Ukukhiqiza i-Isola Agilex7 PCB ye-High-Speed ​​​​FPGA kanye ne-AI Hardware

I-Highleap Electronics inikeza ukwenziwa kwe-PCB kanye nokuhlanganiswa kwe-PCB kwamabhodi anesivinini esikhulu achaza i-Isola Agilex7, ama-laminate aphansi e-Isola, noma ama-stackups ahlobene ne-Agilex 7 FPGA.

Thumela ithebula lakho le-Gerber, ODB++, stackup, callout yezinto zokwakha kanye ne-impedance. Ithimba lethu lobunjiniyela lizobuyekeza ukutholakala kwezinto zokwakha, ukusebenza kwe-stackup, isakhiwo se-HDI, izidingo ze-back-drill, i-BGA fanout kanye nezidingo ze-PCBA ngaphambi kwekhotheshini.

Ukuqinisekiswa Kwezinto Ezibalulekile Nokuqoqwa Kwezinto Ezihlanganisiwe

Esicelweni sokukhiqiza se-Isola Agilex7 PCB, isinyathelo sokuqala sokukhiqiza ukuqinisekisa izinto kanye nokufakwa kwe-stackup njengoba nje ikhasimende lihlose. Amanye ama-RFQ asebenzisa i-“Agilex7” ukuchaza ibhodi le-Intel Agilex 7 FPGA, kanti amanye ayisebenzisa njengengxenye yegama lezinto zangaphakathi noma leplatifomu. Ngakho-ke, ikhotheshini kufanele isekelwe kumdwebo, uhlu lwezinto ezivunyiwe kanye nefayela le-stackup kunokuba kusekelwe kugama elingukhiye kuphela.

I-Highleap Electronics ibuyekeza i-callout yezinto zokwakha, ukujiya kwe-dielectric, isisindo sethusi, inani lezingqimba, ithebula le-impedance, ngohlobo kanye nokuphela kwendawo ngaphambi kokuqinisekisa intengo nesikhathi sokuhola. Uma umdwebo ucacisa i-Isola laminate, sihlola ukuthi i-core kanye ne-prepreg eceliwe kungatholakala futhi kucutshungulwe ngokwesakhiwo sebhodi.

Ukuze uthole ulwazi oluhlobene, umhlahlandlela wethu wezinto ze-PCB ezisheshayo uchaza ukuthi ama-laminate aphansi avame ukubuyekezwa kanjani kumabhodi edijithali asheshayo.

Izidingo Zokwenziwa Kwebhodi Le-Agilex 7 FPGA

Ukusesha okuningi kokukhiqizwa kwe-Isola Agilex7 PCB kuxhunywe ngamabhodi e-Agilex 7 FPGA noma amabhodi e-accelerator asheshayo. Lawa mabhodi avame ukuhlanganisa amaphakheji e-BGA acwebezelayo, imemori ye-DDR, i-PCIe, i-Ethernet, ukulawulwa kwamandla, amawashi kanye nezixhumi ezixinene kakhulu ku-PCB eyodwa enezingqimba eziningi.

Ngaphambi kokwenziwa, ukubuyekezwa kwe-Highleap Electronics:

• Umzila wokuphunyuka we-BGA kanye nesu ngaphansi kwephakheji ye-FPGA noma ye-SoC
• Ukuqhubeka kwendiza yokubhekisela kwe-PCIe, i-Ethernet, inkumbulo kanye nomzila wewashi
• Izendlalelo zokusatshalaliswa kwamandla, ibhalansi yethusi kanye nezindawo zokuhlushwa kokushisa
• Ukuphuma kwesixhumi, izingxenye zesixhumi esinqenqemeni kanye nezixhumi ze-mezzanine ezisheshayo
• Ukufakwa kwamaphaneli, imigodi yamathuluzi, ama-fiducial kanye nemizila yokuhlanganisa yokukhiqiza i-SMT

Ngemikhiqizo yekhompyutha ethuthukisiwe, amakhasi ethu okukhiqiza ibhodi le-FPGA kanye ne -AI computing PCB ahlanganisa izidingo zohlelo lokusebenza ezihlobene.

Izinketho ze-Isola Low-Loss Laminate

Uma i-RFQ ifuna izinto ze-Isola, i-laminate eqondile kufanele iqinisekiswe kusukela kumdwebo wamakhasimende noma ku-AVL. Ukukhetha izinto ze-Isola ezisheshayo kungafaka i-I-Tera MT40, i-Tachyon 100G, i-Astra MT77 nezinye izinhlelo ezifanelekile kuye ngobude besiteshi, isabelomali sokulahlekelwa, inhloso yezindleko kanye nokutholakala.

I-Highleap Electronics ingacaphuna izinto ze-Isola ezishiwo uma zitholakala futhi zivunyelwe ukwakha. Uma isikhathi sokuhola izinto siba yinkinga, singasiza futhi ekulungiseleleni isibuyekezo sobunjiniyela senye indlela evunyelwe. Ukushintsha akufanele kwenziwe ngaphandle kwemvume yamakhasimende ngoba imiphumela ye-Dk, Df, i-copper foil, i-prepreg flow, ukuziphatha kwe-lamination kanye ne-impedance ingashintsha.

• Ukwakhiwa kwezinto eziqondile: isetshenziswa lapho ukudweba kwamakhasimende noma uhlelo lokufaneleka lungavumeli ezinye izinto esikhundleni sazo.
• Ukubuyekezwa kwezinto ezilinganayo: isetshenziswa lapho ithimba lokuklama livumela indawo evunyelwe ngemuva kokuqhathaniswa kobunjiniyela.
• Ukuhlanganiswa kwe-hybrid: isetshenziswa lapho izendlalelo zesignali ezikhethiwe kuphela ezidinga izinto ezilahlekelwa kancane kuyilapho ezinye izendlalelo zingasebenzisa i-laminate ehlukile evunyelwe.

Izinkomba eziwusizo zifaka phakathi ukwenziwa kwe-Isola I-Tera MT40 PCB , izinto ze-Isola Tachyon 100G PCB kanye nezinhlelo zokusebenza ze-Isola Astra MT77 PCB.

Ukubuyekezwa kwe-Impedance elawulwayo kanye ne-Back-Drill

Amabhodi asekelwe kwi-Isola esheshayo kufanele abuyekezwe ukuze kutholakale ukuthi alawulwa yini ngaphambi kokuba amafayela e-PCB akhishwe ukuze akhiqizwe. Ububanzi be-trace, ukujiya kwe-dielectric, ukujiya kwethusi, imaski ye-solder, ukwakheka kwendiza yokubhekisela kanye nokuqina kwethusi konke kungathinta umphumela wokugcina.

I-Highleap Electronics ihlola ithebula le-impedance ngokumelene ne-stackup futhi ingalungisa amakhuphoni e-impedance ngokusekelwe kuphaneli yokukhiqiza evunyiwe. Ukuze uthole isivinini esikhulu ngokushintshashintsha, ukubhoboza emuva kungadingeka futhi ukuze kuncishiswe izingcezu ezisele emizileni ebalulekile.

Bheka amakhasi ethu mayelana nokukhiqizwa kwe-PCB okulawulwayo , ukuqondisa i-differential pair kanye nobuchwepheshe bokubhoboza emuva kwe-PCB ukuze uthole ulwazi oluhlobene nenqubo.

I-HDI, i-BGA Fanout kanye ne-Dense Routing

Amabhodi e-Agilex 7 FPGA kanye namabhodi okusheshisa anesivinini esikhulu avame ukudinga ukuphuma kwe-BGA eningi, iziteshi zomzila ezimfushane kanye nokusatshalaliswa kwamandla okuzinzile. I-HDI icatshangwa uma ama-vias avamile esebenzisa isikhala esiningi kakhulu somzila noma engakwazi ukusekela iphethini yokuphunyuka ye-BGA.

• I-Microvias: isetshenziselwa ukuphunyuka kwe-BGA eningi kanye nezingxenye zokuxhumanisa ezinobuningi obukhulu uma kudingeka ngokwesakhiwo.
• Izindwangu ezingaboni futhi ezifihliwe: isetshenziswa lapho iziteshi zokuhambisa zidinga ukulondolozwa kuyo yonke imiklamo yezingqimba eziningi.
• Nge-in-pad: kubukezwe izakhiwo ezigcwalisiwe, ezinezivalo kanye nezihlelwe ngendlela ehlelekile ngaphansi kwamaphakheji acwebezelayo.
• I-lamination elandelanayo: kubukezwe lapho isakhiwo noma i-stackup ingenakwakhiwa ngomjikelezo owodwa we-lamination.
• Izingxenye zokushisa namandla: kubukezwe ibhalansi yethusi, ukuhlushwa kokushisa kanye nokuthembeka kokuhlanganiswa.

Ukuze uthole amakhasi ahlobene nekhono, buyekeza ukukhiqizwa kwe-HDI PCB , okungabonakali futhi okufihliwe ngokwenziwa kwe-PCB kanye nesiqondiso se-HDI sama-PCB ebhodi lebhodi leseva.

Ukuhlanganiswa kwe-PCB, Ukuhlolwa kanye Nokusekelwa Kokuhlola

Amaphrojekthi ehadiwe e-FPGA ne-AI asheshayo avame ukudinga ukuhlanganiswa kwe-PCB ngemva kokwenziwa. I-Highleap Electronics ingabuyekeza ububanzi be-PCBA kanye ne-PCB stackup ukuze ukukhetha izinto, ukuqeda kwendawo, inqubo ye-BGA, indlela yokuhlola kanye nezidingo zokuhlola kuqondaniswe ngaphambi kokukhiqiza.

Ukusekelwa komhlangano

• Ukuhlanganiswa kwe-SMT kwezingxenye ze-BGA, QFN, LGA, DFN, inkumbulo, iwashi, amandla kanye nesixhumi
• Ukubuyekezwa kokuhlanganiswa kwezixhumi ze-M.2, ibhodi nebhodi, i-Ethernet, i-USB-C, umphetho kanye ne-high-speed mezzanine
• I-stencil, i-solder paste, i-reflow kanye nokuhlela ukuhlolwa kwamaphakheji e-fine-pitch
• Ukuhlolwa kwe-X-ray kwe-BGA kanye nezingxenye eziqediwe phansi lapho kudingeka khona

Ukusekelwa kokuthola ulwazi kanye nokuhlolwa

• Ukubuyekezwa kwe-BOM kwezinombolo zezingxenye zomkhiqizi, izingxenye ezivunyiwe kanye nezingxenye ezingafanele zishintshwe
• Amamodeli e-turnkey engaphelele, i-turnkey egcwele noma izingxenye ezithunyelwe
• Ukusekelwa kokuhlela lapho kunikezwa amafayela nezinqubo ze-firmware
• Ukulungiselela ukuhlolwa okusebenzayo okusekelwe kuzilungiselelo zamakhasimende, isofthiwe, inqubo yokuhlola kanye nezindlela zokuphasa/ukwehluleka

Amakhasi esevisi afanele afaka ukuhlanganiswa kwe-BGA PCB , ukutholakala kwezingxenye ze-elekthronikhi , ukuhlolwa kokusebenza kwezinhlangano ze-PCB kanye nokuhlanganiswa kwe-turnkey PCB.

Usekelo Lokudluliselwa Kwabahlinzeki Bezakhiwo Ezikhona

Imibuzo eminingi yokukhiqiza i-Isola Agilex7 PCB ivela kumaphrojekthi akhona adinga umhlinzeki omusha we-PCB. Ukudluliselwa kungabangelwa ukutholakala kwezinto ezibonakalayo, izinkinga zokukhiqiza, isikhathi sokuhola, izikhala zokusekelwa kwe-PCBA, ingcindezi yentengo noma impendulo yobunjiniyela engaphelele evela kumhlinzeki wangaphambilini.

Ukudluliselwa komhlinzeki okuphumelelayo kufanele kulondoloze inhloso kagesi neyemishini evunyiwe yomklamo wokuqala ngenkathi kuhlonzwa izinkinga zokukhiqiza ngaphambi kokwakhiwa okulandelayo.

Uhlu Lokuhlola Amafayela e-RFQ

Ukuze ucaphune iphrojekthi yokukhiqiza ye-Isola Agilex7 PCB ngokunembile, thumela iphakheji ephelele yokukhiqiza lapho kungenzeka khona. Idatha ephelele isiza ukuqinisekisa indlela yezinto ezibonakalayo, ukusebenza kwenqubo, intengo, isikhathi sokuhola kanye nobubanzi be-PCBA.

• Amafayela okukhiqiza e-Gerber X2, ODB++ noma i-IPC-2581
• Umdwebo we-stackup one-callout yezinto ze-Isola noma uhlu lwezinto ezivunyiwe
• Ithebula le-Impedance elinezinhloso eziphelele kanye nezihlukile
• Ifayela lokubhoboza, ngezincazelo kanye nezidingo zokubhoboza emuva
• Amanothi okwenziwa aneklasi ye-IPC, ukuqeda ubuso, imaski yomshini wokudayisa, ngezimfuneko zokugcwalisa kanye nekhuphoni
• Uhlu olubalulekile lwe-net noma amanothi e-SI ezindlela ze-PCIe, SerDes, Ethernet, DDR, HBM, CXL, clock noma RF
• I-BOM, i-CPL kanye nomdwebo womhlangano uma kudingeka i-PCBA
• Amafayela okuhlela, inqubo yokuhlola, ulwazi lwe-fixture noma izidingo ze-FAI uma zitholakala
• Okulindelwe yisibonelo, inani lokuhlola kanye nobuningi bokukhiqiza
• Amanothi angaphambilini omhlinzeki noma amarekhodi okukhiqiza avunyiwe uma lokhu kuyiphrojekthi yokudlulisa

I-Highleap Electronics ingacaphuna ukwenziwa kwe-PCB, ukuhlanganiswa kwe-PCB, i-turnkey PCBA noma ukwesekwa kokudluliselwa kwabaphakeli ngemuva kokubuyekeza iphakheji yakho yokuklama.

Thumela i-Isola Agilex7 PCB Quote noma uxhumane ne-Highleap Electronics ukuze uthole i-stackup, ukutholakala kwezinto, i-impedance, i-HDI, i-BGA assembly noma isibuyekezo sokuhlolwa okusebenzayo.