Ukukhiqizwa kwe-PCB ye-Motherboard ye-Workstation yama-Multi-GPU PCIe Gen5 Platforms

I-PCB yebhodi lomama lendawo yokusebenza iyipulatifomu yokudlulisa amandla kanye nokusabalalisa i-bandwidth yobuchwepheshe. Amabhodi esimanje angahambisa iziteshi zememori eziyisishiyagalombili ze-DDR5 ECC, izixhumanisi eziningi ze-PCIe Gen5 x16, izixhumi eziningana ze-NVMe, amadivayisi okuphatha/okuphepha kanye ne-CPU VRM yamanje ephezulu kumhlangano owodwa omkhulu we-multilayer. Ingozi yokukhiqiza akuyona "inkimbinkimbi" emfushane; ukulahleka kwesiteshi, ngama-stubs, i-warpage yebhodi, i-socket/connector assembly kanye nemizila yezinsiza engonakala buthule uma ukulawula ukukhiqiza kubuthakathaka.

I-Highleap Electronics ikhiqiza indawo yokusebenza eklanywe ngamakhasimende kanye nama-PCBA ebhodi le-motherboard asheshayo anezinketho zokwenziwa kwezingqimba eziningi/ukulahlekelwa okuphansi, i-impedance elawulwayo, i-backdrill lapho kuchazwe khona, i-BGA assembly, i-AOI/X-ray, uhlelo lwe-firmware kanye nokuhlolwa kokusebenza.

Qala ngomthwalo womsebenzi kanye ne-Lane Topology, hhayi i-Board Form Factor

I-PCB yebhodi lomama lendawo yokusebenza ichazwa yi-bandwidth yezinsizakusebenza. Izinhlelo zobungcweti zingadinga ama-core amaningi e-CPU, iziteshi zememori eziyisishiyagalombili, ama-GPU amaningana e-bandwidth egcwele, ama-drive amaningi e-NVMe kanye namakhadi enethiwekhi noma e-accelerator anesivinini esikhulu. Ngakho-ke, ukwakheka kwe-PCB kufanele kuqale ngemephu yomzila/yezinsizakusebenza ngaphambi kokubekwa kwesixhumi.

Amapulatifomu amanje e-AMD Threadripper PRO 9000 WX, isibonelo, aveza imizila efinyelela ku-128 ye-PCIe 5.0 kanye neziteshi zememori ze-DDR5 eziyisishiyagalombili. Lelo zinga le-I/O lishintsha ngokuphelele inkinga yokuqondisa: ibhodi lendawo yokusebenza lingathwala izixhumanisi eziningi ze-32 GT/s x16 ngesikhathi esisodwa, hhayi isikhala esisodwa sehluzo kanye nezingxenye ezimbalwa ezimfushane.

Hlela i-CPU Socket kanye ne-Eight Memory Channels njenge-Producing Zone

Amasokhethi amakhulu okusebenzela kanye nezixhumi eziningi ze-DIMM zakha indawo yokuphuma exinene kakhulu enezidingo eziqinile zomzila kanye nomshini. Ukufakwa kwebhodi, ngokusebenzisa ubuchwepheshe kanye ne-socket backplate kufanele kwakhiwe ndawonye.

• I-socket fanout: Inani eliphezulu lamaphini lidinga ama-vias aminyene kanye nezakhiwo zamandla/zomhlabathi; imithetho yokubhoboza kanye ne-aspect-ratio kumele ihlale ngaphakathi kwefasitela lenqubo elizinzile lomenzi.
• Iziteshi eziyisishiyagalombili: Umzila we-DDR5 udla izifunda ezinkulu, ezilinganayo ezizungeze isokhethi. Gcina izindiza zokubhekisela ziqhubeka futhi ugweme izinguquko zezendlalelo ezingadingekile.
• Izixhumi ze-DIMM: I-geometry yesixhumi esingena ngembobo/ukufakwa kwengcindezi noma i-solder ithinta umzila kanye nokulandelana kokuhlanganiswa.
• Inani labantu be-ECC: I-FCT kufanele ihlole i-matrix yenani lesiteshi esisekelwayo kunokuba ihlole isethi ye-DIMM encane kakhulu.
• Umthwalo wemishini: I-torque ye-CPU cooler/backplate ingagoba ibhodi; ukuthamba kanye nebhalansi yethusi akuzona izindlela zokulinganisa ubuhle.

Izinto Zokushayela Isabelomali Sesiteshi se-PCIe Gen5, Ama-Vias kanye nama-Retimers

Ku-32 GT/s, imizila ye-PCIe yesiteshi sokusebenza ingase iwele ibhodi elikhulu kusukela kusokhethi ye-CPU iye kuma-slots akude e-x16. Ngayinye ngokushintsha, isixhumi kanye ne-intshi yokulandelela idla imajini. Ngakho-ke iphakheji yokwenziwa kufanele ibone ukuthi yiziphi iziteshi ezidinga i-backdrill, izinto ezilahlekelwa kancane, ama-retimers noma ukulawulwa kwe-impedance okuqinile.

Amakhono okukhiqiza ngesivinini esikhulu se-Highleap angafaka phakathi i-impedance elawulwayo, i-backdrilling kanye nezinketho zezinto ezilahlekelwa kancane njengalezo ezisetshenziswa ekwakhiweni kwebhodi lomama/iseva elinesivinini esikhulu. Ukwakhiwa okuqondile kufanele kulandele ukuhlaziywa kwesiteshi sekhasimende, hhayi i-stack-up evamile ye-workstation.

Ukulethwa Kwamandla Kumele Kusekele Ingqalasizinda Yomthwalo Nokwandiswa Kwe-CPU Eqhubekayo

Indawo yokusebenza kulindeleke ukuthi iqhubeke nokunikeza, ukulingisa, ukuhlanganisa noma imisebenzi ye-AI isikhathi eside. Ngakho-ke ukwakheka kwe-VRM kudinga kokubili impendulo yesikhashana kanye ne-margin yokushisa eqhubekayo. I-motherboard isabalalisa amandla kuma-slots, imemori, isitoreji kanye namasekethe okuphatha ngenkathi isebenzisana ne-chassis PSU kanye namandla asizayo e-GPU.

• I-CPU VRM: Inani lezigaba, ama-thermals e-MOSFET/inductor kanye ne-copper/via current kufanele kubuyekezwe ngaphansi komthwalo oqhubekayo.
• Izixhumi ze-EPS: Izixhumi zemigodi edlulayo ezinamandla aphezulu zidinga indawo yethusi, ukugcwaliswa kwemigodi kanye nokusekelwa kwemishini.
• Izikhala ze-PCIe: Izitimela ze-Slot 12 V/3.3 V kanye ne-assistant signaling kumele zihlale ngaphakathi kwemingcele yokuxhuma/yamanje ngisho nalapho ama-GPU esebenzisa izintambo zikagesi ezihlukene.
• Amandla enkumbulo: Iziteshi eziyisishiyagalombili zandisa amandla enkumbulo esabalele kanye nokuhlukaniswa.
• Ukulinda/ukuphatha: Imisebenzi ye-BMC, i-wake kanye nesevisi ingaqhubeka inikwe amandla uma i-CPU eyinhloko ivaliwe.

Ukuthembeka Kwemishini Kubalulekile Ngama-GPU Agcwele Ubude Nama-Cooler Amakhulu

Amabhodi okusebenzela aphethe izingxenye ezisindayo kunama-PC avamile ehhovisi. Ama-GPU amaningi agcwele ubude, ama-DIMM amade, ama-CPU cooler amakhulu kanye nama-heatsink okugcina izinto adala amandla okugoba nokufaka. Ubukhulu bebhodi, izimbobo zokufaka kanye nokuqinisa izikhala kufanele kubuyekezwe nomthengisi we-chassis.

• Izikhala ze-PCIe: Kungadingeka ukuqinisa noma ukugcina i-chassis kumakhadi asindayo; i-PCB yodwa akufanele ithwale imithwalo yokuthutha.
• Ukusekelwa kwebhodi: Engeza izindawo zokuma eduze kwezixhumi ezinamandla okufaka kanye nezindawo zamakhadi asindayo lapho ishasi livumela khona.
• Ukugcina ngaphandle: Ama-backplate, izikulufo ze-heatsink kanye nama-GPU cooler kungangqubuzana nezingxenye ezingemuva.
• Ikhasi lempi: Amabhodi amakhulu acebile ngethusi adinga ukulinganisela kwe-lamination kanye nokulawulwa kokuthamba.
• Ezokuthutha: Iziqu zokuthunyelwa kwemishini yokusebenza eziqediwe ziwumsebenzi wesistimu, kodwa ukwakheka kwe-PCB akufanele kudale ukugxila okusobala kokucindezeleka okungasekelwa.

Sebenzisa Inqubo Yokwenza Eyenzelwe Amabhodi Amakhulu Anezingqimba Eziningi Ezisheshayo

Amabhodi esiteshi somsebenzi ahlanganisa ubukhulu obukhulu nenani eliphezulu lezingqimba kanye nomzila osheshayo oqinile. Ngakho-ke, ukwenziwa kufanele kugxile ekubhalisweni, ukuhambisana kwe-impedance, ikhwalithi ye-plating kanye nokulawulwa kwe-stub kuyo yonke iphaneli.

• Ukulawulwa kwezinto: Umndeni we-resin/ingilazi yokukhiya lapho ukulahleka kwesiteshi kuncike ku-laminate evunyiwe.
• Impedance: Sebenzisa amakhuphoni amelela izakhiwo ezibalulekile ze-PCIe/imemori bese ubika imiphumela ngohlelo oluvunyelwene ngalo.
• I-Backdrill: Qinisekisa i-stub/ukujula okusele ngamakhuphoni enqubo noma i-microsection uma kudingeka.
• Ibhalansi yethusi: Nciphisa ingozi yomnsalo/yokujika ezungeze amasimu amakhulu endiza kanye nethusi le-VRM.
• Ngokuthembeka: I-PTH enesilinganiso esiphezulu kanye ne-dense fanout kufanele ihlale ngaphakathi kwamandla okubhoboza/ukufaka iplati afanelekile.
• Ekupheleni kwendawo: Khetha isiphetho sezidingo zokuhlanganiswa kwephimbo elincane kanye nesixhumi/ukuxhumana.

Ukuhlanganiswa Kuhlanganisa Ama-BGA Asezingeni Eliphansi Nama-Socket Anesisindo Esiphezulu Nama-Connector

Umklamo wenqubo yokuhlanganisa udinga ukubhekana nazo zombili izinhlangothi ze-component spectrum. Ama-retimers, amadivayisi e-chipset/BMC kanye nabalawuli bamandla amancane bangase babe yi-BGAs/QFNs e-fine-pitch, kuyilapho izixhumi ze-DIMM/PCIe/EPS kanye nama-socket e-CPU engeza isisindo sokushisa kanye nokuzwela komshini.

• I-SPI/AOI: Ukunamathiswa kokulawula kanye nokubekwa okubonakalayo ngaphambi kokuba amasokhethi/izixhumi ezibizayo kwenze kube nzima ukulungisa kabusha.
• I-X-ray: Hlola amalunga e-BGA/LGA afihliwe ngokwecebo lekhwalithi.
• I-solder yesixhumi: Qinisekisa ukugcwaliswa kwembobo ebholeni ku-EPS, ama-header nezinye izingxenye ezinobunzima obukhulu.
• Ukuvikelwa kwesokhethi: Vimbela ukungcola/ukugoba kokuxhumana ngesikhathi sokuhlanganiswa nokuhlolwa kwezansi komfula.
• Imikhawulo yokusebenza kabusha: Chaza ukuphinda usebenze okuphezulu kwama-retimers/BGA ngoba ukushisa okuphindaphindiwe kumabhodi amakhulu anezingqimba eziningi ezilahlekelwa kancane kungadala umonakalo ocashile.

Ukwaziswa Kwesiteshi Sokusebenzela Kumelwe Kuqinisekise Ububanzi Bezinsizakusebenza, Hhayi Ukuba Khona Kwedivayisi Kuphela

I-FCT yokukhiqiza kufanele ithole uhlelo oluqala kodwa luqeqesha buthule i-slot ye-x16 GPU ngobubanzi/isivinini esincishisiwe, ilahlekelwe isiteshi sememori noma yehluleke isixhumanisi se-NVMe. Lokho kudinga idatha yokuxilonga ngale kwesikrini se-POST esilula.

Lawula i-BIOS, i-Retimer kanye ne-Management Firmware nge-Board Review

Amabhodi omabhodi e-workstation ashesha kakhulu angathwala amadivayisi amaningana angahlelwa: i-BIOS flash, i-embedded controller, i-BMC, ama-retimers, abalawuli be-USB-C PD kanye namadivayisi ewashi ngezinye izikhathi angahlelwa. Ngakho-ke, ushintsho lwehadiwe lungadinga ukukhishwa kwe-firmware okuhlelekile.

• Isithombe segolide: Chaza i-firmware ekhishwe esethiwe yi-motherboard revision.
• I-oda lokuhlela: Amanye amadivayisi kumele ahlelwe ngaphambi kokuqalisa kokuqala; ama-socket/izihlanganisi zedokhumenti kanye nokuqinisekiswa.
• Ubunikazi: Amakheli e-serial, ama-MAC kanye nokunikezwa kokuphepha kufanele kube okuhlukile futhi okuhlolekayo.
• Ukubuyela emuva/ukululama: Qinisekisa izindlela zokubuyisa ngesikhathi se-PVT, hhayi ngemva kokwehluleka kwensimu.
• Shintsha isilawuli: Izinguquko zesixhumanisi se-retimer/clock/BOM kurekhodi lokuqinisekisa le-BIOS elihambisanayo.

Ubuqotho Besignali Yokuklama Ngokubambisana kanye Nobuqotho Bamandla Ngokuphathelene Nokulayisha Kwe-Multi-GPU

Amabhodi esiteshi somsebenzi acindezela isignali kanye nezinhlelo zamandla ngesikhathi esisodwa. Umsebenzi we-multi-GPU ungandisa ithrafikhi ye-CPU/imemori, umsebenzi we-slot kanye nomthwalo we-VRM ndawonye. Ngakho-ke umsindo we-power-plane, ukungaqhubeki kwe-reference-plane kanye nezinto zokubuyisela isikhathi kufanele zibuyekezwe ngokubambisana kunokuhlola okuhlukile kwe-SI kanye ne-VRM.

• Imizila yokubuyisela isikhathi: Gcina ukuphakelwa/ukuhlukanisa umsindo kusendaweni; i-retimer enamandla angaphansi ingaqeqesha ngezikhathi ezithile ngisho noma isiteshi esingasebenzi samukelekile.
• Izinhlobo zokubhekisela: Ukusika kwe-VRM okunamandla aphezulu akufanele kuphoqe amandla okubuyisa i-PCIe eduze kwezikhala.
• Izinto zewashi: Amadivayisi e-PCIe/refclk kanye nama-buffer adinga ukuhlukaniswa kwamandla kusuka ekushintsheni izindawo ezishisayo.
• Amandla esikhala: Ukusabalalisa kwamanje kanye nokubuyiselwa kwesixhumi akufanele kunciphise ireferensi yomhlabathi ngaphansi kwemizila yesivinini esikhulu.
• Ukuhlolwa kokulayisha: I-DVT kufanele ihlanganise ithrafikhi yememori ye-CPU kanye nomsebenzi we-GPU/PCIe omele ukuze kubonakale ama-counter okuqeqesha kabusha noma amaphutha ngaphansi kokucindezeleka okukhulu kukagesi.

Umthwalo wemfanelo womenzi ukuphinda ukhiqize i-stack-up evunyiwe kanye ne-geometry yamandla. I-OEM kufanele ihlinzeke ngemikhawulo ye-SI/PI kanye nanoma yiziphi izibali zokuxilonga ezidinga ukubhekwa ngesikhathi sokuqinisekiswa.

Sebenzisa idatha ye-PVT Yield ukuze unqume ukuthi ibhodi selikulungele yini ngempela ukuvota

Ibhodi lomama lendawo yokusebenza lingabonakala liphumelela uma amasampula ayishumi obunjiniyela eqala, kodwa kusenefasitela lenqubo elingazinzile. I-PVT kufanele ilinganise amaphutha ngendlela kanye nesixhumi esibonakalayo ukuze ithimba lazi ukuthi isakhiwo singaphinde sikhiqizwe yini.

Ukukhululwa kwevolumu kufanele kulandele isinyathelo sokulungisa ezindleleni eziphindaphindayo, hhayi nje iphesenti le-head-pass-yield leeld. Inzuzo ephezulu iyonke isengafihla isikhala esisodwa se-Gen5 esingaphansi esiba yimbuyiselo yensimu ebizayo.

Idatha ye-RFQ ye-Workstation Motherboard PCB kanye ne-PCBA

I-Highleap ingasekela ukwenziwa kwebhodi lebhodi le-workstation eliklanywe ngamakhasimende kanye ne-PCBA, okuhlanganisa ukwenziwa kwe-multilayer ngesivinini esikhulu, i-backdrill/impedance elawulwayo lapho kuchazwe khona, ukuhlanganiswa kwe-BGA, ukuhlolwa, uhlelo kanye nokuhlolwa kokusebenza.

• Imephu yezinsizakusebenza: I-CPU/isokhethi, i-topology yememori yeziteshi eziyisishiyagalombili noma enye, ukwabiwa kwemizila ye-PCIe, i-NVMe kanye nokwakhiwa kokuphatha.
• Iphakheji yobuqotho besiginali: ukuhlanganiswa, izinto zokwakha, ukuvimba, i-backdrill, ama-insertion-loss target/coupons kanye nezindawo zokubuyisela isikhathi.
• amandla: Ithagethi yamandla e-CPU, ukwakheka kwe-VRM, izixhumi ze-EPS, amandla esikhala kanye nemizila yokulinda.
• Imishini: uhlaka lwebhodi, isikhala sesikhala se-GPU, izindawo zokufaka/zokusekela, izindawo zokugcina ezipholile/i-backplate kanye nezidingo zokujiya/ukuthamba kwebhodi.
• I-BOM: amasokhethi, izixhumi ze-DIMM/PCIe, ama-retimer, amawashi, izingxenye ze-VRM, i-BMC/TPM kanye nezinye ezivunyiwe.
• Ukuhlela/i-FCT: Izithombe ze-BIOS/BMC/retimer, ukwabiwa kwe-serial/MAC, ukuhlolwa kobubanzi bememori/PCIe, isitoreji kanye nokuxilongwa kwamandla.