Ukukhiqiza i-RO3006 PCB

Ukukhiqizwa kwe-PCB ye-RO3006 kuyasiza lapho ukwakhiwa okuphezulu kwe-Dk kunganciphisa usayizi wesekethe ngenkathi kugcinwa ibhodi eliqediwe lingakhiqizwa. Isinqumo esibalulekile akusikho i-Dk ejwayelekile yodwa, kodwa ukuthi ukwakhiwa okukhethiwe kusekela kanjani ububanzi bokulandelela obudingekayo, isikhala kanye nokuhlelwa kwezingqimba. Ukukhiqizwa kwe-PCB ye- Rogers RO3006 kusetshenziswa lapho umklamo we-RF udinga i-laminate ye-Dk 6.15 ye-geometry ehlanganisiwe ngaphandle kokuthuthela ekilasini le-Dk 10.2 elinamandla kakhulu. I-RO3006 iyinto ye-PTFE egcwele i-ceramic enenqubo ye-Dk 6.15 +/- 0.15 kanye ne-dissipation factor 0.0020 ku-10 GHz. I-Highleap Electronics ihlola i-stackup, i-impedance, ikhwalithi yokubhoboza, ukulungiswa kwemigodi, i-plating, ukuqeda, kanye nemingcele yokuhlanganisa ngaphambi kokukhiqizwa.

Okuqukethwe

1. Uma i-RO3006 iyi-PCB Material efanele
2. I-RO3006 Iyinto Ephakathi Nephakeme Kakhulu, Ngakho-ke I-Stackup Kumele Ikhishwe Kusenesikhathi
3. Izakhiwo Zezinto Ezithinta Ukukhiqizwa
4. Isibuyekezo se-DFM kanye ne-Stackup Ngaphambi Kokucaphuna
5. Izilawuli Zenqubo Yokukhiqiza
6. Iphakheji ye-RFQ kanye namarekhodi okukhiqiza

Ububanzi bezinto ezibonakalayo: Leli khasi liphathelene nokwakhiwa kwe-PCB kusetshenziswa izinto ezishiwo yiRogers. I-Highleap Electronics ikhiqiza ibhodi eliqediwe kanye ne-PCBA; ukukhiqizwa kwe-laminate kanye nokuthengiswa kwezinto ezibonakalayo kungaphandle kobubanzi besevisi yethu.

Uma i-RO3006 iyi-PCB Material efanele

I-RO3006 isetshenziswa lapho isekethe ye-RF idinga i-dielectric constant ephezulu kune-laminates ye-microwave ephansi ye-Dk kodwa ayidingi i-miniaturization enamandla ye-RO3010. Ifanela ama-antenna amancane, izihlungi, ama-couplers, amasekethe e-GPS/GNSS, amamojula we-microwave, kanye namabhodi e-RF alawulwayo-impedance lapho i-Dk 6.15 isiza ukunciphisa usayizi wesekethe ngenkathi igcina umklamo ungakhiqizwa.

Isinqumo esibalulekile ukuthi i-stackup, ukujiya kwethusi, kanye ne-trace geometry kungagcinwa njalo ekukhiqizweni. I-RO3006 akuyona nje into yokufaka esikhundleni sezinto ezibonakalayo; kufanele ikhishwe ngokujiya kwe-dielectric okuchaziwe, iphrofayili yethusi, i-impedance target, kanye nendlela yokuhlola ukuze ibhodi elenziwe lifane nemodeli ye-RF. Imininingwane yokwenziwa kufanele ihlale ihambisana nokuziphatha kwezinto ze-RO3006 ekwakhiweni kwe-RF , kufaka phakathi ukwakhiwa kwe-dielectric okuvunyiwe.

I-RO3006 Iyinto Ephakathi Nephakeme Kakhulu, Ngakho-ke I-Stackup Kumele Ikhishwe Kusenesikhathi

I-RO3006 iphakathi kwama-laminate e-microwave aphansi kwe-Dk nezinto ze-Dk eziphezulu kakhulu njenge-RO3010. Lokhu kuyenza ibe usizo kumasekethe e-RF aqinile, kodwa futhi kusho ukuthi imodeli kagesi iboshwe ngokuqinile ekujikeni kwe-dielectric, iphrofayili yethusi, ububanzi be-trace eqoshiwe, kanye nethusi elicwebezelwe ekugcineni. Umklamo obukeka ulula ku-Gerber ungase wehluleke ukuvimba noma ukuphendula imvamisa uma i-stackup ishintshwa ngemva kokucaphuna. Uma i-miniaturization enkulu iholela ku- RO3010 njengendlela ehlukile yokwenziwa kwe-Dk ephezulu , umsebenzi wobuciko kanye nokubekezelelana kokukhiqiza kudinga ukuvunywa kabusha.

Isihloko okumele sixazululwe ngokuningiliziwe ukukhishwa kwe-stackup. I-Highleap icela ithebula le-impedance, ukubekezelelana kwethagethi, ukujiya kwe-dielectric, isisindo sethusi, ukucabanga kwephrofayili yethusi, kanye nanoma yikuphi ukucabanga kokulingisa esigabeni se-RFQ. Uma i-stackup ishiywa efektri ngemuva kokuthi ukwakheka kwe-RF kuqediwe, umhlinzeki kungadingeka alungise ububanzi bomugqa, ithusi eliqediwe, noma ukujiya kwe-dielectric, futhi lezo zinguquko zingashukumisa impendulo yesihlungi, ukusebenza kwe-coupler, noma ukufaniswa kwe-antenna.

Kumabhodi ahlanganisiwe, isibuyekezo siphinde sihlanganise ukuthi i-RO3006 isetshenziswa yini kuzo zonke izingqimba ze-RF noma ezigabeni ezikhethiwe kuphela. Ukushintsha kwezinto kuthinta i-lamination, ukubhaliswa, ukubhoboza, kanye nokuthembeka kwemigodi ehlanganisiwe. Umthengi kufanele achaze ukuthi yiziphi izingqimba ezine-geometry ye-RF elawulwayo, yiziphi izingqimba ezisekelayo zedijithali noma zamandla, nokuthi ngabe ibhodi idinga amakhuphoni e-impedance, ukulinganiswa kwesihloko sokuqala, noma ukukhiya kwe-oda eliphindaphindwayo.

• Khipha i-RO3006 stackup ngaphambi kwe-DFM yokugcina, hhayi ngemva kokuba umhlinzeki eqale ukusebenzisa amathuluzi.
• Gcina ukujiya kwethusi okulingisiwe kanye nezinhloso zethusi eziqediwe zihambisana nomdwebo wokwenziwa.
• Ngokwakhiwa kwe-hybrid, chaza ukuthi i-RO3006 iqala kuphi futhi ima kuphi ukuze ukubhaliswa kanye ne-lamination kubuyekezwe.

Izakhiwo Zikagesi ze-RO3006 Ezisetha I-RF Geometry

Isibuyekezo se-DFM kanye ne-Stackup Ngaphambi Kokucaphuna

Isilinganiso esithembekile siqala ngesethi ephelele ye-Gerber, amafayela okubhoboza, uhlu lwe-net, uhlaka lwebhodi, umdwebo we-stackup, i-callout yezinto zokwakha, isisindo sethusi, ukuqeda kobuso , amanothi emaski e-solder, ama-impedance target, kanye nanoma yiziphi izidingo zokuhlanganisa. I-Highleap ihlola ukuthi umklamo ungenziwa ngokuphindaphindiwe yini ngaphambi kokuqala kwamathuluzi.

Izilawuli Zenqubo Yokukhiqiza

Indlela yenqubo kufanele ikhethwe ngaphambi kokuba izinto zikhishwe ukuze zikhiqizwe. Izilawuli ezijwayelekile zifaka phakathi ukuqinisekiswa kwezinto, ukuhlolwa kwengqimba yangaphakathi, ukubuyekezwa kwe-lamination, ikhwalithi yokubhoboza, ukulungiswa kwemigodi, i-copper plating, ukubhaliswa kwemaski ye-solder, ukuqeda ubuso, ukunemba komzila, ukuhlolwa kukagesi, kanye nokuhlolwa kokugcina. I-Highleap ibuyekeza i-geometry ye-RF kanye nokubhoboza kanye ne-lamination ngoba izakhiwo ezihlangene zikhulisa iphutha lokubhalisa. Umdwebo wokukhiqiza kufanele uchaze ukujiya kwe-dielectric okuqediwe kanye nethusi ukuze ukuqinisekiswa kwe-impedance kube nenjongo. Amanani empahla eqondile kufanele ahlolwe ngokumelene nemibhalo yamanje yomhlinzeki webanga elicacisiwe kanye nokwakhiwa.

Kuma-oda aphindaphindwayo e-RO3006, gcina i-stackup evunyiwe, iphrofayili yethusi, isinxephezelo se-etch, ifomethi yephaneli, ikhuphoni ye-impedance kanye nemigomo yokuhlola izinzile. Ushintsho ekwakhiweni kwethusi noma kwe-dielectric kufanele lubangele ukubuyekezwa kobunjiniyela ngaphambi kokuba kukhishwe i-lot elandelayo.

Iphakheji ye-RFQ kanye namarekhodi okukhiqiza

I-RO3006 ifanela ama-antenna amancane, izihlungi ze-RF, ama-couplers, amasekethe e-GPS ne-GNSS, amamojula e-microwave, kanye namabhodi e-hybrid RF adinga ukusebenza kwe-Dk 6.15 ngokulawula ukukhiqiza okusebenzayo.

Thumela amafayela e-Gerber, amafayela okubhoboza, i-stackup, ubukhulu be-RO3006, isisindo sethusi, ithebula le-impedance, izidingo zekhuphoni, ukuqeda kwendawo, umbala wemaski we-solder, izidingo zokuhlola, inani le-prototype, inani lokukhiqiza, kanye nedatha yokuhlanganisa uma kudingeka i-PCBA.

Kwezakhiwo ze-RO3006, ubufakazi obuwusizo buhlanganisa ukuqinisekiswa kwe-impedance, ukuhlolwa kobukhulu bezici ze-RF, imiphumela ye-microsection lapho kuchazwe khona, amarekhodi ezinto kanye nokuhlolwa kukagesi. Ububanzi bokuhlola kufanele bugxile ekwakheni okuqediwe okusetshenziselwa imodeli ye-RF. Ukuze uthole ikhotheshini, chaza ukwakhiwa kwe-RO3006, ubukhulu bebhodi, ithusi, izici ze-RF ezincane, amakilasi emigodi kanye nezidingo zokuhlola. Lokhu kudala ikhotheshini ezungeze ibhodi langempela le-high-Dk kunentengo ejwayelekile ye-Rogers.