Ukukhiqiza i-RT duroid 6002 Aerospace PCB

Ukukhiqizwa kwe-RT duroid 6002 aerospace PCB kufanele kuxhume ukukhetha kwezinto ezisetshenziswayo nohlelo lokufaneleka. Amabhodi e-RF e-Aerospace avame ukudinga okungaphezu kokusebenza kukagesi okujwayelekile; ukujikeleza kokushisa, izinto ezicatshangelwayo zokukhipha igesi, imibhalo kanye nokuthembeka kwembobo ehlanganisiwe kungathinta umzila wokukhiqiza. Ukukhiqizwa kwe-Rogers RT/duroid 6002 PCB kusetshenziswa lapho ibhodi le-RF kumele ligcine ukusebenza kukagesi kuzinzile ngokujikeleza kokushisa, ukudlidliza kokuqalisa, ukuhlanganiswa okuthembekile kakhulu, kanye nokuphila isikhathi eside kwenkonzo. I-RT/duroid 6002 iyinhlanganisela ye-PTFE egcwele i-ceramic ene-Dk 2.94 +/- 0.04, i-dissipation factor 0.0012 ku-10 GHz, i-thermal coefficient ephansi ye-Dk, kanye ne-z-axis CTE ephansi. I-Highleap Electronics ikhiqiza amabhodi e-RT/duroid 6002 okulayisha imithwalo yesathelayithi, ama-feed e-phased-array, amamojula e-radar, ama-assemblies e-aerospace RF, kanye nama-stackups e-hybrid e-low-CTE.

Okuqukethwe

1. Uma i-RT/duroid 6002 iyi-PCB Material efanele
2. Ukuthembeka kwe-CTE ephansi kuyisizathu sangempela sokukhetha i-RT/duroid 6002
3. Izakhiwo Zezinto Ezithinta Ukukhiqizwa
4. Isibuyekezo se-DFM kanye ne-Stackup Ngaphambi Kokucaphuna
5. Izilawuli Zenqubo Yokukhiqiza
6. Iphakheji ye-RFQ kanye namarekhodi okukhiqiza

Ububanzi bezinto ezibonakalayo: Leli khasi liphathelene nokwakhiwa kwe-PCB kusetshenziswa izinto ezishiwo yiRogers. I-Highleap Electronics ikhiqiza ibhodi eliqediwe kanye ne-PCBA; ukukhiqizwa kwe-laminate kanye nokuthengiswa kwezinto ezibonakalayo kungaphandle kobubanzi besevisi yethu.

Uma i-RT/duroid 6002 iyi-PCB Material efanele

I-RT/duroid 6002 iyisinqumo esinamandla lapho i-PCB kumele ihlanganise ukulahlekelwa okuphansi kwe-RF nokuziphatha okuzinzile kwemishini ngokusebenzisa ukujikeleza kokushisa. Ngokuvamile ikhethwa kumabhodi e-RF endiza, amasekethe okulayisha imithwalo yesathelayithi, amamojula e-radar, amanethiwekhi okuphakelwa kwe-phased-array, kanye nama-microwave ahlanganiswe ngensimbi lapho ukuthembeka kwembobo efakwe i-plated kanye nokuzinza kobukhulu kubaluleke kakhulu njengokulahlekelwa kokufakwa.

Akuyona into yokuqala okufanele uyikhethele ibhodi ngalinye le-RF elinokulahlekelwa okuncane. Uma umklamo udinga kuphela ukusebenza okujwayelekile kwe-microwave yezentengiselwano, enye i-Rogers laminate ingaba usizo kakhulu. I-RT/duroid 6002 iba yigugu lapho ibhodi inezidingo eziqinile zokushisa-zemishini, izithwali eziboshiwe, imibhalo ethembekile kakhulu, noma indawo yesevisi lapho ukulungiswa kunzima khona. Izidingo zokwamukelwa kohlelo oluthile kufanele zifakwe kokufakwayo kwekhotheshini ye-RT/duroid 6002 ngaphambi kokuba umhlinzeki azibophezele ekukhokheni izindleko nasekulethweni.

Ukuthembeka kwe-CTE ephansi kuyisizathu sangempela sokukhetha i-RT/duroid 6002

Umbuzo oyinhloko wokukhiqiza awukona nje ukuthi ukulahlekelwa yi-RF kuphansi yini. Ama-laminate amaningi e-PTFE aphansi angasekela imigqa yokudlulisa i-microwave, kodwa i-RT/duroid 6002 ikhethwa lapho ukuthembeka kwe-PCB kuyingxenye yomklamo we-RF. I-CTE yayo ephansi ye-z-axis isiza ekunciphiseni ukucindezeleka okufakwe i-plated-through-hole ngesikhathi sokujikeleza kokushisa, futhi ukunwetshwa kwayo ngaphakathi kwendiza kusondele ngokwanele kuthusi ukusekela izici ze-microwave ezizinzile ngokwesilinganiso.

Kumabhodi ezindiza kanye nesathelayithi, lokhu kubalulekile ngoba ibhodi lingaxhunywa kumshini wokuthwala insimbi, livezwe ekujikelezeni kokushisa kwe-vacuum, noma lisetshenziswe kumojuli we-RF ovaliwe lapho ukulungiswa kwensimu kungenzeki khona. Ngakho-ke i-Highleap ibukeza i-stackup njengesakhiwo sokuthembeka, hhayi nje njengokukhethwa kwe-laminate. Isisindo sethusi, ukujiya kwe-dielectric, usayizi wembobo, ukujiya kwe-plating, indandatho ye-annular, i-metal backing, uhlelo lokunamathela, i-final routing, kanye namarekhodi okuhlola konke kudinga ukusekela umgomo ofanayo wokushisa-we-mechanical. Uma izingxenye zifakiwe ku-oda, ukuhlanganiswa kumabhodi e-RT/duroid 6002 avunyiwe kudinga i-BOM, inqubo yokunamathisela kanye nokuhlolwa kokugcina ukuze kwabelwane ngokubuyekezwa kokwenziwa.

Ekucaphuneni okusebenzayo, ingxoxo ebaluleke kakhulu ivame ukuba ukuthi umdwebo unikeza ukulawula okwanele yini phezu kwesakhiwo esiqediwe. Uma umdwebo uthi “RT/duroid 6002” kuphela kodwa ungachazi ubukhulu be-dielectric, ithusi, i-plating, i-surface finish, i-carrier bonding, i-impedance coupon, noma amarekhodi okwamukelwa, abahlinzeki ababili bangacaphuna amabhodi ahlukene kakhulu. Umthengi olungiselela i-oda le-RF lendiza kufanele akhiye lezi zinto ngaphambi kokukhishwa kwe-prototype ukuze i-prototype ibe yisisekelo sokukhiqiza.

• Sebenzisa i-RT/duroid 6002 uma i-CTE ephansi kanye nokulahlekelwa okuphansi kokubili kuyingxenye yesidingo sokuklama.
• Chaza izidingo zokuthembeka kwemigodi ehlanganisiwe kusenesikhathi, ikakhulukazi ekujikelezeni kokushisa noma ekuhlanganisweni okusekelwe yinsimbi.
• Gcina i-stackup, ukwakheka kwekhuphoni, imithetho yokubhoboza, kanye namarekhodi okuhlola ezinzile kusukela ku-prototype kuya ekwakhiweni okuphindaphindiwe.

Izakhiwo ze-RT/duroid 6002 Ezihlobene Nokuthembeka

Isibuyekezo se-DFM kanye ne-Stackup Ngaphambi Kokucaphuna

Isilinganiso esithembekile siqala ngesethi ephelele ye-Gerber, amafayela okubhoboza, uhlu lwe-net, uhlaka lwebhodi, umdwebo we-stackup, i-callout yezinto zokwakha, isisindo sethusi, ukuqeda kobuso, amanothi emaski e-solder, ama-impedance target, kanye nanoma yiziphi izidingo zokuhlanganisa. I-Highleap ihlola ukuthi umklamo ungenziwa ngokuphindaphindiwe yini ngaphambi kokuqala kwamathuluzi.

Izilawuli Zenqubo Yokukhiqiza

Indlela yenqubo kufanele ikhethwe ngaphambi kokuba izinto zikhishwe ukuze zikhiqizwe. Izilawuli ezijwayelekile zifaka phakathi ukuqinisekiswa kwezinto, ukuhlolwa kwengqimba yangaphakathi, ukubuyekezwa kwe-lamination, ikhwalithi yokubhoboza, ukulungiswa kwemigodi, i-copper plating, ukubhaliswa kwemaski ye-solder, ukuqeda ubuso, ukunemba komzila, ukuhlolwa kukagesi, kanye nokuhlolwa kokugcina. I-Highleap ingachaza ubufakazi bokuhlola kanye nokufaneleka okuzungeze i-stackup ekhishwe. Izilawuli ezibucayi zingafaka ukuhlonza izinto, amarekhodi e-lamination, ukuhlolwa kobukhulu, ukuhlolwa kwemigodi ehlanganisiwe kanye nokuhlolwa okwengeziwe kwemvelo noma kwe-RF uma kuchazwe uhlelo. Amanani empahla eqondile kufanele ahlolwe ngokumelene nemibhalo yamanje yomhlinzeki webanga elicacisiwe kanye nokwakhiwa.

Ukuze uthole ukwakhiwa kwezindiza okuphindaphindiwe noma okuthembekile kakhulu, gcina ukulandeleka kwezinto, ukuhlanganiswa okuvunyiwe, umzila wokubhoboza, ifasitela lokufaka amaplanga, amarekhodi okuhlola kanye nokulawulwa koshintsho kuhambisana nokwakhiwa okufanelekile. Ushintsho lwenqubo noma lwezinto kufanele luphathwe njengoshintsho lobunjiniyela, hhayi nje ukushintshwa kokuthenga.

Iphakheji ye-RFQ kanye namarekhodi okukhiqiza

Izinhlelo zokusebenza ezifanele kakhulu zifaka phakathi izihlungi ze-satellite transponder, amanethiwekhi okwenza imisebe, amamojula e-low-CTE RF, ama-airborne radar assembly, ama-front end asesiteshini esingaphansi komhlaba, kanye namabhodi e-hybrid microwave lapho ukuthembeka kwemigodi ehlanganisiwe kanye nokulawula ubukhulu kubaluleke njengokulahlekelwa yi-RF.

Thumela amafayela e-Gerber, idatha yokubhoboza, amanothi e-stackup, ubukhulu be-RT/duroid 6002, isisindo sethusi, ukuqeda kobuso, ama-impedance target, izidingo zokuthwala insimbi, amakhuphoni okuhlola, izidingo zemibhalo, inani le-prototype, inani lokukhiqiza, kanye neshejuli yoku-oda kabusha elindelekile.

Kwezakhiwo ze-RT/duroid 6002 ezinokwethenjelwa okuphezulu, ubufakazi obuwusizo buhlanganisa ukulandeleka kwezinto, ukuhlolwa kokujiya okuqediwe, ukuhlolwa kwe-microsection noma imbobo efakwe ipulasitiki, ukuqinisekiswa kwe-impedance kanye nedatha yezimfanelo zemvelo noma zokushisa edingwa uhlelo. Ukuze uthole i-RFQ yendiza, thumela umdwebo wamanje, ibanga lezinto, i-stackup, izidingo zokuthembeka, izidingo zobuningi kanye nemibhalo. Ikhotheshini ingabese ihlukanisa ukukhiqizwa okujwayelekile nomsebenzi wezimfanelo.