Substrate yeABF: Zvishandiso, Maitiro Ekugadzira, Mashandisirwo, uye Kubatanidzwa kwePCB

Kune mainjiniya vanoongorora makombiyuta epamusoro, networking, AI, accelerator, processor, kana mamwe maapplication ane I/O ane high-I/O, kunzwisisa hukama huripo pakati pezvinhu zveABF dielectric, IC substrates, package interconnects, HDI structures, uye system-level PCBs kwakakosha.

Chii chinonzi ABF Substrate?

ABF inomirira Ajinomoto Build-up Film , tekinoroji yemafirimu e dielectric yakagadzirwa kuti ishandiswe pakurongedza ma semiconductor ane density yakakura.

Substrate yeABF inowanzova nechimiro chepakati chakasanganiswa nezvikamu zvakawanda zve dielectric ne copper interconnect layers. Zvidimbu zve copper zvakapfava uye microvias zvinoumbwa mukati mezvikamu izvi zve build-up kuti pave ne dense routing inodiwa pakati pe semiconductor package ne external PCB.

Kuvaka uku kwakasiyana zvachose nePCB yakajairika ine layer yakawanda.

PCB yechinyakare inowanzo gadziriswa zvichienderana nekusimba kwemuchina, kugona kugadzira, mashandiro emagetsi, zvinodiwa pakupisa, uye mutengo padanho rebhodhi rehurongwa. Chigadziko cheABF package, kana tichienzanisa, chinofanira kugamuchira kubatana kwakasimba kwazvo pedyo nemudziyo we semiconductor.

Saka substrate inoshanda sebhiriji remagetsi neremakanika pakati penzvimbo mbiri dzakasiyana kwazvo:

Basa iri repakati ndiro rinoita kuti tekinoroji yeABF ive yakabatana zvikuru netekinoroji yeIC substrate kwete kugadzirwa kwePCB kwakajairika.

Sei ABF Inoshandiswa pakugadzira IC Packaging Yepamusoro?

Chikonzero chikuru chinoita kuti ABF ive yakakosha ndechekuti mapakeji emhando yepamusoro e semiconductor anoda huwandu hwekubatana husingakwanise kupa matekinoroji ePCB.

Ma processor emazuva ano, maGPU, maAI accelerator, zvishandiso zve networking, uye mamwe mapakeji e-high-I/O semiconductor anogona kuva nehuwandu hwakawanda hwekubatanidza magetsi mukati menzvimbo diki yepakeji.

Saka, substrate yepakeji inofanira kupa:

• Nzira dzemhangura dzakatsetseka
• Kuwanda kwekubatana kwakanyanya
• Matanho akawanda ekuvaka
• Ma microvia akagadzirwa nelaser
• Ukobvu hwe dielectric hwakadzorwa
• Yakagadzikana magetsi emagetsi
• Nzvimbo dzakavimbika dzemhangura-kusvika-dielectric
• Maitiro akarongwa nehukuru
• Kuenderana nemaitiro ekupakata e semiconductor

Maumbirwo eABF anogonesa kuwedzera huwandu hwenzira dzakatwasuka pamwe nedzakatwasuka.

Panzvimbo pekuedza kubatanidza kwese kuburikidza nechimiro chePCB chakakora, mainjiniya vanogona kuvaka mamwe ma layer e dielectric ne copper akatenderedza core substrate uye kushandisa microvias kubatanidza ma layer ari pedyo.

Maitiro aya anogonesa kuwanda kwenzira dzekufambisa mukati mechikamu chidiki chepakeji.

Mhedzisiro yacho inonyanya kukosha kumidziyo ye semiconductor uko huwandu hwepakeji I/O hwave chimwe chezvinhu zvikuru zvinotadzisa kugadzirwa kwesystem yese.

ABF Substrate vs. PCB Yechinyakare

Zvakakosha kuti usashandise mazwi ekuti ABF PCB neABF package substrate vachichinjana.

Kunyangwe zvese zvichishandisa maconductor emhangura nezvinhu zve dielectric, zvinangwa zvekugadzira kwavo uye zvinodiwa pakugadzira zvakasiyana.

PCB yakajairika inogona kubatanidza processor, memory, power circuitry, connectors, nezvimwe zvikamu mubhodhi rakakura.

Substrate yeABF package inoita basa rakasiyana: inopa kubatana kwakasimba kwazvo pasi kana kuti pedyo ne semiconductor package.

Musiyano iwoyo unotsanangurawo kuti sei matekinoroji aya achiwanzoonekwa pamwe chete mumasisitimu emagetsi epamusoro.

Mashandiro anoita ABF Building-Up Structures

Chimiro cheABF substrate chakareruka chinogona kunzwisiswa senhevedzano yezvikamu zve dielectric nemhangura zvakavakirwa papakati.

Pfungwa yekugadzira inowanzo sanganisira matanho makuru akati wandei:

Kufamba chaiko kwemaitiro kunosiyana zvichienderana nekugadzirwa kwe substrate, kugona kwemugadziri, mitemo yekugadzira, uye zvinodiwa pamapakeji.

Kuvaka Dielectric

Firimu reABF rinopa mukana wekudzivirira pakati pezvivakwa zvemhangura zvinofambisa mhepo.

Dielectric inofanira kupa hunhu hwemagetsi hunodiwa ukuwo ichitsigira kugadzirwa kwezvinhu zvakanaka uye kubatana kwakavimbika.

Ukobvu uye hunhu hwechikamu chega chega che dielectric zvinopesvedzera routing geometry, kuburikidza nekuumbwa, maitiro e impedance, capacitance, uye hunhu hwemakanika.

Ma microvia eLaser

Chimwe chezvinhu zvinonyanya kukosha pakuvaka zvivako zvepamusoro kushandiswa kwema microvias akaumbwa nelaser.

Kusiyana nemaburi makuru ekare, ma microvia anogona kubatanidza zvikamu zviri pedyo asi achitora nzvimbo shoma.

Izvi zvinobvumira nzira dzekufambisa kuti dzipfuure nepakati penzvimbo dzine vanhu vakawanda.

Saka, hunyanzvi hwe microvia, saizi ye landing-pad, mhando ye copper plating, uye kurongeka kwe alignment zvakakosha pakubudirira kwe substrate.

Kune tekinoroji yePCB ine chekuita nayo, gwara redu rekuvaka maPCB ane huwandu hwakanyanya hwekubatana rinopa ruzivo rwakakosha rwekuti ma "miniature vertical interconnects" anowedzera sei huwandu hwe "routing density".

Mhangura Metallization

Mushure mekuumbwa kwe dielectric uye kuchera ne laser, zvivakwa zve conductive conductive zvinofanira kugadzirwa.

Zvichienderana nemaitiro ekugadzira, kuumbwa kwembeu-layer, copper isina electro, electroplating, uye maitiro ekugadzira mapatani zvinogona kubatanidzwa kuti zvigadzire geometry inodiwa yekufambisa.

Pahukuru hwepamusoro hwe substrate, kutonga kwemaitiro kunowedzera kukosha nekuti kusiyana kudiki muukobvu hwemhangura, upamhi hwemutsara, nzvimbo, kana kunyoresa kunogona kukanganisa mashandiro emagetsi uye ekugadzira.

Matambudziko Ekugadzira Substrate yeABF

Kugadzira ABF substrate kunoda zvakawanda kupfuura kugadzirwa kwePCB kwakajairika.

Dambudziko harisi rekukonzereswa nemaitiro mamwe chete. Rinobva mukusangana kwemajiometri akanaka kwazvo, maitiro akawanda ekuvaka, maitiro ezvinhu, kugadzirisa mhangura, kuchera nelaser, kunyoresa, kuongorora, uye manejimendi yegoho.

Kugadzira Mapatani Akanaka

Sezvo upamhi hwemitsara nenzvimbo zvichidzikira, misiyano midiki inova yakakosha zvakanyanya.

Kuchinja kwemaitiro kungave kusina basa paPCB yakajairika kunogona kusagamuchirwa kana geometry yemutyairi ikayerwa pachiyero chidiki kwazvo.

Saka vagadziri vanoda nzira dzakanyatsorongeka dzekutora mifananidzo, kuputira, kutema, kunyoresa, uye kuongorora.

Layer-to-Layer Registration

Rutivi rumwe nerumwe rwekuwedzera rwekuvaka runounza chimwe chinodiwa chekuenderana.

Microvia inofanira kumira zvakanaka pane chinhu chiri pasi pemhangura, nepo nzira yepamusoro yekufambisa ichifanirawo kuenderana nechimiro chakakomberedza.

Saka zvikanganiso zvekunyoresa zvinogona kuungana mukati menguva yekugadzira.

Via Kuvimbika

Microvias dzinofanira kuchengetedza kubatana kwemagetsi nemakemikari kwakavimbika kuburikidza nekugadzirisa nekushanda kunotevera.

Kusasimba kuburikidza nekuumbwa, kusakwana kwemhangura, maburi, kutsemuka, kana kushushikana zvakanyanya zvinogona kukonzera matambudziko ekuvimbika.

Saka hukama huripo pakati pekuboorwa kwelaser, desmear, kuumbwa kwembeu, plating, uye mafambiro ekupisa anotevera hunofanira kudzorwa nokungwarira.

Kugadzikana Kwezvinhu uye Dimensional

Zvigadziko zvepakeji zvinosangana nekumanikidzwa kwekupisa uye kwemakanika panguva yekugadzira, kuunganidza, uye kushanda.

Kusiyana kwehuwandu hwekuwedzera kwekupisa, hunhu hwehunyoro, hunhu hwe dielectric, kugoverwa kwemhangura, uye kugadzirwa kwe layer zvinogona kukanganisa kugadzikana kwehukuru uye kuvimbika kwepakeji.

Nekuda kwechikonzero ichi, kusarudzwa kwezvinhu hakugone kuparadzaniswa nechimiro chose che substrate.

Tekinoroji yeABF Substrate neHDI

Zvigadziko zveABF neHDI PCB zvine pfungwa dzakawanda dzakakosha dzekugadzira, asi hazvifanirwe kubatwa sematekinoroji akafanana.

Ose anogona kushandisa:

• Zvikamu zve dielectric zvakaunganidzwa
• Laser kuchera
• Microvias
• Mhangura yakanaka
• Kugadziriswa kwakarongeka
• Nzira yekuronga zvinhu zvakanyanya

Zvisinei, substrate yeABF package inoshanda padanho re semiconductor-package, uko huwandu hwekubatana uye zvinodiwa zvemadimension zvinogona kuoma zvakanyanya.

Tekinoroji yeHDI ichiri kukosha zvakanyanya kune rumwe rutivi rwebhodhi rehurongwa.

Semuenzaniso, sisitimu yekombiyuta yepamusoro inogona kunge iine:

Saka, substrate yepakeji nePCB yesystem zvinofanira kushanda pamwe chete pamagetsi uye pamakina.

Ichi ndicho chimwe chezvikonzero nei vagadziri vePCB vane hunyanzvi vachiwedzera kuda ruzivo muzvivakwa zvine huwandu hwakawanda pane kungogadzira zvinhu zvemazuva ano zvine jira rakawanda.

Kuvaka kwakarongeka kwakakosha zvikuru pakugadzira magadzirirwo akaomarara eHDI. Mainjiniya vanogona kudzidza zvakawanda nezvenzira iyi munyaya yedu pamusoro peHDI PCB stack-up design.

Kushanda Kwemagetsi kweABF Substrates

Kusarudzwa kwesubstrate yeABF hakusi kwekungoenderana nehuwandu hwenzira dzinoshandiswa chete.

Kushanda kwemagetsi kunowedzera kukosha sezvo mapakeji ekubatanidza anotsigira mwero wedata wakakwira uye huwandu hwakawanda hwemasaini.

Dielectric Zvivakwa

Hunhu hwe dielectric constant uye dissipation system ye dielectric hunokanganisa kupararira kwechiratidzo, capacitance, impedance, uye kurasikirwa.

Hunhu hwakakodzera hunofanira kuongororwa pamwe chete nechimiro chaicho chepakeji pane kubatwa senhamba dzezvinhu zvakaparadzana.

Chiratidzo Kuperera

Kubatana kupfupi hakubvisi matambudziko ekubatana kwemasaini otomatiki.

Pahuwandu hwedata hwakakwira, ma package traces, ma vias, transitions, reference planes, uye PCB connections zvese zvinogona kubatsira ku:

• Insertion kurasikirwa
• Dzorera kurasikirwa
• cross talk
• Reflections
• Skew
• Impedance discontinuities

Saka substrate yepakeji inoumba chikamu chechiteshi chakakwana chinomhanya zvikuru.

Kana chiratidzo chabuda mupakeji uye chapinda muPCB yesystem, PCB stackup uye system yezvinhu zvinofanirwa kuramba zvichitsigira zvinodiwa nemagetsi.

Pamashandisirwo ehurongwa, mainjiniya vanogona kuongorora zviwanikwa zvedu pakugadzira maPCB anomhanya zvakanyanya uye zvinhu zvePCB zvinomhanya zvakanyanya.

Simba Kuperera

Ma processor nema accelerator epamusoro anogonawo kugadzira zvinodiwa zvekupa simba zvakanyanya.

Chigadziko chepasi chinofanira kugamuchira simba rakawanda uye kubatana kwepasi ukuwo chichichengetedza mashandiro emagetsi nekupisa anogamuchirika.

Izvi zvinonyanya kukosha mumacomputer systems ane simba guru uko simba re processor, high-speed interfaces, memory bandwidth, uye thermal design zvakabatana zvakanyanya.

Zvishandiso zveABF Substrate

Zvigadziko zveABF zvinonyanya kusanganiswa nekurongedza kwema semiconductor epamusoro uko kunodiwa huwandu hwakawanda hwekubatanidza.

CPUs uye GPUs

Ma processor anoshanda zvakanyanya anoda huwandu hwakawanda hwekubatanidza mapakeji uye nzira dzakasimba dzekushandisa substrate.

Zvishandiso zvepakeji zvakagadzirwa neABF zvinogona kupa chimiro chakanaka chekubatanidza chinodiwa pakati pepakeji yesemiconductor nesystem yekunze.

AI Accelerators

Zvishandiso zveAI zvemakombiyuta zvinoda zvakawanda pa processor I/O, memory interfaces, simba rekutumira, uye kutaurirana nekukurumidza.

Sezvo magadzirirwo eaccelerator achinyanya kuoma, huwandu hwekubatanidza ma package-level hunowedzera kukosha.

PCB yekunze inofanira kupa zvivakwa zvemagetsi, zvemakanika, zvekupisa, uye zvemagetsi zvakakodzera zvakatenderedza pasuru.

Hardware yeNetworking uye Data-Center

Zvishandiso zvekushandura zvinomhanya zvakanyanya uye zve networking zvinogona kuda kubatana kwemapakeji akawanda pamwe chete nehurongwa hwemasystem-board hunoda simba.

Chikamu chepasi nePCB zvinofanira kushanda pamwe chete kuchengetedza kusimba kwechiratidzo muchiteshi chose.

ASIC uye Zvishandiso zveKomputa Zvakagadzirwa

Maseketi akabatanidzwa akagadzirirwa mashandisirwo anogona kunge aine zvinodiwa zvepakeji zvakagadzirwa zvinoenderana nezvinodiwa.

Magadzirirwo e substrate angangoda kugadzirisa marongero chaiwo eI/O, ma power domains, high-speed interfaces, uye zvirambidzo zvemakanika.

Magadzirirwo Akavakirwa paChiplet

Magadzirirwo eChiplet anoisa zvinodiwa zvakanyanya pakubatana kwemapakeji nekuti madhiraivha akawanda e semiconductor anogona kutaurirana kuburikidza nechimiro chepakeji chakafanana.

Sezvo magadzirirwo emapakeji achichinja, substrate inova chikamu chakakosha chehurongwa hwekubatanidza zvinhu.

ABF Substrate uye BGA Packaging

Tekinoroji yeABF yakabatana zvakanyanya nemagadzirirwo emapakeji epamusoro, kusanganisira mapakeji emhando yepamusoro-I/O BGA.

Chikamu chepakeji chinoparadzira masaini kubva ku semiconductor die kuenda kuma external package terminals, ayo anogona kubatana ne system PCB.

Izvi zvinogadzira mazinga akawanda ekubatana:

Kuchinja pakati pemazinga aya kunofanira kugadzirwa nokungwarira.

Kune mainjiniya vanoshanda nechikamu chebhodhi cheiyi interface, kunzwisisa ma substrates eBGA uye maumbirwo emapakeji kunobatsira.

Kana pasuru yeBGA yaiswa pabhodhi rehurongwa, geometry yejoints, dhizaini yemapad, thermal profile, kuiswa kwezvikamu, uye kuongororwa zvinovawo zvakakosha.

Kugadzira PCB Yakatenderedza Pakeji Yakavakirwa paABF

PCB yesystem inofanira kugadzirwa kuti ienderane nepakeji pane kuti ionekwe sechikamu chakasiyana.

Kubuda kweFan uye Nzira dzekutiza

Mapakeji e-High-I/O anogona kugadzira nzvimbo dzakaoma kwazvo dzekutiza.

Mugadziri wePCB angangoda kusanganisa nzira yekufambisa BGA zvakanaka, zvivakwa zvinopinda mupad, microvias, ma-vias akavigwa, uye mabasa ekuisa layer akarongwa zvakanaka.

Chinangwa hachisi chekungobatanidza zvese zvinobatanidzwa pabhodhi. Maitiro ekugadzirisa nzira anofanirawo kuchengetedza kugona kwekugadzira uye kushanda kwemagetsi.

Kusarudzwa KwemaStackup

Kuunganidzwa kwePCB kunokanganisa:

• Kuvharirwa kwechiratidzo
• Kuenderera mberi kwereferensi
• Kugovera simba
• cross talk
• Thermal maitiro
• Kuburikidza nezvivakwa
• Kugadzira kuoma

Kune mapurosesa ane kumhanya kukuru uye mabhodhi enetworking, shanduko yekuisa package kuenda kuPCB inofanira kufungwa nezvayo panguva yekugadzira stackup.

Power Delivery

Ma processor makuru nema accelerators angada kutumirwa kwemagetsi akawanda kuburikidza nenzvimbo diki dzepakeji.

Saka PCB inoda chimiro chakakodzera chemagetsi, kugoverwa kwemhangura, kuburikidza nekurongeka, nzira yekuparadzanisa, uye dhizaini yekupisa.

Manufacturing Tolerances

Chishandiso chepakeji chakaoma kwazvo chinogona kuita kuti kugadzirwa kwePCB kuve nyore kubatwa nekuunganidzwa kwesimba.

Zviyero zvepad, kunyoreswa kwemasiki esimbi, kuburikidza nekuiswa kwayo, ukobvu hwemhangura, kurongeka kwekuboorwa, uye kunyoreswa kwezvikamu zvese zvinofanirwa kuongororwa zvichienderana nekugona kwayo kugadzira.

Ongororo yakasimba yePCB yekugadzira inogona kuona matambudziko ekugadzira usati watanga kugadzira.

ABF Substrate vs. Mamwe matekinoroji eIC Substrate

ABF haisiyo yega chinhu kana chivakwa chinoshandiswa kugadzira zvinhu zve semiconductor substrates.

Mhando dzakasiyana dzemapakeji dzinogona kuda matekinoroji akasiyana e substrate.

Sarudzo yakakodzera inoenderana nezvinhu zvakaita se:

• Kuverengwa kweI/O
• Package size
• Kuwanda kwenzira
• Kumhanya kwechiratidzo
• Zvinodiwa pakupisa
• Chinangwa chemutengo
• Mechanical constraints
• Kugadzirwa kwehuwandu
• Magadzirirwo epakeji yeSemiconductor

ABF inonyanya kusanganiswa ne substrates dzemhando yepamusoro dzemhando yepamusoro, asi dzimwe nzira dze substrate dzinogona kunge dzakakodzera kune mamwe mapoka emapakeji.

Ndosaka kusarudza substrate kuchifanira kutanga nekugadzirwa kwepakeji uye zvinodiwa nemagetsi pane kungosarudza zvinhu zvemhando yepamusoro zviripo.

Kufunga Nezvekuvimbika kwechikamu cheABF

Kuvimbika kunofanirwa kuongororwa muhurongwa hwese hwepakeji nebhodhi.

Thermal Cycling

Kuchinja-chinja kwekushisa kunodzokororwa kunokonzera kushushikana kwemuchina nekuti zvinhu zvakasiyana zvinokura uye zvinogwamba nematanho akasiyana.

Saka substrate yepakeji, semiconductor package, solder joints, uye PCB zvinofanira kuongororwa sechimiro chakabatanidzwa.

mwando

Zvinhu zve dielectric zve organic zvinogona kushanda pamwe nehunyoro, izvo zvinogona kukanganisa maitiro ekugadzirisa uye kuvimbika.

Saka, mamiriro ekubata hunyoro uye kuchengetwa kwemvura anofanira kudzorwa zvichienderana nezvinodiwa nezvinhu uye magadzirirwo epakeji.

Microvia Kuvimbika

Zvivako zve microvia zvinofanirwa kuramba zvakavimbika pamagetsi uye pamakina kuburikidza nekugadzira nekushanda kwemhepo inopisa.

Hunhu hwemhangura, kuburikidza ne geometry, plating, dielectric interfaces, uye thermal stress zvese zvinobatsira pakushanda zvakanaka.

Kuvimbika kwePakeji kuenda kuPCB

Kunyangwe kana ABF substrate pachayo ichishanda nemazvo, kubatanidzwa kwakazara kunogona kuramba kuchikundikana pa package-to-PCB interface.

Majoini eBGA solder, PCB warpage, kusawirirana kwethermal, assembly profile, uye mechanical loading zvese zvinogona kukanganisa kuvimbika kwemunda.

Kune mashandisirwo eBGA, mainjiniya vanogona zvakare kuongorora ruzivo rwedu pamusoro peBGA PCB assembly uye zvine chekuita nekuongorora uye kufunga nezve solder-joint.

Maitiro Ekuongorora Chirongwa cheABF Substrate

Pakuongorora purojekiti ine chekuita neABF, zvinobatsira kupatsanura zvinodiwa kuita mazinga mana.

1. Zvinodiwa paSemiconductor Package

• Saizi yefa
• Kuverengwa kweI/O
• Package zviyero
• Kurira kweI/O
• Simba rinodiwa
• Zvinodiwa zvekushandisa pakumhanya kwepamusoro
• Magadzirirwo emapakeji

2. Zvinodiwa zveSubstrate

• Core kugadzirwa
• Huwandu hwezvikamu zvakaunganidzwa
• Sisitimu yeDielectric
• Mutsetse/nzvimbo diki
• Zviyero zve microvia
• Zviyero zvepad
• Mhangura ukobvu
• Surface kupera
• Kunyoresa zvinodiwa
• Zvinodiwa zveWarpage

3. Zvinodiwa zvePCB yeSisitimu

• Kuwanda kwePCB layer
• stackup
• Material system
• Kudzora impedance
• Nzira yekutiza BGA
• Kuburikidza nechimiro
• Huremu hwemhangura
• Zvinodiwa pakupisa
• Kugovera simba
• Surface kupera

4. Zvinodiwa paGungano

• Zvimiro zvechikamu cheBGA
• Solder namatidza
• Dhizaini yestencil
• Reflow profile
• Zvinodiwa zveAOI
• X-ray kuongorora
• Kuongororwa kwemagetsi
• Zvinodiwa pakugadzirisa
• Kuchengetedza

Kuparadzanisa mazinga aya mana kunoita kuti zvive nyore kuona kuti dambudziko rinobva kupi.

Dambudziko repakeji harifanirwe kutorwa sedambudziko rekugadzira PCB, uye muganho wePCB-level routing haufanirwe kuverengerwa otomatiki kune substrate yeABF.

Substrate yeABF iri muAdvanced Electronics Manufacturing Chain

Tekinoroji yeABF inoratidza kuti kurongedza kwema semiconductor nekugadzira maPCB kuri kuramba kuchibatanidzwa.

Puratifomu yemazuva ano yemakombiyuta inoshanda zvakanyanya inogona kusanganisira matekinoroji akasiyana-siyana ekugadzira:

Danho rega rega rine zvinodiwa zvehunyanzvi zvakasiyana, asi kubatana kwemagetsi nekwemakanika pakati pazvo kunofanira kuramba kuchienderana.

Kune vagadziri vePCB, izvi zvinoreva kuti kunzwisisa kurongedza kwema semiconductor kuri kuwedzera kukosha kunyangwe kana mutoro chaiwo wekugadzira wakatarisana nebhodhi rehurongwa.

PCB haisisiri kungori puratifomu isina chinhu yakatenderedza processor. Inoumba chikamu chehurongwa hwemagetsi, hwekupisa, uye hwemakanika.

Nei DFM Ichikosha paProjekti dzePCB dzine chekuita neABF

Mapakeji akavakirwa paABF anogona kugadzira maPCB interfaces akakora zvakanyanya.

Kuedza kugadzirisa ma interfaces iwayo mushure mekunge marongerwo ePCB apera kunogona kutungamira pakugadzirisa patsva zvisina kufanira.

Ongororo yeDFM inofanira kutanga kugadzirwa isati yaburitswa.

Chinangwa ndechekuchengetedza dhizaini yemagetsi yaunoda uku uchivimbisa kuti bhodhi remagetsi rinogona kugadzirwa nguva dzose.

Izvi zvinonyanya kukosha kana dhizaini ichibatanidza mapakeji epamusoro neHDI structures, nekuti dhizaini inodzoserwa inogona kunge ichiri kusashanda pakukura kwekugadzirwa.

Kubva paABF Package kusvika paFinished PCBA

Substrate yeABF pachayo chikamu chimwe chete chechigadzirwa chose.

Kana pasuru yepamusoro yabatanidzwa nePCB yesystem, maitiro ekugadzira anoenderera mberi kuburikidza nekuiswa kwezvikamu, kusungirirwa, kuongororwa, kuyedzwa, uye pamwe nekubatanidzwa kwesystem-level. Padanho rePCB, HDI assembly pasystem-board interface inoramba iri basa rakasiyana rekugadzira kubva pakugadzira pasuru yepakeji.

Saka, mubatsiri wekugadzira ane hunyanzvi anofanira kunzwisisa hukama huripo pakati pePCB isina chinhu nekugadzirwa kwekupedzisira.

Kune mapurojekiti anoda kugadzirwa kwebhodhi uye kubatanidzwa kwezvikamu, masevhisi ekubatanidza PCB anogona kubatsira kubatanidza matanho ekugadzira nekubatanidza mukati memaitiro ekugadzira akarongeka.

Izvi zvinonyanya kukosha kumapuraneti e processor ane density yakakura uko zvirevo zvekugadzirwa kwePCB uye parameters dzemusangano hazvigone kutariswa zvakazvimirira.

ABF Substrate: Zvinhu Zvinokosha Zvaunofanira Kuziva

Tekinoroji yeABF substrate ine chinzvimbo chakakosha pakati pekurongedza kwema semiconductor uye kugadzirwa kwePCB padanho resystem.

Pfungwa dzakakosha ndedzi:

• ABF zvinoreva Ajinomoto Build-up Film, tekinoroji ye organic dielectric inoshandiswa zvakanyanya muzvikamu zvepamusoro zvepakeji.
• An Substrate yeABF package haisi PCB yakajairika yakagadzirwa kubva kune imwe laminate.
• Chinangwa chayo chikuru ndechekupa kubatana kwakanyanya kwemagetsi pakati pe semiconductor package ne outer system.
• Kuvaka ma layer, laser microvias, fine copper routing, uye tight registration ndizvo zvakakosha pa tekinoroji iyi.
• Zvishandiso zveABF zvine hukama hwakasimba nezvirongwa zve semiconductor zvine I/O zvakaita sema processor, accelerators, ASICs, uye zvishandiso zve networking zvepamusoro.
• Chikamu chepasi nePCB yesystem zvinofanirwa kufungwa pamwe chete kuti zvionekwe zvakanaka, simba rinosvika, mashandiro ekupisa, uye kuvimbika.
• Matekinoroji ePCB ane huwandu hwakanyanya seHDI anova akakosha zvakanyanya pakushandisa package-to-board interface.
• Kugona kugadzira zvinhu kunofanirwa kuongororwa nekukurumidza nekuti ma geometrics akanaka uye kushivirira kwakasimba kunogona kukanganisa zvakanyanya goho uye mutengo.
• Chigadzirwa chekupedzisira hachingotsamiri pamhando yesubstrate chete asiwo pakugadzirwa kwePCB, kuunganidzwa, kuongororwa, uye kuyedzwa.

Mibvunzo Inowanzo bvunzwa Nezve ABF Substrates