Ukukhethwa Kwezinto Ze-PCB ze-PCIe 6.0 zama-Motherboards, ama-Risers kanye namakhadi e-Add-In

Ukukhethwa kwezinto ze-PCIe 6.0 kungokweplatifomu ephelele, hhayi ibhodi elilodwa elihlukanisiwe. I-PCI-SIG icacisa izinga ledatha elingavuthiwe elingu-64.0 GT/s eline-PAM4 signalling, i-FEC elula, i-CRC kanye ne-FLIT-based encoding. Ngakho-ke i-motherboard, i-riser kanye nekhadi lokwengeza kungadla izingxenye ezahlukene zesabelomali sikagesi ngisho noma zithengwa kubahlinzeki abahlukene.

I-Highleap iguqula i-topology evunyiwe ibe yizilawuli zezinga lebhodi: ukwabiwa kwezingqimba, iphrofayili yethusi, i-differential impedance, isakhiwo se-via kanye ne-backdrill, i-connector geometry kanye nobufakazi bekhuphoni. Ikhasi lokukhiqiza akufanele lithembise ukuhambisana nephrothokholi egameni le-laminate; kufanele libonise ukuthi idatha ye-PCB ne-PCBA ephindaphindwayo isekela kanjani umsebenzi wokuhambisana nekhasimende.

Umzila webhodi oqondileIkhwalithi yokuqhuma kanye nokuguquka kungase kunqobe.

Ibhodi lomama + i-AICWomabili amabhodi kanye nesixhumi esisemaphethelweni abelana ngesabelomali.

Ibhodi lomama + isiphakamisi + i-AICIzingxenye ezengeziwe zenza ukulawulwa kokulahlekelwa kanye ne-stub kube nzima kakhulu.

I-PCIe 6.0 Topology Inquma Isidingo Sezinto Ezibalulekile

I-PCIe 6.0 ingavela njengomzila omfushane phakathi kwamadivayisi ku-PCB eyodwa, uxhumano lwe-motherboard-to-add-in-card ngokusebenzisa isixhumi esinqenqemeni, indlela eqondiswa yi-riser, noma ipulatifomu yebhizinisi eyinkimbinkimbi kakhulu enezinguquko ezengeziwe. Izinto zebhodi zinegalelo ekulahlekelweni okusatshalaliswe; isixhumi ngasinye kanye nensimu edlulayo kunezela ukungaqhubeki. Imizila emifushane eqondile ingase ibuswe yi-package kanye ne-breakout geometry. Imizila emide yamabhodi amaningi inika ukulahlekelwa okwengeziwe ku-laminate kanye nethusi.

I-Topology	Izinkinga ze-PCB ezivelele	Indlela yokukhetha izinto
Ukuxhumeka okufushane kwedivayisi ebhodini	Ukuphunyuka kwe-BGA, ukuguquka kwezendlalelo, ukuqhubeka kokubhekisela kanye nokuxoxa kwendawo.	Lungiselela i-topology kuqala; ukwakheka okujwayelekile okunelahleko eliphansi kunganele.
Ikhadi lokufaka i-Motherboard kuya ku-add-in	Isixhumi somphetho, ama-vias e-host kanye nekhadi, ukwabiwa komzila kanye nobukhulu bekhadi.	Yenza imodeli yamabhodi kanye nesixhumi; ungakhethi ibhodi ngalinye ngokuzimela.
Ikhadi le-Motherboard kanye ne-riser kanye ne-add-in	Izixhumi eziningi, ubude obengeziwe be-PCB, ukugoba okuqongelelekile kanye nokulahlekelwa kokubuya.	Izinto ezilahlekelwa kancane kanye nokulawulwa okunamandla kwe-stub kuba amathuba amaningi.
Ukwakhiwa kwesakhiwo okubuyiselwe emuva noma okuhlukaniswe ngezigaba	Isabelomali sezingxenye, indawo, ubuqotho bamandla kanye nemizila yesivinini esikhulu yendawo.	Khetha izinto ngokwesigaba ngasinye sikagesi kunebanga eliphelele lesistimu.

Umakhi wesistimu kufanele anikeze incazelo yesigaba, ubude obukhulu bomzila, amamodeli okuxhuma kanye nethagethi yesiteshi. I-Highleap ibe isihlola ukuthi inani lezingqimba eziphakanyisiwe, ukujiya kanye necebo lokudlula lingakhiqizwa yini. Ipulatifomu ephelele ingasebenzisa izinto ezahlukene emabhodini ahlukene, uma nje ingxenye ngayinye ihlala ngaphakathi kwesabelo sayo futhi uchungechunge lokuhlinzeka lulawulwa.

Ingabe umzila omfushane we-PCIe 6.0 ungasebenzisa i-high-Tg FR-4?

Kungenzeka, kodwa impendulo incike kubude bomzila, ithusi, iphakheji, inani lezixhumi, ukulingana kanye nokubekezelelana. I-"High-Tg" iyisigaba sokushisa, hhayi isiqinisekiso sokulahlekelwa yisiteshi. Eminye imizila emifushane ingasebenza nomndeni we-FR-4 ofanele olahlekelwe phakathi noma olahlekelwe kancane; eminye imizila idinga ukwakhiwa kokulahlekelwa okuncane. Isinqumo singesokulinganisa kanye nokuhlanganiswa kweprototype, hhayi umthetho webhulogi ojwayelekile.

Ingabe ibhodi lomama kanye nekhadi lokwengeza kufanele kusebenzise izinto ezifanayo?

Akunjalo ngempela. Zingaba nobude obuhlukene bemizila, ukubalwa kwezingqimba, ukujiya kwebhodi, umthamo wokukhiqiza kanye nezinhloso zezindleko. Okubalulekile isiteshi esisuka ekugcineni siye ekugcineni. Ipulatifomu engabizi kakhulu ingagcina isakhiwo esisebenza kahle kakhulu sengxenye ende noma ezwela kakhulu ekulahlekelweni ngenkathi isebenzisa enye into evunyelwe kwenye indawo. Ukuguqulwa kwesixhumanisi kanye nendiza yokubhekisela kusadinga ukwenziwa kwemodeli ehlangene.

Ukukhethwa Kwezinto Ezisetshenziswayo ze-Motherboard, Riser kanye ne-Add-In Card

Ibhodi lomama livame ukuphatha umzila omude kakhulu noyinkimbinkimbi kakhulu, kodwa lingase libe nokuguquguquka okukhulu kwezingqimba. Ikhadi lokufaka kumele lihlangabezane nezidingo zobukhulu bomshini kanye nesixhumi esinqenqemeni. I-riser ingangeza izixhumi ezimbili kanye nenye ingxenye ye-PCB ngevolumu encane. Ngakho-ke ibhodi ngalinye lidinga i-stackup ehlangabezana nemikhawulo yalo yokukhiqiza yendawo kanye nesabelomali sesiteshi esabiwe.

Kubhodi lomama, umenzi wezinto ubuyekeza iphimbo le-BGA, ukuphuma, ukwabiwa kwezingqimba, ngokubala, usayizi webhodi, amasimu e-DIMM noma okuxhuma kanye nokulawula i-warp. Ukuze uthole ikhadi elingeziwe, ukunaka kushintshela eminweni enqenqemeni, i-bevel, ukujiya okuqediwe, ukuqaliswa kokuxhuma, ukulingana kwe-bracket kanye nokulayisha kwe-assembly. I-riser ingaba lula ngomshini kodwa ibize kakhulu ngogesi ngoba okuxhuma kwayo kanye nezimpawu zayo ezimfushane kwengeza ukungaqhubeki. Lokhu kungafani kufanele kuvele ku-RFQ.

Ukukhetha kwethusi nengilazi

Ithusi elinomfanekiso ophansi linganciphisa ukulahlekelwa yi-conductor, kuyilapho ukwakhiwa kwengilazi okufanele kungasiza ngokugoba kanye nokungaguquguquki kwe-impedance. Ukutholakala okuqondile kuncike ezintweni ezibonakalayo kanye nobukhulu. I-stackup kufanele isho ukuthi iphrofayili yethusi iyimpoqo yini. Umklamo kufanele futhi ucabangele i-routing angle kanye ne-pair geometry kunokulindela ukuthi izinto zizoxazulula yonke imiphumela yokweluka kwengilazi.

Inani lezingqimba akuyona i-metric yokusebenza

Ukwengeza izendlalelo kungenza kube lula ukuqhubeka kwezithenjwa futhi kunciphise ukuguquka, kodwa futhi kungandisa ukujiya kanye nobude be-stub. Inani lezendlalelo elifanele yilelo elisekela ukuphuma, ubuningi be-routing, ukusatshalaliswa kwamandla, izindiza zezithenjwa kanye nezinto ezikhiqizwayo ngezakhiwo. I-Highleap ingaphakamisa ukuhlelwa kwezendlalelo ngemuva kokubukeza i-BGA kanye nezindawo zokuxhuma; i-stackup ejwayelekile "yebhodi le-PCIe elinezendlalelo ezingu-16" ayidluliselwa phakathi kwemikhiqizo.

Ithimba lokuklama kufanele lisebenzise isu elicacile lokuqondisa ama-differential-pair ukuze kuhlukaniswe izikhala, izindiza zokubhekisela, ukuhlukanisa ama-pair kanye nokushintshashintsha. Ifektri ilawula i-geometry ekhishwe; ayikwazi ukulungisa i-pair ewela igebe lendiza elingafanele noma eshintsha izinkomba ngaphandle kokuhlela indlela yokubuyela emuva.

Nge-Stubs, Izixhumi kanye ne-BGA Escape Kungabusa Isiteshi

Ukukhethwa kwezinto ezibonakalayo kuthola ukunakwa ngoba kulula ukukubeka emdwebeni, kodwa izinkinga ezinkulu kakhulu ezingagwenywa zivame ukuba yi-geometric. I-stub edlulayo ingazwakala. Ukuqaliswa kwesixhumi kungadala amandla amaningi noma i-inductance. Ukuqhuma kwe-BGA kungaphoqa ukuguquka okukhulu kwentamo kanye nendiza. I-resin ephansi ye-Df ayikwazi ukusula lokhu kungazinzi.

Kunini lapho kudingeka khona ukubhoboza emuva kwe-PCIe 6.0?

Ukubhoboza emuva kuyafaneleka lapho ubude obungasetshenziswanga obufakwe i-plated-via busongela isiteshi futhi lapho i-stub eseleyo efiselekayo ingakhiqizwa. Umklamo kufanele uchaze izendlalelo ezixhunyiwe, uhlangothi lokubhoboza, ububanzi be-backdrill, ukujula okuqondiwe kanye nokugcinwa ngaphandle. I-Highleap ibuyekeza ukubekezelela i-stub eseleyo ngokumelene nokubhaliswa kanye nekhono lokubhoboza. Kwamanye ama-stackup, ama-vias angaboni noma isabelo sesendlalelo esihlukile singasebenza kangcono.

Buyekeza inqubo eningiliziwe yokudonsa emuva kwe-PCB ngaphambi kokucacisa inani elincane kakhulu elisele. Indlela yokwamukela—ukususwa okuncane, i-X-ray noma olunye ulawulo oluvunyelwene ngalo—kufanele lufakwe ku-oda.

Ubunikazi bokuqalisa isixhumi

Umthengisi wesixhumi anganikeza indawo yokubhekisela, kodwa ukuqaliswa kokugcina kuncike ekujiyeni kwebhodi, i-pad geometry, i-antipad, ama-return vias kanye nezendlalelo zokubhekisela. Ukuqaliswa kwekhadi le-host kanye ne-add-in kufanele kwenziwe njengesibonelo njengengxenye yendlela efanayo. I-Highleap ingalawula ukubhoboza, i-pad, i-antipad kanye nokubhaliswa kwezendlalelo; umklami wesistimu kufanele avume i-geometry kagesi.

Ukuqhekeka nokuhlanganiswa kwe-BGA

Amadivayisi acwebezelayo angadinga i-via-in-pad, i-via egcwele, i-via evalwe nge-cap noma i-microvias ezingaboni. Lezo zinqumo zithinta izindleko zebhodi elingenalutho kanye nokuhlanganiswa kwe-BGA. Uma i-Highleap ihlanganisa ibhodi, amaqembu okukhiqiza kanye ne-stencil angahlela ukuqeda i-pad, i-coplanarity, ivolumu ye-solder, ukuhlolwa kwe-X-ray kanye nokufinyelela kabusha. Izidingo ezijwayelekile zokuhlanganiswa kwe-BGA PCB kufanele zifakwe kusenesikhathi, ikakhulukazi kumaphakheji amakhulu namabhodi amakhulu anezingqimba eziphakeme.

Izilawuli Zokukhiqiza Ezivikela Umkhawulo we-PCIe 6.0

Umdwebo wokukhiqiza kufanele uhumushe imodeli yesiteshi ibe izinto ezilawulwayo. Lokhu kungafaka phakathi izinto eziqondile kanye nethusi, ukujiya kwe-dielectric, i-differential kanye ne-single-end impedance, i-trace geometry eqediwe lapho imininingwane ebalulekile, nge-via kanye ne-backdrill, ubukhulu bomphetho-isixhumi, umnsalo kanye nokusonta, kanye nezidingo zekhuphoni. Inothi elithi “PCB ehambisana ne-PCIe 6.0” akuyona incazelo yokwenziwa elinganiswayo.

I-Highleap isebenzisa i-CAM kanye nokubuyekezwa kwe-stackup ukuqinisekisa ukugcwaliswa kwe-resin, ibhalansi yethusi, isikhala sokubhoboza-kuya-kwethusi, izakhiwo ze-impedance, ukukala kwephaneli kanye namakhuphoni okuhlola. Ifektri ibe isiqopha ukwakhiwa okuvunyiwe ukuze kulandelwe ama-oda aphindaphindwayo. Uma i-core, i-prepreg noma i-copper foil ingatholakali, ushintsho kufanele luthunyelwe kanye nokubalwa kwe-stackup kanye ne-impedance okubuyekeziwe kunokwenziwa ngaphansi kwesigatshana esibanzi sezinto ezilinganayo.

Ukubekezelelana kwe-Impedance kanye nokuhambisana kwekhuphoni

Ithebula le-impedance kufanele libonise ungqimba, uhlobo lokulandelela, ithagethi, ukubekezelelana kanye nesidingo sokuhlola. Amakhuphoni kudingeka amele ukwakhiwa komkhiqizo. Ikhasimende kufanele lisho ukuthi ukwamukelwa kusekelwe ku-TDR yekhuphoni, ukulinganiswa komkhiqizo noma kokubili. Buyekeza ukulawulwa kwe-impedance kuma-PCB anesivinini esikhulu ukuze ugweme ukubiza okungacacile.

Ukulawula okugobile nobubanzi bomugqa

Ukuchezuka okuhlukile kungabangelwa ukungalingani komzila, ukuluka kwengilazi kanye nokushintsha okungalingani. Umenzi ulawula isinxephezelo sobuciko, ukuqopha kanye nokwakhiwa; umklami ulawula i-geometry yomzila kanye nobude be-pair. Ukufaniswa kobude obubalulekile akufanele kushiywe emithethweni ezenzakalelayo ngaphandle kokucabangela izifunda ezingahlanganisiwe kanye nezinkambu zephini yokuxhuma.

Umlando wokushisa womhlangano

Ikhadi le-motherboard le-PCIe noma i-accelerator lingase lithwale amadivayisi amakhulu e-BGA kanye nezixhumi ezisindayo. Imijikelezo eminingi yokugeleza kabusha, ukugoqa okukhethayo noma ukuphinda kusebenze kabusha kungenza ibhodi licindezeleke. Ukukhethwa kwezinto kufanele kufake ukuthembeka kokushisa, hhayi ukulahlekelwa kuphela. Izinto zokuhlanganisa kanye nokusekelwa kokugeleza kabusha kungadingeka futhi ukulawula i-warpage.

Cela isilinganiso sokuphathwa kokushisa kwe-PCB yerobhothi

Ukubuyekezwa kanye Nesilinganiso Sobunjiniyela be-PCIe 6.0 PCB

I-Highleap inganikeza ukwenziwa kweprototype, i-PCBA ephansi kanye nokusekelwa kokukhiqiza, kodwa ikhotheshini kumele isekelwe engxenyeni yangempela yebhodi. Faka umdwebo wesiteshi se-PCIe noma isifinyezo somzila esifanele, noma ngabe imodeli ephelele yesistimu iyimfihlo. Ifektri idinga ulwazi olwanele ukuhlukanisa umzila obalulekile kusuka kumzila ojwayelekile wokuhlukanisa.

Idatha ye-RFQ yebhodi le-PCIe 6.0

I-Gerber/ODB++, umdwebo wokwenziwa, ukubhoboza kanye nedatha yokubhoboza ngemuva;
izinto ezivunyiwe noma imvume yokuphakamisa isakhiwo esilinganayo;
i-stackup, iphrofayili yethusi, ithebula le-impedance kanye nezendlalelo zomzila ezibalulekile;
ubude bomzila obuphezulu, inani lokuxhuma kanye nesifinyezo sokushintsha;
ikhuphoni, ipharamitha ye-S, i-microsection noma izidingo zokwamukelwa kobukhulu;
I-BOM, i-centroid, umdwebo wokuhlanganisa, uhlelo kanye nohlelo lokuhlola ukusebenza;
inani le-prototype, isibikezelo sokukhiqiza, indawo yokulethwa kanye nezidingo zokupakisha.

Ngemva kokubuyekezwa, ikhotheshini ingaqinisekisa ukutholakala kwezinto, isikhathi sokukhiqizwa, ukuhlolwa, ukuhlanganiswa, ukukhokha kanye nezinketho zokuthumela. Izinsuku zokushintsha okusheshayo zinikezwa kuphela ngemva kokuhlolwa kwe-laminate ekhethekile, ithusi kanye nezingxenye. Ama-oda e-prototype angathunyelwa nge-international express, kuyilapho ama-oda evolumu angasebenzisa amalungiselelo okuthutha avunyelwene ngawo. Ukulandelelwa kwelothi kusekela ukubuyekezwa kobunjiniyela ngemuva kokulethwa kanye nesenzo sokulungisa.

Ukuze uthole ingxoxo ebanzi yokukhiqiza, bheka ukukhiqizwa kwe-PCB okusheshayo . Isimangalo sezinga lekhasi kufanele sihlale sinembile: I-Highleap ikhiqiza amabhodi ngokwe-stackup evunyelwe amakhasimende kanye nezindlela zokwamukelwa ezilinganiswayo; ukuhambisana kokugcina kwe-PCIe kuncike ku-silicon ephelele, iphakheji, isixhumi, ibhodi, i-firmware kanye nokuqaliswa kwesistimu.

Abantu abasebenzisa isikhathi sabo kabusha bashintsha umbuzo obalulekile, hhayi isidingo sokuzithiba

I-retimer ingahlukanisa indlela ende ibe izingxenye zikagesi ezimfushane, inciphise ukufinyelela okudingekayo kusuka esigabeni ngasinye. Iphinde ingeze amaphakheji, amandla, amawashi kanye nomzila wendawo. Ngakho-ke izinto zingakhethwa ngesigaba, kodwa i-retimer ayikuvumeli ukunganaki ukuqaliswa kwesixhumi noma ngama-stubs. Ukubekwa kwayo kufanele kufakwe ekubuyekezweni kwe-stackup kanye nokuhlanganiswa.

Ngokuthenga, amapulatifomu abuyiselwe isikhathi angaba nokubuyekezwa okuhlukile kwebhodi kanye nezingozi ze-BOM. I-Highleap ingacaphuna ibhodi elingenalutho kanye nokuhlanganiswa ndawonye ukuze ukwakheka kwesivinini esikhulu, ukulethwa kwamandla, ihadiwe yokushisa kanye nesikhathi sokuhola kwengxenye kucatshangelwe ohlelweni olulodwa.

Ubukhulu besixhumi somphetho bungobomshini kanye nogesi

Amakhadi okufaka adinga ukujiya okuqediwe okulawulwayo, i-bevel, ukuqeda kokuthintana, ukufaka ukhiye kanye nohlaka. Lezo zinto zithinta ukufakwa nokusebenza kwesixhumi. Ukuqaliswa kusukela kokuthintana kuya kumzila wangaphakathi kumele kufane nendawo evunyelwe kanye ne-stackup. Ngakho-ke ushintsho lwezinto ezibonakalayo olushintsha ukujiya kwekhadi noma i-trace geometry lungathinta kokubili ukulingana kanye nempendulo yesiteshi.

I-Highleap ihlola izidingo ze-gold-finger, bevel kanye nobukhulu ngesikhathi sokubuyekezwa kwe-CAM. Ikhasimende kufanele linikeze imininingwane efanele yekhadi kanye nanoma yimiphi imikhawulo yezinyawo zesixhumi nomthengisi. Uma kuhlanganiswa i-bracket noma i-stiffener, ukubekezelelana kwayo kanye nomthwalo kufanele kufakwe.

Ukuvunyelwa kwesibonelo kufanele kufake zonke izingxenye zebhodi

Ukuhlola ikhuphoni lebhodi lomama akufakazeli ukuthi ikhadi le-riser nelokwengeza lisebenzisa ukwakheka okufanayo. Ingxenye ngayinye ebalulekile kufanele ibe ne-impedance emele futhi, lapho kudingeka, ubufakazi bokulahlekelwa. Ukuhlolwa kwesistimu kufanele kusebenzise izixhumi nezintambo ezihlosiwe. Uma abahlinzeki abahlukene benza izingxenye ezahlukene, ukuhlelwa okwabiwe kanye nokuqagela kokuqalisa kuba kubaluleke kakhulu.

I-Highleap ingakhiqiza izinhlobo eziningana zamabhodi ahlobene ngaphansi kwephrojekthi eyodwa futhi igcine amarekhodi ahlukene ezinto ezibonakalayo kanye nokuhlolwa. Lokhu kungenza kube lula ukuhlangana ngoba izinguquko esigabeni esisodwa zihlala zibonakala kunokuba zifihlwe ngemuva kweziteshi zokuthenga ezihlukene.

Ikhwalithi yokuhlanganisa ithinta ukulungisa amaphutha okuhambisana nomthetho

Amaphakheji amakhulu e-BGA angaba nezimbobo, ukuvuleka noma ukugoba okubonakala njengamaphutha esistimu ngezikhathi ezithile. Izixhumi zingaphazamiseka noma zonakaliswe ngesikhathi sokucindezela. Izinsalela zokuhlanza zingathinta amasekethe okusekela ane-impedance ephezulu. I-Highleap ingafaka i-X-ray, i-AOI, ukuhlolwa kwesihloko sokuqala kanye nokuhlolwa kokusebenza, kodwa umthengi kufanele achaze ukuthi yibuphi ubufakazi obudingekayo.

Uma ipulatifomu yehluleka ukuhambisana nomthetho, idatha yokuhlanganiswa egciniwe kanye nedatha yebhodi elingenalutho kusiza ukuhlukanisa i-geometry yesiteshi nezinkinga zokusonta noma zezingxenye. Lokhu kunciphisa isilingo sokushintsha izinto ngaphambi kokuthola imbangela yangempela.

Ukuthenga okulula akufanele kunciphise ukulawula ushintsho

I-Highleap isekela amalungiselelo okukhokha nokuthumela kwamanye amazwe, ukuthola izingxenye kanye nama-oda aphindaphindwayo. Ukulula akusho ukuthi kuzofakwa ezinye izinto endaweni yazo. Izinto, izixhumi kanye nezingxenye ezibalulekile zishintshwa kuphela ngaphansi kwenqubo yokuvunyelwa okuvunyelwene ngayo. Ikhotheshini ingakhomba izinto ezinikezwe amakhasimende, ezithunyelwe kanye nezinto ezivela efektri ukuze ubunikazi bucace.

Ngemva kokulethwa, indawo elandelekayo kanye namarekhodi okuhlolwa asekela ukubuyekezwa kobunjiniyela. Inqubo yobungcweti yangemva kokuthengisa iqala ngedatha evunyiwe, izimpawu ezibonwe kanye nenani elithintekile, bese inquma ukuvimbela kanye nesinyathelo sokulungisa.

Ubuqotho bamandla kanye nehadiwe yokushisa kungavimbela ukuqoqwa kwesignali

Ukwabiwa kwezingqimba zesivinini esikhulu akwenzeki ngokwakodwa. Amadivayisi e-PCIe 6.0, ama-retimer kanye nama-switch adinga ukulethwa kwamandla, ukuhlukanisa kanye nokusekelwa kokushisa. Ukwengeza izindiza zokubhekisela ukuze kube nobuqotho besiginali kungandisa inani lezingqimba; ukwengeza i-hardware yethusi esindayo noma ye-heatsink kungathinta ukujiya kanye ne-warpage. Ukubuyekezwa kwe-stackup kufanele kufake kokubili izidingo zesiginali kanye namandla.

I-Highleap ingabuyekeza ibhalansi yethusi, isikhala sendiza yamandla kanye nehadiwe yokuhlanganisa, kodwa ikhasimende kufanele linikeze imikhawulo yamanje, yokushisa neyemishini. I-stackup yesignali kuphela engakwazi ukusekela izingxenye zokugcina ayilungele ukukhiqizwa.

Izinzuzo zokulungisa ukuhambisana nomthetho ezivela ebhodini legolide elilawulwayo

Ngemva kokuba isihloko sokuqala siphumelele ukuhlolwa kwebhodi okuvunyelwene ngakho kanye nohlelo, gcina i-stackup yayo, ulwazi lwe-lot yezinto ezibonakalayo, idatha yekhuphoni elinganisiwe kanye nerekhodi lomhlangano njengesisekelo. I-lot yakamuva ingaqhathaniswa nalokhu kulungiselelwa kwegolide. Uma umkhawulo wokuhambisana ushintsha, uphenyo lunganquma ukuthi ibhodi, izingxenye, isixhumi noma i-firmware ishintshile yini.

I-Highleap ingagcina idatha yokukhiqiza evunyiwe futhi ikhiqize kabusha ukwakhiwa okukhishwe kuye ngokutholakala kwezinto. Ikhasimende kufanele ligcine imiphumela yokuhlolwa kwesistimu kanye nokucushwa kwemishini. Ndawonye, la marekhodi enza ubunjiniyela bangemva kokuthengisa busebenze kangcono.

Inothi lezindinganiso: I-PCI Express 6.0 isebenzisa isignali ye-PAM4 engu-64 GT/s enemodi ye-FEC ne-FLIT. Izidingo zokuthobela imithetho ezinemininingwane zihlala zilawulwa yizincazelo ze-PCI-SIG kanye namadokhumenti epulatifomu yekhasimende.

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- Gerber, ODB++, noma .pcb, spec.
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- Ubuningi
- Isikhathi sokushintsha

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