.
• Ukuthamba kwebhodi, uhlaka kanye nesikhombikubona sokufaka.

Izidingo zamadokhumenti

Amadokhumenti angafaka irekhodi lezinto ezibonakalayo, ukuqinisekiswa kwe-stackup, ukuhlolwa kukagesi, umbiko wokuhlola, i-microsection, umbiko wesihloko sokuqala noma irekhodi lokuhlola elisebenzayo elichazwe yikhasimende. Lokhu kufanele kucelwe ngaphambi kwekhotheshini. Uma ibhodi lizosetshenziswa kumkhiqizo onokwethenjelwa kakhulu, iphakheji yamadokhumenti kufanele ibonise izinga lobungozi kunokuba ibonise kuphela izindleko zokwakha eziphansi kakhulu.

Izinto okufanele uzicabangele ngokuthembeka

Ukuthembeka kuncike ekwakhiweni komkhiqizo, amandla okusebenza, ukujikeleza kwezinga lokushisa, ukwesekwa kwemishini, ikhwalithi yejoyinti le-solder, isilinganiso sezingxenye kanye nendawo ezungezile. Ithusi elinzima lingasekela amandla okusebenza kanye nokusabalala kokushisa, kodwa akuqinisekisi ukuthembeka kuphela. Ukuhlanganiswa okuphelele kufanele kubuyekezwe futhi kuqinisekiswe ngaphansi kwezimo zokusetshenziswa ezihlosiwe yikhasimende.