Ukukhiqizwa kwe-Nelco N7000-2 HT PCB kwamaphrojekthi e-High-Speed ​​​​Multilayer

I-Nelco N7000-2 HT PCB

Izingcaphuno ezimbili ezithi “Nelco N7000-2 HT” zingachaza amabhodi ahlukene. Ukutholakala kwe-core kanye ne-prepreg, okuqukethwe kwe-resin, iphrofayili yethusi, isikhala se-dielectric esiqediwe, umzila wokubhoboza, ukujula kwe-backdrill kanye nobufakazi bokuhlola kunquma ukuthi ukwakhiwa okucashuniwe kufanelana yini nemodeli yokulahlekelwa nokuthembeka kwekhasimende.

I-Highleap isondela ku-N7000-2 HT njengokwakhiwa okulawulwayo kwezingqimba eziningi kunokuba ilebula le-premium. Ishidi ledatha lamanje eliqondile kanye nokwakhiwa okutholakalayo kufanele kuqinisekiswe ngochungechunge lokuhlinzekwa kwezinto ezisetshenziswayo ku-quotation. Lapho ukutholakala kudinga okunye, ushintsho oluhlongozwayo kumele lubhalwe phansi, luhlelwe lapho kudingeka khona futhi luvunyelwe ngaphambi kokukhiqizwa.

Ububanzi bukagesiUkwakhiwa kwezinto, ithusi kanye nezidingo zesiteshi esilinganiswayo.
Ububanzi bemishiniInani lezingqimba, ukujiya, indlela yokubhoboza, ukubhaliswa kanye ne-warpage.
Ububanzi bobufakaziUkuvinjelwa, ikhuphoni lokulahlekelwa, ukususwa kwezicubu ezincane kanye nokulandeleka.

Ingabe i-Nelco N7000-2 HT iyinto efanele i-PCB yakho?

I-N7000-2 HT ibaluleke kakhulu lapho ibhodi lidinga inhlanganisela yokulahlekelwa okuphansi kokudlulisela, ikhono lokushisa eliphezulu kanye nokucutshungulwa okuqinile kwezingqimba eziningi. Amathuba ajwayelekile afaka imishini yenethiwekhi, ihadiwe yeseva nesitoreji, izinhlelo zokuhlola, izindiza noma i-elekthronikhi yezimboni, kanye namapulatifomu okulawula anezingqimba eziphakeme aneziteshi ezinde eziqondisiwe. Kungavela futhi kumasu ezinto ezihlanganisiwe lapho izingqimba zesignali ezikhethiwe kuphela ezidinga ukulahlekelwa okuphansi. Ngakho-ke isinqumo sezinto kufanele silandele isiteshi sangempela kanye nokwakhiwa, hhayi ilebula lomkhiqizo elibanzi njenge-“100G board,” “server PCB” noma “high-speed backplane.”

Umzila omfushane we-chip-to-chip kukhadi lendodakazi elincane ngezinye izikhathi ungahlala ngaphakathi komkhawulo wento etholakala kakhulu ye-Tg ephezulu. Ngokuphambene nalokho, izinga lomzila eliphakathi lingavumela i-N7000-2 HT uma umzila umude, ibhodi liqukethe izixhumi eziningana, ama-via anezicucu ezisele ezinengqondo, noma ibhodi eliqediwe lijiyile ngokwanele ukwandisa ingozi yokwenziwa. Yingakho i-Highleap ibukeza isithombe sokulahlekelwa okuphelele nokuthembeka kunokuqhathanisa inani elilodwa kuphela lesici sokusabalalisa.

Isimo sephrojekthi Kusho ukuthini ngokukhetha Ulwazi oludingekayo ngaphambi kokukhishwa
Imizila emifushane egibele kanye noshintsho olulodwa I-N7000-2 HT inganikeza inzuzo, kodwa ukwakhiwa okungabizi kakhulu nakho kunganele. Indlela ende kakhulu, izinga lomzila, i-margin yokwamukela kanye nezinye izindlela ezivunyelwe.
Imizila yamakhadi amade noma ye-backplane Ukulahlekelwa kwe-dielectric kanye nomqhubi osabalalisiwe kuba okubaluleke kakhulu. Inhloso yokufaka nokulahlekelwa, amamodeli esixhumi, iphrofayili yethusi kanye nokwabiwa kwesendlalelo.
I-PCB enezingqimba eziningi noma ebanzi Ukubhaliswa, ukugcwaliswa kwe-resin, ukubhoboza kanye nokuthembeka kwemigodi efakwe amapulangwe kumele kucatshangelwe ngokusebenza kwesignali. Inani lezingqimba, ukujiya okuqediwe, ubukhulu bokubhoboza, ukusatshalaliswa kwethusi kanye nomlando wokushisa.
Imijikelezo eminingi yokugeleza kabusha noma ukujikeleza kwe-field thermal Izakhiwo zezinto ezibonakalayo ziyasiza, kodwa i-geometry yemigodi kanye nezilawuli zokukhiqiza zihlala zibalulekile. Iphrofayili yokuhlanganisa, inani lokugeleza kabusha, ukulindela ukuphinda kusebenze kanye nesigaba sokuthembeka.
Uhlu lwezinto ezivunyiwe ezilawulwa ngamakhasimende Akukho okufanele kushintshwe ngoba nje enye i-laminate ibonakala ifana ngogesi. Izinga eliqondile, ukwakhiwa, izidingo zesitifiketi kanye nenqubo yokugunyazwa.

Kubathengi abaqhathanisa imindeni eminingana, indawo yokuqala esebenza kahle kakhulu ukubuyekezwa kokukhethwa kwezinto ze-PCB okusheshayo okuhlelekile . Lokho kuqhathanisa kufanele kusebenzise indlela yokuhlola efanayo, imvamisa, okuqukethwe kwe-resin kanye nesimo sethusi. Amanani ajwayelekile ashicilelwe avela kumashidi edatha ahlukene awashintshisani ngokuzenzakalelayo, futhi awazona iziqinisekiso zebhodi eliqediwe.

Kunini lapho ukuthuthukiswa kwezinto ezibonakalayo kungenzeka khona ukudala inani langempela?

Ukuthuthukiswa kudala inani lapho ukulahleka kwe-dielectric kumelela ingxenye ebalulekile yesiteshi nalapho umenzi angalondoloza ukwakhiwa okucatshangelwayo ekukhiqizweni. Uma isiteshi silawulwa ukuqaliswa kwesixhumi okungekuhle, i-open via stub, i-antipad enkulu kakhulu, ukuhlukaniswa kwendiza yokubhekisela noma indlela yokubuya engalawulwa, ukuya ku-laminate elahlekelwa kancane kungase kungatholi imajini eyanele. I-topology kufanele ilungiswe kuqala. Uma ibhodi lilawulwa ukuthembeka kwembobo edlulayo, ithimba lokuklama kufanele lihlole nesilinganiso sesici, usayizi wembobo oqediwe, ithusi elincane lebharele kanye nokuvezwa kwenhlangano kunokuthembela egameni lezinto njengesixazululo esijwayelekile.

Kufanele kucatshangelwe nini okunye okuqukethwe?

Uhlelo olungabizi kakhulu lwe-Tg olune-Tg lungafaneleka eziteshini ezimfushane kanye nasezingqimbeni eziningi ezivamile. Umndeni olahlekelwa kancane ungadingeka ukuze uthole i-backplane yesizukulwane esilandelayo eside ngemuva kokususwa kokulahlekelwa okungagwenywa. I-RF laminate ezinikele ingafaneleka kakhulu kuma-antenna noma izakhiwo ze-microwave. Ukuqhubeka kokunikezwa kunganquma nokukhetha okusebenzayo: uma ukwakhiwa okuqondile kwe-N7000-2 HT core noma prepreg kunesikhathi sokuhola esingafanele, i-Highleap ingaletha enye indlela ekhiqizwe ukuze kuvunyelwe amakhasimende ngokubhala, kodwa akufanele ishintshwe buthule.

Kusukela Ezidingweni Zesiteshi Kuya Ku-N7000-2 HT Stackup Engakhiqizwa

I-stackup iyibhuloho eliphakathi kokulingisa nokukhiqizwa kwefektri. Ukukhishwa okuwusizo kukhomba umndeni we-laminate oqondile, ukufanisa i-prepreg, ubukhulu be-dielectric obuqondiwe, isisindo sethusi kanye nephrofayili yethusi. Kuphinde kutshele umenzi ukuthi yiziphi izilinganiso eziyimingcele kagesi nokuthi yiziphi eziwukuphela kwamanani okuqala okulingisa. Ngaphandle kwalowo mehluko, isitolo sebhodi singahlangabezana nobukhulu obuphelele ngenkathi sihambisa isikhala se-dielectric ngendlela eshintsha i-impedance noma ukulahleka kwesiteshi.

I-Highleap ivame ukuqala ngezimfuneko zebhodi eliqediwe futhi isebenza emuva ngokusebenzisa izakhiwo zokucindezela ezitholakala esifundeni kanye nobuningi obudingekayo. Nge-PCB ye-N7000-2 HT eyenziwe ngokwezifiso, lokhu kubuyekezwa kuhlanganisa ubukhulu be-prepreg obucindezelwe, isidingo se-resin esizungeze ithusi, izitayela zeglasi, ukutholakala kwe-core, ukwelashwa kwethusi, i-lamination elandelanayo uma ikhona, ukujula kokubhoboza, ukufinyelela kwe-backdrill kanye nokusetshenziswa kwephaneli. Ukwakhiwa okuhlongozwayo bese kubuyiselwa ukuze kuvunyelwe amakhasimende ngaphambi kokuba idatha yokukhiqiza iqandiswe.

Yimaphi amanani e-dielectric afaneleka ku-solver yasensimini?

Sebenzisa amanani okuklama aqondene nokwakhiwa kwengqikithi yangempela noma i-prepreg, hhayi inombolo eyodwa yokumaketha ekopishwe eshadini lokuqhathanisa. Okuqukethwe kwe-resin, ukuqinisa ingilazi, imvamisa, umswakama, iphrofayili yethusi kanye nendlela yokuhlola kuthinta umphumela ophumelelayo. Ngakho-ke imodeli ye-impedance kufanele ixhunywe ekwakhiweni kokukhiqiza okuthile. I-Highleap ingabala ubukhulu bomkhondo obukhiqizwayo kusukela ku-stackup evunyiwe, kodwa umnikazi wesistimu uhlala enesibopho semodeli yesiteshi kanye nokuhambisana nephrothokholi.

Ithusi kufanele lichazwe kanjani?

Ithusi liyinguquko kagesi kanye neyokukhiqiza. Ithusi elinobukhulu obuphansi linganciphisa ukulahlekelwa umqhubi, ikakhulukazi njengoba i-spectrum yokusebenza iqhubekela phezulu, kodwa kumele itholakale ngobukhulu obudingekayo kanye nokwakhiwa. Ukwelashwa kwesendlalelo sangaphakathi nakho kuthinta ubuso bokugcina obubonwa yisignali. Umdwebo othi "ithusi elilodwa le-ounce" kuphela awuchazi ngokugcwele umkhondo oqediwe: i-base foil, i-plating, i-etch compensation kanye nokwelashwa kwendawo konke kuthinta i-geometry. Ngenxa yalesi sizathu, ikhotheshini kufanele ibonise ukuthi iphrofayili yethusi iyimpoqo, iyathandwa noma ivulekele isiphakamiso sobunjiniyela.

Lapho umkhawulo wobuqiniso besignali uqinile, iphrojekthi ingacacisa nendlela yokuhlola yokufakwa nokulahlekelwa evunyelwe noma ikhuphoni. Lapho ukuvimba kungukulawula okuyinhloko, sebenzisa ithebula lokulawula ukuvimba kwe-PCB elichazwe ngokucacile elinesendlalelo, i-geometry, izindiza zokubhekisela kanye nokubekezelelana. Gwema amanothi angacacile anjengokuthi “zonke izibhangqa ezihlukile ezingama-100 ohms” lapho kukhona ukwakheka kwezingqimba eziningana.

Kufanele kukhethwe ngendlela yokwakha ngaphambi kokuba izinto zisolwe

Ibhodi elinezingqimba eziphakeme lingadinga ama-via adlulayo, ama-via angaboni, ama-via agqitshwe, ukubhoboza ngemuva noma inhlanganisela. Ukukhetha okulungile kuncike ekuphumeni kwe-BGA, ukuguqulwa kwezingqimba, ukujiya okuqediwe, ububanzi bokubhoboza kanye nesibonelelo se-stub esisele. Ukubhoboza emuva kuyasiza kuphela uma i-stub esele, ukubekezelelana kokubhalisa kanye nokufinyelela kokubhoboza kulawulwa. Akuthuthukisi ngokuzenzakalelayo yonke isiteshi. Buyekeza ukwakhiwa kwangempela kokubhoboza emuva kanye nesidingo se-stub esisele ngaphambi kokuba itafula lokubhoboza likhishwe.

Indawo yokuhlola yokukhishwa: i-stackup kufanele isho izinto eziqondile noma imithetho elinganayo evunyiwe, ukwakheka okuyinhloko nokwangaphambi kokubhaliswa, uhlobo lwethusi, ukujiya kwebhodi eliqediwe, izendlalelo ze-impedance, isikhala esincane se-dielectric, ukujula kokubhoboza kanye nokubhoboza ngemuva, izidingo zekhuphoni kanye nokubuyekezwa kwesethi yedatha evunyiwe ngamakhasimende.
I-Nelco N7000-2 HT PCB stackup

Yini Eyenza Ibhodi Le-N7000-2 HT Elinezingqimba Eziphakeme Libe Nzima Ukulenza?

Izinto zokwakha zingasekela amabhodi adinga kakhulu, kodwa ingozi yokukhiqiza isaqhutshwa yi-geometry. Inani eliphezulu lezendlalelo landisa inani lezindawo zokubhalisa. Amabhodi aqediwe aqinile andisa ukucindezeleka kodonga lwemigodi futhi enza kube nzima kakhulu ukusika nokufaka i-plating. Ithusi eliqinile lidala umehluko wesidingo se-resin futhi lingaphazamisa ukugeleza. Amaphaneli amakhulu akhulisa isinxephezelo sobuciko kanye ne-warpage. Lokhu kusebenzisana kuchaza ukuthi kungani ikhotheshini ye-N7000-2 HT PCB enezendlalelo eziphezulu kungafanele isekelwe kuphela endaweni yesikwele kanye nenani lezendlalelo.

Ngesikhathi sokubuyekezwa kwe-CAM, i-Highleap ihlola amasongo azungezile, isikhala sokubhoboza-kuya-kwethusi, ama-antipads, izikhala ze-backdrill, ibhalansi yethusi, ukugcwaliswa kwe-resin nxazonke kwezikhala zendiza, ukubekezelelana kwe-rout, amakhuphoni e-impedance kanye nezidingo zephaneli yokuhlangana. Lapho umklamo unamandla kakhulu ukuze kube nomkhiqizo ozinzile, impendulo yobunjiniyela kufanele ibone ukungqubuzana okuthile futhi iphakamise ushintsho olulawulwayo—hhayi nje ukwenqaba iphrojekthi noma ithembise ukuthi ifektri “ingazama.”

Ukubopha nokubhalisa

Imijikelezo yokucindezela kumele inikeze ukuphulukiswa okuphelele kanye nokugeleza okwanele kwe-resin ngaphandle kokudala ukushintshashintsha kobukhulu ngokweqile. Izingqimba zangaphakathi zethusi ephezulu, ukuvuleka okukhulu kanye nobuningi bethusi obungalingani kungabangela indlala ye-resin yendawo noma ukungalingani kobukhulu. Izinhloso zokubhalisa kumele zibhekele ukunyakaza kwezinto, ukwakheka kobuciko kanye nokuzulazula kokubhoboza. Emikhiqizweni emikhulu noma ephezulu kakhulu, iphaneli yokuhlola ingaba yigugu kakhulu kunokuqaliswa kokukhiqiza okugcwele okusheshayo ngoba inikeza idatha yokulinganisa kanye nesinxephezelo sokucindezela.

Ukubhoboza, ukukhipha i-desmear kanye nokuthembeka kwemigodi ehlanganisiwe

Ukubhoboza ngomshini kudala ukushisa kanye ne-smear; isimo samathuluzi, inani lokushaya kanye nemingcele yokudla kumele ifane nokwakhiwa. I-Desmear kumele ihlanze udonga lwembobo ngaphandle kokulimaza ubuqotho be-resin-to-glass. I-copper plating kumele ifinyelele ubuncane bokudonsa kulo lonke ibhakede, kufaka phakathi imigodi enesilinganiso esiphezulu. I-laminate inciphisa ingozi kuphela uma le misebenzi ilawulwa. Abathengi abanezidingo zokujikeleza kokushisa ezidingayo kufanele bachaze ikhuphoni noma indlela yokufaneleka edingekayo kunokucela "i-PCB enokwethenjelwa okuphezulu" engacacile.

Kumaphrojekthi lapho ukubalwa kwezingqimba kanye nokusinda kwemigodi kubusa khona isinqumo, ingxoxo ebanzi yezinto ze-PCB ezibalwe ngezingqimba eziphezulu kanye nokuthembeka kungasiza ukuhlukanisa ingozi yezinto ezibonakalayo engozini yejiyometri.

Umhlangano uthinta isinqumo sebhodi elingenalutho

Ibhodi elingenalutho kamuva lingase libone ukugeleza kabusha kwe-SMT okunezinhlangothi ezimbili, ukusongelwa okukhethayo, ukufakwa kokufakwa kokucindezela, ukulungiswa ngesandla noma imijikelezo yokufaneleka ephindaphindwayo. Ngakho-ke i-Highleap ibuza ngenqubo yokuhlanganisa ngaphambi kokuqedela amanye ama-stackup. Uma kudingeka i-turnkey PCBA, ukwakheka kwe-stencil, ukulawulwa komswakama wezingxenye, amaphrofayili e-BGA, izinto zokusekela kanye nokuhlolwa kuhlelwa ne-PCB. Lokhu kuthembeke kakhulu kunokuphatha ukwenziwa nokuhlanganiswa njengemiyalelo engahlobene.

Ubufakazi bekhwalithi bungalinganiswa nephrojekthi: izitifiketi zezinto ezibonakalayo, amarekhodi e-stackup, imiphumela ye-impedance, ukuhlolwa kukagesi, idatha ye-microsection, ukuhlolwa kobukhulu kanye nemibhalo yesihloko sokuqala kungachazwa ezidingweni zokuthenga. Akuwona wonke ama-oda adinga yonke imibiko; iphakheji efanele incike engcupheni nasekusetshenzisweni kokugcina.
Cela isilinganiso sokuphathwa kokushisa kwe-PCB yerobhothi

Indlela i-Highleap Ebuyekeza Ngayo Futhi Izilinganiso Zephrojekthi ye-N7000-2 HT PCB

Impendulo esheshayo iqala ngedatha ephelele. I-Highleap ingacaphuna ama-prototypes, ukwakheka kwevolumu ephansi kanye nokukhiqizwa okuhleliwe, kodwa isikhathi sokuhola sezinto ezikhethekile kumele siqinisekiswe ngaphambi kokuba kwenziwe isithembiso sokujika ngokushesha. Iphakheji ewusizo kakhulu ifaka amafayela okukhiqiza, ukudweba, ukuqoqa, amafayela okubhoboza, izidingo ze-impedance, ubuningi, ifomethi yephaneli noma yokulethwa, i-BOM yokuhlanganisa kanye nedatha yokukhetha nokubeka lapho kudingeka khona i-PCBA.

Iphakheji ye-RFQ enconyiwe

  • Idatha yokwenziwa kwe-Gerber, i-ODB++ noma i-IPC-2581 kanye nomdwebo olawulwa ukubuyekezwa;
  • ukwakhiwa okuqondile kwe-N7000-2 HT noma imvume yokuphakamisa ukwakhiwa ukuze kuvunyelwe;
  • ukujiya okuqediwe, ithusi, ukuqeda kobuso, imaski yokubopha kanye nokubekezelelana kobukhulu;
  • ithebula le-impedance, izendlalelo zesiteshi ezibalulekile, izidingo zokulahlekelwa noma zekhuphoni;
  • ishadi lokubhoboza, ngohlobo, ukujula kokubhoboza emuva kanye nethagethi ye-residual-stub;
  • ubuningi beprototype kanye nokukhiqiza, ukulethwa okuqondiwe kanye nendlela yokupakisha;
  • I-BOM, i-centroid, umdwebo wokuhlanganisa, imiyalelo yokuhlola namafayela okuhlela i-turnkey PCBA.

Ngemva kokubuyekezwa kobuchwepheshe, ikhotheshini ingasho ukutholakala kwezinto, izindleko zamathuluzi noma zokuhlola, isikhathi sokuhola sokukhiqiza, ububanzi bokuhlanganisa kanye nemigomo yokuthumela. Izindlela zokukhokha kanye nemali kuqinisekiswa ngokwenani le-oda kanye ne-akhawunti yekhasimende. Ama-oda esibonelo ngokuvamile angahamba nge-express yamazwe ngamazwe; ukuthunyelwa okukhulu kokukhiqiza kungasebenzisa i-courier, i-air shipment noma enye indlela evunyelwene ngayo. Ukupakisha kukhethwa ukuvikela amabhodi aqediwe kanye nemikhiqizo ehlanganisiwe ngesikhathi sokuphathwa kokuthunyelwa kwamanye amazwe.

Ukusekelwa kuyaqhubeka ngemva kokuthunyelwa. Uma kubikwa inkinga yokwenziwa noma yokuhlanganiswa, irekhodi lendawo, idatha yokuhlola kanye namafayela avunyiwe kungabuyekezwa yithimba lobunjiniyela. Isenzo sokulungisa sincike ebufakazini obuvela ezinhlangothini zombili, kodwa amarekhodi ephrojekthi alandelekayo enza uphenyo lusheshe futhi lube usizo kakhulu kunesitatimende sewaranti esijwayelekile.

Ukuze ucele amanani, sebenzisa iphakheji ephelele yekhotheshini yokwenziwa kwe-PCB kanye nokuhlanganiswa . I-Highleap izobona idatha yobunjiniyela engekho ngaphambi kokuba i-oda likhishwe kunokuvumela izinto ezingacacile noma inothi le-stackup libe yiphutha lokukhiqiza.

Indlela ithimba lokuthenga elingaqhathanisa ngayo izingcaphuno ezimbili ze-N7000-2 HT

Amanani amabili afana kuphela uma echaza ukwakhiwa okufanayo kanye nobufakazi. Hlola ukuthi bobabili abahlinzeki bacaphune i-laminate eqondile kanye ne-prepreg efanayo, iphrofayili yethusi efanayo, isidingo esifanayo se-backdrill, ukubekezelelana okufanayo kwe-impedance kanye nephakheji efanayo yokuhlola. Ikhotheshini eyodwa ingase ibonakale iphansi ngoba ithatha ukujiya okuhlukile kwe-core, ithusi elijwayelekile, ikhuphoni yokungalahleki noma isigaba esibanzi sokufaka esikhundleni sezinto. Cela umhlinzeki ngamunye ukuthi abuyisele i-stackup ehlongozwayo futhi akhombe yonke into ecatshangelwayo ngaphambi kokukhetha umthombo.

Isikhathi sokulethwa kufanele futhi sihlukaniswe ngokuthengwa kwezinto, ukwenziwa kwe-PCB kanye nokuhlanganiswa. Umhlinzeki angakhangisa ukukhiqizwa kwe-PCB okusheshayo ngenkathi i-core noma i-prepreg edingekayo ingekho esitokweni. I-Highleap iqinisekisa ukutholakala kwezinto ngaphambi kokuthembisa isheduli. Lapho ikhasimende linesidingo esibikezelwe, ukubhukha izinto noma ukwakhiwa kwe-oda eliphindaphindwayo kunganciphisa ingozi yesikhathi esizayo sokulethwa.

Ama-oda aphindaphindwayo adinga ukuphathwa koshintsho okulawulwayo

Ibhodi lesivinini esikhulu elidlula ukuqinisekiswa kweprototype lingakhukhuleka uma i-oda elilandelayo lisebenzisa esinye isitayela sengilazi, iphrofayili yefoyili, ukujiya okucindezelwe noma isinxephezelo se-CAM. I-oda lokuthenga kufanele libhekisele ku-stackup evunyiwe kanye nokubuyekezwa kobuciko. I-Highleap iqopha ukwakhiwa okukhishwe futhi ithumela izinguquko zezinto noma zenqubo ukuze zivunyelwe uma zingathinta ukusebenza kukagesi noma kokuthembeka.

Ngezinhlelo zesikhathi eside, ikhasimende lingachaza inqubo elinganayo evunyiwe. Enye indlela ephakanyisiwe kufanele ifake phakathi umenzi, ibanga, ukwakhiwa, idatha yokuklama efanele, ithusi kanye nokubalwa kwe-impedance okubuyekeziwe. Kuye ngengozi, ushintsho lungadinga indawo encane yokufaneleka esikhundleni sokufaneleka kabusha kwesistimu egcwele. Le ndlela ivikela ukuqhubeka kokuhlinzekwa ngaphandle kokuphatha yonke i-laminate enesigaba sokumaketha esifanayo njengokufana.

Ukuhlanganiswa kwe-PCB kungadalula ubuthakathaka bebhodi elingenalutho

Amabhodi amakhulu eseva kanye nezokuxhumana angase athwale izixhumi ezisindayo, ama-BGA amakhulu, izingxenye zokulingana ngokucindezela kanye nama-heat sink. Iphaneli yokuhlanganisa kanye ne-fixture kufanele kusekele ibhodi ngesikhathi sokugeleza kabusha. Amandla okufaka okulingana ngokucindezela kufanele acatshangelwe eduze kwezimbobo ezifakwe ipulasitiki kanye nethusi lendawo. Uma iphrojekthi isebenzisa ukusonta okukhethiwe ngemuva kwe-SMT, umcimbi wokushisa owengeziwe ungowohlelo lokuthembeka.

Uma i-Highleap inikeza ukuhlanganiswa kwe-turnkey, onjiniyela bebhodi kanye ne-assembly babelana ngolwazi lwe-stackup, iphaneli, ingxenye kanye nokuhlolwa. Lokhu kuvumela ukunamathiswa kwe-solder, ukwesekwa kokugeleza kabusha, ukufakwa kwesixhumi, ukuhlolwa kwe-X-ray kanye nokuhlolwa kokusebenza ukuthi kuhlelwe ngaphambi kokuba kuqedwe ibhodi elingenalutho. Amakhasimende asebenzisa esinye i-assembler kufanele asanikeze umlando wokushisa olindelekile ukuze ikhotheshini yokwenziwa ibonise isimo sangempela sesevisi.

Kusho ukuthini ukuthi “isiqinisekiso sekhwalithi” kulo msebenzi

Ukuqinisekiswa kwekhwalithi kufanele kube uhlu olufushane lwezilawuli ezixhunywe engcupheni yokuhluleka. Nge-backplane ye-N7000-2 HT kungasho ukulandeleka kwezinto ezibonakalayo, ukuvinjelwa kanye namakhuphoni okulahlekelwa ukufakwa, ukuqinisekiswa kwe-residual-stub kanye nokulawula okunezimbobo zokuxhuma. Ngesilawuli sezimboni esijiyile kungasho ithusi elinodonga lwembobo, ukucindezeleka kokushisa kanye nokugoba/ukujika. Isitifiketi esijwayelekile esithi ibhodi liphumelele ukuhlolwa asithathi indawo yezindlela zokwamukelwa zephrojekthi ethile.

I-Highleap ingavumelana ngokugcinwa kwamarekhodi kanye nokubika ngaphambi kwe-oda. Lokhu kusiza abathengi abangochwepheshe ukugwema amadokhumenti angadingekile ngenkathi beqinisekisa ukuthi ubufakazi obudingekayo ukuze kuvunyelwe amakhasimende, uphenyo lwasensimini noma amafayela okulawula buyatholakala. Isimiso esifanayo siyasebenza ekusekelweni kwangemva kokuthengisa: ukwehluleka okubikiwe kuyaphenywa ngedatha ye-lot, i-stackup, inqubo kanye nokuhlanganiswa kunokuba kuphendulwe ngesitatimende esijwayelekile.

Inothi elibalulekile: izakhiwo kanye nokutholakala kumele kuqinisekiswe kusukela kudatha yakamuva elawulwayo ye-Nelco kanye nokwakhiwa okuqondile okucashunwe yi-core/prepreg yephrojekthi. Idatha evamile ayizona iziqinisekiso eziqediwe.

Izixazululo ze-Highleap PCB kanye ne-PCBA - cela ikhotheshini

Posts Kunconywe

Ungasithola kanjani isilinganiso sama-PCB

Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:

    • Gerber, ODB++, noma .pcb, spec.
    • Uhlu lwe-BOM uma udinga ukuhlangana
    • Ubuningi
    • Isikhathi sokushintsha
Ngokungeziwe ekwenziweni kwe-PCB, sinikeza uhla olubanzi lwezinsizakalo ze-elekthronikhi, okuhlanganisa i-PCB design, i-PCBA, nezixazululo ze-turnkey. Kungakhathaliseki ukuthi udinga usizo ngokwenza i-prototyping, ukuqinisekiswa kwedizayini, ukuthola ingxenye, noma ukukhiqizwa ngobuningi, sihlinzeka ngosekelo olusuka ekupheleni ukuze siqinisekise impumelelo yephrojekthi yakho.

Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.

    Sitshele Ngephrojekthi Yakho Ye-PCB

    Awekho amafayela okuklama okwamanje? Akunankinga. Yabelana ngalokho okwaziyo, futhi sizolandela uma kudingeka imininingwane eyengeziwe.



    Faka amafayela (ngokuzikhethela)

    Amafayela e-PCB, i-BOM, i-PDF/STEP, i-TXT, izithombe, i-ZIP/RAR/7Z · Isamba esiphezulu esingu-50 MB