Sarudzo ye224G PCB yezvinhu zvePAM4 Channels zvinogadzirwa
Chikumbiro chePCB che224G chinongoshanda chete kana chikamu chebhodhi chechiteshi chatsanangurwa. Kubuda kwepakeji, kuburitswa kweconnector, copper profile, kurasikirwa kwe dielectric, kuburikidza nekuchinja uye kugadzirwa kwemhando dzakasiyana siyana zvinodya zvikamu zvakasiyana zvebhajeti; zita re laminate rega hariratidzi kana link yacho ine margin.
Basa reHighleap nderekushandura fungidziro yemutengi kuita zvinodiwa zvekugadzira zvinoyerwa: stackup inotenderwa, copper inodzorwa, miganhu ye impedance, stub targets uye test coupons dzakakodzera. Kutevedzera silicon kunoramba kuri mhedzisiro yesystem-level. Order yekutenga isina chinhu inofanira kutsanangura humbowo hunogona kuburitswa nefekitori pane kukumbira mhuri yezvinhu kuti ive nechokwadi chekuti puratifomu yakazara ye224G.
Tsanangura 224G Channel Usati Wasarudza Laminate
Pakeji inobatsira yekutanga kuronga inoratidza chinotumira nekugamuchira, modulation, ma package models, huwandu hwezvikamu zvePCB, connector count, maximum route length, via transitions, target impedance uye equalisation assumptions. Inosiyanisawo host board kubva ku module, riser, cable assembly kana backplane. Pasina architecture iyoyo, kuenzanisa laminate ifungidziro.
Kirasi ye224G inowanzobatanidzwa nekugadzirwa kwePAM4 SerDes uye mapuratifomu ekubatana kwechizvarwa chinotevera kana emakombiyuta. PAM4 ine ruzivo rwakawanda pane chiratidzo chimwe nechimwe kupfuura NRZ asi inopa mikana midiki yekuona yakatwasuka, zvichiita kuti ruzha, kutaura kwakabatana, kufungisisa uye kugadzirisa kurasikirwa kuve kwakaoma. Izvi hazvirevi kuti nzira yega yega inofanirwa kushandisa zvinhu zvakafanana. Kubatana kupfupi kubva papakeji kuenda papakeji kunogona kuva nebhajeti yakasiyana kubva panzira refu yechassis ine maconnector akawanda. Kune mabhodhi eMEGTRON 9 e224Gbps-class links , sarudzo yelaminate inofanirwa kuongororwa ne copper profile, stackup, via transitions uye bhajeti chaiyo yekurasikirwa kwechiteshi.
| Mubvunzo wechiteshi | Chikonzero nei fekitori yePCB ichida mhinduro | Typical output |
|---|---|---|
| Chii chinorehwa ne "224G" mukugadzirwa uku? | Inosarudza spectrum yezviratidzo uye zvirevo zvekugamuchirwa zvakakodzera. | Tsananguro yemugwagwa uye tarisiro yegwaro rehurongwa. |
| Nzira yacho iri paPCB yakawanda sei? | Zviyero zvekurasikirwa nezvinhu zvine hurefu hwakarongwa, nepo shanduko dzichiwedzera zvirango zvakasiyana. | Kureba kwakanyanya zvichienderana nechikamu chebhodhi nechikamu cherukoko. |
| Mangani ma connectors uye via fields aripo? | Mabundu nemastub zvinogona kutonga chiteshi chipfupi. | Mamodheru ekubatanidza, hurongwa hwekuboorera uye chinangwa chekuboorera kumashure. |
| Kurasikirwa kupi kwebhodhi kunotenderwa? | Chinhu hachigoni kusarudzwa zvine musoro pasina chinangwa chinoyerwa. | Masiki yekuisira kana muganho wekubvumidza kupinza kana kuponi. |
| Ndeipi nzira yekushanda inodiwa? | Kufungidzira kwemazita hakuna kukwana pakugadzira huwandu hwezvinhu. | Kushivirirana uye ongororo yenyaya dzakaipa. |
Tanga nehurongwa hwekusarudza zvinhu zvePCB zvine hungwaru uye nekukurumidza . Kuenzanisa kunofanira kushandisa data rekugadzira rakagadzirwa uye chimiro chemhangura chaunoda. Chinhu chakaburitswa chakayerwa pane imwe sampuli hachisi humbowo hwekuti chinhu chepakati nechakagadziriswa mumhuri imwe chete chinoita zvakafanana.
Ko nzira yega yega ye224G inoda laminate yakaderera-kurasikirwa here?
Kwete. Mamwe machaneli mapfupi anogona kunge aine muganho wekuchinja pane muganho we dielectric-loss. Laminate ine muganho wekuderedza inova yakakosha kana kurasikirwa kwebhodhi rakaparadzirwa kukashandisa mari inosvika mushure mekunge topology yagadziriswa. Zvinokwanisikawo kuti mapuranga akasiyana mune imwe system ashandise matanho akasiyana ezvinhu. Sarudzo chaiyo ndiyo yekuvaka ine njodzi shoma inosangana nezvinodiwa zvechannel zvakakwana uye kushivirira kugadzirwa, kwete zvinhu zvinodhura zvakanyanya pane runyorwa rwakatenderwa.
Ndeipi frequency yekushanda inofanira kushandiswa kuenzanisa zvinhu?
Kuenzanisa kunofanira kutevedzera modhi yechiteshi uye zvirevo zvinoshandiswa nechikwata chesystem. Usaderedza chiteshi chePAM4 chebroadband kuita frequency imwe chete yedata-sheet. Ongorora kurasikirwa kana frequency, dhizaini yaDk, kurasikirwa kwemhangura uye hukama hwemodhi pamusoro pebhendi rakakodzera. Dhirowa yePCB inofanira kuratidza zvinodiwa pabhodhi rinoyerwa pane kudzokorora nhamba yekushambadzira.
Kushandiswa Kwebhajeti Yekurasikirwa kwe224G Chaizvo
Nzira iyi icheni. Kubuda kwepakeji, kubuda kweBGA, trace conductor, dielectric, vias, connector launches, AC-coupling structures uye reference changes zvese zvinobatsira. Crosstalk uye mode conversion zvinogona kuderedza kushandiswa kwemaziso kunyangwe kana insertion loss ichiita seinogamuchirika. Kuchinja kwekugadzira kunobvisa zvese zvinopihwa kubva pa nominal model.
Kugoverwa kwekurasika kunobatsira kudzivirira laminate kuti isave tsananguro iri nyore kune dambudziko rega rega. Kana chinobatanidza uye minda ichitora mari yakawanda, kuvandudza hunyanzvi hwavo kunogona kuwana mari yakawanda kupfuura kuchinja resin. Kana nzira yacho ikaramba iripo kwenguva refu mushure mekugadziriswa kwetopology, kusarudzwa kwezvinhu nemhangura kunova kwakakosha.
Pakeji uye BGA escape
Mapakeji akakora anomanikidza mitsipa kudzika, ma-via madiki uye shanduko dzereferensi-plane. Kubuda kunogona kuva kupfupi, asi kusagadzikana kwayo kunogona kugadzira kushandurwa kwereflection uye mode. Stackup inofanira kurongeka neBGA pitch uye pad field usati waisa layer count. Ma-via asina kusimba kana kuti via-in-pad zvinogona kubatsira mune mamwe magadzirirwo, asi zvinowedzera matanho ekuita uye zvinodiwa pakukodzera.
Kuoma kwemhangura uye geometry yakapedzwa
Pakukwira kwemafrequency, magetsi anoungana pedyo nepamusoro pemuchina wekufambisa magetsi. Mhangura, kugadziriswa kwekubatanidza, upamhi hwetrace, chimiro chemativi emadziro uye ukobvu hwakapedzwa zvese zvinokanganisa kurasikirwa kwemuchina wekufambisa magetsi. Kutsanangura mhangura yeVLP kana HVLP kunogona kubatsira, asi chigadzirwa chaicho uye kugadziriswa kwayo kunofanirwa kuwanikwa muchivako chakasarudzwa. Purojekiti iyi inofanira kuongorora copper foil uye high-frequency surface effects pane kufunga kuti "low-profile copper" yese yakaenzana.
Kuburikidza nekuchinja uye zvimedu zvakasara
Nzira inopfuudzwa kuburikidza nepakati pechinhu inogona kugadzira stub ine resonant kana chiratidzo chikachinja ma layer asati asvika kudivi riri kure. Kuboorera kumashure, ma blind vias kana layer assignment zvinogona kuderedza hurefu husina kushandiswa. Nzira yakasarudzwa inofanira kuverengerwa kushivirira ma drill, kunyoreswa kwe layer, stub yasara uye dhizaini ye antipad. Laminate ine kurasikirwa kwakaderera haidzimise resonant kuburikidza nepakati pechinhu.
Zvinobatanidza uye geometry yekutanga
Mamodheru ekubatanidza anofanirwa kusanganisira nzira yekutevera mafambiro emagetsi nekudzoka, kwete chikamu chemutengesi chete. Maantipadhi ekuvhura, maviya ekudzoka, machinjiko epad uye ma cut-out emuno anogona kutonga. Fekitori yePCB inogona kudzora magadzirirwo ejometri, asi mutengesi weconnector nemugadziri wesystem vanofanira kupa modhi nechinangwa.
- Bvisa kusagadzikana kwe topology kunogona kudzivirirwa.
- Simbisa mamodheru ekubatanidza nemapakeji.
- Kudzora kuburikidza nematanda uye nzira dzekudzoka.
- Sarudza profile yemhangura uye stackup.
- Ongorora kurasikirwa kwe dielectric kwakaparadzirwa kwasara.
- Sarudza nhanho yezvinhu zvine mwero wekugadzirwa.
Kuchinja Bhajeti Rekurasikirwa Kuita Hurongwa Hwekuronga Zvinhu Zvakafanana uye Kugadzira
Kana gwaro rekugoverwa kwechiteshi rabvumirana, data rekugadzira rinofanira kurichengetedza. Stackup inofanira kuratidza zvivakwa zvepakati nezviripo, nzvimbo ye dielectric yakapedzwa, copper profile, signal-layer assignment uye reference planes. Tafura yekudhirowa inofanira kutaurwa kuburikidza nerudzi, saizi yakapedzwa, divi rekumashure, kudzika kwechinangwa uye residual stub. Tafura ye impedance inofanira kupatsanura geometry yega yega ne layer.
Highleap inoongorora kana chivakwa chiri kurongwa chiripo, kana ukobvu hwakadzvanywa huchigona kubatwa, kana resin inogona kuzadza pateni yemhangura, uye kana drill/backdrill tolerances dzichigona kugadzirwa. Kana paine imwe nzira yekuvaka, inodzoserwa kuti itenderwe nevatengi ne revised impedance geometry. Fekitori haifanirwe kutsiva chinhu kana copper foil nekuti zita rekuti Drk rinotaridzika zvakafanana.
Kuruka nekucheka girazi
Magirazi akasiyana-siyana anogona kusangana nenzvimbo dzakasiyana dzegirazi/resin, zvichikonzera kutsveyama. Kona yenzira, maitiro egirazi, kugoverwa kweresin uye geometry yenzira mbiri zvese zvinokanganisa mhedzisiro yacho. Kudzivirira kwakanyanya kunoenderana neprojekiti. Mugadziri anogona kusimbisa kuvakwa kwegirazi kuripo, ukuwo timu yekugadzira ichidzora nzira uye kunzwisiswa kwenzira.
Kudzorwa kweimpedance uye kushivirira
Kushivirira kwakasimba kunowedzera zvinodiwa pakuita uye pakunoni. Mufananidzo unofanirwa kuratidza kana kushivirira kuchishanda pakunoni, kurongeka kwechigadzirwa kana zvese zviri zviviri, uye kuti ndeipi nzira yekuyedza inogamuchirwa. Kunoni dzekuyedza dzinofanira kumiririra layer yekugadzira, dielectric nemhangura. Impedance chete hairatidzi kurasikirwa kwakaderera kwekupinza, saka purojekiti ye224G ingangoda TDR ne frequency-domain coupon.
Kuti uwane magadzirirwo azvo, shandisa PCB stackup yakagadzirira kugadzirwa pane kushandisa conceptual layer list. Copper, prepreg pressing, solder mask uye surface finish zvinofanira kuiswa pazvinopesvedzera modhi.
Kusimbiswa kwe backdrill
Kudzika kwemuchina wekudhonza mvura kunogona kusimbiswa nechikamu chidiki chemvura kana imwe nzira inobvumiranwa. Chiyero chekugamuchira chinofanira kutaura nzvimbo inobvumirwa yekudhonza mvura uye kuparadzaniswa kubva pane yakabatana layer yekupedzisira. Chikwata cheCAM cheHighleap chinoongororawo kuti dhayamita yemuchina wekudhonza mvura inobvisa bharero rakaputirwa pasina kukanganisa mhangura iri pedyo. Ongorora maitiro emuchina wekudhonza mvura usati waisa chinangwa chisingagoneki.
Kusiyana kwekugadzirwa kunofanirwa kuve mumuenzaniso
Upamhi hwemaetch, ukobvu hwe dielectric, ukobvu hwemhangura, Dk, nzvimbo yekuboorera uye kudzika kwe backdrill zvinosiyana mukati mezvikamu zvinodzorwa. Chikwata chechiteshi chinofanira kutevedzera zviyero izvozvo kana kutsanangura muganhu wakakwana webhodhi. Dhayagiramu yeziso yakagadzirwa kubva pa geometry yakanaka haigone kushandurwa kuita garandi yefekitori. Highleap inogona kupa data rebhodhi rakayerwa; muridzi wesystem anorishandisa mukuongorora kwakazara kwelink.
Maitiro Ekugadzira uye Kutora 224G PCB
Muenzaniso we224G unofanirwa kupindura mibvunzo chaiyo. Chivako chakasarudzwa chinogona kudzvanywa kusvika pakukora here? Kurasikirwa kweimpedance nekuiswa mukati memiganhu yekuponi yakabvumiranwa here? Chidimbu chasara chinodzorwa here? Bhodhi rinoramba rakati sandara zvakakwana here kuti riunganidzwe? BGA neminda yekubatanidza inogadzirwa here pakugadzirwa kwayo? Muenzaniso unoratidza chete kuenderera mberi kwemagetsi hausi humbowo hwakakwana hwekuburitswa kwevhoriyamu.
- kuunganidzwa kwakatenderwa uye kurongeka kwezvinhu/mhangura;
- mhinduro dze coupon ye impedance ye geometry yega yega yakakosha;
- kuponi yekupinza-kurasikirwa kana kuponi yeS-parameter payakatarwa;
- kudhonzwa kwemusana kana kuburikidza ne microsection umboo;
- ukobvu hwakapedzwa, uta/kutenderera uye mushumo wehukuru hwakakosha;
- chinyorwa chekutanga chekuunganidza uye bvunzo yekushanda kana yesystem uko PCBA inosanganisirwa.
Highleap inogona kupa ma prototypes ebhodhi risina chinhu, kugadzirwa kwakaderera uye turnkey assembly. Kune mapakeji epamusoro, ongororo ye assembly inosanganisira dhizaini yeBGA pad, stencil, hunyoro hwekunzwa, reflow profile, X-ray inspection uye rework limits. Pfungwa dze high-speed signal-integrity dzinofanira kugoverwa nechikwata che assembly apo kuiswa kwechikamu, kuiswa kwe connector kana shield zvinokanganisa channel.
Nguva yekuburitsa zvinhu inoenderana nekuwanikwa kwelaminate nemhangura chaiyo, huwandu hwema layer, sequential lamination, backdrill, bvunzo uye kuunganidza zvinhu. Nguva dzekukurumidza dzinosimbiswa mushure mekunge zvaiswa mukati mazvo zvaongororwa. Kotesheni dzinogona kusanganisira mari yekubhadhara, sarudzo dzekutumira zvinhu nekukurumidza kana kuti zvekutakura zvinhu pasi rose, kurongedza uye kuteverwa kwekutumira zvinhu. Mushure mekutumirwa, zvinyorwa zvepurojekiti zvinotsigira kuongororwa kwekukundikana kana matanho ekugadzirisa kana dambudziko rebhodhi kana rekuunganidza rikataurwa.
Kugadzira makuponi chikamu chekugadzirwa kwePCB
Kuponi yekupinza-kurasikirwa inofanira kumiririra zvinhu zvekugadzira, profile yemhangura, kuvakwa kwelayer uye kugadziriswa. Nzira yakatwasuka iri nyore yakaiswa pane imwe girazi kana mamiriro emhangura inogona kusaenderana nechiteshi chechigadzirwa. Zvishandiso zvakabatana, kuburitswa kweprobe uye magadzirirwo ekuenzanisa zvinokanganisawo data rakayerwa. Mutengi anofanira kutsanangura nzira kana kubvumidza kuponi yemugadziri asati aisa panel.
Highleap inotarisa kana coupon yacho inokodzera pani yekugadzira uye kana ichida geometry yekuvhurwa yakadzorwa, backdrill kana ma reference vias. Nzvimbo ye coupon inokanganisa mashandisirwo epaneru nemutengo, saka inofanira kutorwa sechinhu chinoshanda pane kungofunga nezverail.
Kuburitswa kwezvigadzirwa kunoda huwandu hwezviverengero
Muenzaniso uri pedyo nemuganhu hausi mhedzisiro yakasimba yekugadzira. Chikwata chesystem chinofanira kuongorora shanduko inotarisirwa muhukobvu hwe dielectric, etch, copper, Dk uye urefu hwe stub. Chinangwa chekugamuchira chingada kunge chakasimba kupfuura muganho wekupedzisira wesystem kuitira kuti shanduko yebhodhi, gungano nezvimwe zvikamu zvirambe zviri muganho. Highleap inogona kupa mafambiro emaitiro uye data rema coupon akayerwa ekuongorora uku.
Pakudzokororwa kweodha, kugadzirwa kwezvinhu zvakatenderwa uye mhangura zvinofanirwa kuramba zvichidzorwa. Kana mutengesi akachinja girazi kana kuwanikwa kwefoil, stackup yakagadziriswa inofanira kuenzaniswa uye kutenderwa. Iyi shanduko chikamu chikuru chevimbiso yemhando ye224G.
Kutenga connector ne assembly zviri muchirongwa
Zuva rekutendeuka nekukurumidza risina chinhu harivimbise kuti chigadzirwa che224G chichagadzirwa. Zvinobatanidza zvinomhanya zvakanyanya, mapakeji makuru, masoketi, nhoo uye zvigadziriso zvekuedza zvinogona kuva nenguva yakareba yekutungamira kupfuura PCB. Kana Highleap ikagadzira turnkey assembly, BOM inoongororwa pamwe chete nekuwanikwa kwezvinhu. Zvimwe zvikamu hazvishandiswe pasina mvumo yemutengi.
Assembly DFM inoongororawo coplanarity yeconnector, zvinodiwa pakudzvanya, BGA escape, rutsigiro rwekudzokorodza uye kuongorora. X-ray uye bvunzo inoshanda zvinogona kubatanidzwa, asi chigadzirwa chekuyedza uye zvinodiwa zvekugamuchira zvinofanirwa kuwanikwa. Bhodhi rinomhanya zvakanyanya risina gungano rechokwadi uye chirongwa chekuyedza rinogona kusvika nekukurumidza uye risingashande.
Maitiro ekuenzanisa zvinopihwa zvekugadzira zvebhodhi re224G
Enzanisa zvinhu zvakanyatsogadzirwa, mhangura, zvinhu, nzira, stub yasara, kushivirira kweimpedance, coupon yekupinza-kurasikirwa, microsection uye assembly scope. Bvunza kana quotation ichisanganisira zvinhu zvekuedza nemareports chaiwo. Simbisa kana mutengesi ari kupa zvinhu zviripo kana kuti achifungidzira kuti zvichawanikwa mune ramangwana. Mutengo wakachipa unogona kutsanangura chigadzirwa chakasiyana.
Mashoko aHighleap anoratidza fungidziro yekuvaka uye chero zvinhu zvinoda kusimbiswa nevatengi. Izvi zvinobatsira kutenga zvinhu kuongorora mutengo, nguva yekutanga uye njodzi dzehunyanzvi pamwe chete, izvo zvinobatsira kupfuura kuronga mafekitori nemutengo weyuniti imwe chete.
Izvo Highleap inogona uye isingagone kuvimbisa
Highleap inogona kuvimbisa zvinodiwa zvekugadzira nekugadzira zvinoyerwa uye zvinosanganisirwa muzvinodiwa zvekutenga zvakatenderwa, zvichienderana nekubvumidzwa kwazvinoitwa. Fekitori haigone kuvimbisa chinobatanidza che224G kubva kuzita relaminate chete. Silicon, package, connector, firmware, equalization, tembiricha uye system layout zvinoramba zviri chikamu chekutevedzera mitemo.
Muganho uyu hausi muganho mubasa; unodzivirira mutengi kubva kuvimbiso isina kutsigirwa. Chinhu chakakodzera chinounzwa iPCB nePCBA zvinoteverwa zvinoenderana ne stackup yakatenderwa, geometry, test coupon uye ongororo.
Tembiricha nemamiriro emusangano zvinofanirwa kuenderana neongororo yechiteshi
Kurasikirwa kwezvinhu uye kondakita kunochinja zvichienderana nemamiriro ekushanda, uye maitiro ekubatanidza kana epakeji anogonawo kuchinja nekupisa. Kana chigadzirwa chichifanira kushanda zvakasiyana-siyana, timu yesystem inofanira kutsanangura kana PCB coupon ichigamuchirwa patembiricha yemukamuri chete kana kuti ichishandiswa seimwe nzira yekuisa mumuenzaniso wakakura wezvakatipoteredza. Highleap inogona kupa humbowo hwebhodhi pasi penzira yakabvumiranwa, nepo kufanirwa kwesystem kuchiramba kuri chiitiko chakasiyana.
Mugero unofanirwawo kugadzirwa muchimiro chawo chakabatanidzwa. Zvinobatanidza zvakasungirirwa, mapakeji makuru, ma heatsinks uye nhoo zvinogona kuchinja maitiro ekuvhurwa kana kuti kutsetseka kwebhodhi. Kuburitswa kwekugadzirwa kunosimbisa chete coupon isina chinhu kunogona kupotsa matambudziko anokonzerwa nekubatanidzwa. Kana module yakazara yakakosha, chirongwa chekutanga chinofanira kusanganisira zviyero zvakaunganidzwa kana bvunzo yesystem.
Chirongwa chekutsvaga zvinhu chakarongwa chinoderedza njodzi yenguva yakatarwa
Nguva dzekushandisa zvinhu zvemhando yepamusoro uye nguva dzekubatanidza zvinhu zvinogona kusava nechokwadi. Chirongwa chinoshanda chinogona kupatsanura kusimbiswa kwezvinhu zveinjiniya, kuponi yekuyedza isina bhodhi, muenzaniso wakaunganidzwa uye kuburitswa kwekugadzirwa. Highleap inogona kutaura danho rega rega uye kuona kuti ndeapi mitengo inobhadharwa kamwe chete. Izvi zvinoita kuti kutenga kuodhe zvinhu zvine mutengo wakareba pasina kuburitsa bhodhi rakazara risina kusimbiswa.
Pakugadzirwa kwezvinhu zvinofungidzirwa, zvinhu zvinotenderwa nemhangura zvinogona kuchengetwa kana kurongwa zvichienderana nekudiwa. Chibvumirano chekutengeserana chinofanira kutaura kuti zvinhu zvisina kushandiswa, kugadziriswa kwedhizaini uye shanduko dzekufungidzira zvinobatwa sei. Ichi chikamu chekutenga zviri nyore kwePCB yepamusoro: mazwi akajeka akakosha kupfuura vimbiso isina kujeka yemasheya asina muganho.
Chinyorwa cheinjiniya: Maitiro ekushandisa 224G uye zvirevo zvinoramba zvichichinja-chinja munzvimbo dzakasiyana siyana. Mutengi anotungamira, mutengesi wesilicon kana gwaro remitemo rinofanira kuzivikanwa muRFQ; izwi rekuti "224G" chete harisi iro gwaro rekugamuchira.
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Nzira yekuwana sei quote yePCBs
Ngatiite ongororo yeDFM/DFA kwauri tobva tadzoka kwauri nemushumo. Unogona kurodha mafaira ako zvakachengeteka kuburikidza newebhusaiti yedu. Tinoda ruzivo runotevera kuti tikupe mutengo:
-
- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.