Izinto ze-PCB Ezingenamthofu Zokuhlanganiswa kwe-PCB kanye Nokukhiqiza Okuthembekile kwe-PCBA
Ukukhethwa kwezinto ze-PCB ezingenalo i-lead kufanele kube yingxoxo yokuhlanganisa, hhayi nje kuphela ekucacisweni kwebhodi elingenalutho. Umbuzo osebenzayo uwukuthi ingabe i-laminate, ukuqeda kobuso, imaski yokwelula, ingxube yephakheji, kanye nenqubo yokugeleza kabusha kungasekela yini ukwakheka okuzinzile okungenalo i-lead ngaphandle kokudala izinkinga zokugoba, ukumanzisa, noma zokuhlola kamuva ekukhiqizweni.
I-Highleap Electronics ibuyekeza amabhodi angenawo umthofu njengamaphrojekthi aphelele e-PCBA. Sixhumanisa ukukhetha kwe-laminate ne- PCB engenawo umthofu , i-solder engenawo umthofu , ukwakheka kwe-stencil, ukuhlanganiswa kwe-SMT, kanye nokuhlolwa ukuze ibhodi likwazi ukuhamba kahle lisuka ekwakhiweni liye ekuhlanganisweni okuphindaphindwayo.
Lokho Okushiwo Ngempela Ukukhetha Izinto Ezingenalo Umthofu
Umgomo uwukuthembeka kokuhlanganiswa, hhayi ilebula emdwebweni
Imidwebo eminingi ikhuluma ngokuhambisana okungenalo i-lead ngaphandle kokucacisa ukuthi iyiphi inkinga okumele ixazululwe. Empeleni, ukubuyekezwa kwezinto ezibonakalayo kumayelana nokuthi ibhodi lingasinda yini emazingeni okushisa aphezulu okuphinda ligeleze, ligcine lithambile, lisekele ukuqeda kobuso obukhethiwe, futhi liphumelele ekuhlolweni ngemva kokuhlanganiswa.
Lokho kusho ukuthi ingxoxo ye-laminate kufanele ixhunywe kusethi yangempela yezingxenye kanye nomzila wenqubo. Ibhodi elakhiwe ngezingxenye ezincane ezingasebenzi kanye ne-SMT elula kungenzeka lingadingi isinqumo esifanayo sezinto ezibonakalayo njenge-BGA assembly exinene noma ibhodi lokulawula lezimboni elinezingqimba eziningi.
Izidingo ezingenalo i-lead zivame ukuvela endaweni yokuhlanganisa
Izimpawu eziqine kakhulu zivame ukuba yilezo ezisebenzayo: ukuvezwa okuphindaphindiwe kokugeleza kabusha, ukuzwela kwephakheji, ukukhathazeka nge-warpage, noma okulindelwe ukuhambisana nokuthunyelwa kwamanye amazwe. Ngakho-ke i-Highleap ikhetha ukubuyekeza ukukhethwa kwezinto kanye namafayela okuhlanganisa kunokuba kube yisihloko esingaxhunywanga ebhodini elingenalutho.
Indlela Ukucindezeleka Kokubuyela Emuva Okushintsha Ngayo Isinqumo Se-PCB
Iphrofayili yokugeleza kabusha ingadalula ubuthakathaka obungabonakali ekwakhiweni kuphela
Ukuhlanganiswa okungenalo umthofu kuvame ukuletha amazinga okushisa aphezulu enqubo kunokushiswa kwe-tin-lead, okungandisa ukucindezeleka ku-laminate, imigodi efakwe amapulangwe, imaski yokushiswa, kanye nezindawo ezinkulu zephakheji. Uma ibhodi lincane, lilinganiselwe kahle, noma ligcwele ama-thermal masses amakhulu, lokho kucindezeleka kuba kubaluleke kakhulu.
- Ukukhuthazela kokushisa kwe-laminate kanye nokuqina kobukhulu
- Ubukhulu bebhodi kanye nebhalansi yethusi
- Inani elilindelekile lemijikelezo yokuphinda ugeleze kanye nanoma yikuphi ukuvezwa kokuphinda usebenze
- Izingxenye ezinkulu noma izindawo ezicwilisa ukushisa ezishintsha ukuziphatha kokushisa kwendawo
Ngenxa yalesi sizathu, ukubuyekezwa kwebhodi elingenalo i-lead kufanele kufake phakathi izibikezelo zenqubo, hhayi nje isitatimende sokuthobela imithetho. Lapho kudingeka khona, i-Highleap ivumelanisa isincomo nokukhiqizwa kwe -High Tg FR4 PCB noma ezinye izindlela zezinto ezisekela kangcono umthwalo wokushisa.
Ukuthamba kwebhodi kuthinta isivuno isikhathi eside ngaphambi kokuba kuvele ukwehluleka kwensimu
Izinhlangano ezinezingxenye ezincane, ama-BGA, noma izixhumi ezinkulu zingalahlekelwa yinzuzo uma ibhodi linyakaza kakhulu ngesikhathi somjikelezo wokushisa. Kulezo zakhiwo, ukukhethwa kwezinto kanye nesakhiwo sebhodi kufanele kuphathwe njengezinqumo zenzuzo yokuhlanganisa, hhayi nje imininingwane yokukhiqiza.
Izinketho Zokuqeda Okungaphezulu Komhlangano Ongenalo I-Lead
Ukuphela kumele kuhambisane nenhlanganisela yephakheji kanye nohlelo lokugcina
Ukusebenza kokusonta okungenalo umthofu kuncike kakhulu ekuqedweni kwendawo ekhethiwe. I-ENIG, i-ENEPIG, i-OSP, isiliva lokucwilisa, ithini lokucwilisa, kanye ne-HASL engenalo umthofu ngayinye idala ukushintshana okuhlukile ngokuba yisicaba, isikhathi sokugcina, izindleko, kanye nokuvumelana kokuhlanganiswa.
| Qeda | Ukulingana okuvamile | Isexwayiso esivamile |
|---|---|---|
| I-ENIG / ENEPIG | Iphimbo elihle, i-BGA, ukwakheka kwenani eliphezulu | Ukulawulwa kwezindleko kanye nenqubo |
| OSP | I-SMT ezwela izindleko enesitoreji esilawulwayo | Isikhathi sokuphila kanye nokuzwela kokuphatha |
| I-HASL engenamthofu | Amabhodi lapho ukuthamba kungabalulekile khona | Imikhawulo ye-Planarity ye-fine pitch |
I-Highleap iqinisekisa ukuqeda uma kuqhathaniswa nengxube yephakheji kanye nokulindela isitoreji noma ukuthunyelwa ngaphambi kokuqedela umzila wokuhlanganisa.
Ukuhlanganiswa Kwephakheji, i-MSL, kanye Nokuhlela Ukuhlola
Ukuzwela kwengxenye kuvame ukuchaza iwindi lenqubo ephephile
Ukuhambisana okungenalo umthofu kuncike ku-BOM njengoba kunjalo nangebhodi. Amadivayisi azwela umswakama, ama-thermal pad amakhulu, ama-BGA, ama-QFN, izixhumi ezifanela ukucindezela, kanye nezinhlangano ezixubile zemigodi yonke iyashintsha indlela ibhodi okufanele lakhiwe futhi lihlolwe ngayo.
I-Highleap ibuyekeza ukuphathwa kwe-MSL, izidingo zokubhaka, isu le-stencil, ukumbozwa kwe-X-ray, kanye nanoma yikuphi ukulindela kokuhlolwa kokusebenza ngaphambi kokukhipha uhlelo lokuhlanganisa. Amaphrojekthi ahlobene avame ukufana nezinsizakalo zokuhlanganisa ze-PCB kanye nokwakhiwa kokulawula okuphezulu lapho ukuqeqeshwa kwenqubo kubaluleke kakhulu kunentengo yebhodi eluhlaza.
Ububanzi bokuhlola kufanele bufane nengozi yangempela yokuhlangana
Ukugeleza okulula kwe-AOI kuphela kunganele kwamanye amabhodi e-SMT, kodwa ukwakheka okungenalo i-lead eningi kakhulu ene-BGA noma amajoyinti afihliwe kungadinga i-X-ray noma ukuqinisekiswa okwengeziwe. Iphakheji yokuhlola efanele kufanele isethwe ngaphambi kwesilinganiso, hhayi ukungezwa ngemva kokuba ukusethwa komugqa sekuhleliwe kakade.
Lapho Ukwakhiwa Nokuhlanganiswa Kudingeka Kuqondaniswe Khona
Amanothi okukhiqiza kufanele asekele inqubo yokuhlanganisa
Amabhodi angenawo umthofu asebenza kangcono uma kukhethwa ukuqeda iphedi, incazelo yemaski yokusongelwa, ibhalansi yethusi, kanye nesu lephaneli kucatshangelwa ukuhlanganiswa. Uma amafayela ebhodi elingenalutho kanye namafayela okuhlanganiswa elungiselelwe ngokuzimela, i-Highleap ihlola ukungalingani ngaphambi kokukhishwa kokukhiqiza.
Lokhu kubaluleke kakhulu emabhodini anendlela yokuphuma ye-BGA, isikhala esincane, izindiza ezinkulu zethusi, noma i-SMT exubile kanye nokuqukethwe okuphuma emgodini. Kulezo zimo, ukukhetha izinto ezibonakalayo, ukukhetha kokuqeda, kanye nokuhlela ukuhlola kufanele kuhambisane kunokuba kube yizingxoxo ezihlukene zesigaba sokugcina.
Ukukhiqiza okuphindayo kudinga iwindi lenqubo ekhiyiwe
Uma ukuhlanganiswa okungenalo i-lead sekuqinisekisiwe, izinto zokwakha, ukuqeda, umndeni wokunamathisela, kanye nokuqagela kokuhlola kufanele kuqhutshwe phambili ngokucacile. Ngaphandle kwalokho i-oda elilandelayo lingavula kabusha imibuzo engagwenywa futhi lidale ukuguquguquka lapho ukwakhiwa kokuqala kwakuzinzile.
Okudingwa yi-Highleap ukuze uthole isilinganiso se-PCBA esingenalo i-Lead
Iphakheji ephelele ivumela impendulo yomhlangano enembe kakhudlwana
- I-Gerber noma i-ODB++, idatha yokubhoboza, kanye namanothi okukhiqiza
- Umdwebo we-BOM, ukukhetha nokubeka, kanye nokuhlanganisa
- Ukuqeda umphezulu kanye nanoma yiziphi izidingo zezinto ezivunyiwe
- Amanothi okuphatha akhethekile e-MSL noma izingxenye ezibucayi
- Ububanzi bokuhlola njenge-AOI, i-X-ray, noma ukuhlolwa kokusebenza
- Inani eliqondiwe, isikhathi sokuhola, kanye nokulindelwe kokuthobela imithetho
Lolo lwazi luvumela i-Highleap ukuthi ihlole ibhodi elingenalo i-lead njengohlelo lwe-PCBA lwangempela kunokuba kube yisethi yamadokhumenti angaphelele.
Imibuzo Evame Ukubuzwa
Ingabe yonke into eyakhiwe ngaphandle komthofu idinga izinto ze-High Tg?
Cha. Kuncike esakhiweni sebhodi, ingxube yephakheji, kanye nokuvezwa kwenqubo. Ezinye izinhlangano zisebenza kahle ezintweni ezijwayelekile, kanti ezinye zizuza ekuthuthukisweni kokushisa.
Ingabe i-ENIG ihlala iyisiphetho esihle kakhulu sokuhlanganiswa okungenalo i-lead?
Akunjalo ngaso sonke isikhathi. Kuyindlela enamandla yokwakha izinto eziningi ezincane, kodwa ukuqeda okuhle kuncike ekutheni zithambile, izindleko, isikhathi sokuphelelwa yisikhathi, kanye nokuhlanganiswa kwezingxenye.
Ingabe i-Highleap ingabuyekeza kokubili ibhodi elingenalutho kanye nephakheji yokuhlanganisa ndawonye?
Yebo. Leyo ngokuvamile yindlela engcono kakhulu yokugwema ukulahlekelwa yisivuno okubangelwa ukungezwani phakathi kokuqagela kokukhiqiza kanye nenqubo yangempela yokuhlanganisa.
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Ungasithola kanjani isilinganiso sama-PCB
Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:
-
- Gerber, ODB++, noma .pcb, spec.
- Uhlu lwe-BOM uma udinga ukuhlangana
- Ubuningi
- Isikhathi sokushintsha
Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.
