Umhlahlandlela Wenqubo Yokuhlanganisa I-PCB Namathisela Nge-Pin In Namathisela

Kugcine ukubuyekezwa: Meyi 2026 · Umhlahlandlela wenqubo kanye nomklamo wokugeleza kabusha kokunamathisela emgodini kwamabhodi obuchwepheshe obuxubile

Phina ku-Namathisela (i-PiP) - ebizwa nangokuthi ukunamathisela emgodini (PIH), ukugeleza kabusha kwembobo, noma ukugeleza kabusha okuphazamisayo — is a way to solder through-hole components in the same reflow oven that solders the surface-mount parts. Instead of running a separate wave-soldering or hand-soldering operation for the few leaded connectors and headers on a board, the assembler prints solder paste directly into the plated through-holes, inserts the component leads into that paste, and reflows everything together. Done correctly it removes an entire process step from a mixed-technology board, but it only works when the holes, the stencil, and the components are designed for it. This guide explains the mechanics, the paste-volume math, the design rules, and where PiP beats — and where it loses to — wave and i-solder ekhethiwe.

Kuyini i-Pin in Paste (PiP) PCB Assembly?

Amabhodi amaningi namuhla alawulwa amadivayisi okufaka izinto ezingaphandle, kodwa asaphethe izingxenye ezimbalwa ze-through-hole (THT) — izixhumi zamandla, ama-header ebhodi kuya ebhodini, ama-capacitor amakhulu e-electrolytic, ama-relay, ama-jack e-RJ45, ama-jack e-DC barrel — adinga amandla omshini womlenze ebhodini. Ngokwesiko lezo zingxenye ezine-lead zihlanganiswa ngokwehlukana: ngokugoqa amagagasi, ngomshini ogoqayo, noma ngesandla. Ngayinye inqubo yesibili enokusetha kwayo, izindleko, kanye nokuvezwa kokushisa.

I-Pin in Paste igoqa leyo nqubo yesibili ibuyele kweyokuqala. Izimbobo ezifakwe ipulasitiki zigcwele i-solder paste ngesikhathi esifanayo sokunyathelisa nge-stencil esinamathisela ama-SMT pads, ingxenye enomthofu ibekwa ukuze izikhonkwane zayo zihlale ngaphakathi kwezibhakede ezigcwele i-paste, futhi lapho ibhodi lidlula kuhhavini ophinda ugeleze i-paste emigodini iyancibilika eceleni kwe-paste ngaphansi kwezingxenye ze-chip, idlule emgqonyeni ukuze yakhe i-fillet efanele kuzo zombili izinhlangothi. Ukunyathelisa okukodwa, indawo eyodwa, ukugeleza okukodwa.

Kungani Usebenzisa I-Pin in Paste Esikhundleni Sokusebenzisa I-Wave Soldering?

Isisusa cishe njalo siwukususa isinyathelo. Ebhodini elingu-95% SMT elinezixhumi ezintathu noma ezine ezinembobo, ukugoqa amagagasi kuphoqa lonke iphaneli ukuthi lidlule kugagasi elincibilikisiwe ukuze nje lenze amalunga ayishumi nambili — umshini owengeziwe, iphalethi lokuvala uhlangothi lwe-SMT, ukugeleza okwengeziwe nokuhlanza, kanye nomjikelezo wesibili wokushisa wezingxenye esezivele ziphinde zageleza kanye.

Ukukhetha i-PiP esikhundleni salokho kuletha izinzuzo eziningana eziqondile:

• Inqubo eyodwa yokushisa. Ibhodi libona iphrofayili eyodwa yokugeleza kabusha esikhundleni sokugeleza kabusha kanye negagasi, kunciphisa ukucindezeleka kokushisa ezingxenyeni ze-SMT ezizwela ukushisa futhi kwenza kube lula ukucubungula okungenalo i-lead.
• Isikhala sabasebenzi abaphansi kanye nephansi. Akukho magagasi ahlukene noma umshini okhethiwe emgqeni, akukho siteshi sokuncibilikisa ngesandla, bambalwa opharetha abathinta ibhodi.
• Amalunga aqinile, alinganisekayo. Umthamo we-solder usethwa yi-stencil aperture, ngakho-ke i-joint ngayinye ithola inani eliphindaphindwayo le-paste kunomphumela oxhomeke esandleni, ngaphandle kokubopha amagagasi noma ama-icicle phansi.

Umehluko ukuthi i-PiP ayithetheleli ngomthamo wokunamathisela kanye nokubekezelela ukushisa kwezingxenye. Uma lezo zinto ezimbili zingaklanywanga, amalunga ayafa noma isixhumi siyancibilika - okuyikho konke okunye kwalesi siqondisi.

Inqubo Yokunamathisela Ngephini, Isinyathelo Ngesinyathelo

Umugqa ojwayelekile we-Pin in Paste ubukeka ufana kakhulu nomugqa ojwayelekile we-SMT, lapho ukufakwa kwembobo kungeziwe ngaphambi kokugeleza kabusha kunokuba kwenziwe ngemva kwalokho. Isinyathelo esisha ngempela ukufakwa; isinyathelo esisodwa kuphela esidinga ubunjiniyela obukhethekile ukuphrinta.

1. Ukuphrinta kwe-stencil — i-paste iphrintwa kuma-SMT pads bese iphoqelelwa ezimbotsheni ezifakwe amapulangwe ngokusebenzisa izikhala ezikhulisiwe (eziphrintiwe kakhulu) noma ezinezitebhisi. Ukulawula ukhiye: ukwakheka kwembobo kanye nobukhulu be-stencil, lapho ivolumu yokunamathisela inqotshwa noma ilahleka khona.
2. Ukubekwa kwe-SMT — umshini wokukhetha nokubeka ugcwalisa zonke izingxenye zokufaka phezulu njengenjwayelo.
3. Ukufakwa kwe-THT — izingxenye ezifakwe i-lead zifakwa ukuze izikhonkwane zazo zihlale emigodini egcwele unamathisela, ngesandla, ngomshini wokubeka, noma nge-insertion fixture. Ukulawula ukhiye: izikhonkwane kumele zifinyelele ku-paste ngaphandle kokuyigcoba ezindongeni zebhareli.
4. Qeda — yonke inhlangano idlula kuhhavini; ama-SMT kanye namajoyinti angena embobeni akhiwa kuphrofayili efanayo. Ukulawula ukhiye: iphrofayili kumele ifudumale ngokuphelele izingxenye ezimbobo ezishisa kakhulu ngaphandle kokupheka izingxenye ze-SMT.
5. Ukuhlolwa — I-AOI ihlola amalunga e-SMT; ama-fillet anezimbobo ahlolwa ngokubonakalayo noma, lapho imiphongolo ibalulekile khona, nge-X-ray ukuze kutholakale ukwakheka kwe-fillet ephezulu/engezansi kanye nokugcwaliswa kwemiphongolo.

Inkinga Yevolumu Yokunamathisela I-Solder ku-PiP (kanye Nokulungiswa)

Nansi inkinga ephakathi. Ibhodlela elinomgodi odlulayo liyivolumu enkulu kakhulu okumele igcwaliswe, kushiywe ifillet ezinhlangothini zombili zebhodi, kodwa i-stencil evamile iphrinta kuphela ungqimba oluyisicaba oluncane (ngokuvamile oluyi-0.10–0.15 mm ubukhulu). Sika imbobo enobukhulu bephedi bese iningi laleyo nhlanganisela liwela ngqo phansi kwebhodlela; uma i-flux isha lapho iphinda igeleza, akusekho nsimbi eyanele yokugcwalisa imbobo, futhi ijoyinti liphuma lilambile ngaphandle kwefillet engezansi.

Abahlanganisi bavala leso sikhala ngezindlela ezintathu eziyinhloko, ngokuvamile ezihlanganisiwe:

Ukuphrinta ngokweqile

Imbobo ye-stencil yenziwa ibe nkulu kune-annular pad ngakho-ke i-paste eyengeziwe inyatheliswa ngendandatho ezungeze imbobo; ngesikhathi sokugeleza kabusha leyo nhlanganisela igeleza ingene emgqonyeni. Imbobo ye-overprint ingaba yizimo eziyindilinga, eziyisikwele, noma ezikhipha unyembezi ezithambekisela ukunamathisela emgodini. Lena yindlela evame kakhulu futhi ebiza kancane ngoba ishintsha kuphela umsebenzi wobuciko we-stencil.

Istencil esinyathelisiwe (esinyathelisiwe)

I-stencil yenziwa ibe nkulu endaweni ezungeze izimbobo ze-PiP — isibonelo i-stencil engu-0.12 mm ekhuphukele ku-0.20 mm lapho kuphela — ngakho-ke uprinti ngalunye lubeka unamathiselo oluningi ngenkathi lugcina izindawo ze-SMT ezincane. Kubiza kakhulu futhi kudinga ukubekwa ngokucophelela kwezinyathelo ukuze i-squeegee ihlale ivalekile, kodwa ilethe amavolumu amakhulu ngaphandle komkhawulo omkhulu.

Ama-preform e-Solder

Ukuze uthole imigodi enomthamo omkhulu (izixhumi zamandla ezisindayo, imiphongolo emikhulu), ucezu oluqinile olubunjwe ngaphambilini — i- preform — lufakwa phezu kwe-paste ephrintiwe ngaphambi kokuphinde lugeleze. Luyancibilikisa futhi lugcwalise i-paste, lugcwalise imiphongolo okungekho stencil efanelekile engayigcwalisa yodwa.

Kungakhathaliseki ukuthi iyiphi indlela esetshenziswayo, i-paste kufanele futhi ifinyelele emgqonyeni, yingakho ama-stencil asikwe nge-laser anezindonga ezibushelelezi nezimbozwe kahle ezibaluleke kakhulu kwi-PiP: izindonga ezihlanzekile zikhulula idiphozithi ejiyile esikhundleni sokushiya ingxenye yayo inamathele e-stencil.

Indlela Yokubala Ivolumu Yokunamathisela I-Solder ye-Pin ku-Paste

I-PiP ingenye yezinqubo ezimbalwa zokuhlanganisa lapho kufanele ngempela wenze ukubala ivolumu kunokuthembela kokuzenzakalelayo. I-logic ilula.

Okokuqala, bala ivolumu yokugcina ye-solder edingwa yijoyinti:

Kudingeka i-solder = ivolumu yebhareli + i-fillet ephezulu + i-fillet engezansi − ivolumu yomthofu ngaphakathi kwebhareli

Umthamo webhareli umgodi ofakwe ipulasitiki ophathwa njengesilinda; susa ingxenye yomsizi ongaphakathi kuwo, bese wengeza isabelo esincane samafillet okufanele akheke ohlangothini ngalunye. Lokho kunikeza umthamo we- solder eqinile oyifunayo ekugcineni.

Okwesibili, guqula lokho kube yivolumu yokunamathisela okumanzi . I-solder paste iyi-suspension yempuphu yensimbi eku-flux, futhi cishe ingxenye yayo ngevolumu iyinsimbi - okusele kuyi-flux eguquguqukayo ngesikhathi sokugeleza kabusha. Njengomthetho osebenzayo, ngakho-ke udinga cishe kabili ivolumu yokugcina yokunamathisela ekunamathiseleni okumanzi okuprintiwe:

Ivolumu yokunamathisela emanzi ≈ 2 × iyadingeka (isici esiqondile sincike ekulayisheni kwensimbi yokunamathisela — hlola ishidi ledatha)

Okwesithathu, klama imbobo kanye nobukhulu be-stencil ukuze uprinte okukodwa kufake ivolumu yokunamathisela okumanzi. Ivolumu yembobo yindawo evulekile ephindaphindwa ubukhulu be-stencil, ngakho-ke ushintshanisa usayizi we-overprint ngokumelene nobukhulu be-stencil; uma imbobo eyisicaba ingakwazi ukufinyelela okuqondiwe ngaphandle kokuba nkulu ngendlela exakile, leso yisibonakaliso sokunyusa i-stencil noma ukwengeza i-preform. Okubalulekile: ungalokothi uvumele indlu ye-stencil isike imbobo ye-PiP “ngosayizi wephedi” — yibeke ngobukhulu kusukela ekubalweni kwevolumu, ngesilinganiso se-metal-to-flux se-paste esakhelwe ngaphakathi.

Imithetho Yokuklama Namathisela Nge-Pin in: Izimbobo, Ama-Lead, kanye Nokugcina Izinto Zingekho

I-PiP enhle iqala ngendlela ehlelekile, hhayi ngendlela eqondile. Imithetho embalwa igcina inqubo iphrinteka futhi amalunga ezwakala:

• Ukususwa kwembobo kuya ku-lead: Ububanzi bembobo ehlanganisiwe ≈ ububanzi be-lead + 0.20–0.25 mm kuma-lead ayindilinga (okuncane kakhulu kwesikwele/unxande). Kuqina kakhulu bese i-lead iklwebheka odongeni; ikhululekile kakhulu futhi i-paste iwele ngaphakathi bese ilunga lilamba.
• Indandatho/iphedi ehlanganisiwe: Sebenzisa i-pad enkulu eseceleni ukuze i-overprint ibe nendawo yokuhlala, isekele i-paste enkulu kanye ne-fillet eqinile.
• Ukugcinwa kwe-SMT: Gcina ama-SMT pads acwebezelayo kude nendandatho yokunyathelisa ukuze i-paste eprintiwe kakhulu ingakwazi ukuxhuma i-pad eseduze.
• Ukungezwani kwezingxenye: vumela isikhala esincane ngaphansi komzimba (noma chaza ingxenye enezinhlangothi ezimelene) ukuze inhlama ikwazi ukukhipha umoya bese yakha i-fillet ephezulu; ingxenye ehleli phansi iyibambe.
• Ukususwa kohlangothi olungezansi: ungagcini lutho olubuthakathaka noma olude ngqo ngaphansi kwembobo ye-PiP ngakolunye uhlangothi — i-fillet engezansi idinga isikhala futhi indawo ibona ukushisa okugcwele.
• Ibhalansi yokushisa: susa izindiza ezinkulu zethusi ezixhuma emgqonyeni ngezipoki ezishisayo, noma umgqomo usebenza njengesinki sokushisa futhi ungase ungafinyeleli ekushiseni kokubuyela emuva.

Lezi yizinhlobo zezinkinga ezibhekwayo ngaphambi kokuba kuqedwe ukubuyekezwa kwe-DFM kanye nokubuyekezwa kwe-assembly (DFA) , lapho ukuzishintsha kumahhala kunokuba kube yimpendulo.

Yiziphi Izingxenye Ezingathengiswa Nge-Pin In Paste?

Isici esisodwa esikhulu sokubopha ugesi ukushisa. Ingxenye kanye namapulasitiki ayo kumele asinde ekuphakameni kokugeleza okugcwele — ngokuvamile cishe ama-245–260 °C kuma-SAC alloys angenawo umthofu. Izixhumi eziningi ezivamile ezisebenzisa imigodi azikalwanga ngalokho ; izindawo zazo zizothamba, zidilike, noma zincibilike. Abakhiqizi bathengisa izinguqulo "ezihambisana nokugeleza kabusha" noma "ezishisa kakhulu" zezixhumi ezivamile ikakhulukazi ze-PiP, futhi lezo yizo okufanele zicaciswe.

Abantu abazongenela ukhetho abahle are reflow-rated parts with modest thermal mass and well-spaced pins: phini izihloko, box headers, and board-to-board connectors sold in reflow-compatible versions, through-hole RJ45 and USB jacks rated for reflow, and smaller power connectors and terminal blocks rated for the oven.

Izinto ezimbi kakhulu — ezisingathwa kangcono yi-wave, i-selective, noma i-hand soldering — zifaka phakathi izixhumi namapulasitiki angalinganiswanga amazinga okushisa aphinde ageleze, izingxenye ezinkulu kakhulu ezinokushisa okuphezulu (ama-transformer amakhulu, imigoqo yamabhasi esindayo) ezingeke zifinyelele izinga lokushisa kuphrofayili evamile, izingxenye ezihlala phansi ezingenayo indlela yokukhipha umoya, imigoqo emikhulu kakhulu ngisho neyangaphambi kokuguquka ehluleka ukugcwalisa ngokuphindaphindiwe, nanoma yini engezwa ngemva kokuphinda igeleze ngezizathu zemishini noma zokuhlola.

Uma ibhodi lixuba izixhumi ezimbalwa ezinobungani ne-PiP nengxenye eyodwa engakwazi ukuphinda igeleze, impendulo evamile iwukuba i-PiP isho ukuthi yini ongayenza bese ukhetha i-solder ehlukile, kunokuba iphoqelele konke ngendlela eyodwa.

Phina ku-Paste vs Wave vs Selective Soldering

I-PiP ayilona ithuluzi elifanele ngaso sonke isikhathi. Incintisana ne-wave soldering kanye ne-selective soldering, futhi ukukhetha okungcono kuncike ekutheni zingaki izingxenye ezingaphakathi kwemigodi ezikhona nokuthi zingayithatha yini i-reflow heat.

Umthetho wesinqumo owusizo: uma izingxenye zembobo edlulayo zilinganiswe kabusha futhi zimbalwa, i-PiP ivame ukuba eshibhile futhi ehlanzekile kakhulu. Uma kunezingxenye eziningi zembobo edlulayo, igagasi lisaphumelela. Uma inani elincane lezingxenye lingakwazi ukusinda ekuphindeni ligeleze, ukushiswa okukhethiwe kusingatha lezo zimo ngaphandle kokudalula lonke ibhodi.

Izinsizakalo Zokuhlanganisa Namathisela eHighleap

I-Highleap Electronics ingumkhiqizi we-PCB kanye ne-PCBA oseShayina eGuangzhou osebenzisa i-Pin in Paste njengengxenye yokuhlanganiswa kwe-turnkey yobuchwepheshe obuxubile . Ukubaluleka kokusebenza nomkhiqizi owenza i-PiP njalo ukuthi izibalo zevolumu kanye nomklamo we-stencil kusingathwa ngaphambi kokuba ibhodi lakhiwe, kungatholakali ngemuva kweqembu lamalungu alambile.

• Ubunjiniyela be-stencil: Ama-stencil asikwe nge-laser angaphezulu kanye nama-step-up asayizi kusukela ekubalweni kwe-paste-volume, kanye nama-solder preforms ama-barrel anevolumu ephezulu.
• Impendulo ye-DFM/DFA: izilinganiso zokudonsa imigodi, ukugcinwa, ukukhululeka kokushisa, kanye nezilinganiso zokuphinda kugeleze izingxenye ezibuyekezwe ngokuhambisana nezinyathelo zakho.
• Ukuhlela kabusha iphrofayili: amaphrofayili alungisiwe ukuze izingxenye ezimbobo ezidlulayo ezinobukhulu obuphezulu zifinyelele izinga lokushisa ngaphandle kokupheka ngokweqile i-SMT encane.
• Ukuhlolwa: I-AOI emajoyintini e-SMT kanye ne-X-ray lapho ukugcwaliswa kwemiphongolo kudinga ukuqinisekiswa.
• Ukukhetha inqubo: isiqondiso esiqotho sokuthi i-PiP, igagasi, noma i-selding ekhethiwe iyindlela efanele nini ebhodini lakho elithile.

Imibuzo Evame Ukubuzwa Nge-Pin in Paste (PiP)

Ingabe i-Pin in Paste iyafana nokushintshashintsha kwe-soldering?

Isebenzisa ukugoqa kabusha, kodwa leli gama libhekisela ngqo ekugoqeni izingxenye ezimbotsheni kuhhavini wokugoqa kabusha ngokuphrinta unamathisele emigodini. Izingxenye ezijwayelekile zokugoqa kabusha ezifakwa ngaphezulu; I-PiP yelula leyo pass efanayo yehhavini ezingxenyeni ezine-lead ukuze kungadingeki igagasi elihlukile noma isinyathelo sokugoqa ngesandla.

Kungani amalunga ami e-PiP ephuma elambile noma engenazo izitho zangaphansi?

Cishe njalo akwanele ukunamathisela. Imbobo eyisicaba, engangephedi ayikwazi ukugcwalisa ibhodlela. Yilungise ngokuyiphrinta ngaphezulu (indandatho enkulu yokumboza ezungeze umgodi), ukuphakamisa i-stencil endaweni, noma ukwengeza i-solder preform — bese usayizi wembobo kusukela ekubalweni kwevolumu okubangela ukuthi ukunamathisela kube cishe ingxenye yensimbi ngevolumu.

Ingabe kukhona isixhumi esingena emgodini esingathengiswa nge-PiP?

Cha. Ingxenye kumele isinde ekuphakameni kokugeleza okugcwele, ngokuvamile cishe ngo-245–260 °C ukuze ingabi nomthofu. Izixhumi eziningi ezijwayelekile azikalwanga ngalokho futhi zizoshintsha. Sebenzisa inguqulo "ehambisana nokugeleza kabusha" noma "yokushisa okuphezulu" yesixhumi, abakhiqizi abasenzela ngqo i-PiP.

Kufanele ngisebenzise nini i-wave soldering esikhundleni se-PiP?

Uma ibhodi linezingxenye eziningi ezimbobo, noma izingxenye ezingakwazi ukwamukela ukushisa okuphinde kugeleze. I-PiP ikhanya kakhulu kumabhodi e-SMT anezingxenye ezimbalwa ezikwazi ukumelana nokugeleza okuphinde kugeleze. Njengoba inani lemigodi edlulayo likhuphuka, ukugoqa amagagasi kuba ngcono kakhulu; kwezinye izimo ezimbalwa ezithinta ukushisa, ukugoqa okukhethayo ngokuvamile kuyimpendulo.