Ukwenziwa kwe-TMM6 PCB

Ukwenziwa kwe-PCB ye-TMM6 kuyindlela egxile enqubweni yokwakha i-TMM ephezulu ye-Dk. Inselele enkulu yokukhiqiza ukugcina ukujiya okuqediwe, ukubhaliswa, i-geometry yethusi kanye nekhwalithi yembobo kuzinzile kulo lonke iphaneli. Ukwenziwa kwe-PCB ye -Rogers TMM6 kusetshenziswa lapho umklamo udinga ukusebenza kwe-microwave ye-Dk 6.0 ngokuziphatha komshini wezinto ze-thermoset ezigcwele i-ceramic. I-TMM6 ine-process Dr 6.00 +/- 0.080 kanye ne-dissipation factor 0.0023 ku-10 GHz. Ivame ukukhethwa kwezihlungi, ama-antenna, ama-couplers, ama-power amplifiers, kanye nama-microwave assemblies lapho ukuzinza kobukhulu kanye nokwenziwa okusebenzayo kubalulekile.

Okuqukethwe

1. Uma i-TMM6 iyi-PCB Material efanele
2. I-TMM6 Ivame Ukwehluleka Noma Iphumelele Ekuhleleni Inqubo Ye-Thick-Substrate
3. Izakhiwo Zezinto Ezithinta Ukukhiqizwa
4. Isibuyekezo se-DFM kanye ne-Stackup Ngaphambi Kokucaphuna
5. Izilawuli Zenqubo Yokukhiqiza
6. Iphakheji ye-RFQ kanye namarekhodi okukhiqiza

Ububanzi bezinto ezibonakalayo: I-Highleap Electronics ikhiqiza futhi ihlanganise i-PCB eqediwe. Ibanga likaRogers elishiwo kuleli khasi likhomba i-laminate echaziwe; i-Highleap ayikhiqizi noma ayithengisi ama-laminate kaRogers.

Uma i-TMM6 iyi-PCB Material efanele

I-TMM6 iyinto ye-thermoset ceramic hydrocarbon esetshenziswa lapho ibhodi le-microwave lidinga ukusebenza kwe-Dk 6.0 ngendlela evamile yokucubungula kunezinto ezisekelwe ku-PTFE. Ivame ukukhethwa kuma-filters, ama-patch antenna, ama-couplers, ama-RF power circuits, kanye nama-microwave assemblies adinga izakhiwo ezizinzile ze-dielectric kanye nama-substrates aqinile ngokwemishini.

Isinqumo esiyinhloko sokukhiqiza ukuthi ngabe ubukhulu bebhodi, osayizi bemigodi eqediwe, isisindo sethusi, kanye nezixhumi zokuxhumanisa ziyasebenza yini ekukhiqizeni okuphindaphindiwe. I-TMM6 ivame ukuvela ezakhiweni ze-RF ezijiyile, ngakho-ke ukubhoboza, ukuhambisa, ukufaka iplati, kanye nekhwalithi yomphetho kufanele kubuyekezwe ngaphambi kokuba isilinganiso siqedwe. Gcina isilinganiso sokuhlola nokubekezelelana esivunyelwene ngaso sihambisana lapho ulungisa izingcaphuno zokwenziwa kwe-TMM ukuze okunikezwayo okuhlukile kuchaze ibhodi elifanayo.

I-TMM6 Ivame Ukwehluleka Noma Iphumelele Ekuhleleni Inqubo Ye-Thick-Substrate

I-TMM6 ivame ukusetshenziswa ezakhiweni ze-microwave ezijiyile, okushintsha isibuyekezo sokukhiqiza. Ama-substrate ajiyile athinta ukubhoboza, umzila, i-geometry yemigodi ehlanganisiwe, ukuguqulwa kwezixhumi, kanye nokubekezelelana komshini. Usayizi wembobo okhululekile ebhodini elincane ungaba yingozi uma isilinganiso se-aspect, i-copper plating, kanye ne-annular ring sezicatshangelwa ndawonye.

Isihloko esinemininingwane se-TMM6 ukuhlela inqubo ye-substrate ejiyile. I-Highleap ibukeza ububanzi bokubhoboza, usayizi wembobo oqediwe, ukujiya kwezinto, isisindo sethusi, indlela yokuqondisa, ikhwalithi yomphetho, kanye nemininingwane yokuqalisa isixhumi ngaphambi kokucaphuna. Umgomo ukuvimbela umdwebo ukuthi ucashunwe njengebhodi le-RF elilula lapho empeleni lidinga ukunakwa okukhethekile kwikhwalithi yembobo, ukuzinza kokuqondisa, ukuthamba kwebhodi, kanye nokulingana komshini.

Uma ibhodi isebenzisa ithusi elisindayo, into yokufakelwa yensimbi, ipuleti lokuthwala, noma ushintsho lwesixhumi se-coaxial, imikhawulo yokushisa neyemishini iyabuyekezwa kanye ne-RF stackup. Amaphedi okuqalisa isixhumi kufanele ahlolwe ngokujiya kwebhodi kanye nemikhawulo yeplati, kuyilapho noma yiziphi izimbobo zokufaka noma imiphetho eqondiwe kufanele ihlolwe ukuze kutholakale ukubekezelelana kwendawo kanye nokuqeda umphetho. Lokhu kwenza ibhodi eliqediwe kube lula ukuhlanganisa futhi kunciphisa ingozi yokuphinda lisebenze.

• Hlola usayizi wembobo oqediwe, isilinganiso sesici, kanye nendandatho ehlanganisiwe esikhundleni sokuhlukanisa.
• Buyekeza ikhwalithi yomzila kanye nomkhawulo kusenesikhathi lapho ibhodi lihlangana nezindawo zokubeka, izithwali, noma izixhumi.
• Gcina ukujiya okuvunyiwe, ithusi, kanye nemithetho yokubhoboza ingashintshi lapho umklamo ungena ekukhiqizweni okuphindaphindiwe.

Izakhiwo ze-TMM6 Ezithinta Ukumba Nokubhalisa

Isibuyekezo se-DFM kanye ne-Stackup Ngaphambi Kokucaphuna

Isilinganiso esithembekile siqala ngesethi ephelele ye-Gerber, amafayela okubhoboza, uhlu lwe-net, uhlaka lwebhodi, umdwebo we-stackup, i-callout yezinto zokwakha, isisindo sethusi, ukuqeda kobuso , amanothi emaski e-solder, ama-impedance target, kanye nanoma yiziphi izidingo zokuhlanganisa. I-Highleap ihlola ukuthi umklamo ungenziwa ngokuphindaphindiwe yini ngaphambi kokuqala kwamathuluzi.

Izilawuli Zenqubo Yokukhiqiza

Indlela yenqubo kufanele ikhethwe ngaphambi kokuba izinto zikhishwe ukuze zikhiqizwe. Izilawuli ezijwayelekile zifaka phakathi ukuqinisekiswa kwezinto, ukuhlolwa kwengqimba yangaphakathi, ukubuyekezwa kwe-lamination, ikhwalithi yokubhoboza, ukulungiswa kwemigodi, i-copper plating, ukubhaliswa kwemaski ye-solder, ukuqeda ubuso, ukunemba komzila, ukuhlolwa kukagesi, kanye nokuhlolwa kokugcina. Ukubuyekezwa kwe-Highleap ukubhoboza, i-lamination, ukubhaliswa kanye nezici ezibalulekile ze-RF ezivela kumdwebo wokwenziwa. Lapho ibhodi likhulu noma lisebenzisa i-geometry ye-microwave encane, amathuluzi nokuhlolwa kuhlelwa ngokuzungeza i-stackup yangempela kuneresiphi ejwayelekile ye-TMM6. Amanani empahla eqondile kufanele ahlolwe ngokuqhathanisa nemibhalo yamanje yomhlinzeki webanga elicacisiwe kanye nokwakhiwa.

Ngokwakhiwa kwe-TMM6 okuphindaphindiwe, gcina ukujiya okuvunyiwe, iresiphi yokubhoboza, indlela yokuqondisa, ukwakhiwa kwethusi kanye nohlelo lokuhlola kuzinzile. Izinguquko ekujiyeni kwebhodi noma ezifundweni zemigodi zingashintsha kokubili ukulingana kwemishini kanye nokuphindaphindwa kwezakhiwo ze-RF.

Iphakheji ye-RFQ kanye namarekhodi okukhiqiza

I-TMM6 ilungele kahle izihlungi ze-microwave, amanethiwekhi kagesi e-RF, ama-antenna e-patch, ama-couplers, ama-resonator, izakhiwo zokulibaziseka, namamojula e-microwave adinga ukusebenza kwe-Dk 6.0 ngokukhiqiza okulawulwayo.

Thumela amafayela e-Gerber, idatha yokubhoboza, ubukhulu be-TMM6, isisindo sethusi, ukuqeda, ithebula le-impedance, ukubekezelelana okulinganayo, amanothi okuhambisa, inani le-prototype kanye nokukhiqiza, kanye namafayela okuhlanganisa uma i-Highleap izokwakha i-PCBA.

Kwezakhiwo ze-TMM6, ubufakazi obuwusizo buhlanganisa ukujiya okuqediwe, ukuhlolwa kokubhoboza kanye nemigodi efakwe ipulasitiki, ukuhlolwa kobukhulu, ukuqinisekiswa kwe-impedance lapho kudingeka khona, amarekhodi ezinto kanye nemiphumela yesihloko sokuqala. Lokhu kuwusizo kakhulu lapho ibhodi isebenzisa i-substrate ejiyile noma i-geometry ye-microwave ezwela imvamisa. Ukuze uthole ikhotheshini, nikeza ibanga le-TMM6, ukujiya kwebhodi, inani lezendlalelo, ithusi, amakilasi emigodi, izidingo ze-impedance kanye nobuningi. Lokhu okufakwayo kwanele ukuhlola umzila wokwenziwa kanye nobubanzi bokuhlolwa. Ubukhulu bokwenziwa buyathola incazelo yabo kagesi ngokuhlola ukwakheka kwesihlungi se-TMM6 , kufaka phakathi izici ze-resonator kanye ne-coupling ezidinga ukulawulwa okuqinile.