Umkhiqizi we-Taconic RF-60A PCB we-Compact High-Dk RF

I-Highleap Electronics ikhiqiza izixazululo ze-Taconic RF-60A PCB zama-antenna aqinile, izihlungi, ama-couplers, ama-resonator, amanethiwekhi afanayo, amasekethe esathelayithi kanye namamojula e-RF anamandla aphezulu. Ukusekelwa kokukhiqiza kufaka phakathi ukubuyekezwa kwejiyometri ye-Dk ephezulu, ukulawulwa kwesikhala esihlanganisiwe okuqinile, imingcele ye-RF ehlanganisiwe, izixhumi ze-interface eziqondile, ukuhlanganiswa kwezixhumi kanye nokuhlolwa okuchazwe ngamakhasimende.

Ngenxa yokuthi i-RF-60A iyigama elidala, i-Highleap iqinisekisa izinto ezilawulwayo, ukujiya okutholakalayo, ithusi, izitifiketi kanye nemithetho yokushintsha evunyiwe ngaphambi kwekhotheshini. I-AGC RF-60TC yamanje iyi-laminate ehlukile ye-Dk-6.15 eqhuba ukushisa; ingahlolwa njengenye indlela kuphela ngokuvunyelwa kwamakhasimende okubhaliwe.

Izici ze-RF-60A kanye ne-RF-60TC yamanje ze-Compact RF

Izinto ze-Dk-6-class zivumela ama-resonator amancane, ama-antenna kanye nezakhiwo ezifanayo, kodwa futhi zenza ukuhlukahluka kobukhulu kube okubaluleke kakhulu ngogesi. I-AGC RF-60TC yamanje iyi-substrate ye-fiberglass esekelwe ku-PTFE, egcwele i-ceramic ene-Dk 6.15 ± 0.15, i-Df 0.002 kanye nokushisa okungu-1.05 W/m·K. Lawo manani ashicilelwe asebenza ku-RF-60TC, hhayi ngokuzenzakalelayo kumdwebo we-RF-60A wesikhathi esidlule.

Bhekisela kudatha esemthethweni yomkhiqizo we-AGC RF-60TC kanye nesiqondiso sezinto ze-PCB ze-Highleap ezine-Dk ephezulu uma ubuyekeza umzila wokukhiqiza wamanje.

Amandla Okukhiqiza e-Taconic RF-60A PCB

I-Highleap ikhiqiza amasekethe e-RF-60A alawulwa amakhasimende ama-antenna amancane, ama-couplers, izihlungi, ama-resonator, amanethiwekhi afanayo, amadivayisi e-RF agqokwayo/ezokwelapha kanye neminye imiklamo esebenzisa i-dielectric constant ephezulu ukunciphisa ubude bomkhathi kanye nosayizi wesekethe. Sisekela amamojula e-RF anezingqimba ezimbili, afakwe imbobo edlulayo, ahlanganisiwe anezingqimba eziningi, ahlanganiswe ngomphetho futhi ahlanganisiwe angaphansi kwe-DFM.

Usekelo lwe-Highleap lwe-Compact Dr-6-Class RF Circuits

Amandla Okukhiqiza e-Highleap Rigid RF PCB

Izibalo ezingezansi ziyimingcele yefektri ye-Highleap eqinile-PCB eshicilelwe. Izakhiwo ze-High-Dk RF-60A zivame ukusebenzisa izikhala ezincane ezihlanganisiwe kanye nama-resonator aqinile, ngakho-ke ukukhiqizwa kokugcina kuqinisekiswa kusukela kulokho okuqondile, ithusi, ukubekezelelana kwe-etch kanye nohlelo lokuhlola. Bheka ithebula eliphelele lamandla e-Highleap eqinile-PCB ukuze uthole imininingwane yefektri eshicilelwe.

Isaziso sokuhlanganiswa kwamandla: amanani etafuleni ayimingcele yamandla efektri ngayinye. Inani lezingqimba, i-geometry engu-2/2 mil, ithusi elingu-10 oz, usayizi wephaneli ophezulu, isilinganiso sesici esingu-20:1 kanye nokwakhiwa kwebhodi elincane kakhulu akucatshangwa ukuthi kungafezeka ngasikhathi sinye. I-Highleap iqinisekisa inhlanganisela esebenzisekayo ngemuva kokubukeza izinto eziqondile, i-stackup, ithusi, i-drill, ukubekezelelana kwe-RF, ukuqeda kwendawo kanye nephakheji yokuhlanganisa.

I-RF-60A iyigama le-Taconic elidala eliqhubeka nokuvela kulabhulali yezobuchwepheshe ye-AGC. Ithebula le-RF eliyinhloko le-AGC lamanje libala i-RF-60TC kune-RF-60A. I-Highleap iqinisekisa isidingo esiqondile sokudweba, isitoko, izitifiketi kanye nenqubomgomo yokushintsha evunyiwe kusetshenziswa iphothifoliyo yamanje ye-AGC RF/microwave. I-RF-60TC noma enye into yekilasi le-Dk-6 ayisetshenziswa njengokushintsha okuzenzakalelayo.

Ukukhiqizwa kuhlanganiswa ngesevisi yokukhiqiza ye-PCB ye-microwave ye-Highleap enomzila oqondene ne-laminate kanye ne-geometry enikeziwe.

Kungani Amasekethe Aphezulu E-Dk Adinga Isiyalo Esiqinile Sobukhulu

I-laminate ene-Dk ephezulu ivumela ama-resonator amancane nama-antenna, kodwa i-geometry ehlanganisiwe ingenza impendulo yemvamisa ibe bucayi kakhulu ekushintsheni kwe-etch, ukujiya kwe-dielectric, ithusi, i-plating kanye nokuphela kwendawo. I-Highleap ibona ubude be-resonant, izikhala ezihlanganisiwe, amaphuzu okuphakelayo kanye nezakhiwo zomhlabathi njengezici ezibalulekile ngesikhathi sokubuyekezwa kwe-CAM.

Ukushintshana kokuklama nokukhiqiza kuchazwa kabanzi kumasu okunciphisa i-RF PCB kanye nokulawula ukubekezelelana kwe-RF PCB.

Ukukhishwa Kwezinto Ezibalulekile Nokungaphephi Ngaphambi Kokusebenzisa Amathuluzi

I-RFQ kumele isho ukuthi ingabe i-impedance yekhasimende kanye nemodeli ye-RF zisebenzisa i-Dk ejwayelekile, inqubo noma umklamo, nokuthi ngayiphi imvamisa noma indlela. I-Highleap ngeke icabange ukuthi inani ledatha le-RF-60A elidala lingathathelwa indawo yinani lamanje le-RF-60TC. Idokhumenti elawulwayo ye-stackup kanye nezinto ezibonakalayo ilawula ukukhiqizwa.

Ukutholakala Kwezinto Eziphathekayo ze-RF-60A kanye Nokuvunyelwa kwe-RF-60TC

I-Highleap igcina umzila wokuqala we-RF-60A kanye nanoma yisiphi isiphakamiso se-RF-60TC sihlukile. Ushintsho oluhlongozwayo luqopha imodeli kagesi, ukujiya, ithusi, ukuziphatha kokushisa, inqubo ye-PTH, umthelela wobuciko, izidingo zeziqu kanye nesitifiketi. Umzila ogunyazwe yikhasimende kuphela okhishwa ekuthengeni nasekukhiqizeni.

• qinisekisa izinga eliqondile, ubunikazi bomkhiqizi, ukujiya, ukubekezelelana, ithusi kanye nemibhalo yelothi;
• thola imigqa ebalulekile ye-RF, ama-resonator, izikhala zokuxhumanisa kanye nezakhiwo ezizwela isigaba;
• faka isimo sethusi esiqediwe kanye nemaski ye-solder kumodeli yejiyometri;
• chaza izakhiwo ze-impedance kanye nemibiko usebenzisa Ukulawulwa kwe-RF impedance;
• chaza ngokubhala ukuthi yini eshintshiwe kanye negunya lokushintsha umklamo;
• bhala phansi isakhiwo esivunyiwe ukuze kutholakale ukuthi silandeleka kanjani ngokuphindelela.

Uma izinto zihlolwa, i-Highleap ingaqhathanisa izinketho ezikhiqizwayo ngokuqhathanisa izinto ze-RF PCB . Ukukhetha kokugcina kanye neziqu kuhlala kumnikazi womklamo.

Ukwakhiwa kanye Nokulawulwa Kwekhwalithi Kwezakhiwo Ezincane ze-RF

I-Highleap inika izilawuli zenqubo ngokuya ngemvamisa yangempela, i-geometry kanye nemigomo yokwamukelwa. Isekethe encane ye-Dk-6 ingadinga ubufakazi obukhulu kunebhodi elikhulu ngokomzimba le-Dk eliphansi ngisho noma zombili zisebenzisa ukwakhiwa okulula kwezingqimba ezimbili.

• ukulinganisa umugqa kanye negebe kuma-resonator akhethiwe, ama-couplers kanye nezakhiwo ezifanayo;
• ukujiya kwe-dielectric kanye nokuqinisekiswa kokujiya kwebhodi eliqediwe;
• ukubhaliswa kokubhoboza okulawulwayo kwe-vias yomhlabathi kanye nezinkomba zokuxhuma;
• ingxenye encane yembobo embozwe nge-plated lapho ukuthembeka kwembobo kuyingozi yephrojekthi;
• ikhuphoni ye-impedance noma imoto yokuhlola echazwe yikhasimende;
• ukukhetha ukuqeda ubuso kusetshenziswa Isiqondiso se-RF kanye nokuqeda ubuso be-microwave;
• ukuhlolwa kukagesi kanye nokuqinisekiswa kwe-RF ongazikhethela njengoba kuchaziwe ku Ukuhlolwa kwe-RF PCB.

Ubufakazi bekhwalithi buyavunyelwana ngaphambi kwekhotheshini. I-Highleap inganikeza ukulandeleka kwezinto, ukuhlolwa kukagesi, imiphumela ekhethiwe yobukhulu, izingxenye ezincane, amarekhodi okuvimba, ukuhlolwa kwesihloko sokuqala kanye nemiphumela yokuhlolwa kwe-RF echazwe yikhasimende uma ifakiwe ku-oda.

Ukuhlanganiswa kwe-RF-60A PCB kanye nokuhlanganiswa kwe-Thermal/Mechanical

I-Highleap ingahlanganisa amabhodi e-RF-60A ngama-RF passives, ama-amplifier, ama-mixer, ama-oscillator, ama-connectors, ama-shield, ama-heat spreaders kanye ne-mechanical hardware. I-High-Dk miniaturization ivame ukubeka izingxenye kanye nezici zokusekela eduze, ngakho-ke i-stencil, ivolumu ye-solder, ukufinyelela kabusha kanye nokulungiswa kwesixhumi kumele kubuyekezwe kusenesikhathi.

Amaphrojekthi e-power-amplifier angabuyekezwa ngokukhiqizwa kwe-PCB ye-power-amplifier ye-Highleap kanye nezilawuli zenqubo yokuhlanganisa i-RF.

Isikhathi Sokuhola se-RF-60A, Ukuqhubeka Kwezinto, kanye Nesilinganiso

Isikhathi sokuhola sikhishwa ngemuva kokuba i-Highleap iqinisekisile izinto ze-RF-60A ezindala, isitoko esinikezwe amakhasimende noma umzila wokushintsha ovunyiwe. Ikhotheshini ikhomba ukukhishwa kobunjiniyela, izinto ezilungele, ibhodi elingenalutho, ukuhlanganiswa kokuqala kanye nezinyathelo zokuthunyelwa kokugcina. Ukulethwa okuhlukanisiwe kungasetshenziswa lapho kudingeka ukuqinisekiswa kwe-RF kusenesikhathi.

Ukuze uthole umzila ophelele we-PCB kanye ne-PCBA, i-Highleap ingahlanganisa ukubuyekezwa kwe-RF laminate nobunjiniyela bokuhlanganisa be-RF PCB kanye nesilinganiso sokukhiqiza esisemthethweni.

Isikhathi sokucaphuna kanye nesikhathi sokuhola siqinisekiswa ngemva kokuba isimo sezinto ezibonakalayo, ukusebenziseka kobukhulu obubalulekile, izidingo zokushisa zokuhlanganisa kanye nokulungela ukuhlolwa sekuvaliwe. Lapho okunye kudinga ukulungiswa noma ukuqinisekiswa kwe-RF, i-Highleap icaphuna isakhiwo seziqu ngokwehlukile ekukhiqizweni okuphindaphindayo.

Thumela i-Gerber/ODB++, umdwebo wokwenziwa, ukucaciswa kwezinto ezilawulwayo, i-stackup, ubukhulu be-RF obubalulekile, izidingo ze-impedance noma ze-S-parameter, amafayela okubhoboza/umzila, ukuqeda, ubuningi, ukulethwa okuqondiwe, i-BOM, imidwebo yokuhlanganisa kanye nendlela yokuhlola nge- Highleap Electronics . Ukuze uthole ukwakhiwa okuphuthumayo, cela ukuhlolwa ngokukhiqizwa okusheshayo kwe-PCB okuvamise kakhulu.

Ingabe i-Highleap ingakwazi ukukhiqiza i-Taconic RF-60A endala?

Yebo, ngemva kokutholakala kwezinto ezibonakalayo okuvunyelwe, ukujiya, ithusi, amadokhumenti kanye nemithetho yokushintshana kuyaqinisekiswa.

Ingabe i-RF-60TC ingayithatha indawo ye-RF-60A?

Akuzange kube ngaphandle kwemvume. Izinto zamanje zinokubekezelelana kwazo kwe-Dk, ukulahleka, izakhiwo zokushisa, ukujiya kanye nesimo sokufaneleka.

Ingabe i-Highleap ingakwazi ukubamba izikhala ezihlangene ngokuqinile?

I-Highleap ibukeza ithusi langempela, i-geometry, ukwakheka kwephaneli kanye nendlela yokwamukela, bese ibuyisela ukubekezelelana okukhiqizwayo kanye nanoma yikuphi ukulinganisa kwesihloko sokuqala okudingekayo.

Ingabe i-RF-60A PCB kanye nokuhlanganiswa kungacashunwa ndawonye?

Yebo. Ukuthola izingxenye, ukuhlanganisa, ukuhlola, ukuhlanganiswa kwemishini kanye nokuhlolwa okuchazwe amakhasimende kungafakwa.

Yiluphi ulwazi oludingekayo ukuze kutholakale ikhotheshini ye-RF-60A PCB?

Nikeza imininingwane yezinto ezilawulwayo, i-Gerber/ODB++, i-stackup, ithusi, ithebula le-geometry elibalulekile, ububanzi bemvamisa, izidingo ze-impedance noma zokulungisa, isikhombikubona sokushisa, ubuningi, amafayela okuhlanganisa kanye nemikhawulo yokuhlola.

Ingabe i-Highleap ingasekela umhlangano we-PCB we-compact high-Dk RF PCB?

Yebo. I-Highleap ingacaphuna ukutholakala kwezingxenye, ukunamathisela okulawulwayo kanye nokugeleza kabusha, ukufakwa kwesixhumi se-RF kanye nesivikelo, ukuhlolwa, ukuhlanza, ihadiwe yokushisa kanye nokuhlolwa kokusebenza okuchazwe ngamakhasimende noma kwe-RF.